By Package Platform, the market is segmented into 2.5D / 3D IC (incl. HBM Stacks), Fan-Out & Wafer-Level CSP, Flip-Chip (FCBGA / FCCSP), and System-in-Package (SiP) (2022–2032)
| Label | 2.5D / 3D IC (incl. HBM Stacks) | Fan-Out & Wafer-Level CSP | Flip-Chip (FCBGA / FCCSP) | System-in-Package (SiP) |
|---|---|---|---|---|
| 2022 | 506.1 USD Mn | 455.6 USD Mn | 1178.7 USD Mn | 544.5 USD Mn |
| 2023 | 513.9 USD Mn | 427.3 USD Mn | 1061.7 USD Mn | 507.6 USD Mn |
| 2024 | 654 USD Mn | 501.9 USD Mn | 1198.1 USD Mn | 593.3 USD Mn |
| 2025 | 819.8 USD Mn | 580.7 USD Mn | 1332.2 USD Mn | 683.2 USD Mn |
| 2026 | 987.3 USD Mn | 645.8 USD Mn | 1423.1 USD Mn | 755.9 USD Mn |
| 2027 | 1180.7 USD Mn | 712.9 USD Mn | 1509.6 USD Mn | 830.2 USD Mn |
| 2028 | 1405.1 USD Mn | 783 USD Mn | 1593.1 USD Mn | 907.2 USD Mn |
| 2029 | 1662.8 USD Mn | 855.2 USD Mn | 1672.1 USD Mn | 986.7 USD Mn |
| 2030 | 1957.7 USD Mn | 929.5 USD Mn | 1745.7 USD Mn | 1066.3 USD Mn |
| 2031 | 2291.2 USD Mn | 1004.5 USD Mn | 1812.7 USD Mn | 1146.5 USD Mn |
| 2032 | 2666.7 USD Mn | 1079.1 USD Mn | 1870.8 USD Mn | 1226.2 USD Mn |
Data Source: Wantstats Repository
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Global Advanced Package Final Test Market By Application
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Global Advanced Package Final Test Market By Package Platform
