By Packaging Technology, the market is segmented into 2.5D / 3D IC & HBM Stacking, Fan-Out & Wafer-Level Packaging, Flip-Chip Packages (FCBGA / FCCSP), Power Modules & Discretes, and Wire-Bond Packages (Leadframe / Laminate) (2022–2032)
| Label | 2.5D / 3D IC & HBM Stacking | Fan-Out & Wafer-Level Packaging | Flip-Chip Packages (FCBGA / FCCSP) | Power Modules & Discretes | Wire-Bond Packages (Leadframe / Laminate) |
|---|---|---|---|---|---|
| 2022 | 92.9 USD Mn | 123.8 USD Mn | 410.2 USD Mn | 232.2 USD Mn | 688.9 USD Mn |
| 2023 | 108.4 USD Mn | 119.2 USD Mn | 375.7 USD Mn | 213.4 USD Mn | 609.6 USD Mn |
| 2024 | 142.1 USD Mn | 135.7 USD Mn | 408.8 USD Mn | 233.4 USD Mn | 641.5 USD Mn |
| 2025 | 179 USD Mn | 153.4 USD Mn | 443.1 USD Mn | 255.7 USD Mn | 673.2 USD Mn |
| 2026 | 216.2 USD Mn | 170.2 USD Mn | 472.8 USD Mn | 276.4 USD Mn | 696.3 USD Mn |
| 2027 | 256.2 USD Mn | 188.2 USD Mn | 504.8 USD Mn | 299.7 USD Mn | 721.6 USD Mn |
| 2028 | 298.5 USD Mn | 207.3 USD Mn | 537.9 USD Mn | 325.8 USD Mn | 747.5 USD Mn |
| 2029 | 343.1 USD Mn | 227.2 USD Mn | 572.5 USD Mn | 354.4 USD Mn | 774.8 USD Mn |
| 2030 | 389.8 USD Mn | 248.2 USD Mn | 608.5 USD Mn | 386.1 USD Mn | 803.4 USD Mn |
| 2031 | 438.2 USD Mn | 270.2 USD Mn | 645.3 USD Mn | 421.5 USD Mn | 833.2 USD Mn |
| 2032 | 488.2 USD Mn | 292.9 USD Mn | 683.4 USD Mn | 460.3 USD Mn | 864.7 USD Mn |
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Global Underfill and Die Attach Materials Market By End-Use Application
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Global Underfill and Die Attach Materials Market By Packaging Technology
