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Asahi Diamond Industrial Co., Ltd.

Company Profile Analysis

Ticker: 6140.T旭ダイヤモンド工業株式会社

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Asahi Diamond Industrial Co., Ltd. - Chemicals & Materials showcase

Year Founded & Workforce

1937

2,065 Employees

Industry

Chemicals & Materials
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Asahi Diamond Industrial Co., Ltd. Overview

Asahi Diamond Industrial is an independent, single-business Japanese manufacturer of diamond and CBN tools, with about JPY 42 billion of sales and roughly 2,000 employees. Around 90% of its output is made to order, and customers reorder at a rate of about 90%, so revenue behaves like a consumable stream tied to customers' production volumes. Its largest end-market is electronics and semiconductors (40% of sales), where it supplies wafer grinding and edge wheels, electroplated diamond wire, CMP pad conditioners and dicing blades. The remainder serves transportation, machinery and stone and construction. The balance sheet is exceptionally conservative (78.5% equity ratio, net cash above JPY 11 billion), but returns have been weak: ROE has ranged from 3% to 6% for five years. The investment debate is whether the Medium-Term Management Plan 2030, which targets a 10% operating margin and 8% ROE, can convert AI-driven semiconductor demand and portfolio pruning into durable profitability.

Employee trend (consolidated, year-end headcount):


The company's own description. The Securities Report describes the group as a single-segment business that manufactures and sells diamond tools, including CBN tools and grinding wheels, mainly to the electronics and semiconductor, transportation equipment, machinery, and stone and construction industries. The corporate philosophy translates roughly as "making manufacturing more interesting", and the long-term vision, VISION 2030, is to become a global niche-top manufacturer that supports the world's manufacturing.

Independent characterisation. Asahi Diamond is best understood as a precision consumables company rather than a capital-goods company. Its tools wear out in proportion to the customer's processed volume, so demand tracks wafer area, vehicle and aircraft component output, bearing and ceramics production, and construction activity. The investor business report (28 Aug 2026) states that a 1.5-fold rise in a customer's output requires roughly 1.5 times the tools. That report gives three structural features:

Custom specification: About 90% of products are made to order and only about 10% are catalogue items. Tools are designed, prototyped and supplied around each customer's process conditions.

High stickiness: The repeat rate is about 90% across the four main industries. Once a tool is qualified into a semiconductor line it is rarely changed.

Direct relationships: Most sales are direct to end users. The machinery category is the exception, where a meaningful share goes through machine-tool builders, which lowers margins.

Revenue model. Revenue is almost entirely product sales recognised at a point in time, mainly on shipment for domestic sales. There is no subscription, licensing or material service revenue. Contract testing and "solution" services are listed only as a new business under consideration in the 2030 plan. Where the group acts as agent, revenue is booked net.

Value chain position. The company buys abrasive grain (synthetic diamond and CBN make up over 95% of grain volume, with some natural diamond), bond materials (metal, resin, vitrified, electroplating) and core bodies, in an approximate cost ratio of 2:2:6. It converts these into finished tools through sintering, electroplating, machining and finishing. It sits between abrasive suppliers and manufacturers of wafers, devices, components and structures. No customer exceeds 10% of sales (Securities Report FY2025).

Unit economics by end-market (FY2024, company approximations):

Source: investor business report, 28 Aug 2026 (volumes are approximate reference values).

Customer types. Silicon and SiC wafer makers, device makers and OSATs, FPD and electronic glass producers, wire drawers, automotive and aircraft component makers, bearing makers, ceramics part makers for semiconductor equipment, carbide tool makers, machine-tool builders, construction and demolition contractors, stone processors, mining and exploration drillers, universities and research institutes, and jewellery consumers (a small legacy line sold partly through TV shopping).

Strategy

Strategic architecture. VISION 2030 is being pursued through three plans described by management as "Hop, Step, Jump": the 2022 plan (Hop), the 2025 plan (Step) and the 2030 plan (Jump), which covers FY2026 to FY2030.

Review of Medium-Term Management Plan 2025 (FY2023 to FY2025). Targets were sales of JPY 49.0 billion, operating income of JPY 4.9 billion, a 10% operating margin and ROE of 6%. None was achieved: FY2025 came in at JPY 42.0 billion, JPY 2.4 billion, 5.7% and 3.2%. Management attributes the miss to stagnation in power semiconductors as EV adoption slowed and to a weaker Chinese economy. It points to the price-to-book ratio reaching about 1 as a positive. The capital policy (payout of at least 50% and a three-year average total return ratio of at least 120%) was carried out.

Medium-Term Management Plan 2030 (adopted 15 May 2026). Its two themes, in paraphrase, are to maximise the value of past investment and to convert the company to a reliably profitable structure. The plan's taglines are becoming a "global 100-year company" and an organisation where people grow and take on challenges.

Financial targets and capital policy.

Initiatives in the last 24 months.

Guidance. FY2026 guidance was raised on 7 August 2026 to revenue of JPY 45.5 billion and operating income of JPY 5.0 billion, an 11.0% margin.

Products & Services

The company does not publish a priced catalogue. About 90% of sales are custom tools, so specifications and prices are set per customer. The register below combines products named in the Securities Report, the research and development section, the investor business report, the website's product topics and the corporate history. Launch years are given where the company states them. Detailed specifications beyond those quoted are not publicly disclosed in the sources consulted.

Electronics and semiconductors

Product / brandDescription and capabilityTarget customerLaunch or latestNotes
Wafer surface-grinding wheelsDiamond wheels for thinning and flattening silicon, SiC and compound wafers; one of five focus productsWafer makers, device makers, OSATsOngoingManagement cites rising demand from AI-related advanced silicon devices; SiC demand slowed with EV sales in FY2024 and FY2025
Wafer edge (chamfering) wheelsWheels for peripheral edge grinding of wafers; focus productWafer makersOngoingNamed in the 2030 plan
Electroplated diamond wire "EcoMEP"Fixed-abrasive wire for slicing hard and brittle materials; focus productWafer and ingot makers, glass processors2,007Solar-use sales of about JPY 10 billion a year in 2015 to 2018 have almost disappeared. Semiconductor and glass uses are growing; FY2025 saw growth in glass processing
CMP conditioners "NEOgO SR" and "SUNBRUSH"Pad conditioners that stabilise polishing performance in chemical mechanical planarisation of devices and wafers; focus productDevice fabs, wafer makersCategory launched 2003; the two named products developed in FY2025Securities Report research and development section
Dicing bladesThin blades for singulating wafers and packages; focus productDevice makers, OSATsOngoingNamed in the 2030 plan
Hub blades (AA Diamond Technology)Hub-type dicing blades for dicing saws, developed by the 50:50 joint venture with Tokyo SeimitsuDevice makers using dicing machinesPromotion started 1 Jul 2026; mass-production sales targeted for the second half of FY2027Company estimates the hub blade market at over JPY 30 billion (FY2023) and targets a 10% to 20% share initially
Inner-diameter (ID) bladesBlades for ingot slicing; historically a high-share, high-margin productWafer makersLegacyLargely displaced by wire sawing as ingots grew
Tools for FPD and electronic glassWheels and cutters for glass substratesGlass makers (AGC and Nippon Electric Glass are disclosed customers)OngoingFPD sales flat in FY2025
Diamond diesWire-drawing dies; the company's founding product lineWire and cable makers1,944Reported under "wire drawing"; special-wire demand fell in FY2025
Tools for electronic componentsGrinding and cutting tools for ceramic and magnetic components and substratesComponent makersOngoingContributed to FY2024 and FY2025 growth

Transportation equipment

Product / brandDescription and capabilityTarget customerLaunch or latestNotes
Diamond and CBN grinding wheels (metal, resin, vitrified, electroplated bonds)Wheels for engine, shaft, chassis and brake partsAutomotive part makersVitrified since 1961; CBN since 1969Demand tracks vehicle output; FY2025 was hit by lower production linked to US trade policy
Rotary dressers, including "SA Dresser" and "KD Dresser"High-precision form dressers for dressing grinding wheels. SA Dresser offers short delivery, as fast as 15 business days, for samples, small lots and design changesAutomotive and bearing grinding linesCategory since 1965; SA Dresser developed in FY2025; KD Dresser featured in trade press in 2023Securities Report; website
Aircraft-engine part toolsTools for jet-engine componentsAerospace suppliersOngoingSales rose in FY2024 and FY2025 as aircraft demand recovered and product qualification advanced
Tools for EV partsTools for brake parts, e-axle parts, battery-related parts and magnetic materialsEV component makersDevelopment focusNamed as an opportunity in climate scenario analysis

Machinery

Product / brandDescription and capabilityTarget customerLaunch or latestNotes
"PCD Multi Edges" end millMulti-flute end mill with cutting edges made entirely of PCD, for drilling and helical milling of quartz glass, SiC ceramics and cemented carbideMakers of semiconductor-equipment parts, mould and carbide processorsDeveloped in FY2025Securities Report
"AFF" superfinishing stoneStone for superfinishing bearing raceways; good chip evacuation and resistance to loading; life 5 to 30 times that of conventional stones according to the companyBearing makersDeveloped in FY2025Securities Report
"M-cloud"Ultra-porous metal-bond wheelPrecision grinding usersFeatured on website—
"AG Wheel"Electroplated wheel with arranged grain placementPrecision grinding usersFeatured on website—
"ARVO" seriesProduct series featured on website—Featured on website—
"Aero Metal"Porous metal-bond wheelPrecision grinding usersFeatured on website—
Tools for ceramicsWheels and cutting tools for ceramic parts used in semiconductor equipment and processesCeramics makersOngoingLargest driver of machinery growth in FY2025 and Q1 FY2026
Tools for carbide tool makersWheels for grinding carbide tools, including tools used for electronic substrate processingTool makers (Union Tool, Tenryu Saw, Nachi-Fujikoshi and Dijet are disclosed customers)OngoingAutomotive tool demand weak; substrate tools strong
Conventional grinding wheels (Koremura)General abrasive wheelsGeneral industryAcquired 2013Subsidiary relocated its head office and plant in FY2023

Stone and construction

Product / brandDescription and capabilityTarget customerLaunch or latestNotes
Diamond blades and cuttersBlades for concrete, asphalt, stone and tileContractors, stone processors (Daiichi Cutter Kogyo and Makita are disclosed customers)1,956Domestic large projects were weak in FY2024 and FY2025
Dry-cut asphalt bladeBlade that cuts asphalt without water, removing sludge and wastewater treatment and shortening work timeRoad-repair contractorsDeveloped in FY2025Securities Report
Diamond bitsCore and drilling bits for construction and resource explorationDrilling and exploration contractors1,951Indonesian mining demand fell in FY2025
Wire saws and band sawsTools for cutting stone and structuresStone and demolition usersOngoingListed by Monex among main products

Other

Product / brandDescriptionNotes
Jewellery (Asahi Diamond Jewelry)Consumer jewellery sold through TV shopping and an online shopSince 1976. Coupons for the online shop are an option in the new shareholder benefit programme
Tools for universities, research institutes and kilnsSpecimen-processing and refractory-processing toolsJPY 1,113 million of "Other" sales in FY2025

Financial Narrative

Income statement

Notes. EBITDA is operating income plus depreciation and goodwill amortisation (Envalith; consistent with the cash flow statements for FY2023 to FY2025). Diluted EPS is not presented because there are no dilutive securities. Revenue CAGR from FY2021 to FY2025 is 3.1% (analyst calculation). Sources: Securities Report FY2025 five-year summary; Tanshin; Envalith.

Commentary.

Revenue: FY2021 was a sharp recovery (+23%) from the pandemic trough of JPY 30.1 billion. Growth then slowed to low single digits. The FY2023 dip came from destocking in machinery and softer Japan, Taiwan and China demand. FY2024 and FY2025 were led by AI-related advanced semiconductor tools and memory recovery, offset by stagnant SiC power-device demand.

Gross margin: The low was 25.9% in FY2023. The rise to 28.2% in FY2025 reflects price increases implemented in stages over three years and productivity gains. The company's FY2026 forecast implies a gross margin of 31.9% (investor business report), and management referred to a 35% gross margin goal at the May 2026 briefing.

Operating income: Operating margin has stayed between 3.9% and 7.6%, well short of the 10% targeted by both the 2025 and 2030 plans. FY2025 profit growth was held back by higher retirement benefit cost, personnel cost and depreciation (results briefing, 26 May 2026).

Pension accounting effect: The company expenses actuarial differences in a single year, the year after they arise. Defined-benefit cost swung from a credit of JPY 14 million in FY2024 to a charge of JPY 513 million in FY2025. An unrecognised actuarial gain of JPY 1,402 million at March 2026 will be recognised in FY2026. This is an analyst reading of the pension notes: roughly JPY 1.6 billion of the forecast FY2026 operating profit improvement is attributable to this swing rather than to trading. Management itself said FY2028 operating profit will be below FY2026 because of temporary retirement benefit effects.

Below operating income: Ordinary income is consistently higher than operating income because of equity-method income (JPY 199 million in FY2025, mainly Shinhan Diamond), dividends, interest and foreign exchange gains (JPY 464 million in FY2025).

Extraordinary items: Gains on sales of cross-held shares were booked every year (JPY 850 million, 730 million and 1,304 million in FY2023 to FY2025). FY2025 also included a JPY 620 million gain on the sale of a former European factory and an impairment loss of JPY 1,920 million, of which JPY 1,801 million related to Asahi Diamond Industrial Europe SAS.

Tax: The effective rate rose to 38.8% in FY2025 because valuation allowances were raised against the European losses (+15.7 points), partly offset by research and development tax credits (-8.6 points).

Balance sheet

Notes. Debt figures follow the investor business report (lease obligations excluded). Working capital is current assets less current liabilities. Goodwill is small and is not separately shown on the balance sheet: JPY 191 million arose on the India acquisition and is amortised over seven years at about JPY 27 million a year. Intangibles rose in FY2025 because of capitalised ERP investment.

Commentary. The balance sheet is dominated by equity. Management now treats this as a problem to be corrected: the 2030 plan aims to lower the equity ratio from about 80% to about 75% through borrowing and returns. Long-term borrowing was introduced for the first time in years in FY2024 (JPY 2.0 billion) and raised to JPY 4.5 billion in FY2025 at an average rate of 1.54%. Inventories have risen every year and now equal 113 days of cost of sales. PP&E fell in FY2025 because of the European impairment and lower capex after two heavy years. Investment securities of JPY 13.3 billion include JPY 7.6 billion of equity-method holdings and JPY 5.6 billion of listed cross-shareholdings.

Cash flow

Notes. Separately from capex, ERP investment was JPY 766 million in FY2025 and is planned at JPY 1,660 million in FY2026 (Q1 FY2026 Tanshin).

Commentary. Operating cash flow has averaged about JPY 5 billion. FY2023 was the exception, when inventory build and lower profit cut it to JPY 2.8 billion. FY2023 and FY2024 capex of about JPY 5 billion a year went into semiconductor tool capacity and reorganisation of domestic production. The business report puts investment over FY2023 to FY2025 at about JPY 15 billion. Capex fell back to JPY 2.7 billion in FY2025 and is planned at JPY 3.0 billion in FY2026. Shareholder returns in FY2025 (dividends declared of about JPY 1.47 billion plus JPY 2.49 billion of buybacks) were about 197% of net income (analyst calculation).

Ratios

Notes. ROE is company-disclosed. ROA is company-disclosed for FY2022 to FY2025 and calculated for FY2021. ROIC is an analyst calculation: operating income after a 30.3% statutory tax rate, divided by year-end net assets plus interest-bearing debt. Interest coverage is company-disclosed for FY2021 to FY2024 and calculated for FY2025. Working-capital days use year-end balances.

Commentary. ROE has fallen from 5.7% to 3.2%, far below any reasonable cost of equity and below the 6% targeted by the previous plan. The two causes are thin margins and a low-turnover, over-capitalised balance sheet (asset turnover about 0.54). The cash conversion cycle is long at about 186 days and lengthening, driven by inventory. Management has named cash-conversion-cycle improvement as an ROE lever in the 2030 plan. Leverage and liquidity are not constraints. The group had JPY 8.9 billion of undrawn overdraft and commitment lines at March 2026.

Latest quarter and current-year forecast

First-half FY2026 forecast (revised): revenue JPY 22,400 million, operating income JPY 2,500 million, ordinary income JPY 2,700 million, net income JPY 1,900 million. Sources: Q1 FY2026 Tanshin; Kabutan.

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Financial Detail

Segment Revenue

CategoryContents (company descriptions)

Electronics and semiconductors

Tools for wafer and ingot processing (silicon, SiC, compound semiconductors), device processing, memory production, FPD and electronic glass, electronic components and wire drawing; includes electroplated diamond wire

Transportation equipment

Tools for automobile parts (engine, shaft, chassis and brake parts) and aircraft parts (jet-engine components)

Machinery

Tools for bearings, ceramics (including parts for semiconductor equipment), carbide tools, machine tools, moulds and substrate-processing tools

Stone and construction

Blades, bits and wire tools for stone processing, construction and demolition, road repair and resource exploration

Other

Universities, research institutes, ceramics kilns and jewellery

Revenue by Segment

IndustryFY2021FY2022FY2023FY2024FY2025

Electronics and semiconductors (JPY Mn)

13,75214,75714,68416,66716,978

Transportation equipment (JPY Mn)

8,1158,2829,2049,6929,632

Machinery (JPY Mn)

9,83210,6409,4349,43010,373

Stone and construction (JPY Mn)

4,1244,2394,2183,9753,885

Other (JPY Mn)

1,3351,4011,1111,2401,113

Total (JPY Mn)

37,16139,32038,65341,00641,983

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Revenue by Segment (%)

IndustryFY2021FY2022FY2023FY2024FY2025

Electronics and semiconductors (% YoY)

24.27.3-0.513.51.9

Transportation equipment (% YoY)

19.32.111.15.3-0.6

Machinery (% YoY)

31.88.2-11.30.010.0

Stone and construction (% YoY)

13.52.8-0.5-5.8-2.3

Other (% YoY)

13.54.9-20.711.6-10.3

Total (% YoY)

23.35.8-1.76.12.4

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Revenue by Segment (%) — Electronics and semiconductors

IndustryFY2021FY2022FY2023FY2024FY2025

Electronics and semiconductors (% of sales)

37.037.538.040.740.4

Transportation equipment (% of sales)

21.821.123.823.622.9

Machinery (% of sales)

26.527.024.423.024.7

Stone and construction (% of sales)

11.110.810.99.79.3

Other (% of sales)

3.63.62.93.02.7

Group Entities

EntityLocationOwnership (%)Role

Yamanashi Asahi Diamond Industrial Co., Ltd.

Nirasaki, Yamanashi, Japan

100.0

Manufacturing; supplies the parent (specified subsidiary)

Koremura Asahi Diamond Industrial Co., Ltd.

Ichihara, Chiba, Japan

100.0

Grinding wheels; manufacture and sale (specified subsidiary)

Asahi Diamond Industrial Europe SAS

Eure-et-Loir, France

100.0

Manufacture and sale, Europe

Asahi Diamond Industrial Germany GmbH

Dortmund, Germany

100.0

Sales

Taiwan Diamond Industrial Co., Ltd.

Taoyuan, Taiwan

69.1

Manufacture and sale (specified subsidiary)

Shanghai Xuhui Diamond Industrial Co., Ltd.

Shanghai, China

100.0

Manufacture and sale

P.T. Asahi Diamond Industrial Indonesia

Bekasi, Indonesia

100.0

Manufacture and sale

Asahi Diamond (Thailand) Co., Ltd.

Bangkok, Thailand

90.0

Manufacture and sale

Asahi Diamond America, Inc.

Ohio, USA

100.0

Sales

Asahi Diamond Industrial Scandinavia AB

Örebro, Sweden

100.0

Sales

Asahi Diamond Industrial Australia Pty., Ltd.

Mona Vale, Australia

100.0

Sales

Asahi Diamond de Mexico, S.A. de C.V.

León, Mexico

100.0

Sales

Asahi Diamond Industrial Malaysia Sdn. Bhd.

Kuala Lumpur, Malaysia

100.0

Sales support

Asahi Diamond Industrial India Pvt. Ltd.

Pune, India

100.0

Sales

Asahi Diamond Vietnam Co., Ltd.

Hanoi, Vietnam

100.0

Sales support

Shinhan Diamond Industrial Co., Ltd. (equity method)

Incheon, Korea

28.5

Manufacture and sale

AA Diamond Technology Co., Ltd. (equity method)

Ichihara, Chiba, Japan

50.0

Hub blade research and development, manufacture and sale

Income Statement and Per-Share Data

MetricFY2021FY2022FY2023FY2024FY2025

Revenue (JPY Mn)

37,16139,32038,65341,00641,983

Cost of sales (JPY Mn)

26,81128,79028,65529,70430,164

Gross profit (JPY Mn)

10,35010,5309,99811,30211,819

SG&A (JPY Mn)

7,5398,0248,4718,9919,415

Operating income (JPY Mn)

2,8112,5061,5262,3112,403

EBITDA (JPY Mn)

5,7725,3884,5085,6665,905

Ordinary income (JPY Mn)

3,6503,2752,4083,0703,346

Pre-tax income (JPY Mn)

4,4083,8303,1063,7993,378

Net income attributable to owners (JPY Mn)

3,2882,7652,1092,4932,009

EPS basic (JPY)

59.2350.8840.5748.3640.92

Dividend per share (JPY)

2426303030

Gross margin (%)

27.926.825.927.628.2

Operating margin (%)

7.66.43.95.65.7

EBITDA margin (%)

15.513.711.713.814.1

Net margin (%)

8.87.05.56.14.8

Revenue growth (% YoY)

23.35.8-1.76.12.4

Balance Sheet and Margin Analysis (%)

MetricFY2021FY2022FY2023FY2024FY2025

Total assets (JPY Mn)

72,24174,17773,90176,35179,203

Cash and equivalents (JPY Mn)

15,54816,38912,81814,81016,156

Trade receivables (JPY Mn)

10,64210,05910,38710,03810,757

Inventories (JPY Mn)

6,7447,2208,1858,7599,367

Property, plant and equipment (JPY Mn)

25,43425,06126,65528,84526,443

Intangible assets incl. goodwill (JPY Mn)

2401903514081,057

Short-term interest-bearing debt (JPY Mn)

21017954423444

Long-term interest-bearing debt (JPY Mn)

0002,0004,500

Total debt (JPY Mn)

2101795442,2344,544

Net debt (JPY Mn; negative = net cash)

-15,338-16,210-12,274-12,576-11,612

Shareholders' equity excl. minorities (JPY Mn)

59,29261,17362,24161,65262,208

Net assets (JPY Mn)

60,86962,88263,99363,57964,133

Working capital (JPY Mn)

28,28029,04626,41627,81630,129

Equity ratio (%)

82.182.584.280.778.5

Book value per share (JPY)

1,067.791,142.251,207.321,200.541,292.35

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Cash Flow

MetricFY2021FY2022FY2023FY2024FY2025

Operating cash flow (JPY Mn)

5,9484,9792,8395,7655,412

Investing cash flow (JPY Mn)

-356-1,260-3,505-3,820-2,120

Capital expenditure, company basis (JPY Mn)

—2,2764,9985,2982,726

Purchase of PP&E, cash basis (JPY Mn)

——4,6754,9992,956

Depreciation of PP&E (JPY Mn)

—2,8032,8863,2573,414

Free cash flow, OCF plus investing CF (JPY Mn)

5,5923,719-6661,9453,292

Financing cash flow (JPY Mn)

-1,077-3,145-3,121-212-1,883

Dividends paid (JPY Mn)

——1,5811,5531,511

Share buybacks (JPY Mn)

——1,7262012,489

Returns & Leverage Ratios (%) and Financial Ratios (x)

MetricFY2021FY2022FY2023FY2024FY2025

ROE (%)

5.74.63.44.03.2

ROA, net income basis (%)

4.73.82.83.32.6

ROIC (%)

3.22.81.62.42.4

Current ratio (x)

6.576.535.275.195.49

Debt to equity (x)

0.0040.0030.0090.0360.073

Net debt to EBITDA (x)

-2.66-3.01-2.72-2.22-1.97

Interest coverage, OCF to interest paid (x)

1,266.4245.0380.9275.682.0

Asset turnover (x)

0.530.540.520.550.54

Days sales outstanding (days)

104.593.498.189.393.5

Days inventory outstanding (days)

91.891.5104.3107.6113.3

Days payables outstanding (days)

20.318.718.120.421.0

Cash conversion cycle (days)

176.0166.2184.3176.5185.8

Dividend payout ratio (%)

40.551.173.962.073.3

Income Statement and Margin Analysis (%)

Item (JPY Mn)Q1 FY2025 (Apr to Jun 2025)Q1 FY2026 (Apr to Jun 2026)Change (%)

Revenue

10,02611,125+11.0

Gross profit

2,8563,793+32.8

Operating income

5851,457+149.1

Ordinary income

7991,575+97.2

Net income attributable to owners

8381,176+40.3

Operating margin (%)

5.813.1—

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Income Statement and Per-Share Data (Change vs FY2025 actual (%)–Revised (7 Aug 2026))

FY2026 company forecast (JPY Mn)Initial (15 May 2026)Revised (7 Aug 2026)Change vs FY2025 actual (%)

Revenue

44,00045,500+8.4

Operating income

3,7005,000+108.0

Ordinary income

3,8005,300+58.4

Net income attributable to owners

2,6003,700+84.1

EPS (JPY)

54.076.87—

Dividend per share (JPY)

3434—

Revenue by Region

RegionFY2021FY2022FY2023FY2024FY2025

Japan (JPY Mn)

19,15019,17917,38718,21719,512

Taiwan (JPY Mn)

3,3883,4543,0803,1112,889

China (JPY Mn)

3,6474,3203,7044,2754,928

Other Asia and Oceania (JPY Mn)

4,9645,6766,0416,5356,819

Europe (JPY Mn)

3,3993,6054,3664,5144,330

North America (JPY Mn)

1,8412,2442,8852,8692,172

Other (JPY Mn)

7688381,1871,4821,331

Total (JPY Mn)

37,16139,32038,65341,00641,983

Revenue by Region (%)

RegionFY2021FY2022FY2023FY2024FY2025

Japan (% YoY)

15.60.2-9.34.87.1

Taiwan (% YoY)

29.81.9-10.81.0-7.1

China (% YoY)

24.318.5-14.315.415.3

Other Asia and Oceania (% YoY)

24.414.36.48.24.3

Europe (% YoY)

41.16.121.13.4-4.1

North America (% YoY)

—21.928.6-0.6-24.3

Other (% YoY)

-53.09.141.624.9-10.2

Revenue by Region (%) — Japan

RegionFY2021FY2022FY2023FY2024FY2025

Japan (% of sales)

51.548.845.044.446.5

Taiwan (% of sales)

9.18.88.07.66.9

China (% of sales)

9.811.09.610.411.7

Other Asia and Oceania (% of sales)

13.414.415.616.016.2

Europe (% of sales)

9.19.211.311.010.3

North America (% of sales)

5.05.77.47.05.2

Other (% of sales)

2.12.13.13.63.2

Capital Markets Data (JPY) and Valuation Multiples (x)

MetricFY2021FY2022FY2023FY2024FY2025

Fiscal-year high (JPY)

7439791,0041,0011,735

Fiscal-year low (JPY)

498546780733684

Approximate fiscal year-end price (JPY)

5929369788321,183

Price-to-earnings ratio at year-end (x)

10.018.424.117.228.9

Total shareholder return index (%; Mar 2021 = 100)

115.8185.7198.9177.4249.0

TOPIX total return index (%; Mar 2021 = 100)

102.0107.9152.5150.2202.2

Valuation Snapshot

MultipleValueBasis

Market capitalisation

About JPY 54.1 billion

48.43 million shares

P/E, trailing

27.3x

FY2025 EPS JPY 40.92

P/E, forecast

14.5x

FY2026 company EPS forecast JPY 76.87

P/B

0.84x

Book value per share JPY 1,330.37 at 30 Jun 2026

Enterprise value

About JPY 43.6 billion

Market capitalisation less net cash of about JPY 10.5 billion at 30 Jun 2026; excludes minority interests and JPY 15.7 billion of investment securities

EV/EBITDA, trailing

7.4x

FY2025 EBITDA JPY 5.9 billion

EV/Sales, trailing

1.04x

FY2025 sales JPY 42.0 billion

Dividend yield, forecast

3.0%

JPY 34 per share

Per-Share Data and Returns & Leverage Ratios (%)

MetricFY2021FY2022FY2023FY2024FY2025

Dividend per share (JPY)

2426303030

Interim dividend per share (JPY)

811151515

Consolidated payout ratio (%)

40.551.173.962.073.3

Shares issued at year-end (million)

55.7053.8951.8951.8948.43

Capital Programmes

ProgrammeAuthorisationExecutedCancellation

FY2022

——

1,811,400 shares, 22 Nov 2022

FY2023

—

2,000,000 shares; JPY 1,726 million

2,000,000 shares, 21 Nov 2023

Feb to Aug 2025

2,000,000 shares; JPY 1.5 billion

2,000,000 shares; JPY 1,488.5 million

2,000,000 shares, 22 Aug 2025

Aug to Dec 2025

1,600,000 shares; JPY 1.2 billion

1,448,600 shares; JPY 1,200.0 million

1,458,600 shares, 24 Feb 2026

Debt Maturity Profile

Maturity bucketLong-term borrowings (JPY Mn)Lease obligations (JPY Mn)

Within 1 year

0 (short-term borrowings 44)

65

1 to 2 years

27647

2 to 3 years

2,27639

3 to 4 years

27619

4 to 5 years

2766

Over 5 years

1,3961

Total

4,500179

Analyst Conclusions

Management guidance. For FY2026 the company forecasts revenue of JPY 45.5 billion (+8.4%), operating income of JPY 5.0 billion (+108%, an 11.0% margin), ordinary income of JPY 5.3 billion, net income of JPY 3.7 billion (EPS JPY 76.87) and a dividend of JPY 34. It plans capex of JPY 3.0 billion, depreciation of JPY 3.5 billion, R&D of JPY 2.7 billion and ERP investment of JPY 1.66 billion. Q1 delivered 29% of full-year operating income. The 2030 plan targets revenue of JPY 53.0 billion, operating income of JPY 5.3 billion and ROE of 8% or more by the year to March 2031. Management has warned that operating income in the year to March 2029 will be below FY2026 on retirement benefit effects.

Consensus. The limited consensus available moved from JPY 4.0 billion to about JPY 5.5 billion of ordinary income for FY2026 after the August revision, slightly above company guidance.

Bull case.

  1. Operating leverage on semiconductor demand is visible. Q1 FY2026 gross margin was 34.1% (JPY 3,793 million on JPY 11,125 million) against 28.5% a year earlier, close to management's 35% ambition. Japan sales rose 16%, and electronics and semiconductor sales rose 12.7%.

  2. Self-help is credible and measurable. Three products exited and ten under review, European plant consolidation done and assets written down, price increases accepted. The 10% margin target is reached in FY2026 on guidance, four years early, albeit with pension help.

  3. Capital returns and valuation. At 0.84 times book and 14.5 times forecast earnings, with net cash equal to about one-fifth of market capitalisation, a 3% yield with a progressive floor, a 100% total-return commitment and JPY 5.6 billion of cross-holdings still to sell, the downside is cushioned. The hub blade venture is an unpriced option.

Bear case.

  1. FY2026 profit is flattered. Roughly JPY 1.6 billion of the operating income increase reflects the swing in actuarial-difference recognition, by analyst estimate. Management's own plan shows lower operating income two years later, and FY2030's JPY 5.3 billion target is barely above FY2026 guidance.

  2. The record on plans is poor and the cycle is not benign. The 2025 plan missed sales by 14% and operating income by 51%. The semiconductor category fell 29% in the year to March 2019. The company's previous growth product, solar wire, was eliminated by Chinese competition, and its main raw material is now subject to Chinese export controls.

  3. Structural return gap. Even on FY2026 guidance, ROE is only about 6% (JPY 3.7 billion on about JPY 63 billion of equity, analyst calculation). The cash conversion cycle is lengthening. The hub blade venture faces an entrenched, far larger incumbent and yields no mass-production revenue before late FY2027. Succession for a 74-year-old President is unresolved.

Catalysts and monitorables for the next 12 months.

Analyst verdict. Asahi Diamond Industrial is a well-capitalised, technically capable consumables maker that has spent a decade earning less than its cost of capital. The loss of its solar wire business after 2016 removed roughly a quarter of revenue, and the 2025 plan's bet on SiC power devices arrived just as EV demand slowed. What has changed in 2026 is the combination of a favourable demand mix (AI-related advanced logic and memory, plus ceramics and substrate tools for semiconductor equipment) with a management that is finally addressing the cost base, the product tail, Europe and the balance sheet at the same time. The first quarter of FY2026 showed what the business can earn when volume, price and mix align: a 13% operating margin.

The caution is that guidance for FY2026 overstates sustainable profit. A large pension actuarial gain is being recognised in a single year, and the company's own medium-term path shows operating income dipping afterwards and reaching only JPY 5.3 billion by March 2031. On that trajectory ROE approaches, but does not comfortably exceed, 8%. The competitive position is respectable rather than dominant: in dicing and wafer grinding the company faces a rival with ten times its sales, and in CMP conditioners it faces well-entrenched American, Taiwanese and Korean suppliers.

The shares at 0.84 times book, with a 3% progressive dividend and a commitment to return all earnings over five years, price in little of the improvement. The balance of evidence supports a constructive but conditional view: the stock is inexpensive protection with optionality on semiconductor consumables and hub blades. A re-rating above book value requires proof, in the two or three quarters after the pension effect fades, that gross margin can hold above 30% and that the portfolio exits are actually executed.


Data caveats and source discrepancies

  1. Founding location. The Securities Report states Ota-ku, Tokyo; the website history states Shinagawa-ku, with the Yukigaya plant in Ota-ku built in 1938.

  2. Fiscal-year labels. Some secondary sources label the year ended March 2026 as "FY2026", others as "FY2025".

  3. Electronics and semiconductor share for FY2024. The company's own supplementary table shows 40.7%; arithmetic from disclosed amounts gives 40.6%. The company figure is used.

  4. Net income for the years to March 2020 and 2021. The investor business report shows losses of JPY 340 million and JPY 331 million; one aggregator (Finboard) shows JPY 287 million and JPY 307 million, which appear to be figures before non-controlling interests. Company figures are used.

  5. Shares outstanding. Some market-data sites still show about 55.5 million shares. The correct figure after cancellations is 48,430,000.

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Executive Leadership

Board of Directors

NamePositionBornJoined / appointedCareer highlightsShares held (thousand)

Kazuki Kataoka (片岡 和喜)

President and Representative Director

5 Mar 1952

Joined 1976; director 2008; President since Jun 2015

Head of sales technology; managing director for corporate strategy; senior managing director and head of sales

197

Tomohiko Hara (原 智彦)

Representative Managing Director; head of Production Division; Mie plant manager

10 Jan 1958

Joined 1980; director 2019; current post Jun 2022

Tamagawa plant; President of P.T. Asahi Diamond Industrial Indonesia; ASEAN and Australia head

52

Toshimasa Hagiwara (萩原 利昌)

Director; head of Sales Division; East Japan head

10 Nov 1959

Joined 1982; director 2014

Nagoya branch manager; chairman of the Shanghai subsidiary; China and Taiwan head

58

Junichi Matsuda (松田 順一)

Director; head of Overseas Business Division and Corporate Strategy Division

11 Apr 1961

Joined 1986; director 2022

Head of the research laboratory; head of corporate strategy

21

Hiroaki Kawai (川合 宏明)

Director; Chiba plant manager

31 Jul 1967

Joined 1990; director Jun 2025

Tokyo sales manager; Central Japan head and Nagoya branch manager

8

Kenichi Kanemoto (兼本 憲一)

Director; Tamagawa plant manager and head of Procurement

26 Sep 1970

Joined 1996; director Jun 2026

Mie plant administration; procurement; executive officer since 2024

6

Yuko Ichikawa (市川 祐子)

Outside Director (independent); chair of the advisory committee

26 Dec 1970

Since Jun 2021

Former head of investor relations at Rakuten; founder of Market River; outside director at several listed and private companies

none disclosed

Eriko Kawajiri (川尻 恵理子)

Outside Director (independent)

18 Aug 1975

Since Jun 2023

Former judge and prosecutor; attorney at Hello Law Office; outside director at Rasa Corporation and others

none disclosed

Tetsuya Nakamura (中村 哲也)

Outside Director (independent)

25 Dec 1958

Since Jun 2026

Former NEC corporate planning head; former director and managing executive officer of Japan Aviation Electronics Industry

none disclosed

—

Full-time Corporate Auditor

7 Jul 1961

Joined 1985; auditor since Jun 2022; reappointed Jun 2026

Accounting and finance department

20

Yukio Otaka (大高 由紀夫)

Outside Corporate Auditor (independent)

23 Oct 1955

Since Jun 2015

Former Mizuho Corporate Bank (Bahrain and Dubai offices)

none disclosed

—

Outside Corporate Auditor (independent)

5 Aug 1953

Since Jun 2017

Former Bank of Tokyo-Mitsubishi; former representative director and CFO of Chiyoda Corporation

none disclosed

Directors' Remuneration

CategoryTotal (JPY Mn)FixedPerformance-linkedStockRecipients

Directors excluding outside directors

1491184267

Corporate auditors excluding outside auditors

1616001

Outside officers

3636005

Total

20217142613

Major Shareholders

RankShareholderShares (thousand)Stake (%)
1

The Master Trust Bank of Japan, Ltd. (trust account)

4,4999.29
2

Asahi Diamond Employee Shareholding Association

2,0114.15
3

Custody Bank of Japan, Ltd. (trust account; includes 286 thousand shares of the officer stock trust)

1,6893.49
4

Asahi Dia Kyoei Shareholding Association (business partners)

1,3292.75
5

Nippon Life Insurance Company

1,0392.15
6

Union Tool Co.

9041.87
7

Rakuten Securities, Inc. (joint account)

7421.53
8

Nomura Securities Co., Ltd.

6941.43
9

JP JPMSE LUX RE BARCLAYS CAPITAL SEC LTD EQ CO

5131.06
10

The Bank of New York Mellon 140044

4020.83
—

Top 10 total

13,82528.55

Competitive Landscape

Key Competitors

CompetitorHomeOverlap with Asahi DiamondScale indicatorPositioning relative to Asahi Diamond

DISCO Corporation (TSE 6146)

Japan

Dicing blades, grinding wheels for wafer thinning

FY2025 sales JPY 436.9 billion; operating income JPY 185.0 billion (42.3% margin)

Dominant in dicing and grinding equipment with captive consumables; far larger and far more profitable. The hub blade venture targets a market where an incumbent of this kind is strong

Noritake Co., Limited (TSE 5331)

Japan

Diamond and CBN wheels, conventional wheels, dressers for automotive, bearing and steel

FY2025 group sales JPY 142.9 billion; operating income JPY 11.1 billion (7.8%); Industrial Products segment sales JPY 56.4 billion

Japan's largest grinding-wheel maker; closest domestic comparator in transportation and machinery

A.L.M.T. Corp. (Sumitomo Electric group)

Japan

Diamond and CBN wheels, dressers, precision tools, wire

—

Broad superabrasive competitor backed by a large parent

Tokyo Diamond Tools Mfg. Co., Ltd.

Japan

Diamond and CBN wheels, wafer-processing wheels

Private; not publicly disclosed

Specialist domestic rival

Kinik Company (TWSE 1560)

Taiwan

CMP diamond discs, wafer grinding wheels, dicing blades, diamond and CBN wheels

2024 sales TWD 7.02 billion; 2025 sales about TWD 8.1 billion (aggregator data); market capitalisation about TWD 110 billion in Sep 2026

Strong CMP conditioner franchise with leading foundries; highly rated by the market

3M Company

USA

CMP pad conditioners, superabrasive wheels

Division data not disclosed

Named among leaders in CMP diamond discs by third-party market research

Saesol Diamond

Korea

CMP conditioners

—

Major supplier to Korean memory makers per third-party research

EHWA Diamond

Korea

CMP conditioners, construction and stone tools, wire

—

Broad Korean rival across semiconductor and construction

Shinhan Diamond Industrial

Korea

CMP conditioners, construction tools

28.5% affiliate of Asahi Diamond

Both partner and competitor in third markets

Entegris; Nippon Steel Chemical & Material

USA; Japan

CMP conditioners

—

Named in third-party CMP disc research

Nakamura Choukou; Chinese wire makers

Japan; China

Electroplated diamond wire

—

Chinese low-price supply destroyed solar-wire economics; Asahi Diamond has retreated to semiconductor and glass niches

Saint-Gobain Abrasives (Norton, Winter); Tyrolit

France; Austria

Superabrasive wheels, dressers, construction tools

—

Global leaders in bonded abrasives; strong in Europe, where Asahi Diamond is loss-making and restructuring

Husqvarna Construction; Hilti

Sweden; Liechtenstein

Construction blades and core bits

—

System sellers with tools and machines in construction

“—” = not publicly disclosed.

Peer Comparison FY2026

MetricAsahi Diamond (FY to Mar 2026)DISCO (FY to Mar 2026)Noritake (FY to Mar 2026)Kinik (FY to Dec 2025)

Revenue

JPY 42.0 billion

JPY 436.9 billion

JPY 142.9 billion

About TWD 8.1 billion (aggregator)

Revenue growth

+2.4%+11.1%+3.4%

About +15% (calculated from aggregator figures)

Operating margin

5.7%42.3%7.8%—

Net margin

4.8%31.0%9.9%

About 17% (aggregator earnings of TWD 1.4 billion)

R&D intensity

6.1%——

About 2.3% (quarterly R&D over quarterly sales, aggregator)

Company Snapshot

$280.4M

Revenue

2,065

Employees

1937

Founded

SWOT Analysis

Strengths

  • Recurring, volume-linked revenue. About 90% of products are made to order and about 90% of customers reorder (investor business report, Aug 2026).
  • Fortress balance sheet. Equity ratio 78.5%; cash and equivalents JPY 16.2 billion against debt of JPY 4.5 billion; JPY 8.9 billion of undrawn bank lines (Securities Report FY2025).
  • Semiconductor exposure at 40% of sales and rising. Electronics and semiconductor sales grew from JPY 13.8 billion in FY2021 to JPY 17.0 billion in FY2025, with JPY 18.9 billion forecast for FY2026.
  • Sustained research and development commitment. Spending rose from JPY 1.8 billion to JPY 2.6 billion over five years, reaching 6.1% of sales, with over half devoted to semiconductors.
  • Customer diversification. No customer accounts for 10% of sales; four end-markets and seven reported regions.
  • Experienced, stable workforce. Parent average tenure 20.97 years; parent attrition 2.5%; plant attrition below 2%.
  • Demonstrated shareholder-return discipline. Shares issued cut from 55.7 million to 48.43 million since 2022; dividend lifted from JPY 6 (year to Mar 2021) to JPY 34 planned.

Weaknesses

  • Low returns. ROE of 3.2% in FY2025 and a five-year range of 3.2% to 5.7%; operating margin 5.7%.
  • Missed plan. Every numerical target of the 2025 plan was missed (sales JPY 42.0 billion against JPY 49.0 billion; operating income JPY 2.4 billion against JPY 4.9 billion).
  • European losses. JPY 1.8 billion impairment at the French subsidiary; the parent wrote down JPY 500 million of its shares and provided JPY 1,708 million against loans to it.
  • Working-capital intensity. Cash conversion cycle of about 186 days; inventories up 39% since FY2021 against sales growth of 13%.
  • Earnings quality. Net income has depended on gains from selling cross-held shares (JPY 1.3 billion in FY2025) and is distorted by one-year recognition of pension actuarial differences.
  • Leadership concentration and age. The President is 74, has served since 2015 and also chairs the board; outside directors are one-third of the board; female managers are 2.3% of managers at the parent.
  • Low-priced long tail. Machinery tools average about JPY 6 thousand per unit with 1.6 million units a year, implying high complexity for modest revenue.

Opportunities

  • AI-driven semiconductor demand. Q1 FY2026 operating margin reached 13.1%, and the full-year forecast was raised 35% at the operating level.
  • Hub blades. A JPY 30 billion-plus market the company has not previously addressed, with a 10% to 20% share target through AA Diamond Technology.
  • Portfolio pruning. Three products exited and ten under review; plant consolidation; a 35% gross margin ambition against 28.2% today.
  • Balance-sheet optimisation. Moving the equity ratio to 75% while returning JPY 10 billion to 20 billion over five years.
  • Price increases. Customers are accepting pass-through after cost inflation; gross margin has risen for two years.
  • India and ASEAN. Other Asia and Oceania sales have grown every year since FY2021 to JPY 6.8 billion; new subsidiaries in India and Vietnam.
  • Further sale of cross-shareholdings. JPY 5.6 billion of listed holdings remain, with unrealised gains of JPY 4.7 billion.

Threats

  • Raw-material supply. China announced export controls on synthetic diamond abrasive grain (company notice, 4 Nov 2025); synthetic diamond and CBN are over 95% of grain used.
  • Commoditisation. Solar wire prices fell about 90% once Chinese producers scaled, erasing about JPY 10 billion of annual sales.
  • Semiconductor cyclicality. Electronics and semiconductor sales fell 29% and 17% in the two years to March 2020.
  • Trade policy. North American sales fell 24% in FY2025 with US trade policy cited.
  • Technology substitution. Laser processing is progressing in some applications (company statement).
  • Powertrain electrification. Engine-part grinding volumes decline as EVs spread (company statement and climate scenario analysis).
  • Stronger rivals. DISCO earns a 42% operating margin on sales ten times larger and bundles consumables with its machines.

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Key Developments

DateEventSignificance
Apr 2025Referral hiring, Instagram recruiting channel, book-purchase support and qualification bonuses introducedResponse to a tight labour market; mid-career hires are about 60% of intake
14 Apr 2025Trade press article on the Mie plant (Densen Shimbun)Visibility of the wire-die business
9 May 2025AA Diamond Technology established with Tokyo Seimitsu (capital JPY 1 billion, 50:50)Entry into hub blades
15 May 2025FY2024 results: sales JPY 41.0 billion (+6.1%), operating income JPY 2.31 billion (+51.4%); FY2025 guidance for flat operating profitRecovery year; guidance acknowledged the gap to the plan
26 May 2025FY2024 results briefingManagement explained weak power-semiconductor demand
25 Jun 2025106th-term Securities Report filedAnnual filing
26 Jun 2025AGM: Kawai elected director; Ai left the board; stock trust extension resolvedBoard refresh
Feb to Aug 2025Buyback of 2,000,000 shares for about JPY 1.49 billion completed (authorised 7 Feb 2025)Capital return under the 120% total return commitment
31 Jul 2025AA Diamond Technology site openedPilot line start
8 Aug 2025Q1 FY2025 results; first-half forecast raised (operating income JPY 0.6 billion to 1.0 billion); new buyback of up to 1.6 million shares or JPY 1.2 billionBetter first-half trading and continued returns
22 Aug 20252,000,000 treasury shares cancelledShares issued fell to 49,888,600
4 Nov 2025Company notice on export controls announced by China's Ministry of Commerce on synthetic diamond abrasive grain–
7 Nov 2025First-half FY2025 results: sales JPY 20.5 billion (-1.0%), operating income JPY 0.99 billion (-23.6%), net income JPY 1.52 billion (+34.5%) on the European factory sale gainUnderlying softness masked by a one-off gain
13 Nov 2025Semi-annual report filedPeriodic filing
17 Nov 2025First-half briefing; full-year forecast unchangedEurope sales and new-factory start-up costs cited
Aug to Dec 2025Buyback of 1,448,600 shares for JPY 1.2 billion completedAverage price about JPY 828 (analyst calculation)
23 Jan 2026First edition of the externally prepared investor business report publishedImproved disclosure of unit volumes, pricing and history
10 Feb 2026Q3 FY2025 results: nine-month ordinary income JPY 2.53 billion74.7% progress against the eventual full-year figure
24 Feb 20261,458,600 treasury shares cancelledShares issued fell to 48,430,000
2 Mar 2026Share price reached JPY 1,735, the high for FY2025 and for the trailing 52 weeksRe-rating on semiconductor-tool expectations
23 Mar 2026New Shiga sales office announcedDomestic coverage
8 Apr 2026Head office relocation announcedEffective 5 May 2026
16 Apr 2026FY2025 forecast revised: net income cut from JPY 2.2 billion to 1.94 billion on European impairment; ordinary income raised from JPY 2.6 billion to 3.39 billionShares rose sharply the next day (Kabutan)
15 May 2026FY2025 results; Medium-Term Management Plan 2030; dividend to rise to JPY 34; correction notice to the Tanshin and notice on parent-only varianceStrategic reset
26 May 2026Results and plan briefingTargets detailed: JPY 53 billion sales, 10% margin, 8% ROE
25 Jun 2026107th-term Securities Report filedAnnual filing; key audit matter on European impairment
26 Jun 2026AGM: Abe and Koyama retired; Kanemoto and Nakamura elected; final dividend JPY 15 approvedBoard refresh; a director with electronics-industry background added
30 Jun 2026Corporate Governance Report updatedPeriodic filing
1 Jul 2026Promotion of AA Diamond Technology hub blades beganFirst commercial step for the joint venture
7 Aug 2026Q1 FY2026 results (operating income +149%); full-year forecast raised (operating income JPY 3.7 billion to 5.0 billion); shareholder benefit programme; share acquisition for the stock compensation planLargest positive revision in years; shares rose 7.4% on the day and 9.0% on 12 Aug (Yahoo! Finance Japan)
12 Aug 2026Digital Plus announced the company's adoption of its "Digital Gift" for shareholder benefitsDetail of the benefit: JPY 3,000 to 10,000 equivalent twice a year
Aug to Sep 2026Exhibitions announced: SEMICON India, wire China, a Vietnam manufacturing fair, Kyushu semiconductor show, SEMICON EuropaOverseas semiconductor marketing in line with the plan
28 Aug 2026Investor business report updated with revised forecastDisclosure
29 Sep 2026Ex-dividend date for the JPY 17 interim dividend and first record date for the benefit holding-period testShareholder returns
6 Nov 2026 (scheduled)First-half FY2026 resultsNext catalyst (Monex Scouter)

Financial Performance

Explore key financial metrics, segmented revenue, balance sheet health, and performance trends.

Revenue

7 charts
Income Statement: Revenue & Gross Profit: Revenue rose from JPY 37,161 Mn in FY2021 to JPY 41,983 Mn in FY2025.
Asahi Diamond Industrial Co., Ltd. — Income Statement: Revenue & Gross Profit
Series (JPY Mn)FY2021FY2022FY2023FY2024FY2025
Revenue37,16139,32038,65341,00641,983
Cost of sales26,81128,79028,65529,70430,164
Gross profit10,35010,5309,99811,30211,819

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