Deep Intelligence Across Industries

Company Headquarters: Geneva, Switzerland Founded: 1987 Workforce: ~ 45,500 Company Working: STMicroelectronics is one of the key semiconductor solution providers and integrated device manufacturers, globally. It offers products,, tools, and software & services to its end-use customers. These products & services can be used in the spectrum of electronics and semiconductor solutions. It conducts its business through three business segments, namely automotive and discrete group (ADG), analog, MEMS and sensors group (AMS), and microcontrollers and digital ICs group (MDG). The company offers its package and material products under the ADG segment. The company also offers a variety of software solutions and evaluation tools to its clients in order to evaluate the package and material product features and to monitor the power equipment’s critical electrical parameters. It is strongly involved in research & development activities to enhance its position in the market. For instance, it has approximately 7,400 employees involved in research & development and product design in order to have an edge in terms of technology. Furthermore, STMicroelectronics continuously updates its substantial patent rights; as the company has approximately 17,000 patents, 9,500 patent families till date, and 500 new patents filed in year 2017. It has a wide product portfolio ranging from amplifiers and comparators, audio ICs to wireless connectivity. It offers wide bandgap transistors and SiC diodes in power transistors and SiC devices segments, respectively. It has approximately 80 sales & marketing offices in 35 countries and 11 manufacturing sites, globally.

Company Headquarters: Taiwan Founded: 1984 Workforce: ~24,000 Company Overview: Siliconware Precision Industries Co. Ltd (SPIL) is engaged in the provision of semiconductor packaging, assembly, testing, and bumping services. Its assembly services include IC packaging processes for chipsets. SPIL also provides in-house design and consultation services. The company's test services are used to validate the assembly process by utilizing testing solutions for a range of digital and mixed signal devices. The bumping services include direct bumping, re-passivation, redistribution, wafer level CSP, and gold bumping services. Apart from this, the company offers packaging and testing solution including substrate packages and lead-frame packages with either wire bond or flip chip interconnections. The company also uses technologies such as wafer thinning, wire bonding, stacked-die bonding, wafer bumping, fine-pitch, and flip-chip assembly for developing packages including quad- plastic ball grid array (PBGA), thin and fine-pitch ball grid array (TFBGA), stacked-die chip scale package (CSP), flat no-leads (QFN), wafer level chip scale package (WLCSP), memory card, and flip chip ball grid array (FCBGA). The application of these packages could be observed in personal computers, consumer products, hand-held products, and wire communications. The company’s product portfolio comprises ball grid array, chip scale, stacked die, memory cards, and quad and dual leaded packages. The company's subsidiaries include SPIL (B.V.I.) Holding Limited, Siliconware US Inc., SPIL (Cayman) Holding Limited, and Siliconware Technology (Suzhou) Limited. Geographically, the company offers its solutions to the US, China, Taiwan, Europe, and other regions.

Company Headquarters: China Founded: 1972 Workforce: ~23,300 Company Overview: Jiangsu Changjiang Electronics Technology Co. Ltd (JCET) is engaged in designing, packaging, and testing of integrated circuits, discrete devices, and chips. It also focuses on the research, development, production, and sale of general industrial products, integrated circuit, semiconductor, electronic parts, and special electronics. The company’s discrete products include diodes, pins, rectifiers, transistors, MOSFET products, regulator circuits, thyristors, energy-saving lamp charger switches, and composite tubes. It also offers lead frame and laminate packaging products and packaging materials. The company's offerings primarily cater to IT and telecommunication and automotive industries. Geographically, JCET distributes its products to China and other countries. The company acquired STATS ChipPAC Pte Ltd in October 2015.

Company Headquarters: South Korea Founded: 1983 Workforce: ~10,000 Company Working: SK Hynix Inc. manufactures and sells semiconductor products globally. The company provides memory semiconductor products such as flash memory chips (NAND Flash), dynamic random-access memory chips (DRAM), and CMOS image sensors (CIS). The company operates in the US, Europe, and Asia among other regions. SK Hynix Inc. operates through its subsidiary in the US, the UK, Germany, Singapore, Hong Kong, India, Japan, Taiwan, and China. The company was formerly known as Hynix Semiconductor Inc. and changed its name to SK Hynix, Inc. in 2012.

Company Headquarters: Idaho, US Founded: 1978 Workforce: ~36,000 Company Overview: Micron Technology Inc. (Micron) is a memory and storage solutions provider. The company offers a broad portfolio of high-performance memory and storage technologies, such as DRAM, NAND, NOR Flash, and 3D XPoint memory. It operates in four segments, namely compute and networking business unit (CNBU), mobile business unit (MBU), storage business unit (SBU), embedded business unit (EBU) and others. The CNBU segment includes memory Components and solutions sold in the cloud server, enterprise, client, graphics, and networking markets. The MBU segment includes memory Components used in smartphone and other mobile-device markets, including discrete DRAM, discrete NAND, and managed NAND. SBU includes SSDs and component-level solutions used in the enterprise and cloud, client, consumer, and discrete storage markets. EBU includes memory and storage Components which include discrete DRAM, discrete NAND, managed NAND, and NOR used in automotive, industrial, and consumer markets. The company promotes its Component via its own sales force, independent sales representatives, distributors, and e-retailers to OEMs around the world. The company offers semiconductor memory and storage Components under Micron, Crucial, and Ballistix brand names. The company has a wide geographic presence in North America, Europe, Asia-Pacific, and Rest of the World.

Company Headquarters: Taiwan Founded: 1995 Workforce: ~650 Company Working: Nanya Technology Corporation manufactures, designs, and sells dynamic random-access memory (DRAM) products for different applications. The company operates in various regions and countries including Europe, the Americas, Japan, Korea, China, and Taiwan. The company’s products include standard DRAM, multi-chip package DRAM, Known Good Die (KGD), Low Power DRAM, and automotive and industrial DRAM’s. The products have wide application in office and enterprises, homes, portable devices, and mobiles; these are also used in the industrial and automotive sectors.

Company Headquarters: Taiwan Founded: 1994 Workforce: ~200 Company Working: Powerchip Technology Corporation (Powerchip Technology) is a Taiwan based company that manufactures and sells logic and memory products to the semiconductor industries in Taiwan and globally. The company provides technologies and services such as open foundry business services, design services, manufacturing services, memory wafer test services and process technology. Moreover, the company also provides open foundry technologies and products such as low power DRAM, LCD drivers, power management ICs, integrated memory chips, and others. Additionally, the company provides manufacturing, design, and memory wafer test service.

Company Headquarters: Taiwan Founded: 1988 Workforce: ~1,405 Company Working: Transcend Information, Inc. manufactures, designs, develops, and markets multimedia, industrial, and digital storage products globally. The company offers the products under the card readers and accessories, dashcams, memory cards, USB (universal serial bus) drives, DRAM (dynamic random-access memory) modules, external storage devices, SSDs (solid-state drives), body cameras, personal cloud storage devices, and wireless and multimedia products categories. The company operates in Asia, the Americas, and Europe, among other regions. The company operates through 14 offices worldwide

Company Headquarters: Taiwan Founded: 1987 Workforce: ~4,800 Company Working: Winbond Electronics Corporation is a Taiwan-based company that develops, manufactures, designs, and sells integrated circuits (ICs) and very-large-scale integration (VLSI) for microelectronic applications. The company operates in three segments namely dynamic random-access memory (DRAM) IC product, flash memory product, and logic IC product. The company provides mobile DRAM devices such as low power double-data-rate synchronous dynamic random-access memory (DDR SDRAM), low power SDR, pseudo-static random-access memory (SRAM), and low power DDR2 SDRAM products. DRAM products cover DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, SDRAM, and KGD. The company also provides flash memory products, serial NOR, parallel NOR, serial NAND, SLC NAND, and secure flash memory products such as TrustME. The company’s products are used in various applications such as mobile/networking, computing, consumer, automotive, and industrial, and wearable devices. In 2018, the company developed an advanced 3xnm process in order to secure its leading position in serial NOR flash memory. The company operates in Asia, Europe, the Americas, and other regions across the world.