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Global 2.5D and 3D IC Packaging Market By Device Type

By Device Type, the market is segmented into 3D NAND Flash, CMOS Image Sensors, High-Bandwidth Memory (HBM), Logic SoCs & AI Accelerators, and RF, Photonics & MEMS Devices (2022–2032)

Author: Wantstats Research TeamSource: Wantstats Repository
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Global 2.5D and 3D IC Packaging Market By Device Type — full underlying data
Label3D NAND FlashCMOS Image SensorsHigh-Bandwidth Memory (HBM)Logic SoCs & AI AcceleratorsRF, Photonics & MEMS Devices
20221276.1 USD Mn1020.9 USD Mn1148.5 USD Mn2424.6 USD Mn510.4 USD Mn
20231013.8 USD Mn796.3 USD Mn1355.1 USD Mn2516 USD Mn444 USD Mn
20241172 USD Mn898.6 USD Mn2215.5 USD Mn3772.7 USD Mn571.6 USD Mn
20251417.8 USD Mn1063.4 USD Mn3249.1 USD Mn5316.7 USD Mn768 USD Mn
20261720.2 USD Mn1271.2 USD Mn4208 USD Mn6794.3 USD Mn1011.3 USD Mn
20272032.6 USD Mn1480.9 USD Mn5259.6 USD Mn8399.4 USD Mn1283.6 USD Mn
20282357.8 USD Mn1695.6 USD Mn6392.9 USD Mn10119.9 USD Mn1581.3 USD Mn
20292696.5 USD Mn1917.9 USD Mn7584.8 USD Mn11926.7 USD Mn1897.4 USD Mn
20303053.8 USD Mn2153.6 USD Mn8819.9 USD Mn13803.9 USD Mn2225.7 USD Mn
20313440.2 USD Mn2412.6 USD Mn10094.8 USD Mn15755.6 USD Mn2561.6 USD Mn
20323865.1 USD Mn2705.5 USD Mn11402 USD Mn17779.3 USD Mn2898.8 USD Mn

Data Source: Wantstats Repository

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Growth Outlook

  • The Global 2.5D and 3D IC Packaging Market By Device Type market is on a steady long-term growth path. Segment value stands at roughly USD 15005 Million in 2026 and is projected to reach USD 38651 Million by 2032 — a gain of about 158% over the forecast period, translating to a CAGR in the double digits.
  • What the regional split looks like (2026): Logic SoCs & AI Accelerators leads, holding roughly 45% of segment value — the single largest regional share. High-Bandwidth Memory (HBM) is the second-largest contributor. 3D NAND Flash, CMOS Image Sensors and RF, Photonics & MEMS Devices make up the remainder, in descending order.
  • By 2032, Logic SoCs & AI Accelerators alone is expected to reach USD 17779 Million, with High-Bandwidth Memory (HBM) at USD 11402 Million.

Market Dynamics

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