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Global Epoxy Molding Compounds Market — Europe by Packaging Technology

By Packaging Technology, the market is segmented into System-in-Package (SiP), Fan-out & Wafer-level Packages, Discrete & Power Device Packages, Substrate-based Packages (BGA / CSP), and Leadframe-based IC Packages (SOP / QFP / QFN) (2022–2032)

Author: Wantstats Research TeamSource: Wantstats Repository
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Global Epoxy Molding Compounds Market — Europe by Packaging Technology — full underlying data
LabelSystem-in-Package (SiP)Fan-out & Wafer-level PackagesDiscrete & Power Device PackagesSubstrate-based Packages (BGA / CSP)Leadframe-based IC Packages (SOP / QFP / QFN)
202211.965253 USD Mn7.133677 USD Mn40.958012 USD Mn34.540656 USD Mn48.77964 USD Mn
202311.496105 USD Mn6.994565 USD Mn38.572764 USD Mn32.356754 USD Mn44.371153 USD Mn
202412.957743 USD Mn8.045807 USD Mn42.616698 USD Mn35.560228 USD Mn47.34923 USD Mn
202514.252771 USD Mn9.031956 USD Mn45.949183 USD Mn38.139139 USD Mn49.307952 USD Mn
202615.701626 USD Mn10.155033 USD Mn49.620281 USD Mn40.970206 USD Mn51.427721 USD Mn
202717.302004 USD Mn11.420875 USD Mn53.598848 USD Mn44.023791 USD Mn53.651911 USD Mn
202819.056496 USD Mn12.838801 USD Mn57.870251 USD Mn47.28434 USD Mn55.946063 USD Mn
202920.973514 USD Mn14.42259 USD Mn62.437563 USD Mn50.75099 USD Mn58.295796 USD Mn
203023.054804 USD Mn16.182158 USD Mn67.283435 USD Mn54.406364 USD Mn60.669334 USD Mn
203125.315166 USD Mn18.137241 USD Mn72.428497 USD Mn58.263969 USD Mn63.071469 USD Mn
203227.763083 USD Mn20.30421 USD Mn77.873324 USD Mn62.320961 USD Mn65.488818 USD Mn

Data Source: Wantstats Repository

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Growth Outlook

  • The Europe by Packaging Technology portion of the Global Epoxy Molding Compounds Market market is on a steady long-term growth path. Segment value stands at roughly USD 168 Million in 2026 and is projected to reach USD 254 Million by 2032 — a gain of about 51% over the forecast period, translating to a CAGR in the high single digits.
  • What the regional split looks like (2026): Leadframe-based IC Packages (SOP / QFP / QFN) leads, holding roughly 31% of segment value — the single largest regional share. Discrete & Power Device Packages is the second-largest contributor. Substrate-based Packages (BGA / CSP), System-in-Package (SiP) and Fan-out & Wafer-level Packages make up the remainder, in descending order.
  • By 2032, Discrete & Power Device Packages alone is expected to reach USD 78 Million, with Leadframe-based IC Packages (SOP / QFP / QFN) at USD 65 Million.

Market Dynamics

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