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Charts & Stats
Global Die Bonding Equipment Market — North America by Equipment Type
By Equipment Type, the market is segmented into Flip Chip Bonders, Epoxy / Adhesive Die Bonders, Hybrid (Die-to-Wafer) Bonders, Thermocompression (TCB) Bonders, and Eutectic & Soft-Solder Die Bonders (2022–2032)
Author: Wantstats Research TeamSource: Wantstats Repository
| Label | Flip Chip Bonders | Epoxy / Adhesive Die Bonders | Hybrid (Die-to-Wafer) Bonders | Thermocompression (TCB) Bonders | Eutectic & Soft-Solder Die Bonders |
|---|---|---|---|---|---|
| 2022 | 29.610202 USD Mn | 56.259414 USD Mn | 6.129201 USD Mn | 20.431013 USD Mn | 35.16217 USD Mn |
| 2023 | 25.488335 USD Mn | 46.692953 USD Mn | 6.438494 USD Mn | 19.212636 USD Mn | 29.450788 USD Mn |
| 2024 | 29.033409 USD Mn | 51.177537 USD Mn | 8.680636 USD Mn | 23.767998 USD Mn | 32.601158 USD Mn |
| 2025 | 33.262629 USD Mn | 56.290757 USD Mn | 11.514064 USD Mn | 29.424775 USD Mn | 36.247775 USD Mn |
| 2026 | 35.946536 USD Mn | 60.214645 USD Mn | 14.490103 USD Mn | 32.895277 USD Mn | 38.923165 USD Mn |
| 2027 | 38.76846 USD Mn | 64.276847 USD Mn | 17.830328 USD Mn | 36.657671 USD Mn | 41.710494 USD Mn |
| 2028 | 41.675817 USD Mn | 68.389461 USD Mn | 21.511917 USD Mn | 40.662744 USD Mn | 44.552875 USD Mn |
| 2029 | 44.665289 USD Mn | 72.55218 USD Mn | 25.516339 USD Mn | 44.897784 USD Mn | 47.448877 USD Mn |
| 2030 | 47.751721 USD Mn | 76.802462 USD Mn | 29.808833 USD Mn | 49.355076 USD Mn | 50.419659 USD Mn |
| 2031 | 50.913873 USD Mn | 81.135404 USD Mn | 34.277275 USD Mn | 53.959513 USD Mn | 53.454735 USD Mn |
| 2032 | 54.133446 USD Mn | 85.634988 USD Mn | 38.535524 USD Mn | 58.49184 USD Mn | 56.580202 USD Mn |
Data Source: Wantstats Repository
Growth Outlook
- The North America by Equipment Type portion of the Global Die Bonding Equipment Market market is on a steady long-term growth path. Segment value stands at roughly USD 182 Million in 2026 and is projected to reach USD 293 Million by 2032 — a gain of about 61% over the forecast period, translating to a CAGR in the high single digits.
- What the regional split looks like (2026): Epoxy / Adhesive Die Bonders leads, holding roughly 33% of segment value — the single largest regional share. Eutectic & Soft-Solder Die Bonders is the second-largest contributor. Flip Chip Bonders, Thermocompression (TCB) Bonders and Hybrid (Die-to-Wafer) Bonders make up the remainder, in descending order.
- By 2032, Epoxy / Adhesive Die Bonders alone is expected to reach USD 86 Million, with Thermocompression (TCB) Bonders at USD 58 Million.
Market Dynamics
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