By Packaging Technology, the market is segmented into Discrete & Power Device Packages, Fan-out & Wafer-level Packages, Leadframe-based IC Packages (SOP / QFP / QFN), Substrate-based Packages (BGA / CSP), and System-in-Package (SiP) (2022–2032)
| Label | Discrete & Power Device Packages | Fan-out & Wafer-level Packages | Leadframe-based IC Packages (SOP / QFP / QFN) | Substrate-based Packages (BGA / CSP) | System-in-Package (SiP) |
|---|---|---|---|---|---|
| 2022 | 492.6 USD Mn | 187.9 USD Mn | 769.7 USD Mn | 624.4 USD Mn | 237.3 USD Mn |
| 2023 | 462.5 USD Mn | 182.2 USD Mn | 697.1 USD Mn | 577.6 USD Mn | 226.7 USD Mn |
| 2024 | 509.4 USD Mn | 207.2 USD Mn | 740.6 USD Mn | 626.9 USD Mn | 254 USD Mn |
| 2025 | 547.5 USD Mn | 229.9 USD Mn | 767.9 USD Mn | 664 USD Mn | 277.7 USD Mn |
| 2026 | 589.3 USD Mn | 255.5 USD Mn | 797.5 USD Mn | 704.5 USD Mn | 304.1 USD Mn |
| 2027 | 634.6 USD Mn | 284 USD Mn | 828.6 USD Mn | 747.7 USD Mn | 333.1 USD Mn |
| 2028 | 683 USD Mn | 315.6 USD Mn | 860.6 USD Mn | 793.1 USD Mn | 364.7 USD Mn |
| 2029 | 734.6 USD Mn | 350.3 USD Mn | 893.3 USD Mn | 840.8 USD Mn | 399 USD Mn |
| 2030 | 789.1 USD Mn | 388.4 USD Mn | 926.3 USD Mn | 890.3 USD Mn | 436 USD Mn |
| 2031 | 846.8 USD Mn | 430 USD Mn | 959.5 USD Mn | 941.8 USD Mn | 475.8 USD Mn |
| 2032 | 907.5 USD Mn | 475.5 USD Mn | 993 USD Mn | 995.2 USD Mn | 518.7 USD Mn |
Data Source: Wantstats Repository
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Global Epoxy Molding Compounds Market By Application
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Global Epoxy Molding Compounds Market By Packaging Technology
