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Global Die Bonding Equipment Market — U.S. by Equipment Type

By Equipment Type, the market is segmented into Flip Chip Bonders, Epoxy / Adhesive Die Bonders, Hybrid (Die-to-Wafer) Bonders, Thermocompression (TCB) Bonders, and Eutectic & Soft-Solder Die Bonders (2022–2032)

Author: Wantstats Research TeamSource: Wantstats Repository
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Global Die Bonding Equipment Market — U.S. by Equipment Type — full underlying data
LabelFlip Chip BondersEpoxy / Adhesive Die BondersHybrid (Die-to-Wafer) BondersThermocompression (TCB) BondersEutectic & Soft-Solder Die Bonders
202221.688233 USD Mn37.218945 USD Mn4.335958 USD Mn16.64728 USD Mn23.423985 USD Mn
202318.704532 USD Mn30.9717 USD Mn4.9264 USD Mn15.673368 USD Mn19.670842 USD Mn
202421.345996 USD Mn34.03484 USD Mn6.994148 USD Mn19.412665 USD Mn21.83163 USD Mn
202524.504709 USD Mn37.539907 USD Mn9.602412 USD Mn24.064007 USD Mn24.341765 USD Mn
202626.480442 USD Mn40.152485 USD Mn12.274318 USD Mn26.902474 USD Mn26.13779 USD Mn
202728.591749 USD Mn42.928933 USD Mn15.112674 USD Mn30.001183 USD Mn28.053719 USD Mn
202830.771848 USD Mn45.749847 USD Mn18.244215 USD Mn33.303854 USD Mn30.014039 USD Mn
202933.019074 USD Mn48.615967 USD Mn21.653916 USD Mn36.800839 USD Mn32.018493 USD Mn
203035.345065 USD Mn51.553742 USD Mn25.313188 USD Mn40.486608 USD Mn34.082225 USD Mn
203137.735208 USD Mn54.561643 USD Mn29.12743 USD Mn44.300695 USD Mn36.199377 USD Mn
203240.177121 USD Mn57.698628 USD Mn32.769325 USD Mn48.063972 USD Mn38.389194 USD Mn

Data Source: Wantstats Repository

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Growth Outlook

  • The U.S. by Equipment Type portion of the Global Die Bonding Equipment Market market is on a steady long-term growth path. Segment value stands at roughly USD 132 Million in 2026 and is projected to reach USD 217 Million by 2032 — a gain of about 65% over the forecast period, translating to a CAGR in the high single digits.
  • What the regional split looks like (2026): Epoxy / Adhesive Die Bonders leads, holding roughly 30% of segment value — the single largest regional share. Thermocompression (TCB) Bonders is the second-largest contributor. Flip Chip Bonders, Eutectic & Soft-Solder Die Bonders and Hybrid (Die-to-Wafer) Bonders make up the remainder, in descending order.
  • By 2032, Epoxy / Adhesive Die Bonders alone is expected to reach USD 58 Million, with Thermocompression (TCB) Bonders at USD 48 Million.

Market Dynamics

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