Darbond Technology Co., Ltd. Overview
Darbond Technology is China's leading domestically owned platform supplier of high-end electronic packaging materials — engineered adhesives, functional films and thermal interface materials (TIMs) that bond, protect, insulate and cool components from the wafer level (level 0) through chip, board and module to complete systems (level 3). Its portfolio of more than 400 products spans four end-markets: integrated-circuit (IC) packaging, smart-terminal (consumer electronics) packaging, new-energy (EV power batteries and photovoltaics) and high-end equipment. New-energy adhesives remain the revenue anchor at roughly 52% of sales, but the strategic thrust is IC packaging: wafer UV tapes, die-attach pastes and films, underfill, lid-attach adhesives and chip-level TIMs that substitute for products from Henkel, Shin-Etsu, H.B. Fuller and Japanese film makers. Backed since before its IPO by China's Big Fund and selling to Apple, Huawei, Xiaomi, CATL, JCET, Tongfu and Huatian, Darbond grew revenue from CNY 584 million in FY2021 to CNY 1,547 million in FY2025, and is accelerating in 2026 on AI-server thermal materials and advanced-packaging import substitution.
What the company does. Darbond formulates, manufactures and sells electronic-grade adhesives and functional film materials. In its own description (FY2025 annual report and 2025–2026 investor-relations records), the company is "led by IC packaging materials technology" and focuses on four application fields — IC packaging, smart-terminal packaging, new-energy applications and high-end equipment applications — with a product line running from level-0 to level-3 packaging and serving head customers in each industry. Its main products are electronic-grade adhesives and functional films; the IC segment's catalogue covers thermal products (pads, gels, phase-change materials, liquid metal), die-attach products (die-attach paste DAP; DAF and conductive CDAF films), wafer-processing films (UV back-grinding and UV dicing tapes), underfill and lid-frame adhesives.
Business model. Darbond is a pure product company. Revenue is earned almost entirely from the sale of formulated materials; there is no material service, subscription or licensing income. Sales are executed both directly (to battery makers, OSATs, handset/EMS manufacturers and automotive OEMs) and through distributors and sales-service agents, a channel the exchange scrutinised during the IPO review. Revenue is recognised on delivery and acceptance; pricing is negotiated per qualified part number, typically with annual price-downs in high-volume new-energy programmes.
Revenue model mix (FY2025).
Product sales (adhesives, films, TIMs): Share of revenue: ~100%; Comment: Core operating revenue CNY 1,545.45 M of CNY 1,547.23 M total revenue (FY2025 annual report)
Services / licensing / subscription: Share of revenue: Negligible; Comment: Technical application support is bundled into product pricing
Value-chain position. Darbond sits between upstream chemical feedstocks (epoxy, acrylic, silicone and polyurethane resins, curing agents, silver and ceramic fillers, film substrates) and downstream device makers. Its value-add is formulation know-how, application engineering and long qualification cycles that embed a material in a customer's bill of materials for the life of a product platform. In IC packaging, materials directly affect yield and reliability, which makes customer qualification slow (often 2–3 years for chip-level materials) but sticky once achieved.
Customer types and end-markets.
IC packaging: Typical customers (publicly named): JCET, Tongfu Microelectronics, Huatian Technology, ATX Semiconductor (日月新), SSD and optical-module makers; Application examples: Wafer thinning/dicing tapes, die attach, underfill, lid attach, TIM1/TIM1.5/TIM2 for CPUs, GPUs, AI chips, optical modules
Smart terminals: Typical customers (publicly named): Apple, Huawei, Xiaomi, OPPO, Transsion, Goertek; Application examples: Structural PUR hot-melts, 3D-screen encapsulation resins, conductive and shielding adhesives for phones, watches, TWS earbuds, AR/VR
New energy: Typical customers (publicly named): CATL and other battery makers; Tongwei, LONGi, Canadian Solar (historic direct customers); a North American shingled-module customer; Application examples: Power-battery structural and thermal adhesives, PACK potting, MS hybrid sealants; shingled-cell conductive adhesive, 0BB UV adhesives
High-end equipment: Typical customers (publicly named): Automotive OEMs, rail, construction and mining machinery, appliances, power tools; Application examples: Body-in-white structural adhesives, chassis seam sealants, battery-box sealing, MRO adhesives
Independent characterisation. Darbond is best understood as a two-engine business. The cash engine is new-energy adhesives — high volume, low margin (gross margin 15.2% in FY2024), heavily exposed to CATL-led price deflation. The value engine is a combined IC + smart-terminal franchise carrying 40–49% gross margins, which together rose from about 30% of revenue in FY2022 to about 41% in FY2025. The investment case depends on how fast IC materials — particularly AI-server TIMs (strengthened by the 2025 Techinno acquisition) and chip-level underfill/DAF/TIM1 — scale from small-batch to volume supply. Profitability has lagged revenue: net margin fell from about 13% in FY2021–FY2022 to 7.0% in FY2025 as new-energy pricing compressed, share-based compensation began, and IPO capacity added depreciation before full utilisation. 2026 shows the first clear operating-leverage inflection, with 9M2026 net profit up 52.7% on revenue up 30.5%.
Strategy
Stated strategy. The company's strategic framework is "1+6+N (New)". The "1" is a single main chain running from IC packaging to smart-terminal and other electronic-system packaging. The "6" are six application markets it targets along that chain: IC packaging, smart-terminal modules, flat-panel display, new-energy power batteries, PV cells, and high-end equipment. The "N" stands for new emerging niches — above all semiconductor advanced packaging — to be entered through capital integration (M&A). Recurring themes in the FY2025 annual report and the 2025–2026 "Quality Improvement, Efficiency Enhancement and Return to Shareholders" action plans are: leadership through IC packaging-materials technology; import substitution of key materials; differentiated strategies per market; "platform-type" expansion across the packaging hierarchy; lean, digitised operations; and stable shareholder returns through dividends and buybacks.
Strategic initiatives in the last 24 months.
TIM platform build-out via Techinno: Timing: Dec 2024 – Feb 2025; Detail and targets: 89.42% acquisition for CNY 257.78 M to target AI server, GPU and data-centre cooling; TIMs are now described as "one of the company's pillar businesses," run through Shenzhen Darbond Interface and Techinno
Attempted entry into EMC (epoxy molding compound): Timing: Sep–Nov 2024; Detail and targets: 53% of Hengsuo Huawei (global #3 EMC maker by volume) at a CNY 1.4–1.6 B valuation; terminated by sellers
Chip-level advanced-packaging materials: Timing: Ongoing; Detail and targets: DAF/CDAF, chip-level underfill and lid adhesive in small-batch delivery; TIM1 passed a key domestic OSAT's full reliability validation (2026); glass-substrate materials in sampling
South China Semiconductor Materials Base: Timing: Approved Feb 2026; Detail and targets: About CNY 230.5 M total investment; converts the 35-tonne semiconductor-materials IPO project, closer to Pearl River Delta OSAT and AI-server customers
Guangxi Lanpo Semiconductor acquisition: Timing: Jun–Jul 2026; Detail and targets: 52.73% control stake; partly financed with up to CNY 41 M acquisition loan
Capacity rollout: Timing: 2023–2025; Detail and targets: Kunshan fully operational, Meishan completed H1 2025, Thailand JV completed 2025
Overseas expansion: Timing: 2024–2026; Detail and targets: Vietnam and Thailand subsidiaries; North American PV customer
Shareholder-return programmes: Timing: 2024–2026; Detail and targets: Three buybacks (CNY 53 M; CNY 40–80 M; CNY 12–24 M), interim plus final dividends at ~33% payout
Cost programme: Timing: 2024–2026; Detail and targets: Bulk procurement bargaining, technical cost-down and smart manufacturing to offset new-energy price declines
Digitalisation of R&D: Timing: 2026 action plan; Detail and targets: Digitised, data-driven R&D platforms to improve development efficiency
Medium-term financial targets. The company does not publish numeric revenue or margin guidance. The qualitative guidance (2026 IR records): IC and smart-terminal shares continue to rise; new energy holds market share and grows with the industry while declining as a share of revenue; high-end equipment grows steadily.
Products & Services
IC packaging materials
| Product | Description / key capabilities | Target customer | Status (latest) |
|---|---|---|---|
| Wafer UV back-grinding (thinning) tape | Protects the active wafer face during back-grinding; UV-release for clean de-tape | OSATs, wafer-level packaging lines | Stable volume supply to mainstream domestic OSATs |
| Wafer UV dicing tape | Holds wafers during singulation; UV-switchable adhesion for die pick-up | OSATs | Stable volume supply |
| Die-attach paste (DAP, 固晶胶) | Conductive and non-conductive epoxy die-attach pastes for leadframe and substrate packages | OSATs, power-device makers | Stable volume supply |
| DAF (die-attach film) | Film-form die attach for thin-die stacking (memory, SiP) | OSATs, memory packaging | Small-batch delivery; breaks foreign monopoly |
| CDAF (conductive die-attach film) | Conductive die-attach film for power and RF dies | OSATs | First domestic supplier to reach mass-production application (2024) |
| Chip-level underfill | Capillary underfill for flip-chip / large high-speed dies; passed testing at a leading international OSAT (2024) | Advanced-packaging OSATs (FC-BGA, HBM-adjacent applications) | Small-batch delivery |
| Board-level underfill / SMT adhesives | Reinforces BGA/CSP solder joints on PCBs | EMS, handset makers | Volume supply |
| Lid-frame (AD) adhesive | Bonds heat-spreader lids and stiffener frames on FC-BGA packages | OSATs (CPU/GPU/AI packages) | Small-batch delivery |
| TIM1 (chip-level thermal material) | Die-to-lid thermal interface for high-power processors | OSATs, AI-chip programmes | Passed a key domestic OSAT's full reliability validation (2026) |
| TIM1.5 / TIM2 pads and gels | Lid-to-heat-sink and board-level thermal pads and dispensable gels | Server, GPU, optical-module, SSD makers | Stable volume supply |
| 12 W/m·K high-performance gel pad | High-conductivity gap pad for AI-GPU servers | AI server ODMs | Developed 2025 |
| Liquid-metal composite paste | Ultra-high-conductivity TIM for AI chips | AI accelerator programmes | Developed 2025 |
| Phase-change materials (PCM) | Pre-applied TIM that flows at operating temperature | CPU/GPU, telecom | In portfolio |
| Two-component high-thermal gel for SSDs | Dispensable gel for enterprise SSD controllers/NAND | SSD makers | Lab-to-mass-production breakthrough (2024) |
| Ultra-thin TIM; high-reliability "合晶" thermal sheet | Thin-bond-line thermal films | High-density electronics | Developed 2025 |
| Glass-substrate packaging materials | Materials adapted for glass-core substrates | Advanced-packaging developers | Design iteration and sample validation (Jul 2026) |
| Techinno TIM range | High-end pads, gels, EMI shielding, absorbers, insulation and heat-dissipation materials (Changshu) | Servers, telecom, automotive electronics | Consolidated since Feb 2025 |
Smart-terminal packaging materials
| Product | Description | Target customer | Status |
|---|---|---|---|
| PUR reactive hot-melt adhesives | Structural bonding of housings, displays and frames; high reliability and reworkability | Apple, Huawei, Xiaomi, OPPO, Transsion | Sales breakthrough across all five (2024); applied in multiple flagship phone models of a leading domestic brand; 2025 "Technology Breakthrough Award" from a head customer |
| LIPO 3D-screen encapsulation photosensitive resin | Enables narrow-bezel, high-reliability encapsulation of curved/3D screens on phones and watches | Xiaomi and others | Volume supply to Xiaomi; Xiaomi "Cooperation Innovation Award" 2024 |
| Conformal coatings (披覆胶) | Moisture and corrosion protection of PCBAs | Handset, wearable, IoT makers | Volume supply |
| Conductive adhesives | Replace solder in heat-sensitive interconnects | Module makers | Volume supply |
| EMI shielding materials | Conductive gaskets and adhesives | Handset, wearable makers | Volume supply |
| Structural and sealing adhesives for wearables / TWS / AR-VR | Waterproofing and structural bonding in miniature devices | Goertek-type acoustics/wearable ODMs | Strategy uses TWS as a beachhead, extending to watches and AR/VR |
| Thermal materials for handsets | Graphite-adjacent pads and gels for SoC hotspots | Handset makers | In portfolio |
New-energy application materials
| Product | Description | Target customer | Status |
|---|---|---|---|
| Power-battery structural adhesives | Cell-to-pack and module bonding | CATL and other battery makers | High domestic share; volumes rising despite price declines |
| Thermal-conductive adhesives / potting | Heat transfer from cells to cooling plates | Battery makers | Volume supply |
| MS hybrid resin materials | Bonding and sealing; new thermal-conductive and low-viscosity grades | Leading NEV OEMs (multiple models) | Batch use |
| PU materials for battery PACK encapsulation | Self-designed synthetic-resin PU with strong adhesion and low modulus | Battery PACK makers | Launched 2025 |
| Shingled-cell (叠瓦) conductive adhesive | Interconnects overlapping solar cells | Primarily a North American customer; rooftop and utility PV | Steady growth; small share of FY2025 revenue; not yet used in space PV |
| 0BB UV adhesive | Fixes busbar-free ribbons in zero-busbar module technology | PV module makers | In portfolio |
| Other PV packaging materials | Frame and junction-box sealants | PV module makers | Small volumes |
High-end equipment application materials
| Product | Description | Target customer | Status |
|---|---|---|---|
| Automotive body structural adhesive | Replaces some spot welds; improves body stiffness and sealing | Automotive OEMs | Applied in body-in-white |
| Modified-silane sealants and hybrid adhesives | Chassis and battery-box weld-seam sealing | Automotive OEMs | Broad application |
| Thermal and insulating adhesives for NEVs | Battery thermal management and electrical safety | NEV OEMs | Volume supply |
| Rail, construction and mining machinery adhesives | Structural bonding, sealing, thread-locking | Equipment makers | Volume supply |
| Appliance and power-tool adhesives; MRO products | General engineering adhesives | Appliance and tool makers; maintenance channels | Volume supply |
Pricing is not published for any product. All products are sold per qualified specification, typically under annual frame agreements with periodic price renegotiation.
Financial Narrative
All figures are in CNY under PRC Accounting Standards for Business Enterprises. FY2023–FY2025 are from the FY2025 annual report; FY2021–FY2022 are from the IPO prospectus and FY2022 annual-report data. The preliminary FY2025 results (express report, February 2026) gave net profit of CNY 105.26 M; the audited annual report gives CNY 107.61 M, which is used throughout.
Income statement
(Zero entries in FY2021–FY2022 for operating and pre-tax profit mark periods outside the three-year comparative window of the latest filings; they are not reported values.)
FY2025 dividend = CNY 0.10 interim + CNY 0.15 final. FY2023 EBITDA and dividend are shown as zero only as table placeholders. The FY2024 final dividend was CNY 2.50 per 10 shares.
Margins (%)
Revenue CAGR FY2021–FY2025: 27.6%. FY2020–FY2025 CAGR is about 30% (from CNY 417 M).
Commentary. Three phases are visible. (1) FY2021–FY2022: hyper-growth (+59% in FY2022) driven by EV-battery adhesives, with new-energy revenue up 121% in FY2022 and net margins near 13%. (2) FY2023: a stall — revenue flat at CNY 932 M as new-energy prices fell faster than volumes rose and consumer electronics destocked; gross margin slipped to 28.8%. (3) FY2024–FY2025: re-acceleration (+25%, +33%) led by IC and smart terminals, but profit grew only modestly. FY2024 net profit fell 5.4% on new-energy margin compression (segment gross margin −6.1 pp to 15.2%), restricted-stock expense, and higher spending on overseas market development, IT and R&D. FY2025 net profit rose 10.5% against revenue up 32.6%; core (non-recurring-adjusted) profit rose a healthier 19.1%. Q4 FY2025 net profit was CNY 37.9 M (+2.4% YoY), below sell-side expectations of about CNY 157 M for the full year.
Quarterly trajectory
9M2026 (Q3 report, 23 October 2026): revenue CNY 1,423 M (+30.5%), net profit CNY 106.0 M (+52.7%), core net profit CNY 100.0 M (+49.9%), operating cash flow CNY 103 M, EPS CNY 0.76. Q3 2026 alone: revenue CNY 542.7 M (+35.7%), net profit CNY 38.4 M (+59.0%). Q1 2026 gross margin was 26.99% (+0.05 pp YoY, +0.62 pp QoQ). The 2026 pattern shows the operating leverage FY2025 lacked: profit growth now exceeds revenue growth by about 20 percentage points.
Balance sheet
(Zero cells are table placeholders for items not carried in the three-year comparative summary.)
At 30 September 2026, total assets were CNY 3,708 M (+7.6% YTD) and parent equity CNY 2,402 M (+3.3%). At 31 March 2026: cash CNY 497.7 M, trading financial assets CNY 384.3 M, notes receivable CNY 124.2 M, accounts receivable CNY 412.3 M, inventory CNY 279.1 M. The balance sheet remains conservatively financed: the debt-to-asset ratio was about 22% through FY2024–Q1 2025, there are no bonds outstanding, and in September 2026 the board authorised up to CNY 700 M of idle own funds for cash management. Liabilities rose in FY2025 mainly through operating payables, minority interests and deferred consideration from the Techinno deal. The 20% final tranche of Techinno consideration is payable after the earn-out period.
Goodwill and intangibles. The Techinno purchase (CNY 257.78 M for 89.42%, against a valuation of CNY 288.4 M for 100% and audited attributable book equity of CNY 51.66 M at 30 September 2024) created the group's main goodwill and acquired-intangible balance. It is protected by an earn-out: Techinno must deliver cumulative net profit of at least CNY 36 M over the commitment period and at least CNY 14 M in 2026, or the sellers compensate Darbond. Techinno earned CNY 12.8 M in FY2025.
Cash flow
The FY2024 dividend (CNY 2.50 per 10 shares on about 140.9 M shares) is approximately CNY 35 M. The FY2025 total of CNY 35.16 M equals 32.67% of net profit. FY2024 buyback cash is as of 31 October 2024; the FY2025 figure is the second programme's CNY 40.01 M through January 2026.
Commentary. Operating cash flow is volatile and was negative in FY2025 (−CNY 100.6 M, including −CNY 90.7 M in Q4) as accounts receivable more than doubled (+116%) on fast growth in longer-term IC and smart-terminal accounts and greater use of notes and supply-chain settlement by battery customers. FY2024's CNY 379 M inflow reflected aggressive collection plus inventory release. 2026 has normalised: H1 OCF +CNY 28.3 M (vs. −CNY 18.2 M), and 9M OCF +CNY 103 M. Capex peaked in FY2023–FY2025 with the Kunshan, Meishan and Thailand bases; the South China semiconductor base (about CNY 230.5 M, of which about CNY 62.4 M is reallocated IPO proceeds) is the main 2026–2027 project.
Ratios
FY2025 debt-to-asset includes minority interests in liabilities; on a parent-equity basis the leverage is lower. The current ratio for FY2025 is a sell-side estimate. Zero cells are placeholders.
Net debt is negative (net cash of roughly CNY 850 M including wealth-management products at FY2025 year-end), so net debt/EBITDA and interest coverage are not meaningful; finance expense was a net income of about CNY 9 M in FY2024. ROE in the 4–5% range is the company's chief financial weakness: the IPO raised CNY 1.64 B of equity that is not yet fully earning. Consensus-style forecasts imply ROE recovering towards 8–11% by FY2026–FY2027 if 2026 momentum holds.
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Segment Overview
| Segment | What it contains | Key subsidiaries / sites |
|---|---|---|
IC packaging materials | Wafer UV back-grinding and dicing tapes; die-attach paste (DAP); DAF/CDAF die-attach films; chip-level and board-level underfill; lid-frame (AD) adhesives; TIM1/TIM1.5/TIM2 pads, gels, PCM, liquid metal | Yantai parent, Kunshan, Shenzhen Darbond Interface Materials, Suzhou Techinno, Dongguan Darbond Yihua, South China base (under construction) |
Smart-terminal packaging materials | Structural PUR reactive hot-melts, UV/photosensitive resins for 3D screen encapsulation, conformal coatings, conductive and EMI-shielding adhesives, SMT adhesives for phones, wearables, TWS, AR/VR | Yantai, Kunshan, Shenzhen |
New-energy application materials | Power-battery structural, thermal-conductive and sealing adhesives (incl. MS hybrid and PU PACK materials); PV shingled-cell conductive adhesive, 0BB UV adhesives and other PV packaging materials | Yantai Darbond New Materials, Meishan (Sichuan), Thailand JV |
High-end equipment application materials | Automotive structural adhesives replacing spot welds, modified-silane and hybrid sealants, thermal and insulating adhesives; rail, construction and mining machinery, appliances, power tools, MRO | Yantai |
Revenue by Segment
| Segment (CNY Mn) | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
IC packaging materials | 94 | 96 | 135 | 250 |
Smart-terminal packaging materials | 182 | 176 | 259 | 383 |
New-energy application materials | 590 | 585 | 685 | 808 |
High-end equipment application materials | 63 | 71 | 86 | 104 |
Total revenue | 929 | 932 | 1,167 | 1,547 |
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View Subscription PlansSegment Revenue
| Segment | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
IC packaging materials | 2 | 40.8 | 85 |
Smart-terminal packaging materials | -3 | 47.1 | 48 |
New-energy application materials | -1 | 17.1 | 18 |
High-end equipment application materials | 13 | 21.0 | 21 |
Segment Revenue (FY2022–FY2025)
| Segment | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
IC packaging materials | 10.1 | 10.3 | 11.6 | 16.2 |
Smart-terminal packaging materials | 19.6 | 18.9 | 22.2 | 24.8 |
New-energy application materials | 63.5 | 62.8 | 58.7 | 52.3 |
High-end equipment application materials | 6.8 | 7.6 | 7.4 | 6.7 |
Segment Revenue (FY2023–FY2024)
| Segment | FY2023 | FY2024 |
|---|---|---|
IC packaging materials | 38.74 | 40.10 |
Smart-terminal packaging materials | 44.69 | 48.86 |
New-energy application materials | 21.30 | 15.23 |
High-end equipment application materials | 40.24 | 41.67 |
Group Entities
| Entity | Ownership | Function |
|---|---|---|
Shenzhen Darbond Interface Materials Co., Ltd. | 100% | TIM R&D and production (South China) |
Weishida Semiconductor (威士达半导体) | 100% | Semiconductor materials |
Darbond (Kunshan) Materials Co., Ltd. | 100% | IPO-funded East China production base |
Sichuan Darbond New Materials (Meishan) | 100% | Southwest production base serving battery and PV customers |
Yantai Darbond New Materials Co., Ltd. | 100% | New-energy materials production (FY2025 revenue CNY 538.8 M; net loss CNY 13.6 M) |
Darbond International | 100% | Overseas holding / trading |
Darbond Vietnam | 100% | Southeast Asia service and manufacturing |
Darbond Thailand | 100% | Thailand holding / operations |
Thailand JV — Darbond Materials Co., Ltd. | Controlling | Thailand production base (completed 2025) |
Dongguan Darbond Yihua Materials Co., Ltd. | 51% | Die-attach / chip-protection materials (FY2024 revenue CNY 36.8 M) |
Suzhou Techinno New Material Technology Co., Ltd. | 89.42% | High-end TIMs (FY2025 revenue CNY 93.1 M; net profit CNY 12.8 M) |
Guangxi Lanpo Semiconductor Co., Ltd. | 52.7273% (from Jul 2026) | Semiconductor materials; acquisition partly funded by an up-to-CNY 41 M CITIC Bank loan |
Income Statement
| Metric (CNY Mn) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Revenue | 584.3 | 928.5 | 932.0 | 1,166.8 | 1,547.2 |
Cost of revenue | 385.4 | 650.0 | 663.9 | 845.3 | 1,129.1 |
Gross profit | 198.9 | 278.6 | 268.1 | 321.5 | 418.2 |
Operating profit | 0 | 0 | 119.7 | 104.4 | 115.9 |
Pre-tax profit | 0 | 0 | 117.2 | 110.7 | 116.6 |
Net profit attributable to parent | 76 | 123 | 102.9 | 97.4 | 107.6 |
Net profit excl. non-recurring items | 0 | 0 | 87.7 | 83.7 | 99.7 |
Income Statement and Per-Share Data
| Metric | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
EBITDA (CNY Mn) | 0 | 148.8 | 166.1 |
Basic EPS (CNY) | 0.72 | 0.69 | 0.76 |
Basic EPS excl. non-recurring (CNY) | 0.62 | 0.59 | 0.71 |
Dividend per share (CNY) | 0 | 0.25 | 0.25 |
R&D expense (CNY Mn) | 62.0 | 66.9 | 72.7 |
Margin Analysis (%)
| Metric | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Gross margin | 34.0 | 30.0 | 28.8 | 27.6 | 27.0 |
Operating margin | 0 | 0 | 12.8 | 8.9 | 7.5 |
EBITDA margin | 0 | 0 | 0 | 12.8 | 10.7 |
Net margin (attributable) | 13.0 | 13.2 | 11.0 | 8.4 | 7.0 |
R&D / revenue | 0 | 0 | 6.65 | 5.73 | 4.70 |
Financial Analysis
| Metric (CNY Mn) | Q1-25 | Q2-25 | Q3-25 | Q4-25 | Q1-26 | Q2-26 | Q3-26 |
|---|---|---|---|---|---|---|---|
Revenue | 316.3 | 373.6 | 399.9 | 457.4 | 406.4 | 473.6 | 542.7 |
Net profit attributable | 27.1 | 18.4 | 24.2 | 37.9 | 34.4 | 33.6 | 38.4 |
Balance Sheet
| Metric (CNY Mn) | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Total assets | 2,740.7 | 2,969.7 | 3,445.6 |
Equity attributable to parent | 2,270.4 | 2,294.0 | 2,324.2 |
Total liabilities incl. minority interests | 470.3 | 675.7 | 1,121.4 |
Cash and equivalents (period end) | 0 | 0 | 466.3 |
Trading financial assets (wealth-management) | 0 | 0 | 383.1 |
Accounts receivable | 0 | 194.5 | 420.2 |
Inventory | 0 | 0 | 218.7 |
Dividends & Capital Returns
| Metric (CNY Mn) | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Net operating cash flow | 38.9 | 379.0 | -100.6 |
Cash dividends declared for the year | 0 | 35.2 | 35.2 |
Share buybacks (cash, approx.) | 0 | 53.1 | 40.0 |
Returns & Leverage Ratios (%) and Financial Ratios (x)
| Ratio | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
ROE, weighted average (%) | 4.60 | 4.30 | 4.66 |
ROE excl. non-recurring (%) | 3.92 | 3.69 | 4.31 |
ROA (net profit / avg. total assets, %) | 0 | 3.4 | 3.4 |
ROIC (%, Postal Savings Securities estimate) | 0 | 3.2 | 3.8 |
Debt-to-asset ratio (%) | 17.2 | 22.2 | 32.5 |
Current ratio (x) | 0 | 3.20 | 3.24 |
Asset turnover (revenue / avg. assets, x) | 0 | 0.41 | 0.48 |
Receivables turnover (x) | 0 | 5.57 | 0 |
Segment Overview — IC packaging materials
| Segment | Mainland China | Southeast Asia | North America / other |
|---|---|---|---|
IC packaging materials | Dominant (JCET, Tongfu, Huatian, ATX and domestic AI/server supply chain) | Emerging via customers' overseas OSAT plants | Minimal |
Smart-terminal packaging materials | Dominant (China assembly of global brands) | Growing as handset and wearable assembly moves to Vietnam/India | Indirect via global brands |
New-energy application materials | Dominant (CATL and domestic battery chain) | Thailand base supports battery/PV customers' overseas plants | PV conductive adhesive for a North American customer |
High-end equipment application materials | Dominant | Minimal | Minimal |
Share Price & Returns
| Reference point | Price | Comment |
|---|---|---|
IPO price (Sep 2022) | 46.12 | — |
23 May 2025 | 38.77 | Post-FY2024 results |
11 Feb 2026 | 61.82 | Limit-up on South China base news |
28 May 2026 | 83.75 | Market cap CNY 11.9 B |
52-week high | 107.28 | Mid-2026 peak |
52-week low | 43.56 | — |
4 Nov 2026 close | 55.94 | +15.7% on the day |
Return window to 4 Nov 2026 | % | — |
1 month | -21.9 | — |
3 months | -0.7 | — |
6 months | -24.2 | — |
1 year | 13.8 | — |
Since IPO (vs. CNY 46.12) | 21.3 | — |
Valuation Snapshot
| Multiple | Value | Basis |
|---|---|---|
P/E (FY2025) | 74 | NP CNY 107.6 M |
P/E (trailing 12 months to Q3 2026) | 55 | TTM NP ≈ CNY 144 M |
P/S (TTM) | 4.2 | TTM revenue ≈ CNY 1,880 M |
P/B | 3.3 | Parent equity CNY 2,402 M (30 Sep 2026) |
EV/EBITDA (FY2025) | 43 | EV ≈ CNY 7.1 B net of about CNY 850 M cash and wealth products; EBITDA CNY 166 M |
Analyst Ratings & Targets
| Broker (date) | Rating | FY2026E revenue (CNY Mn) | FY2026E NP (CNY Mn) | FY2027E NP (CNY Mn) |
|---|---|---|---|---|
Postal Savings Securities (24 Mar 2026) | Buy | 2,018 | 195 | 305 |
SDIC Securities (9 Jul 2026) | Buy | — | 177 | 389 |
Zheshang Securities (26 Oct 2025) | Buy | 1,970 | 230 | 320 |
Per-Share Data and Returns & Leverage Ratios (%)
| Metric | FY2024 | FY2025 | FY2026 |
|---|---|---|---|
DPS (CNY) | 0.25 | 0.25 | 0.10 |
Payout ratio (%) | 36 | 32.67 | 20.78 |
Capital Programmes
| Programme | Period | Size | Execution |
|---|---|---|---|
First | 2024 | — | 1,299,170 shares, CNY 53.05 M (to 31 Oct 2024), price range CNY 24.77–51.80 |
Second | 2 Apr 2025 – 1 Apr 2026 | CNY 40–80 M | 991,897 shares, CNY 40.01 M (to 31 Jan 2026) |
Third | Proposed 31 Jul 2026 | CNY 12–24 M, cap CNY 115.29 | For ESOP / equity incentives |
Analyst Conclusions
Management guidance. No numeric guidance is given. Management expects IC packaging and smart-terminal materials to keep outgrowing the group, new energy to hold share and grow with the industry, and high-end equipment to grow steadily. Priorities for 2026–2027 are volume ramp of chip-level materials (TIM1, underfill, DAF/CDAF, lid adhesive), AI-server TIMs, construction of the South China semiconductor base, integration of Techinno and Guangxi Lanpo, and overseas (Thailand/Vietnam) expansion.
Consensus growth expectations. Published forecasts imply FY2026 revenue of about CNY 1.95–2.05 B (+26–30%) and net profit of CNY 177–230 M. 9M2026 results (revenue +30.5%, NP +52.7%) support the revenue path; profit is tracking below the forecast range.
Bull case.
-
AI thermal and advanced-packaging leverage. IC revenue nearly doubled to about CNY 250 M in FY2025. With TIM1 validated and three chip-level products in small-batch supply, IC could exceed 20% of sales in FY2026–FY2027 at around 40% gross margin, lifting group margins.
-
Operating leverage has arrived. 9M2026 net profit growth (+52.7%) is 22 points above revenue growth, and OCF has turned positive (+CNY 103 M). Spare capacity at Kunshan, Meishan and Thailand means incremental revenue drops through at high marginal rates.
-
Overhang clearing and insider conviction. Big Fund is down to 10.65% from 18.65%, Zhoushan Taizhong is below 5%, and the founders cancelled their November 2026 sale with zero shares sold while the company keeps buying back stock.
Bear case.
-
New-energy drag persists. At 52% of revenue and around 15% gross margin, continued battery and PV price deflation can absorb most IC gains; the Yantai new-energy subsidiary lost CNY 13.6 M in FY2025.
-
Returns stay sub-par. ROE of 4–5% on CNY 2.4 B of equity does not justify a 55x trailing P/E unless profit roughly doubles; FY2025 profit missed expectations by about 30%.
-
Chip-level commercialisation risk. Qualification at top OSATs is slow, Henkel, Shin-Etsu and Namics are entrenched, and R&D intensity (4.4–4.7%) is thin for the roadmap breadth.
Key catalysts and monitorables (next 12 months).
FY2026 annual results and dividend: Expected timing: April 2027; Why it matters: Tests whether NP reaches the CNY 177–230 M forecast range
Q1 2027 results: Expected timing: April 2027; Why it matters: Durability of operating leverage
Techinno 2026 earn-out (≥ CNY 14 M): Expected timing: FY2026 audit; Why it matters: Goodwill safety; deferred 20% consideration
TIM1 / underfill / DAF volume orders at domestic OSATs: Expected timing: Rolling; Why it matters: Shift from small-batch to volume
South China base construction milestones: Expected timing: 2026–2027; Why it matters: IC capacity near Pearl River Delta customers
- Guangxi Lanpo integration and first consolidated contribution — Expected timing: Q4 2026 – FY2027; Why it matters: Scope and synergy of the new subsidiary
Glass-substrate materials validation: Expected timing: 2027; Why it matters: Long-dated advanced-packaging option
Big Fund and founder share-reduction activity: Expected timing: Ongoing; Why it matters: Supply overhang
Receivables and OCF trend: Expected timing: Quarterly; Why it matters: Quality of growth
New-energy pricing (CATL tenders) and PV export policy: Expected timing: Ongoing; Why it matters: Margin pressure on the largest segment
Analyst verdict. Darbond Technology is China's most complete domestic platform for electronic packaging materials, and the evidence points to a business moving into a more profitable phase after three years in which revenue growth failed to reach the bottom line. Revenue nearly tripled between FY2021 and FY2025, but net profit rose only 42%, as falling battery-adhesive prices, share-based pay and IPO-funded capacity diluted returns to a 4–5% ROE. Two things now look different. First, the mix is changing structurally: IC packaging and smart-terminal materials, carrying gross margins about 25 points above new energy, reached roughly 41% of sales in FY2025, and the Techinno acquisition has turned thermal interface materials into a pillar business tied to AI-server demand. Second, 2026 numbers show real operating leverage for the first time since listing — nine-month net profit up 52.7% on revenue up 30.5%, with operating cash flow back in surplus. The chip-level pipeline (TIM1 validated, underfill, DAF/CDAF and lid adhesives in small-batch supply) gives credible upside to an IC business that domestic OSAT capex and supply-chain localisation should keep driving.
The risks are just as concrete. New energy is still more than half of revenue and is structurally deflationary. R&D intensity has fallen below 5%. And a trailing P/E of around 55x already discounts a substantial profit ramp that published forecasts place above what the 2026 run-rate supports. On the other side, Big Fund's stake has been cut from 18.65% to 10.65%, the founders' decision not to sell in November 2026 and continued buybacks signal internal confidence, and a net-cash balance sheet funds both organic capacity and further bolt-on deals. On balance, Darbond is a quality, policy-aligned compounder whose rerating depends on execution: the shares should outperform if IC revenue keeps compounding at 50% or more and group net margin returns to around 10% in FY2027, but they will remain volatile while profit lags the sell-side's expectations.
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View Subscription PlansExecutive Leadership
Board of Directors
| Name | Title | Background |
|---|---|---|
Xie Haihua (解海华) | Chairman of the Board; legal representative; co-controlling shareholder | Long-serving leader since the company's early years; general partner of employee platforms Yantai Kanghui and Yantai Derui; legal representative of Darbond (Kunshan); proposer of the third buyback (July 2026) |
Dr. Chen Tian'an (陈田安) | Director and General Manager; co-controlling shareholder | Co-founder and technical leader of the move into IC packaging materials; holds overseas nationality (listed as an overseas individual shareholder); legal representative of Dongguan Darbond Yihua |
Wang Jianbin (王建斌) | Director; co-controlling shareholder | Founding-team member; 6.12% holder |
Lin Guocheng (林国成) | Co-controlling shareholder | Founding-team member; 9.29% holder |
Chen Xin (陈昕) | Co-controlling shareholder | Founding-team member; 1.25% holder |
Yu Jie (于杰) | Deputy General Manager, Board Secretary and Chief Financial Officer | Head of finance and investor relations; legal representative of Suzhou Techinno post-acquisition |
Zhang Chengjia (张城嘉) | Head of Accounting | Signs the financial statements alongside the chairman and CFO |
Zhan Shineng (战世能) | Director, Board Office (Securities Director) | Investor-relations lead |
Zhai Cheng (翟丞) | Securities Affairs Representative | Investor relations |
Prof. Song Hongsong (宋红松) | Independent Director (since Dec 2023) | Born August 1969; PhD, law professor at Yantai University and director of its IP Research Centre; national IP expert pool member; arbitrator in Qingdao and Yantai |
Prof. Li Ming (李明) | Independent Director (since Jan 2025) | Born February 1960; PhD from Kyushu Institute of Technology; tenured professor at Shanghai Jiao Tong University's School of Materials Science, director of its Electronic Materials Technology Institute; earlier years in packaging-materials R&D at Mitsui High-tec |
Prof. Yang Deren (杨德仁) | Former Independent Director (Dec 2020 – Jan 2025) | Born April 1964; CAS Academician, Zhejiang University; resigned under CAS rules on academicians' outside roles |
Board & Management Changes
| Date | Change | Context |
|---|---|---|
Dec 2024 | Independent director Yang Deren resigns | CAS rules on academicians' outside roles |
6 Jan 2025 | Li Ming elected independent director; committee seats reshuffled | Adds advanced-packaging materials expertise |
FY2025 | Auditor changes from Yongtuo CPA to Mazars China (中审众环) | Standard unqualified FY2025 opinion |
31 Dec 2025 | Orient Securities' continuous supervision period ends | Normal STAR Market timeline |
Major Shareholders
| # | Shareholder | Type | Shares | % of total |
|---|---|---|---|---|
| 1 | National Integrated Circuit Industry Investment Fund Co., Ltd. | State-owned legal person | 15,433,534 | 10.85 |
| 2 | Xie Haihua | Domestic individual | 15,116,354 | 10.63 |
| 3 | Lin Guocheng | Domestic individual | 13,208,201 | 9.29 |
| 4 | Wang Jianbin | Domestic individual | 8,703,115 | 6.12 |
| 5 | Zhoushan Taizhong Venture Capital Partnership (LP) | Other (6.70 M shares pledged) | 7,111,800 | 5.00 |
| 6 | Yantai Kanghui Investment Center (LP) — employee platform | Other | 5,939,050 | 4.18 |
| 7 | Yantai Derui Investment Center (LP) — employee platform | Other | 5,724,379 | 4.02 |
| 8 | Chen Tian'an | Overseas individual | 3,145,456 | 2.21 |
| 9 | HKSCC Nominees Ltd. (Northbound Stock Connect) | Other | 2,534,693 | 1.78 |
| 10 | Chen Xin | Domestic individual | 1,774,223 | 1.25 |
Competitive Landscape
Competitors by Segment
| Segment | Global competitors | Domestic competitors |
|---|---|---|
IC packaging materials (underfill, die attach, lid adhesives) | Henkel (Loctite / Hysol), Namics, Resonac (formerly Showa Denko Materials), Shin-Etsu Chemical, Sumitomo Bakelite | Huahai Chengke (EMC and electronic adhesives, incl. Hengsuo Huawei) |
Wafer UV tapes / DAF | Lintec, Nitto Denko, Furukawa Electric, Resonac | Smaller domestic film makers |
Thermal interface materials | Laird / DuPont, Parker Chomerics, Honeywell (PCM), Shin-Etsu, Fujipoly, 3M | Jones Tech (中石科技), Feirongda, Silicone-based TIM specialists |
Smart-terminal adhesives | Henkel, H.B. Fuller, 3M, Dow, DELO | Huitian New Materials, Kangda New Materials |
New-energy (battery / PV) adhesives | Henkel, H.B. Fuller, Sika, 3M, Dow | Huitian New Materials, Guibao Technology, Shanghai Kangda |
High-end equipment adhesives | Henkel, Sika, 3M, Dow | Huitian New Materials, Kangda New Materials |
Peer Comparison FY2026
| Company | Revenue | Revenue growth (%) | Net profit attributable | Net margin (%) |
|---|---|---|---|---|
Darbond Technology (688035) | 1,547 | 32.6 | 107.6 | 7.0 |
Huitian New Materials (300041) | 4,436 | 11.2 | 221 | 5.0 |
Jones Tech / 中石科技 (300684) | 1,830 | 17.1 | 339 | 18.5 |
Huahai Chengke (688535) | 458 | 38.1 | 24.3 | 5.3 |



