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Global Epoxy Molding Compounds Market — U.S. by Packaging Technology

By Packaging Technology, the market is segmented into System-in-Package (SiP), Fan-out & Wafer-level Packages, Discrete & Power Device Packages, Substrate-based Packages (BGA / CSP), and Leadframe-based IC Packages (SOP / QFP / QFN) (2022–2032)

Author: Wantstats Research TeamSource: Wantstats Repository
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Global Epoxy Molding Compounds Market — U.S. by Packaging Technology — full underlying data
LabelSystem-in-Package (SiP)Fan-out & Wafer-level PackagesDiscrete & Power Device PackagesSubstrate-based Packages (BGA / CSP)Leadframe-based IC Packages (SOP / QFP / QFN)
202211.752749 USD Mn8.397629 USD Mn21.853962 USD Mn31.365076 USD Mn32.1582 USD Mn
202311.445302 USD Mn8.394503 USD Mn20.795852 USD Mn29.654591 USD Mn29.90823 USD Mn
202413.075182 USD Mn9.843874 USD Mn23.214321 USD Mn32.890483 USD Mn32.630401 USD Mn
202514.57603 USD Mn11.264401 USD Mn25.28752 USD Mn35.597506 USD Mn34.739624 USD Mn
202616.27356 USD Mn12.909279 USD Mn27.587245 USD Mn38.585197 USD Mn37.040739 USD Mn
202718.172113 USD Mn14.797057 USD Mn30.101624 USD Mn41.831302 USD Mn39.50151 USD Mn
202820.281162 USD Mn16.951702 USD Mn32.82737 USD Mn45.325917 USD Mn42.102928 USD Mn
202922.616631 USD Mn19.404343 USD Mn35.770906 USD Mn49.072649 USD Mn44.839275 USD Mn
203025.187654 USD Mn22.182438 USD Mn38.926781 USD Mn53.058763 USD Mn47.690248 USD Mn
203128.017909 USD Mn25.328404 USD Mn42.311191 USD Mn57.301096 USD Mn50.662752 USD Mn
203231.124808 USD Mn28.882138 USD Mn45.928787 USD Mn61.800461 USD Mn53.74907 USD Mn

Data Source: Wantstats Repository

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Growth Outlook

  • The U.S. by Packaging Technology portion of the Global Epoxy Molding Compounds Market market is on a steady long-term growth path. Segment value stands at roughly USD 132 Million in 2026 and is projected to reach USD 221 Million by 2032 — a gain of about 67% over the forecast period, translating to a CAGR in the high single digits.
  • What the regional split looks like (2026): Substrate-based Packages (BGA / CSP) leads, holding roughly 29% of segment value — the single largest regional share. Leadframe-based IC Packages (SOP / QFP / QFN) is the second-largest contributor. Discrete & Power Device Packages, System-in-Package (SiP) and Fan-out & Wafer-level Packages make up the remainder, in descending order.
  • By 2032, Substrate-based Packages (BGA / CSP) alone is expected to reach USD 62 Million, with Leadframe-based IC Packages (SOP / QFP / QFN) at USD 54 Million.

Market Dynamics

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