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Darbond Technology Co., Ltd.

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Ticker: 688035.SS

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Year Founded & Workforce

2003

Industry

Semiconductor
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Darbond Technology Co., Ltd. Overview

Darbond Technology is China's leading domestically owned platform supplier of high-end electronic packaging materials — engineered adhesives, functional films and thermal interface materials (TIMs) that bond, protect, insulate and cool components from the wafer level (level 0) through chip, board and module to complete systems (level 3). Its portfolio of more than 400 products spans four end-markets: integrated-circuit (IC) packaging, smart-terminal (consumer electronics) packaging, new-energy (EV power batteries and photovoltaics) and high-end equipment. New-energy adhesives remain the revenue anchor at roughly 52% of sales, but the strategic thrust is IC packaging: wafer UV tapes, die-attach pastes and films, underfill, lid-attach adhesives and chip-level TIMs that substitute for products from Henkel, Shin-Etsu, H.B. Fuller and Japanese film makers. Backed since before its IPO by China's Big Fund and selling to Apple, Huawei, Xiaomi, CATL, JCET, Tongfu and Huatian, Darbond grew revenue from CNY 584 million in FY2021 to CNY 1,547 million in FY2025, and is accelerating in 2026 on AI-server thermal materials and advanced-packaging import substitution.

What the company does. Darbond formulates, manufactures and sells electronic-grade adhesives and functional film materials. In its own description (FY2025 annual report and 2025–2026 investor-relations records), the company is "led by IC packaging materials technology" and focuses on four application fields — IC packaging, smart-terminal packaging, new-energy applications and high-end equipment applications — with a product line running from level-0 to level-3 packaging and serving head customers in each industry. Its main products are electronic-grade adhesives and functional films; the IC segment's catalogue covers thermal products (pads, gels, phase-change materials, liquid metal), die-attach products (die-attach paste DAP; DAF and conductive CDAF films), wafer-processing films (UV back-grinding and UV dicing tapes), underfill and lid-frame adhesives.

Business model. Darbond is a pure product company. Revenue is earned almost entirely from the sale of formulated materials; there is no material service, subscription or licensing income. Sales are executed both directly (to battery makers, OSATs, handset/EMS manufacturers and automotive OEMs) and through distributors and sales-service agents, a channel the exchange scrutinised during the IPO review. Revenue is recognised on delivery and acceptance; pricing is negotiated per qualified part number, typically with annual price-downs in high-volume new-energy programmes.

Revenue model mix (FY2025).

Product sales (adhesives, films, TIMs): Share of revenue: ~100%; Comment: Core operating revenue CNY 1,545.45 M of CNY 1,547.23 M total revenue (FY2025 annual report)

Services / licensing / subscription: Share of revenue: Negligible; Comment: Technical application support is bundled into product pricing

Value-chain position. Darbond sits between upstream chemical feedstocks (epoxy, acrylic, silicone and polyurethane resins, curing agents, silver and ceramic fillers, film substrates) and downstream device makers. Its value-add is formulation know-how, application engineering and long qualification cycles that embed a material in a customer's bill of materials for the life of a product platform. In IC packaging, materials directly affect yield and reliability, which makes customer qualification slow (often 2–3 years for chip-level materials) but sticky once achieved.

Customer types and end-markets.

IC packaging: Typical customers (publicly named): JCET, Tongfu Microelectronics, Huatian Technology, ATX Semiconductor (日月新), SSD and optical-module makers; Application examples: Wafer thinning/dicing tapes, die attach, underfill, lid attach, TIM1/TIM1.5/TIM2 for CPUs, GPUs, AI chips, optical modules

Smart terminals: Typical customers (publicly named): Apple, Huawei, Xiaomi, OPPO, Transsion, Goertek; Application examples: Structural PUR hot-melts, 3D-screen encapsulation resins, conductive and shielding adhesives for phones, watches, TWS earbuds, AR/VR

New energy: Typical customers (publicly named): CATL and other battery makers; Tongwei, LONGi, Canadian Solar (historic direct customers); a North American shingled-module customer; Application examples: Power-battery structural and thermal adhesives, PACK potting, MS hybrid sealants; shingled-cell conductive adhesive, 0BB UV adhesives

High-end equipment: Typical customers (publicly named): Automotive OEMs, rail, construction and mining machinery, appliances, power tools; Application examples: Body-in-white structural adhesives, chassis seam sealants, battery-box sealing, MRO adhesives

Independent characterisation. Darbond is best understood as a two-engine business. The cash engine is new-energy adhesives — high volume, low margin (gross margin 15.2% in FY2024), heavily exposed to CATL-led price deflation. The value engine is a combined IC + smart-terminal franchise carrying 40–49% gross margins, which together rose from about 30% of revenue in FY2022 to about 41% in FY2025. The investment case depends on how fast IC materials — particularly AI-server TIMs (strengthened by the 2025 Techinno acquisition) and chip-level underfill/DAF/TIM1 — scale from small-batch to volume supply. Profitability has lagged revenue: net margin fell from about 13% in FY2021–FY2022 to 7.0% in FY2025 as new-energy pricing compressed, share-based compensation began, and IPO capacity added depreciation before full utilisation. 2026 shows the first clear operating-leverage inflection, with 9M2026 net profit up 52.7% on revenue up 30.5%.

Strategy

Stated strategy. The company's strategic framework is "1+6+N (New)". The "1" is a single main chain running from IC packaging to smart-terminal and other electronic-system packaging. The "6" are six application markets it targets along that chain: IC packaging, smart-terminal modules, flat-panel display, new-energy power batteries, PV cells, and high-end equipment. The "N" stands for new emerging niches — above all semiconductor advanced packaging — to be entered through capital integration (M&A). Recurring themes in the FY2025 annual report and the 2025–2026 "Quality Improvement, Efficiency Enhancement and Return to Shareholders" action plans are: leadership through IC packaging-materials technology; import substitution of key materials; differentiated strategies per market; "platform-type" expansion across the packaging hierarchy; lean, digitised operations; and stable shareholder returns through dividends and buybacks.

Strategic initiatives in the last 24 months.

TIM platform build-out via Techinno: Timing: Dec 2024 – Feb 2025; Detail and targets: 89.42% acquisition for CNY 257.78 M to target AI server, GPU and data-centre cooling; TIMs are now described as "one of the company's pillar businesses," run through Shenzhen Darbond Interface and Techinno

Attempted entry into EMC (epoxy molding compound): Timing: Sep–Nov 2024; Detail and targets: 53% of Hengsuo Huawei (global #3 EMC maker by volume) at a CNY 1.4–1.6 B valuation; terminated by sellers

Chip-level advanced-packaging materials: Timing: Ongoing; Detail and targets: DAF/CDAF, chip-level underfill and lid adhesive in small-batch delivery; TIM1 passed a key domestic OSAT's full reliability validation (2026); glass-substrate materials in sampling

South China Semiconductor Materials Base: Timing: Approved Feb 2026; Detail and targets: About CNY 230.5 M total investment; converts the 35-tonne semiconductor-materials IPO project, closer to Pearl River Delta OSAT and AI-server customers

Guangxi Lanpo Semiconductor acquisition: Timing: Jun–Jul 2026; Detail and targets: 52.73% control stake; partly financed with up to CNY 41 M acquisition loan

Capacity rollout: Timing: 2023–2025; Detail and targets: Kunshan fully operational, Meishan completed H1 2025, Thailand JV completed 2025

Overseas expansion: Timing: 2024–2026; Detail and targets: Vietnam and Thailand subsidiaries; North American PV customer

Shareholder-return programmes: Timing: 2024–2026; Detail and targets: Three buybacks (CNY 53 M; CNY 40–80 M; CNY 12–24 M), interim plus final dividends at ~33% payout

Cost programme: Timing: 2024–2026; Detail and targets: Bulk procurement bargaining, technical cost-down and smart manufacturing to offset new-energy price declines

Digitalisation of R&D: Timing: 2026 action plan; Detail and targets: Digitised, data-driven R&D platforms to improve development efficiency

Medium-term financial targets. The company does not publish numeric revenue or margin guidance. The qualitative guidance (2026 IR records): IC and smart-terminal shares continue to rise; new energy holds market share and grows with the industry while declining as a share of revenue; high-end equipment grows steadily.

Products & Services

IC packaging materials

ProductDescription / key capabilitiesTarget customerStatus (latest)
Wafer UV back-grinding (thinning) tapeProtects the active wafer face during back-grinding; UV-release for clean de-tapeOSATs, wafer-level packaging linesStable volume supply to mainstream domestic OSATs
Wafer UV dicing tapeHolds wafers during singulation; UV-switchable adhesion for die pick-upOSATsStable volume supply
Die-attach paste (DAP, 固晶胶)Conductive and non-conductive epoxy die-attach pastes for leadframe and substrate packagesOSATs, power-device makersStable volume supply
DAF (die-attach film)Film-form die attach for thin-die stacking (memory, SiP)OSATs, memory packagingSmall-batch delivery; breaks foreign monopoly
CDAF (conductive die-attach film)Conductive die-attach film for power and RF diesOSATsFirst domestic supplier to reach mass-production application (2024)
Chip-level underfillCapillary underfill for flip-chip / large high-speed dies; passed testing at a leading international OSAT (2024)Advanced-packaging OSATs (FC-BGA, HBM-adjacent applications)Small-batch delivery
Board-level underfill / SMT adhesivesReinforces BGA/CSP solder joints on PCBsEMS, handset makersVolume supply
Lid-frame (AD) adhesiveBonds heat-spreader lids and stiffener frames on FC-BGA packagesOSATs (CPU/GPU/AI packages)Small-batch delivery
TIM1 (chip-level thermal material)Die-to-lid thermal interface for high-power processorsOSATs, AI-chip programmesPassed a key domestic OSAT's full reliability validation (2026)
TIM1.5 / TIM2 pads and gelsLid-to-heat-sink and board-level thermal pads and dispensable gelsServer, GPU, optical-module, SSD makersStable volume supply
12 W/m·K high-performance gel padHigh-conductivity gap pad for AI-GPU serversAI server ODMsDeveloped 2025
Liquid-metal composite pasteUltra-high-conductivity TIM for AI chipsAI accelerator programmesDeveloped 2025
Phase-change materials (PCM)Pre-applied TIM that flows at operating temperatureCPU/GPU, telecomIn portfolio
Two-component high-thermal gel for SSDsDispensable gel for enterprise SSD controllers/NANDSSD makersLab-to-mass-production breakthrough (2024)
Ultra-thin TIM; high-reliability "合晶" thermal sheetThin-bond-line thermal filmsHigh-density electronicsDeveloped 2025
Glass-substrate packaging materialsMaterials adapted for glass-core substratesAdvanced-packaging developersDesign iteration and sample validation (Jul 2026)
Techinno TIM rangeHigh-end pads, gels, EMI shielding, absorbers, insulation and heat-dissipation materials (Changshu)Servers, telecom, automotive electronicsConsolidated since Feb 2025

Smart-terminal packaging materials

ProductDescriptionTarget customerStatus
PUR reactive hot-melt adhesivesStructural bonding of housings, displays and frames; high reliability and reworkabilityApple, Huawei, Xiaomi, OPPO, TranssionSales breakthrough across all five (2024); applied in multiple flagship phone models of a leading domestic brand; 2025 "Technology Breakthrough Award" from a head customer
LIPO 3D-screen encapsulation photosensitive resinEnables narrow-bezel, high-reliability encapsulation of curved/3D screens on phones and watchesXiaomi and othersVolume supply to Xiaomi; Xiaomi "Cooperation Innovation Award" 2024
Conformal coatings (披覆胶)Moisture and corrosion protection of PCBAsHandset, wearable, IoT makersVolume supply
Conductive adhesivesReplace solder in heat-sensitive interconnectsModule makersVolume supply
EMI shielding materialsConductive gaskets and adhesivesHandset, wearable makersVolume supply
Structural and sealing adhesives for wearables / TWS / AR-VRWaterproofing and structural bonding in miniature devicesGoertek-type acoustics/wearable ODMsStrategy uses TWS as a beachhead, extending to watches and AR/VR
Thermal materials for handsetsGraphite-adjacent pads and gels for SoC hotspotsHandset makersIn portfolio

New-energy application materials

ProductDescriptionTarget customerStatus
Power-battery structural adhesivesCell-to-pack and module bondingCATL and other battery makersHigh domestic share; volumes rising despite price declines
Thermal-conductive adhesives / pottingHeat transfer from cells to cooling platesBattery makersVolume supply
MS hybrid resin materialsBonding and sealing; new thermal-conductive and low-viscosity gradesLeading NEV OEMs (multiple models)Batch use
PU materials for battery PACK encapsulationSelf-designed synthetic-resin PU with strong adhesion and low modulusBattery PACK makersLaunched 2025
Shingled-cell (叠瓦) conductive adhesiveInterconnects overlapping solar cellsPrimarily a North American customer; rooftop and utility PVSteady growth; small share of FY2025 revenue; not yet used in space PV
0BB UV adhesiveFixes busbar-free ribbons in zero-busbar module technologyPV module makersIn portfolio
Other PV packaging materialsFrame and junction-box sealantsPV module makersSmall volumes

High-end equipment application materials

ProductDescriptionTarget customerStatus
Automotive body structural adhesiveReplaces some spot welds; improves body stiffness and sealingAutomotive OEMsApplied in body-in-white
Modified-silane sealants and hybrid adhesivesChassis and battery-box weld-seam sealingAutomotive OEMsBroad application
Thermal and insulating adhesives for NEVsBattery thermal management and electrical safetyNEV OEMsVolume supply
Rail, construction and mining machinery adhesivesStructural bonding, sealing, thread-lockingEquipment makersVolume supply
Appliance and power-tool adhesives; MRO productsGeneral engineering adhesivesAppliance and tool makers; maintenance channelsVolume supply

Pricing is not published for any product. All products are sold per qualified specification, typically under annual frame agreements with periodic price renegotiation.

Financial Narrative

All figures are in CNY under PRC Accounting Standards for Business Enterprises. FY2023–FY2025 are from the FY2025 annual report; FY2021–FY2022 are from the IPO prospectus and FY2022 annual-report data. The preliminary FY2025 results (express report, February 2026) gave net profit of CNY 105.26 M; the audited annual report gives CNY 107.61 M, which is used throughout.

Income statement

(Zero entries in FY2021–FY2022 for operating and pre-tax profit mark periods outside the three-year comparative window of the latest filings; they are not reported values.)

FY2025 dividend = CNY 0.10 interim + CNY 0.15 final. FY2023 EBITDA and dividend are shown as zero only as table placeholders. The FY2024 final dividend was CNY 2.50 per 10 shares.

Margins (%)

Revenue CAGR FY2021–FY2025: 27.6%. FY2020–FY2025 CAGR is about 30% (from CNY 417 M).

Commentary. Three phases are visible. (1) FY2021–FY2022: hyper-growth (+59% in FY2022) driven by EV-battery adhesives, with new-energy revenue up 121% in FY2022 and net margins near 13%. (2) FY2023: a stall — revenue flat at CNY 932 M as new-energy prices fell faster than volumes rose and consumer electronics destocked; gross margin slipped to 28.8%. (3) FY2024–FY2025: re-acceleration (+25%, +33%) led by IC and smart terminals, but profit grew only modestly. FY2024 net profit fell 5.4% on new-energy margin compression (segment gross margin −6.1 pp to 15.2%), restricted-stock expense, and higher spending on overseas market development, IT and R&D. FY2025 net profit rose 10.5% against revenue up 32.6%; core (non-recurring-adjusted) profit rose a healthier 19.1%. Q4 FY2025 net profit was CNY 37.9 M (+2.4% YoY), below sell-side expectations of about CNY 157 M for the full year.

Quarterly trajectory

9M2026 (Q3 report, 23 October 2026): revenue CNY 1,423 M (+30.5%), net profit CNY 106.0 M (+52.7%), core net profit CNY 100.0 M (+49.9%), operating cash flow CNY 103 M, EPS CNY 0.76. Q3 2026 alone: revenue CNY 542.7 M (+35.7%), net profit CNY 38.4 M (+59.0%). Q1 2026 gross margin was 26.99% (+0.05 pp YoY, +0.62 pp QoQ). The 2026 pattern shows the operating leverage FY2025 lacked: profit growth now exceeds revenue growth by about 20 percentage points.

Balance sheet

(Zero cells are table placeholders for items not carried in the three-year comparative summary.)

At 30 September 2026, total assets were CNY 3,708 M (+7.6% YTD) and parent equity CNY 2,402 M (+3.3%). At 31 March 2026: cash CNY 497.7 M, trading financial assets CNY 384.3 M, notes receivable CNY 124.2 M, accounts receivable CNY 412.3 M, inventory CNY 279.1 M. The balance sheet remains conservatively financed: the debt-to-asset ratio was about 22% through FY2024–Q1 2025, there are no bonds outstanding, and in September 2026 the board authorised up to CNY 700 M of idle own funds for cash management. Liabilities rose in FY2025 mainly through operating payables, minority interests and deferred consideration from the Techinno deal. The 20% final tranche of Techinno consideration is payable after the earn-out period.

Goodwill and intangibles. The Techinno purchase (CNY 257.78 M for 89.42%, against a valuation of CNY 288.4 M for 100% and audited attributable book equity of CNY 51.66 M at 30 September 2024) created the group's main goodwill and acquired-intangible balance. It is protected by an earn-out: Techinno must deliver cumulative net profit of at least CNY 36 M over the commitment period and at least CNY 14 M in 2026, or the sellers compensate Darbond. Techinno earned CNY 12.8 M in FY2025.

Cash flow

The FY2024 dividend (CNY 2.50 per 10 shares on about 140.9 M shares) is approximately CNY 35 M. The FY2025 total of CNY 35.16 M equals 32.67% of net profit. FY2024 buyback cash is as of 31 October 2024; the FY2025 figure is the second programme's CNY 40.01 M through January 2026.

Commentary. Operating cash flow is volatile and was negative in FY2025 (−CNY 100.6 M, including −CNY 90.7 M in Q4) as accounts receivable more than doubled (+116%) on fast growth in longer-term IC and smart-terminal accounts and greater use of notes and supply-chain settlement by battery customers. FY2024's CNY 379 M inflow reflected aggressive collection plus inventory release. 2026 has normalised: H1 OCF +CNY 28.3 M (vs. −CNY 18.2 M), and 9M OCF +CNY 103 M. Capex peaked in FY2023–FY2025 with the Kunshan, Meishan and Thailand bases; the South China semiconductor base (about CNY 230.5 M, of which about CNY 62.4 M is reallocated IPO proceeds) is the main 2026–2027 project.

Ratios

FY2025 debt-to-asset includes minority interests in liabilities; on a parent-equity basis the leverage is lower. The current ratio for FY2025 is a sell-side estimate. Zero cells are placeholders.

Net debt is negative (net cash of roughly CNY 850 M including wealth-management products at FY2025 year-end), so net debt/EBITDA and interest coverage are not meaningful; finance expense was a net income of about CNY 9 M in FY2024. ROE in the 4–5% range is the company's chief financial weakness: the IPO raised CNY 1.64 B of equity that is not yet fully earning. Consensus-style forecasts imply ROE recovering towards 8–11% by FY2026–FY2027 if 2026 momentum holds.

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Financial Detail

Segment Overview

SegmentWhat it containsKey subsidiaries / sites

IC packaging materials

Wafer UV back-grinding and dicing tapes; die-attach paste (DAP); DAF/CDAF die-attach films; chip-level and board-level underfill; lid-frame (AD) adhesives; TIM1/TIM1.5/TIM2 pads, gels, PCM, liquid metal

Yantai parent, Kunshan, Shenzhen Darbond Interface Materials, Suzhou Techinno, Dongguan Darbond Yihua, South China base (under construction)

Smart-terminal packaging materials

Structural PUR reactive hot-melts, UV/photosensitive resins for 3D screen encapsulation, conformal coatings, conductive and EMI-shielding adhesives, SMT adhesives for phones, wearables, TWS, AR/VR

Yantai, Kunshan, Shenzhen

New-energy application materials

Power-battery structural, thermal-conductive and sealing adhesives (incl. MS hybrid and PU PACK materials); PV shingled-cell conductive adhesive, 0BB UV adhesives and other PV packaging materials

Yantai Darbond New Materials, Meishan (Sichuan), Thailand JV

High-end equipment application materials

Automotive structural adhesives replacing spot welds, modified-silane and hybrid sealants, thermal and insulating adhesives; rail, construction and mining machinery, appliances, power tools, MRO

Yantai

Revenue by Segment

Segment (CNY Mn)FY2022FY2023FY2024FY2025

IC packaging materials

9496135250

Smart-terminal packaging materials

182176259383

New-energy application materials

590585685808

High-end equipment application materials

637186104

Total revenue

9299321,1671,547

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Segment Revenue

SegmentFY2023FY2024FY2025

IC packaging materials

240.885

Smart-terminal packaging materials

-347.148

New-energy application materials

-117.118

High-end equipment application materials

1321.021

Segment Revenue (FY2022–FY2025)

SegmentFY2022FY2023FY2024FY2025

IC packaging materials

10.110.311.616.2

Smart-terminal packaging materials

19.618.922.224.8

New-energy application materials

63.562.858.752.3

High-end equipment application materials

6.87.67.46.7

Segment Revenue (FY2023–FY2024)

SegmentFY2023FY2024

IC packaging materials

38.7440.10

Smart-terminal packaging materials

44.6948.86

New-energy application materials

21.3015.23

High-end equipment application materials

40.2441.67

Group Entities

EntityOwnershipFunction

Shenzhen Darbond Interface Materials Co., Ltd.

100%

TIM R&D and production (South China)

Weishida Semiconductor (威士达半导体)

100%

Semiconductor materials

Darbond (Kunshan) Materials Co., Ltd.

100%

IPO-funded East China production base

Sichuan Darbond New Materials (Meishan)

100%

Southwest production base serving battery and PV customers

Yantai Darbond New Materials Co., Ltd.

100%

New-energy materials production (FY2025 revenue CNY 538.8 M; net loss CNY 13.6 M)

Darbond International

100%

Overseas holding / trading

Darbond Vietnam

100%

Southeast Asia service and manufacturing

Darbond Thailand

100%

Thailand holding / operations

Thailand JV — Darbond Materials Co., Ltd.

Controlling

Thailand production base (completed 2025)

Dongguan Darbond Yihua Materials Co., Ltd.

51%

Die-attach / chip-protection materials (FY2024 revenue CNY 36.8 M)

Suzhou Techinno New Material Technology Co., Ltd.

89.42%

High-end TIMs (FY2025 revenue CNY 93.1 M; net profit CNY 12.8 M)

Guangxi Lanpo Semiconductor Co., Ltd.

52.7273% (from Jul 2026)

Semiconductor materials; acquisition partly funded by an up-to-CNY 41 M CITIC Bank loan

Income Statement

Metric (CNY Mn)FY2021FY2022FY2023FY2024FY2025

Revenue

584.3928.5932.01,166.81,547.2

Cost of revenue

385.4650.0663.9845.31,129.1

Gross profit

198.9278.6268.1321.5418.2

Operating profit

00119.7104.4115.9

Pre-tax profit

00117.2110.7116.6

Net profit attributable to parent

76123102.997.4107.6

Net profit excl. non-recurring items

0087.783.799.7

Income Statement and Per-Share Data

MetricFY2023FY2024FY2025

EBITDA (CNY Mn)

0148.8166.1

Basic EPS (CNY)

0.720.690.76

Basic EPS excl. non-recurring (CNY)

0.620.590.71

Dividend per share (CNY)

00.250.25

R&D expense (CNY Mn)

62.066.972.7

Margin Analysis (%)

MetricFY2021FY2022FY2023FY2024FY2025

Gross margin

34.030.028.827.627.0

Operating margin

0012.88.97.5

EBITDA margin

00012.810.7

Net margin (attributable)

13.013.211.08.47.0

R&D / revenue

006.655.734.70

Financial Analysis

Metric (CNY Mn)Q1-25Q2-25Q3-25Q4-25Q1-26Q2-26Q3-26

Revenue

316.3373.6399.9457.4406.4473.6542.7

Net profit attributable

27.118.424.237.934.433.638.4

Balance Sheet

Metric (CNY Mn)FY2023FY2024FY2025

Total assets

2,740.72,969.73,445.6

Equity attributable to parent

2,270.42,294.02,324.2

Total liabilities incl. minority interests

470.3675.71,121.4

Cash and equivalents (period end)

00466.3

Trading financial assets (wealth-management)

00383.1

Accounts receivable

0194.5420.2

Inventory

00218.7

Dividends & Capital Returns

Metric (CNY Mn)FY2023FY2024FY2025

Net operating cash flow

38.9379.0-100.6

Cash dividends declared for the year

035.235.2

Share buybacks (cash, approx.)

053.140.0

Returns & Leverage Ratios (%) and Financial Ratios (x)

RatioFY2023FY2024FY2025

ROE, weighted average (%)

4.604.304.66

ROE excl. non-recurring (%)

3.923.694.31

ROA (net profit / avg. total assets, %)

03.43.4

ROIC (%, Postal Savings Securities estimate)

03.23.8

Debt-to-asset ratio (%)

17.222.232.5

Current ratio (x)

03.203.24

Asset turnover (revenue / avg. assets, x)

00.410.48

Receivables turnover (x)

05.570

Segment Overview — IC packaging materials

SegmentMainland ChinaSoutheast AsiaNorth America / other

IC packaging materials

Dominant (JCET, Tongfu, Huatian, ATX and domestic AI/server supply chain)

Emerging via customers' overseas OSAT plants

Minimal

Smart-terminal packaging materials

Dominant (China assembly of global brands)

Growing as handset and wearable assembly moves to Vietnam/India

Indirect via global brands

New-energy application materials

Dominant (CATL and domestic battery chain)

Thailand base supports battery/PV customers' overseas plants

PV conductive adhesive for a North American customer

High-end equipment application materials

Dominant

Minimal

Minimal

Share Price & Returns

Reference pointPriceComment

IPO price (Sep 2022)

46.12—

23 May 2025

38.77

Post-FY2024 results

11 Feb 2026

61.82

Limit-up on South China base news

28 May 2026

83.75

Market cap CNY 11.9 B

52-week high

107.28

Mid-2026 peak

52-week low

43.56—

4 Nov 2026 close

55.94

+15.7% on the day

Return window to 4 Nov 2026

%

—

1 month

-21.9—

3 months

-0.7—

6 months

-24.2—

1 year

13.8—

Since IPO (vs. CNY 46.12)

21.3—

Valuation Snapshot

MultipleValueBasis

P/E (FY2025)

74

NP CNY 107.6 M

P/E (trailing 12 months to Q3 2026)

55

TTM NP ≈ CNY 144 M

P/S (TTM)

4.2

TTM revenue ≈ CNY 1,880 M

P/B

3.3

Parent equity CNY 2,402 M (30 Sep 2026)

EV/EBITDA (FY2025)

43

EV ≈ CNY 7.1 B net of about CNY 850 M cash and wealth products; EBITDA CNY 166 M

Analyst Ratings & Targets

Broker (date)RatingFY2026E revenue (CNY Mn)FY2026E NP (CNY Mn)FY2027E NP (CNY Mn)

Postal Savings Securities (24 Mar 2026)

Buy

2,018195305

SDIC Securities (9 Jul 2026)

Buy

—177389

Zheshang Securities (26 Oct 2025)

Buy

1,970230320

Per-Share Data and Returns & Leverage Ratios (%)

MetricFY2024FY2025FY2026

DPS (CNY)

0.250.250.10

Payout ratio (%)

3632.6720.78

Capital Programmes

ProgrammePeriodSizeExecution

First

2024—

1,299,170 shares, CNY 53.05 M (to 31 Oct 2024), price range CNY 24.77–51.80

Second

2 Apr 2025 – 1 Apr 2026

CNY 40–80 M

991,897 shares, CNY 40.01 M (to 31 Jan 2026)

Third

Proposed 31 Jul 2026

CNY 12–24 M, cap CNY 115.29

For ESOP / equity incentives

Analyst Conclusions

Management guidance. No numeric guidance is given. Management expects IC packaging and smart-terminal materials to keep outgrowing the group, new energy to hold share and grow with the industry, and high-end equipment to grow steadily. Priorities for 2026–2027 are volume ramp of chip-level materials (TIM1, underfill, DAF/CDAF, lid adhesive), AI-server TIMs, construction of the South China semiconductor base, integration of Techinno and Guangxi Lanpo, and overseas (Thailand/Vietnam) expansion.

Consensus growth expectations. Published forecasts imply FY2026 revenue of about CNY 1.95–2.05 B (+26–30%) and net profit of CNY 177–230 M. 9M2026 results (revenue +30.5%, NP +52.7%) support the revenue path; profit is tracking below the forecast range.

Bull case.

  1. AI thermal and advanced-packaging leverage. IC revenue nearly doubled to about CNY 250 M in FY2025. With TIM1 validated and three chip-level products in small-batch supply, IC could exceed 20% of sales in FY2026–FY2027 at around 40% gross margin, lifting group margins.

  2. Operating leverage has arrived. 9M2026 net profit growth (+52.7%) is 22 points above revenue growth, and OCF has turned positive (+CNY 103 M). Spare capacity at Kunshan, Meishan and Thailand means incremental revenue drops through at high marginal rates.

  3. Overhang clearing and insider conviction. Big Fund is down to 10.65% from 18.65%, Zhoushan Taizhong is below 5%, and the founders cancelled their November 2026 sale with zero shares sold while the company keeps buying back stock.

Bear case.

  1. New-energy drag persists. At 52% of revenue and around 15% gross margin, continued battery and PV price deflation can absorb most IC gains; the Yantai new-energy subsidiary lost CNY 13.6 M in FY2025.

  2. Returns stay sub-par. ROE of 4–5% on CNY 2.4 B of equity does not justify a 55x trailing P/E unless profit roughly doubles; FY2025 profit missed expectations by about 30%.

  3. Chip-level commercialisation risk. Qualification at top OSATs is slow, Henkel, Shin-Etsu and Namics are entrenched, and R&D intensity (4.4–4.7%) is thin for the roadmap breadth.

Key catalysts and monitorables (next 12 months).

FY2026 annual results and dividend: Expected timing: April 2027; Why it matters: Tests whether NP reaches the CNY 177–230 M forecast range

Q1 2027 results: Expected timing: April 2027; Why it matters: Durability of operating leverage

Techinno 2026 earn-out (≥ CNY 14 M): Expected timing: FY2026 audit; Why it matters: Goodwill safety; deferred 20% consideration

TIM1 / underfill / DAF volume orders at domestic OSATs: Expected timing: Rolling; Why it matters: Shift from small-batch to volume

South China base construction milestones: Expected timing: 2026–2027; Why it matters: IC capacity near Pearl River Delta customers

  • Guangxi Lanpo integration and first consolidated contribution — Expected timing: Q4 2026 – FY2027; Why it matters: Scope and synergy of the new subsidiary

Glass-substrate materials validation: Expected timing: 2027; Why it matters: Long-dated advanced-packaging option

Big Fund and founder share-reduction activity: Expected timing: Ongoing; Why it matters: Supply overhang

Receivables and OCF trend: Expected timing: Quarterly; Why it matters: Quality of growth

New-energy pricing (CATL tenders) and PV export policy: Expected timing: Ongoing; Why it matters: Margin pressure on the largest segment

Analyst verdict. Darbond Technology is China's most complete domestic platform for electronic packaging materials, and the evidence points to a business moving into a more profitable phase after three years in which revenue growth failed to reach the bottom line. Revenue nearly tripled between FY2021 and FY2025, but net profit rose only 42%, as falling battery-adhesive prices, share-based pay and IPO-funded capacity diluted returns to a 4–5% ROE. Two things now look different. First, the mix is changing structurally: IC packaging and smart-terminal materials, carrying gross margins about 25 points above new energy, reached roughly 41% of sales in FY2025, and the Techinno acquisition has turned thermal interface materials into a pillar business tied to AI-server demand. Second, 2026 numbers show real operating leverage for the first time since listing — nine-month net profit up 52.7% on revenue up 30.5%, with operating cash flow back in surplus. The chip-level pipeline (TIM1 validated, underfill, DAF/CDAF and lid adhesives in small-batch supply) gives credible upside to an IC business that domestic OSAT capex and supply-chain localisation should keep driving.

The risks are just as concrete. New energy is still more than half of revenue and is structurally deflationary. R&D intensity has fallen below 5%. And a trailing P/E of around 55x already discounts a substantial profit ramp that published forecasts place above what the 2026 run-rate supports. On the other side, Big Fund's stake has been cut from 18.65% to 10.65%, the founders' decision not to sell in November 2026 and continued buybacks signal internal confidence, and a net-cash balance sheet funds both organic capacity and further bolt-on deals. On balance, Darbond is a quality, policy-aligned compounder whose rerating depends on execution: the shares should outperform if IC revenue keeps compounding at 50% or more and group net margin returns to around 10% in FY2027, but they will remain volatile while profit lags the sell-side's expectations.

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Executive Leadership

Board of Directors

NameTitleBackground

Xie Haihua (解海华)

Chairman of the Board; legal representative; co-controlling shareholder

Long-serving leader since the company's early years; general partner of employee platforms Yantai Kanghui and Yantai Derui; legal representative of Darbond (Kunshan); proposer of the third buyback (July 2026)

Dr. Chen Tian'an (陈田安)

Director and General Manager; co-controlling shareholder

Co-founder and technical leader of the move into IC packaging materials; holds overseas nationality (listed as an overseas individual shareholder); legal representative of Dongguan Darbond Yihua

Wang Jianbin (王建斌)

Director; co-controlling shareholder

Founding-team member; 6.12% holder

Lin Guocheng (林国成)

Co-controlling shareholder

Founding-team member; 9.29% holder

Chen Xin (陈昕)

Co-controlling shareholder

Founding-team member; 1.25% holder

Yu Jie (于杰)

Deputy General Manager, Board Secretary and Chief Financial Officer

Head of finance and investor relations; legal representative of Suzhou Techinno post-acquisition

Zhang Chengjia (张城嘉)

Head of Accounting

Signs the financial statements alongside the chairman and CFO

Zhan Shineng (战世能)

Director, Board Office (Securities Director)

Investor-relations lead

Zhai Cheng (翟丞)

Securities Affairs Representative

Investor relations

Prof. Song Hongsong (宋红松)

Independent Director (since Dec 2023)

Born August 1969; PhD, law professor at Yantai University and director of its IP Research Centre; national IP expert pool member; arbitrator in Qingdao and Yantai

Prof. Li Ming (李明)

Independent Director (since Jan 2025)

Born February 1960; PhD from Kyushu Institute of Technology; tenured professor at Shanghai Jiao Tong University's School of Materials Science, director of its Electronic Materials Technology Institute; earlier years in packaging-materials R&D at Mitsui High-tec

Prof. Yang Deren (杨德仁)

Former Independent Director (Dec 2020 – Jan 2025)

Born April 1964; CAS Academician, Zhejiang University; resigned under CAS rules on academicians' outside roles

Board & Management Changes

DateChangeContext

Dec 2024

Independent director Yang Deren resigns

CAS rules on academicians' outside roles

6 Jan 2025

Li Ming elected independent director; committee seats reshuffled

Adds advanced-packaging materials expertise

FY2025

Auditor changes from Yongtuo CPA to Mazars China (中审众环)

Standard unqualified FY2025 opinion

31 Dec 2025

Orient Securities' continuous supervision period ends

Normal STAR Market timeline

Major Shareholders

#ShareholderTypeShares% of total
1

National Integrated Circuit Industry Investment Fund Co., Ltd.

State-owned legal person

15,433,53410.85
2

Xie Haihua

Domestic individual

15,116,35410.63
3

Lin Guocheng

Domestic individual

13,208,2019.29
4

Wang Jianbin

Domestic individual

8,703,1156.12
5

Zhoushan Taizhong Venture Capital Partnership (LP)

Other (6.70 M shares pledged)

7,111,8005.00
6

Yantai Kanghui Investment Center (LP) — employee platform

Other

5,939,0504.18
7

Yantai Derui Investment Center (LP) — employee platform

Other

5,724,3794.02
8

Chen Tian'an

Overseas individual

3,145,4562.21
9

HKSCC Nominees Ltd. (Northbound Stock Connect)

Other

2,534,6931.78
10

Chen Xin

Domestic individual

1,774,2231.25

Competitive Landscape

Competitors by Segment

SegmentGlobal competitorsDomestic competitors

IC packaging materials (underfill, die attach, lid adhesives)

Henkel (Loctite / Hysol), Namics, Resonac (formerly Showa Denko Materials), Shin-Etsu Chemical, Sumitomo Bakelite

Huahai Chengke (EMC and electronic adhesives, incl. Hengsuo Huawei)

Wafer UV tapes / DAF

Lintec, Nitto Denko, Furukawa Electric, Resonac

Smaller domestic film makers

Thermal interface materials

Laird / DuPont, Parker Chomerics, Honeywell (PCM), Shin-Etsu, Fujipoly, 3M

Jones Tech (中石科技), Feirongda, Silicone-based TIM specialists

Smart-terminal adhesives

Henkel, H.B. Fuller, 3M, Dow, DELO

Huitian New Materials, Kangda New Materials

New-energy (battery / PV) adhesives

Henkel, H.B. Fuller, Sika, 3M, Dow

Huitian New Materials, Guibao Technology, Shanghai Kangda

High-end equipment adhesives

Henkel, Sika, 3M, Dow

Huitian New Materials, Kangda New Materials

Peer Comparison FY2026

CompanyRevenueRevenue growth (%)Net profit attributableNet margin (%)

Darbond Technology (688035)

1,54732.6107.67.0

Huitian New Materials (300041)

4,43611.22215.0

Jones Tech / 中石科技 (300684)

1,83017.133918.5

Huahai Chengke (688535)

45838.124.35.3

Company Snapshot

$215.2M

Revenue

2003

Founded

Shandong, China

Headquarters

SWOT Analysis

Strengths

  • Rapid, sustained top-line growth: Revenue CAGR 27.6% FY2021–FY2025; +32.6% FY2025; +30.5% 9M2026
  • High-margin IC and smart-terminal franchises: FY2024 gross margins of 40.1% (IC) and 48.9% (smart terminal) vs. 27.6% group
  • Domestic firsts in advanced packaging: First domestic mass-production CDAF (2024); chip-level underfill validated at a leading international OSAT; TIM1 passed a key domestic OSAT's full reliability validation (2026)
  • Tier-1 customer base: Apple, Huawei, Xiaomi, OPPO, Transsion, CATL, JCET, Tongfu, Huatian, ATX; customer awards from Xiaomi (2024), CATL (2025 EHS) and BOE (2025)
  • Net-cash balance sheet: Cash CNY 466 M plus CNY 383 M wealth-management products at FY2025 year-end; no bonds; up to CNY 700 M authorised for cash management (Sep 2026)
  • Shareholder-return discipline: ~33% dividend payout in FY2025 including a first interim dividend; three buyback programmes since 2024

Weaknesses

  • Low returns on equity: Weighted ROE 4.66% (FY2025), 4.30% (FY2024)
  • Margin erosion: Gross margin 34.0% (FY2021) → 27.0% (FY2025); net margin 13.0% → 7.0%
  • New-energy concentration at thin margins: 52.3% of FY2025 revenue; FY2024 segment gross margin 15.2% (−6.1 pp)
  • Working-capital strain: Receivables +116% in FY2025; FY2025 OCF −CNY 100.6 M
  • Falling R&D intensity: 6.65% (FY2023) → 4.70% (FY2025) → 4.36% (H1 2026)
  • Loss-making new-energy subsidiary: Yantai Darbond New Materials: FY2025 revenue CNY 538.8 M, net loss CNY 13.6 M, negative net assets

Opportunities

  • AI-server thermal boom: TIM market to USD 4.1 B by 2031; 12 W/m·K gel pad and liquid-metal paste developed for AI GPUs
  • Advanced-packaging localisation: Advanced packaging about USD 52 B in 2026 (>54% of the market); domestic OSATs expanding CoWoS-like and HBM lines
  • Chip-level products moving from small batch to volume: DAF/CDAF, underfill and lid adhesive in small-batch delivery; TIM1 validated
  • South China base: About CNY 230.5 M project close to Pearl River Delta customers
  • Overseas customer migration: Thailand JV base completed 2025; Vietnam subsidiary; North American PV customer
  • M&A platform: Techinno met its first-year profit target (CNY 12.8 M); Guangxi Lanpo added in 2026; net cash supports further deals

Threats

  • Continued battery-materials price deflation: Analysts cut FY2025 forecasts in May 2025 because new-energy average prices fell faster than expected
  • Persistent share overhang: Big Fund sold 8% of shares between 2025 and July 2026; founders filed (then cancelled) a 3% plan in Sept–Nov 2026
  • Domestic rivals consolidating: Huahai Chengke now owns Hengsuo Huawei and claims #2 global EMC shipments
  • Multinational incumbency in top-tier sockets: Henkel, Shin-Etsu and H.B. Fuller are named as principal competitors in the FY2025 annual report
  • PV policy and price shocks: Removal of PV export tax rebates (April 2026); industry overcapacity
  • Valuation volatility: 52-week range CNY 43.56–107.28; −24% over six months to 4 November 2026

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Key Developments

DateEventSignificance
9 May 2025FY2024 AGM approves CNY 2.50 per 10 shares dividend~CNY 35 M payout
15–16 May 2025IR meeting: Q1 2025 strength attributed to a clear industry recovery and strong demand across all segmentsConfirms cyclical upturn
24 May 2025Shenwan Hongyuan cuts FY2025 profit forecast citing faster-than-expected new-energy price declines; keeps BuyHighlights new-energy pricing risk
Jun 2025Big Fund completes first 3% sell-down (stake 15.65%)Supply overhang
Jun 2025Suzhou Darbond deregisteredFootprint rationalisation
H1 2025Meishan (Sichuan) IPO base completed; Kunshan fully operationalCapacity in place for growth
16 Aug 2025H1 2025: revenue CNY 690 M (+49.0%), NP CNY 45.6 M (+35.2%); interim dividend CNY 1.00 per 10 sharesFirst-ever interim dividend
Aug 2025Big Fund announces second sell-down plan (up to 3%)Overhang continues
3 Sep 2025Postal Savings Securities: chip-level TIM1 entering customer validation; BuyPipeline visibility
19 Sep 202553.42 M IPO-restricted shares (incl. controllers') become tradableFloat rises to 100%
25 Oct 2025Q3 2025: revenue CNY 400 M (+25%), core NP −6% YoY; 9M gross margin 28.0% (+1.4 pp)Profit lags revenue
Oct 2025Tianjin Techinno deregisteredIntegration step
Nov 2025Big Fund's second plan ends after selling 2% (stake 13.65%)—
2025Thailand JV production base completedOverseas capacity
Jan 2026Zhoushan Taizhong announces plan to sell up to 2%Venture-holder exit
Jan 2026Second buyback reaches 991,897 shares / CNY 40.0 MMinimum programme size met
4 Feb 2026EGM approves South China Semiconductor Materials Base (about CNY 230.5 M)IC capacity pivot
11 Feb 2026Shares hit the daily limit-up to CNY 61.82Market rerating on semiconductor theme
28 Feb 2026FY2025 express report: revenue +32.6%, NP +8.0% (preliminary)Below consensus
23 Feb – 2 Mar 2026IR: shingled-PV adhesive not used in space PV, talks with North American customer onlyDamps speculation
10 Apr 2026FY2025 annual report: NP CNY 107.6 M (+10.5%); CNY 1.50 per 10 final dividend; auditor Mazars ChinaFinal numbers above express
10 Apr 2026Zhoushan Taizhong ends its sale early at 4.99%Overhang eases
17 Apr 2026Big Fund announces third sell-down plan (up to 3%)—
25 Apr 2026Q1 2026: revenue CNY 406 M (+28.5%), NP CNY 34.4 M (+26.8%)Momentum continues
7–8 May 2026CITIC strategy conference: FY2025 segment mix disclosed (IC 16.2%, terminal 24.8%, new energy 52.3%, equipment 6.7%)Mix shift confirmed
28 May 2026Big Fund falls to 11.90%; shares at CNY 83.75 (market cap CNY 11.9 B)Stake sold into strength
Jun–Jul 2026Acquisition of 52.73% of Guangxi Lanpo SemiconductorNew subsidiary
6 Jul 2026Big Fund completes third plan (stake 10.65%, ~CNY 364 M raised)—
6 Jul 2026Company says glass-substrate packaging products are still in customer design and samplingExpectation management
1–16 Jul 2026Site visits by 18+ institutions; the chairman hostsRising institutional interest
9 Jul 2026SDIC Securities initiates: 2026–2028 NP forecasts CNY 177 / 389 / 756 MMost bullish published view
31 Jul 2026Chairman proposes third buyback (CNY 12–24 M, cap CNY 115.29)Incentive pool
11 Aug 2026H1 2026: revenue CNY 880 M (+27.5%), NP CNY 68.1 M (+49.3%); CNY 1.00 per 10 interim dividend; TIM1 validation passedOperating leverage visible
23 Sep 2026Wang Jianbin, Chen Xin and Lin Guocheng announce plans to sell up to 3%Insider supply
23 Sep 2026Board approves up to CNY 700 M idle-cash managementStrong liquidity
23 Oct 2026Q3 2026: revenue CNY 543 M (+35.7%), NP CNY 38.4 M (+59.0%)Record quarter
3 Nov 2026Founders terminate reduction plan with zero shares soldConfidence signal
4 Nov 2026Shares +15.7% to CNY 55.94 in a sector-wide semiconductor rallyRebound from lows

Financial Performance

Explore key financial metrics, segmented revenue, balance sheet health, and performance trends.

Revenue

1 chart
Revenue by Segment: Total revenue rose from CNY 929 Mn in FY2022 to CNY 1,547 Mn in FY2025.
Darbond Technology Co., Ltd. — Revenue by Segment
Series (CNY Mn)FY2022FY2023FY2024FY2025
Total revenue9299321,1671,547
IC packaging materials9496135250
Smart-terminal packaging materials182176259383
New-energy application materials590585685808
High-end equipment application materials637186104

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Sources

  1. Yantai Darbond Technology FY2025 Annual Report (10 April 2026), FY2024 Annual Report (19 April 2025), 2025 and 2026 Half-Year Reports, Q3 2025 and Q3 2026 reports, FY2025 Express Report (2026-011)
  2. Darbond announcements 2024-058, 2024-070, 2024-077, 2025-001, 2025-005, 2025-017, 2025-063, 2026-007, 2026-018, 2026-025, 2026-054; reduction-plan results (3 November 2026); 2025 and 2026 "Quality Improvement, Efficiency Enhancement and Return to Shareholders" action plans
  3. Darbond investor-relations activity records 2025-001, 2025-003, 2026-001, 2026-002, 2026-003, 2026-004
  4. IPO prospectus (draft, October 2021)
  5. Sell-side reports: Postal Savings Securities (Sep 2025, Mar 2026), Zheshang Securities (Apr 2025, Oct 2025), Shenwan Hongyuan (May 2025), SDIC Securities (Jul 2026), Capital Securities (Apr 2023)
  6. News coverage: Xinhua Finance, Securities Daily, Cailian Press, Economic Herald, East Money, Stockstar, NBD, Jiemian, Wallstreetcn, Gelonghui, etnet
  7. Peer filings and coverage: Huitian New Materials FY2025, Huahai Chengke FY2025, Jones Tech FY2025

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