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Global Epoxy Molding Compounds Market — North America by Packaging Technology

By Packaging Technology, the market is segmented into System-in-Package (SiP), Fan-out & Wafer-level Packages, Discrete & Power Device Packages, Substrate-based Packages (BGA / CSP), and Leadframe-based IC Packages (SOP / QFP / QFN) (2022–2032)

Author: Wantstats Research TeamSource: Wantstats Repository
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Global Epoxy Molding Compounds Market — North America by Packaging Technology — full underlying data
LabelSystem-in-Package (SiP)Fan-out & Wafer-level PackagesDiscrete & Power Device PackagesSubstrate-based Packages (BGA / CSP)Leadframe-based IC Packages (SOP / QFP / QFN)
202214.576472 USD Mn10.089006 USD Mn32.474002 USD Mn39.777374 USD Mn44.54063 USD Mn
202314.231617 USD Mn10.095947 USD Mn31.071855 USD Mn37.756198 USD Mn41.510896 USD Mn
202416.30148 USD Mn11.852074 USD Mn34.880218 USD Mn42.045735 USD Mn45.388154 USD Mn
202518.222618 USD Mn13.577802 USD Mn38.21309 USD Mn45.695938 USD Mn48.432552 USD Mn
202620.402717 USD Mn15.578802 USD Mn41.932332 USD Mn49.74371 USD Mn51.764135 USD Mn
202722.850108 USD Mn17.878732 USD Mn46.027739 USD Mn54.166853 USD Mn55.34094 USD Mn
202825.579876 USD Mn20.508007 USD Mn50.50232 USD Mn58.959156 USD Mn59.139374 USD Mn
202928.615648 USD Mn23.50598 USD Mn55.374464 USD Mn64.132281 USD Mn63.154496 USD Mn
203031.972952 USD Mn26.907877 USD Mn60.644819 USD Mn69.676993 USD Mn67.360898 USD Mn
203135.686292 USD Mn30.767426 USD Mn66.348298 USD Mn75.623274 USD Mn71.771612 USD Mn
203239.782912 USD Mn35.135762 USD Mn72.502854 USD Mn81.980836 USD Mn76.379231 USD Mn

Data Source: Wantstats Repository

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Growth Outlook

  • The North America by Packaging Technology portion of the Global Epoxy Molding Compounds Market market is on a steady long-term growth path. Segment value stands at roughly USD 179 Million in 2026 and is projected to reach USD 306 Million by 2032 — a gain of about 70% over the forecast period, translating to a CAGR in the high single digits.
  • What the regional split looks like (2026): Leadframe-based IC Packages (SOP / QFP / QFN) leads, holding roughly 29% of segment value — the single largest regional share. Substrate-based Packages (BGA / CSP) is the second-largest contributor. Discrete & Power Device Packages, System-in-Package (SiP) and Fan-out & Wafer-level Packages make up the remainder, in descending order.
  • By 2032, Substrate-based Packages (BGA / CSP) alone is expected to reach USD 82 Million, with Leadframe-based IC Packages (SOP / QFP / QFN) at USD 76 Million.

Market Dynamics

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