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Guangdong Tianyu Semiconductor

Company Profile Analysis

Ticker: 2658.HK廣東天域半導體股份有限公司

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Guangdong Tianyu Semiconductor - Semiconductor showcase

Year Founded & Workforce

2009

1,239 Employees

Industry

Semiconductor
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Guangdong Tianyu Semiconductor Overview

Guangdong Tianyu Semiconductor is a Dongguan-based pure-play maker of silicon carbide (SiC) epitaxial wafers. These wafers are the active-layer substrates on which SiC MOSFETs, Schottky diodes and power modules are built. Founded in 2009 as China's first specialist SiC epitaxy house, it brought 4-inch epitaxy into mass production in 2014, 6-inch in 2018 and 8-inch in 2023. By 2024 revenue and volume it was the largest self-manufactured SiC epitaxial wafer supplier in China, with a 30.6% revenue share and 32.5% volume share. It was also the third-largest China-based supplier globally, at 6.7% of revenue and 7.8% of volume. The company sells to power-device makers serving electric vehicles, charging, photovoltaics, energy storage, rail, smart grid and, more recently, AI data-centre power supplies. Strategic investors include Huawei's Hubble and BYD. It listed in Hong Kong in December 2025 to fund an expansion toward 800,000 wafers a year, centred on 8-inch capacity at its new Songshan Lake Ecological Park base.


What the company does

Tianyu grows thin, precisely doped single-crystal SiC layers on purchased SiC substrates by chemical vapour deposition (CVD). The result, an epitaxial wafer, is the starting material for SiC power devices. Epitaxy sets the drift-layer thickness and doping that determine a device's blocking voltage, on-resistance and yield. Defect density, thickness uniformity and doping uniformity in the epi layer therefore pass straight through to device performance and cost. Tianyu says it has mastered the full production cycle for epi wafers used in unipolar and bipolar devices rated from 600 V to 30,000 V.

The company's own description in its annual report covers the R&D, production and sale of 4-inch, 6-inch and 8-inch SiC epitaxial wafers, plus value-added services: SiC epitaxial foundry (toll processing on customer-supplied substrates), epitaxial wafer cleaning and SiC-related inspection and testing.

Business and revenue model

Revenue streamModelFY2025 share of revenue (%)
Self-manufactured 6-inch epitaxial wafersProduct sale, priced per wafer by specification45.3
Self-manufactured 8-inch epitaxial wafersProduct sale, priced per wafer by specification28.0
Self-manufactured 4-inch epitaxial wafersProduct sale0.4
Other sales and services (mainly foundry)Service fee per processed wafer; cleaning and test fees26.3

Self-manufactured 6-inch epitaxial wafers: Model: Product sale, priced per wafer by specification; FY2025 share of revenue (%): 45.3

Self-manufactured 8-inch epitaxial wafers: Model: Product sale, priced per wafer by specification; FY2025 share of revenue (%): 28.0

Self-manufactured 4-inch epitaxial wafers: Model: Product sale; FY2025 share of revenue (%): 0.4

Other sales and services (mainly foundry): Model: Service fee per processed wafer; cleaning and test fees; FY2025 share of revenue (%): 26.3

All revenue is product or service. There is no subscription or licensing revenue. The business is capital intensive: CVD reactors, cleanrooms and metrology make up most of the asset base. Substrates are the largest variable cost, and the company has steadily moved them to domestic suppliers.

Value-chain position

The SiC chain runs: high-purity powder → crystal growth and substrate (e.g. SICC/Tianyue Advanced, TanKeBlue, Wolfspeed, Coherent) → epitaxy (Tianyu, Hantian Tiancheng, Resonac, SK Siltron) → device fabrication (Infineon, STMicroelectronics, onsemi, ROHM, BYD Semiconductor, and Chinese fabless and IDM players) → modules → end systems. Tianyu is a merchant epitaxy supplier. Unlike vertically integrated device makers that grow their own epi, it sells to device makers that choose to outsource epitaxy, either fully or for overflow capacity.

Customers and end-markets

Customers are SiC power-device manufacturers (IDMs and foundries) in China and abroad, plus research institutes. End uses include new energy (EV traction inverters and on-board chargers, PV inverters, charging piles, energy storage), rail transit, smart grids, general aviation and home appliances. Since 2026 they also include server and data-centre power: overseas revenue jumped in the first half of 2026, which management linked to AI computing and data-centre demand.

Customer concentration is high. The five largest customers accounted for 73.5%, 61.5% and 77.2% of revenue in 2021, 2022 and 2023, and 91.4% in the first half of 2024. The single largest customer accounted for 30.9%, 21.1%, 42.0% and 52.6% over the same periods. In 2023 one South Korean customer bought RMB491 million of 6-inch epi wafers, 42% of revenue. That customer's orders fell to RMB35.96 million in the first half of 2024, the main cause of the 2024 revenue collapse.

Independent characterisation

Tianyu is a scale-driven, price-taking materials supplier. Its fortunes depend on SiC device demand and on the supply-demand balance for substrates and epi capacity. The company enjoyed first-mover status in China and rapid growth from 2021 to 2023. It then hit a severe price-led downturn in 2024, which forced a RMB315 million inventory write-down, and recovered only partly in 2025. The strategic bet is that 8-inch wafers, foundry services and international customers (Korea, Japan, Europe) will restore utilisation and margins as demand broadens from EVs into AI data-centre power.

Strategy

Stated strategy (FY2025 annual report and 2026 interim report)

Management's stated aim is to "consolidate and expand" Tianyu's leading position in China's SiC epitaxial wafer market. Its recurring strategic themes are:

  1. 8-inch transition. Ramp up 8-inch capacity at the Ecological Park and lead the industry shift from 6-inch to 8-inch, which management expects to speed up from 2026.

  2. Technology differentiation. 4H-SiC thick-film fast epitaxy, multi-layer epitaxy and thicker wafers for high-voltage devices, plus R&D in gallium oxide and diamond.

  3. Customised delivery and services. A custom-delivery model and expansion of foundry, cleaning and inspection services.

  4. Internationalisation. New sales centres in Malaysia, Italy and Japan, and continued expansion in Korea, Japan and Europe.

  5. Domestic substitution. Localised equipment (more than 80%) and substrates (more than 90%) to cut cost and supply-chain risk.

  6. New demand vectors. AI data-centre power (800 V HVDC architectures), EVs and charging infrastructure.

Initiatives in the last 24 months

DateInitiativeDetail
Dec 2025Hong Kong IPOGross proceeds about HK$1.74 billion; 62.5% of net proceeds for capacity expansion over five years, 15.1% for R&D and innovation, and the remainder for strategic investments and acquisitions, the global sales network and working capital
Dec 2025Ecological Park baseLine commissioned; base underpins the 800,000 wafers-per-year target
Jan 2026Qinghe Jingyuan allianceJoint process development of bonded SiC, SOI, POI, 12-inch-plus SiC composite heat-dissipation substrates and interposers
Feb 2026EYEQ Lab strategic agreementLong-term SiC epi supply and application partnership with a Korean SiC power-device firm
May 2026H-share full circulationCSRC accepted application to convert unlisted shares into H shares
Sep 2026H-share repurchase programmeUp to 10% of H shares (about 5.9 million shares) under the AGM mandate

Dec 2025: Initiative: Hong Kong IPO; Detail: Gross proceeds about HK$1.74 billion; 62.5% of net proceeds for capacity expansion over five years, 15.1% for R&D and innovation, and the remainder for strategic investments and acquisitions, the global sales network and working capital

Dec 2025: Initiative: Ecological Park base; Detail: Line commissioned; base underpins the 800,000 wafers-per-year target

Jan 2026: Initiative: Qinghe Jingyuan alliance; Detail: Joint process development of bonded SiC, SOI, POI, 12-inch-plus SiC composite heat-dissipation substrates and interposers

Feb 2026: Initiative: EYEQ Lab strategic agreement; Detail: Long-term SiC epi supply and application partnership with a Korean SiC power-device firm

May 2026: Initiative: H-share full circulation; Detail: CSRC accepted application to convert unlisted shares into H shares

Sep 2026: Initiative: H-share repurchase programme; Detail: Up to 10% of H shares (about 5.9 million shares) under the AGM mandate

Guidance and medium-term targets

The company does not issue numerical revenue or margin guidance. The quantified targets are 800,000 wafers of annual capacity after full Ecological Park ramp-up, continued growth in 8-inch's revenue share, and the allocation of IPO proceeds above. Management expects SiC power-semiconductor demand to keep growing in 2026, led by AI data centres, EVs and charging.

Products & Services

Self-manufactured SiC epitaxial wafers

ProductDescription and key capabilitiesTarget customersMass-production yearStatus
4-inch 4H-SiC epitaxial wafersLegacy diameter; single- and multi-layer epi for diodes and MOSFETs; one of China's first in volumeResearch institutes, legacy device lines2,014Run-off; RMB2.7 million revenue in FY2025. The 4-inch market is expected to shrink from 54 thousand wafers in 2023 to 20 thousand in 2028
6-inch 4H-SiC epitaxial wafersMainstream diameter; thin and thick drift layers for 650 V–3.3 kV devices and above; automotive-grade quality systemEV inverter, OBC, PV, charging and industrial device makers2,018Largest revenue line through FY2025; ASP under pressure. Industry 6-inch ASP is projected to fall from RMB9,377 per wafer in 2021 to RMB6,560 in 2028
8-inch 4H-SiC epitaxial wafersNext-generation diameter with lower cost per die; capacity concentrated at the Ecological Park baseLeading IDMs migrating to 200 mm; Korean and overseas customers2,023Fastest-growing line; 42.3% of H1-2026 revenue
Thick-film, high-voltage epiThick-layer fast epitaxy for 3.3 kV–30 kV unipolar and bipolar devices; broke foreign suppliers' hold on thick epi above 3,300 VRail traction, smart grid and HVDC device makers—Specialty, higher-value niche
Multi-layer and custom-structure epiMulti-layer stacks, buffer layers and trench-fill epitaxy for advanced MOSFET and superjunction structuresDevice R&D and advanced-node customers—Customised delivery model

Pricing is per wafer, negotiated by specification (diameter, layer thickness, doping, defect grade). List prices are not publicly disclosed. The prospectus states that the company strategically cut prices to gain market penetration.

Value-added services

ServiceDescriptionTarget customersCommercial note
SiC epitaxial foundryGrowth of epi layers on customer-supplied substrates; customer keeps substrate ownershipDevice makers with their own substrate supply, including vertically integrated substrate makersMain driver of the 430% jump in other sales and services in FY2025; margin of 1.9% in FY2025
Epitaxial wafer cleaningPost-epi and pre-process cleaning using in-house cleaning technologyDevice fabsBundled with foundry and product sales
SiC inspection and testingDefect mapping, thickness and doping metrology and related testsDevice makers, research institutesExpansion of foundry and inspection services is an explicit 2026 priority

Development-stage materials

ProgrammeDescriptionPartnerYear announced
Bonded SiC substratesBonded SiC wafers to cut substrate cost and enable new device structuresQinghe Jingyuan2,026
SOI and POISilicon-on-insulator and piezoelectric-on-insulator bonded substratesQinghe Jingyuan2,026
12-inch-plus SiC composite heat-dissipation substrates and interposersLarge-diameter SiC thermal substrates for advanced packagingQinghe Jingyuan2,026
Gallium oxide and diamond materialsNext-generation ultra-wide-bandgap materialsIn-house R&D2,026

Financial Narrative

Income statement — five-year headline

The FY2021 growth cell is a placeholder of zero because FY2020 revenue has not been published. Revenue CAGR was 46.4% over FY2021–FY2025 and 17.5% over FY2022–FY2025.

Income statement — detailed

EBITDA is operating profit plus depreciation and amortisation as reported in the cash flow statement.

FY2025 income statement detail (RMB thousand, from the FY2025 annual results)

Interim comparison (RMB thousand, from the 2026 interim results)

Commentary. Tianyu's income statement has gone through three phases. From FY2021 to FY2023 it scaled quickly: revenue rose 7.6-fold, wafer shipments climbed from 17,001 to about 131,000, and the company moved from a RMB180 million loss to a RMB95.9 million profit. In 2023, however, that profit rested on one Korean customer that took 42% of revenue. The FY2024 collapse had three causes: that customer's orders evaporated, Chinese 6-inch epi capacity expanded quickly, and prices of both epi wafers and substrates fell sharply. Revenue fell 55.6%, and a RMB315.1 million inventory write-down pushed gross margin to -72%. FY2025 was a partial repair. Revenue grew 36.5% on 8-inch volume and a five-fold rise in foundry services. The write-down provision fell to RMB13.1 million. Cheaper domestic substrates also lowered unit costs, and gross margin returned to 18.8%. The net loss narrowed by 88%, to RMB62.2 million, even as finance costs rose to RMB48.7 million after capitalised interest of RMB20.7 million.

The first half of 2026 reversed much of that progress. Revenue edged up 4.3%, but cost of sales jumped 49.1% for four reasons: 8-inch wafers carry higher unit costs, Q1 seasonality left fixed costs under-absorbed, new inventory write-down provisions were booked, and releases of earlier write-downs fell. The result was a small gross loss. Administrative expenses rose from RMB17.5 million to RMB77.8 million, a trade-receivable impairment of RMB35.4 million was recorded, and a net FX loss of RMB19.1 million turned operating profit into a RMB114.7 million loss. The data show that pricing, not volume, now drives profitability.

Shipments and capacity

The first prospectus reported 132,072 wafers for 2023; the final prospectus gives 130,702. Capacity utilisation was below 58.9% during the 2024 downturn. On full ramp-up of the Ecological Park base, total annual capacity is planned to reach 800,000 epi wafers.

Balance sheet

Zeros in this table mark items not published for that date (lease liabilities and payables at FY2024; PP&E and intangibles at H1-2026). They are not reported values. The company carries no goodwill.

Commentary. The listing transformed the balance sheet. Net current liabilities of RMB523 million at end-2024 became net current assets of RMB1,065 million, and gearing (borrowings to equity) fell from 138.9% to 83.6%. Equity rose to RMB2.71 billion after RMB1.54 billion of net proceeds were credited to share capital and reserves. The quality of the year-end position is weaker than the totals suggest. Trade receivables of RMB742.6 million equal about 105% of FY2025 revenue, reflecting heavy fourth-quarter shipments and rescheduled deliveries. By the date of the annual results the company had collected more than RMB470 million of them. By mid-2026 cash had fallen to RMB570 million after RMB360 million of capex and debt repayment. Inventories had tripled to RMB211.8 million, and gearing stood at 75.0%. Undrawn committed bank facilities of RMB4.82 billion and effective borrowing rates of 2.39%–3.80% give ample refinancing headroom. Pledged assets fell from RMB1,006.4 million at end-2025 to RMB674.1 million.

Cash flow

Commentary. Tianyu has burned between RMB700 million and RMB985 million of free cash flow every year since 2022, a cumulative RMB3.5 billion. Equity (RMB2.9 billion across the Series B and the IPO) and RMB2.3 billion of net new debt have funded it. FY2025 operating cash flow was negative because of a RMB612 million rise in receivables. That reversed in the first half of 2026, when operating cash flow was a positive RMB235 million, up 342% year on year, helped by collections and RMB92.9 million of customer prepayments recorded as contract liabilities. Capex stepped down from a peak of RMB1.02 billion in FY2023 to RMB599 million in FY2025, then rose to RMB360 million in the first half of 2026 as the Ecological Park base was fitted out. Remaining capital commitments were RMB1,193 million at 30 June 2026. Buybacks began only in September 2026.

Ratios

ROE and ROA use total net profit and average balances. Interest coverage on an EBIT basis was negative in both FY2024 and FY2025. The FY2025 year-end cash conversion cycle is inflated by fourth-quarter billing. On the 30 June 2026 balance sheet, annualising first-half revenue, receivable days fall to about 242.

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Financial Detail

Grouping Details

GroupingContents

Self-manufactured SiC epitaxial wafers

4-inch, 6-inch and 8-inch 4H-SiC epitaxial wafers grown on purchased substrates and sold outright

Other sales and services

SiC epitaxial foundry (customer-consigned substrates), wafer cleaning, inspection and testing, and other sales

Products

ProductFY2024FY2025

6-inch epitaxial wafers (CNY Mn)

455.8321.4

8-inch epitaxial wafers (CNY Mn)

21.0198.4

4-inch epitaxial wafers (CNY Mn)

7.62.7

Self-manufactured wafers subtotal (CNY Mn)

484.4522.5

Other sales and services (CNY Mn)

35.2186.7

Total revenue (CNY Mn)

519.6709.2

Products — 6-inch share of revenue

ProductFY2024FY2025

6-inch share of revenue (%)

87.745.3

8-inch share of revenue (%)

4.028.0

4-inch share of revenue (%)

1.50.4

Other sales and services share (%)

6.826.3

YoY growth FY2025 vs FY2024

Growth (%)

—

6-inch

-29.5—

8-inch

846.8—

4-inch

-64.9—

Self-manufactured subtotal

7.9—

Other sales and services

430.4—

Total

36.5—

Products (Half-Yearly)

ProductH1-2025H1-2026

8-inch epitaxial wafers (CNY Mn)

104.7147.1

6-inch epitaxial wafers (CNY Mn)

185.2146.8

4-inch epitaxial wafers (CNY Mn)

2.61.1

Other sales and services (CNY Mn)

40.953.0

Total revenue (CNY Mn)

333.4347.9

Segment Margins & Growth (%)

MetricFY2024FY2025H1-2025H1-2026

Self-manufactured wafers gross margin (%)

-72.325.038.83.0

Other sales and services gross margin (%)

-64.51.9-34.2-19.1

Group gross margin (%)

-72.018.829.8-0.3

Revenue by Segment

MetricFY2025H1-2025H1-2026

Self-manufactured wafers gross profit (CNY Mn)

130.5113.38.9

Other sales and services gross profit (CNY Mn)

3.6-14.0-10.1

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Income Statement and Margin Analysis (%)

MetricFY2021FY2022FY2023FY2024FY2025

Revenue (CNY Mn)

154.6436.91,171.2519.6709.2

Revenue growth (%)

0182.6168.1-55.636.5

Gross margin (%)

15.720.018.5-72.018.8

Net profit, total (CNY Mn)

-180.32.895.9-500.3-62.2

Net margin (%)

-116.60.68.2-96.3-8.8

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Income Statement and Per-Share Data

MetricFY2022FY2023FY2024FY2025

Revenue (CNY Mn)

436.91,171.2519.6709.2

Cost of sales (CNY Mn)

349.4954.6894.0575.8

Gross profit (CNY Mn)

87.5216.6-374.4133.4

R&D expense (CNY Mn)

295561.059.6

Operating profit (CNY Mn)

14.2102.7-554.6-25.3

D&A (CNY Mn)

34.389.1130.8145.8

EBITDA (CNY Mn)

48.5191.8-423.8120.4

Pre-tax profit (CNY Mn)

3.7111.0-589.2-74.1

Net profit, total (CNY Mn)

2.895.9-500.3-62.2

Net profit attributable to shareholders (CNY Mn)

7.0101.4-492.5-55.6

EPS basic and diluted (MYR Bn)

0.020.28-1.36-0.15

Dividend per share (MYR Bn)

0000

Margin (%)

Margin (%)FY2022FY2023FY2024FY2025

Gross margin (%)

20.018.5-72.018.8

Operating margin (%)

3.38.8-106.7-3.6

EBITDA margin (%)

11.116.4-81.617.0

Net margin (%)

0.68.2-96.3-8.8

Business Lines

LineFY2024FY2025

Revenue

519,622709,228

Cost of sales

-893,982-575,804

Gross profit

-374,360133,424

Other net income

13,37727,724

Selling and distribution expenses

-19,023-19,134

Administrative and other operating expenses

-113,599-107,714

R&D expenses

-61,032-59,619

Loss from operations

-554,637-25,319

Finance costs

-34,551-48,744

Loss before taxation

-589,188-74,063

Income tax credit

88,93611,854

Loss for the year

-500,252-62,209

Attributable to equity shareholders

-492,455-55,605

Attributable to non-controlling interests

-7,797-6,604

Business Lines (Half-Yearly)

LineH1-2025H1-2026

Revenue

333,404347,888

Cost of sales

-234,067-349,104

Gross profit

99,337-1,216

Other net income

17,0763,956

Selling and distribution

-9,104-9,717

Administrative and other operating

-17,545-77,849

R&D

-26,984-29,874

Operating profit

62,780-114,700

Finance costs

-24,710-29,509

Profit before tax

38,070-144,209

Income tax

-7,16521,635

Profit for the period

30,905-122,574

Attributable to equity holders

34,245-119,807

EPS basic and diluted (MYR Bn)

0.09-0.30

Financial Analysis

MetricFY2021FY2022FY2023FY2024

Epitaxial wafer sales volume incl. foundry (pieces)

17,00144,515130,70278,928

Financial Analysis (FY2022–May-2025)

MetricFY2022FY2023May-2025

Annual epi capacity (thousand wafers)

50170420

Balance Sheet

MetricFY2022FY2023FY2024FY2025

Total assets (CNY Mn)

1,758.53,043.03,479.65,443.1

Non-current assets (CNY Mn)

763.51,995.92,877.23,250.2

Current assets (CNY Mn)

995.01,047.1602.32,193.0

Current liabilities (CNY Mn)

143.3786.41,125.31,127.7

Non-current liabilities (CNY Mn)

39.9559.91,134.71,602.4

Total liabilities (CNY Mn)

183.21,346.32,259.92,730.1

Total equity (CNY Mn)

1,575.41,696.71,219.62,713.0

Working capital (CNY Mn)

851.8260.7-523.01,065.3

Balance Sheet (FY2024–H1-2026)

MetricFY2024FY2025H1-2026

Cash and cash equivalents (CNY Mn)

114.61,166.3570.4

Restricted cash (CNY Mn)

37.86.9106.9

Short-term borrowings (CNY Mn)

634.6765.5535.1

Long-term borrowings (CNY Mn)

1,059.61,501.51,415.1

Total borrowings (CNY Mn)

1,694.22,267.01,950.2

Net debt (CNY Mn)

1,579.61,100.71,379.8

Lease liabilities (CNY Mn)

048.044.0

Property, plant and equipment (CNY Mn)

2,338.72,761.10

Intangible assets (CNY Mn)

3.55.20

Inventories (CNY Mn)

183.469.2211.8

Trade and bills receivables (CNY Mn)

147.5742.6461.0

Trade and bills payables (CNY Mn)

0141.2327.9

Contract liabilities (CNY Mn)

04.392.9

Cash Flow

MetricFY2022FY2023FY2024FY2025

Operating cash flow (CNY Mn)

-262.287.4-62.3-386.1

Capital expenditure (CNY Mn)

-437.7-1,021.0-840.3-599.3

Free cash flow (CNY Mn)

-699.9-933.9-902.6-985.3

Investing cash flow (CNY Mn)

-514.5-1,090.0-842.8-601.0

Net debt issued/(repaid) (CNY Mn)

-184.1777.8917.8581.6

Equity issued (CNY Mn)

1,394001,533

Financing cash flow (CNY Mn)

1,211726.9830.12,061

Dividends paid (CNY Mn)

0000

Share buybacks (CNY Mn)

0000

Cash interest paid (CNY Mn)

5.121.759.485.3

Share-based compensation (CNY Mn)

7.917.223.225.8

Returns & Leverage Ratios (%) and Financial Ratios (x)

RatioFY2022FY2023FY2024FY2025

ROE (%)

0.25.9-34.3-3.2

ROA (%)

0.24.0-15.3-1.4

ROIC (%)

0.95.1-21.3-0.1

Current ratio (x)

6.951.330.541.95

Borrowings to equity (%)

150138.983.6

Asset turnover (x)

0.250.490.160.16

Ratio

FY2025

———

Net debt / EBITDA (x)

9.1———

EBITDA / finance costs (x)

2.5———

Days sales outstanding, year-end (days)

382———

Days inventory outstanding, year-end (days)

44———

Days payables outstanding, year-end (days)

89———

Cash conversion cycle, year-end (days)

337———

Revenue by Region (%)

RegionFY2021FY2022FY2023FY2024FY2025

Revenue outside Chinese Mainland (% of total)

14.712.644.28.60.6

Revenue by Region

RegionFY2024FY2025H1-2025H1-2026

Chinese Mainland (CNY Mn)

474.9705.4332.2285.4

South Korea (CNY Mn)

39.31.10.260.6

Other countries (CNY Mn)

5.52.71.11.9

Total (CNY Mn)

519.6709.2333.4347.9

Growth (%)

Growth (%)FY2025 vs FY2024 (%)H1-2026 vs H1-2025 (%)

Chinese Mainland

48.5-14.1

South Korea

-97.240,321

Other countries

-50.972.6

Share Price & Returns

Reference pointPrice (HKD)

IPO price (5 Dec 2025)

58.00

Day-two intraday high (8 Dec 2025)

46.16

FY2025 year-end close (31 Dec 2025)

48.00

Intraday high on Samsung SiC reports (15 May 2026)

54.30

Post-buyback-announcement level (15 Sep 2026)

35.44

Latest close (6 Nov 2026)

43.30

Performance to 6 Nov 2026

Return (%)

Since IPO price

-25.3

Year to date (from FY2025 close)

-9.8

Valuation Multiples

MultipleTianyu (2658.HK)Hantian Tiancheng (2726.HK)

P/E, trailing (x)

negative earnings

532.5

P/B (x)

5.677.32

EV/Sales, trailing (x)

22.331.9

Market capitalisation (HKD Mn)

17,0290

Enterprise value (HKD Mn)

18,6670

Capital Markets

MetricFY2022FY2023FY2024FY2025

Dividend per share (MYR Bn)

0000

Debt Maturity Profile

MaturityFY2024FY2025H1-2026

Due within one year (CNY Mn)

634.6765.5535.1

Due after one year (CNY Mn)

1,059.61,501.51,415.1

Analyst Conclusions

Management guidance

Management offers qualitative guidance only. It expects SiC power-device demand to keep growing, driven by AI data centres, EVs and charging, and it expects the 6-inch-to-8-inch transition to speed up. It plans to keep ramping 8-inch capacity at the Ecological Park and to grow overseas, foundry and inspection revenue. No numerical revenue, margin or capex guidance has been issued. No formal consensus forecasts are published.

Bull case

  1. 8-inch inflection. 8-inch revenue went from RMB21 million in FY2024 to RMB147 million in H1-2026 alone. If utilisation rises at the Ecological Park, the 38.8% self-made wafer margin of H1-2025 shows achievable profitability.

  2. International re-rating. Korean revenue of RMB60.6 million in H1-2026, together with Samsung's SiC restart and the EYEQ Lab channel, could rebuild the overseas mix that made up 44% of revenue in FY2023, this time with 8-inch and AI-power demand behind it.

  3. Pricing-cycle turn. Industry-wide SiC price increases in 2026 and high substrate utilisation, combined with Tianyu's localised cost base, could restore gross margins faster than the market expects. The H1-2026 operating cash inflow of RMB235 million and RMB92.9 million of customer prepayments point to firmer demand.

Bear case

  1. Structural price pressure. H1-2026 gross margin of -0.3%, after 18.8% in FY2025, shows the company remains a price taker in an oversupplied Chinese epi market, with 6-inch ASPs still falling.

  2. Losing ground to Hantian Tiancheng. The peer grew 92% at a 27.8% gross margin in H1-2026 and holds about 31.6% of global volume, against Tianyu's 7.8%. That suggests share and customer migration toward a stronger 8-inch competitor.

  3. Capital intensity and dilution risk. Four consecutive years of free cash outflow (RMB985 million in FY2025), RMB1.19 billion of commitments, falling cash (RMB570 million at mid-2026) and a full-circulation overhang on a 14.94% float could pressure the shares even if operations improve.

Key catalysts (next 12 months)

Expected timingCatalyst
Q4 2026 – Q1 2027Volume and pricing trends in H2-2026, including whether the Q2-2026 order recovery holds
Q1 2027FY2026 profit alert and annual results; scale of inventory and receivable provisions
2,027CSRC decision on H-share full circulation and any conversion of unlisted shares
2,027Ecological Park ramp-up toward the 800,000-wafer target
2,027New Korean, Japanese and European customer qualifications; progress of the Samsung SiC pilot line
OngoingPace of H-share repurchases against the 5.9 million-share mandate
OngoingCommercial milestones from the Qinghe bonded-substrate programme

Q4 2026 – Q1 2027: Catalyst: Volume and pricing trends in H2-2026, including whether the Q2-2026 order recovery holds

Q1 2027: Catalyst: FY2026 profit alert and annual results; scale of inventory and receivable provisions

2027: Catalyst: CSRC decision on H-share full circulation and any conversion of unlisted shares

2027: Catalyst: Ecological Park ramp-up toward the 800,000-wafer target

2027: Catalyst: New Korean, Japanese and European customer qualifications; progress of the Samsung SiC pilot line

Ongoing: Catalyst: Pace of H-share repurchases against the 5.9 million-share mandate

Ongoing: Catalyst: Commercial milestones from the Qinghe bonded-substrate programme

Monitorables

Gross margin of self-manufactured wafers by half-year; 8-inch share of revenue; overseas share of revenue; top-five customer concentration; receivable days and impairment charges; inventory levels; capex against commitments; net debt and undrawn facilities; Hantian Tiancheng's growth and margins; industry ASPs for 6- and 8-inch epi.

Analyst verdict

Guangdong Tianyu Semiconductor is a strategically relevant but financially fragile asset. Its claim to relevance is real. It is China's pioneer and largest domestic supplier of SiC epitaxial wafers, has built one of the country's biggest 6- and 8-inch epi capacity bases, has localised most of its equipment and substrate supply, and counts Huawei's Hubble and BYD among its backers. In SiC power semiconductors, epitaxy is a gating step, and demand drivers are widening from 800 V EVs to AI data-centre HVDC power.

The financial record is less reassuring. Revenue has swung from RMB1.17 billion to RMB520 million and back to RMB709 million. Gross margin has moved between +18.5%, -72%, +18.8% and -0.3% within three years, and free cash flow has been deeply negative every year. The swings come from the company's structural position: a merchant supplier squeezed between consolidating substrate makers and device makers that can grow their own epi, serving a handful of large customers in a market whose capacity has run ahead of demand. The first half of 2026 confirmed that position. Volume and Korean revenue recovered, but pricing pushed margins back to zero while the main domestic peer grew 92% at a 28% gross margin.

The IPO has removed near-term solvency risk, buybacks provide some technical support, and the 8-inch ramp and Korean channel give real optionality. A sustained re-rating, however, needs evidence that the company can hold self-manufactured wafer margins above 20% through a full cycle while filling the Ecological Park. That has not yet been shown. At about 22x trailing EV/sales and 5.7x book, the valuation already prices in a good deal of that recovery. The balance of evidence supports a cautious, catalyst-driven stance: positive on the industry's direction, neutral to cautious on Tianyu's ability to capture it profitably until two consecutive halves of positive, rising gross margins confirm the turn.

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Executive Leadership

Board of Directors

NameRoleAgeTenure / background

Li Xiguang (李錫光)

Chairman, Executive Director and General Manager

59

Co-founder; Chairman and GM since 2009; formerly in audio-visual disc manufacturing

Au Yeung Chung (歐陽忠)

Non-executive Director

62

Co-founder; formerly in audio-visual disc manufacturing

Jiang Dacai

Non-executive Director

—

Member of the Audit Committee

He Zhengsheng

Independent Non-executive Director

—

Chairs the Remuneration and Nomination Committees

Li Min

Independent Non-executive Director

—

Chairs the Audit Committee

Vincent Chin (Chin Vincent)

Independent Non-executive Director

—

Independent director

“—” = not publicly disclosed.

Executive Leadership Team

NameTitleAgeBackground

Li Xiguang

General Manager

59

As above

Peng Guanghui

Chief Financial Officer

55

COO and CFO from 2015 to June 2019; CFO since July 2019

Li Yongmei

Deputy General Manager

46

Joined April 2021; oversees supply chain and sales

Han Jingrui

Deputy General Manager and Head of R&D

38

More than 14 years in SiC epitaxy R&D; named on 20 invention and 18 utility-model patents

Li Zhuoxing

Joint Company Secretary

—

Nephew of Li Xiguang

Chan Pak Lun

Joint Company Secretary

—

Hong Kong-based joint secretary

“—” = not publicly disclosed.

Board of Directors — Zhuang Shuguang

NameRole

Zhuang Shuguang

Chair of Supervisory Committee

Yuan Yi

Supervisor

Yin Xuefang

Supervisor

Directors' Remuneration

CommitteeChairMembersMeetings in FY2025

Audit

Li Min

He Zhengsheng, Jiang Dacai

1

Remuneration

He Zhengsheng

Au Yeung Chung, Li Min

1

Nomination

He Zhengsheng

Li Xiguang, Li Min

—

Strategic and ESG

Li Xiguang

Au Yeung Chung, He Zhengsheng

—

“—” = not publicly disclosed.

Major Shareholders

HolderSharesClass% of total issued shares

Au Yeung Chung

66,126,373

Unlisted (non-H)

16.81

Zhuang Shuguang

28,139,493

Unlisted (non-H)

7.16

Lee Yuk Ming

22,349,321

Unlisted (non-H)

5.68

Lee Yuk Ming

10,000,000

H shares

2.54

Shenzhen Hubble Technology Investment Partnership (Huawei)

19,852,303

Unlisted (non-H)

5.05

Shenzhen Hubble Technology Investment Partnership (Huawei)

4,000,000

H shares

1.02

Competitive Landscape

Key Competitors

CompetitorCountrySegment overlapPositioning relative to Tianyu

Hantian Tiancheng Electronic Technology (Xiamen) (2726.HK)

China

Merchant SiC epi, 4/6/8-inch

Largest merchant epi supplier globally by volume (31.6% share in 2024); earlier in 8-inch commercial supply; serves 4 of the top 5 SiC device makers

Resonac (formerly Showa Denko)

Japan

Merchant SiC epi

Long-established automotive-grade epi supplier to global IDMs

SK Siltron

South Korea

SiC substrates and epi

Korean incumbent; competes in the Korean channel Tianyu is re-entering

Wolfspeed

United States

Substrates, epi, devices (integrated)

Global substrate leader; sells epi and grows its own

Coherent

United States

SiC substrates and epi

Vertically integrated materials supplier

STMicroelectronics

Switzerland/Italy

In-house epi for SiC devices

Leading SiC device maker; partly a customer, partly a self-supplier

ROHM / SiCrystal

Japan/Germany

Integrated substrate, epi and devices

Captive epitaxy

Infineon

Germany

In-house epi and devices

Captive supply; price leader in devices

CETC-affiliated epi suppliers (e.g. Hebei Puxing / CETC 13th and 55th Institutes)

China

Domestic SiC epi

State-linked domestic competitors

SICC / Tianyue Advanced (2631.HK; 688234.SH)

China

SiC substrates (supplier)

Key upstream supplier; potential forward integration into epi

Sanan Optoelectronics (Hunan Sanan)

China

Integrated substrate, epi and devices

Captive epi; competes for domestic device customers

Peer Comparison FY2025

MetricTianyu (2658.HK)Hantian Tiancheng (2726.HK)

FY2025 revenue (CNY Mn)

709.2765

FY2025 revenue growth (%)

36.5-21.4

FY2025 gross margin (%)

18.824.8

FY2025 net profit attributable (CNY Mn)

-55.612

H1-2026 revenue (CNY Mn)

347.9578

H1-2026 revenue growth (%)

4.392.0

H1-2026 gross margin (%)

-0.327.8

H1-2026 net profit attributable (CNY Mn)

-119.848.6

2024 global epi share by volume (%)

7.831.6

Recent Developments

There have been no material litigation, regulatory sanctions, layoffs or leadership departures in the period.

Company Snapshot

$98.6M

Revenue

1,239

Employees

2009

Founded

Dongguan, China

Headquarters

SWOT Analysis

Strengths

  • Domestic market leadership. The largest self-manufactured SiC epi supplier in China in 2024, with 30.6% of revenue and 32.5% of volume.
  • Scale of capacity. About 420,000 wafers a year of 6- and 8-inch capacity at May 2025, rising toward 800,000 with the Ecological Park.
  • 8-inch momentum. 8-inch revenue grew from RMB21.0 million in FY2024 to RMB198.4 million in FY2025 and reached 42.3% of H1-2026 revenue.
  • Technology depth. 84 patents (33 invention), capability across 600 V–30,000 V, and thick-epi know-how above 3,300 V.
  • Supply-chain localisation. Equipment above 80% and substrates above 90% domestic; FY2025 unit costs fell partly on domestic substrates.
  • Strengthened balance sheet and liquidity. Equity of RMB2.71 billion after the IPO and RMB4.82 billion of undrawn committed bank facilities at mid-2026.

Weaknesses

  • Customer concentration. The top five customers took 77.2% of FY2023 revenue and 91.4% in the first half of 2024; the largest took 52.6%.
  • Volatile margins. Gross margin swung from 18.5% (FY2023) to -72.0% (FY2024), 18.8% (FY2025) and -0.3% (H1-2026).
  • Persistent cash burn. Free cash flow was negative by RMB700–985 million every year from FY2022 to FY2025.
  • Low-margin services mix. Other sales and services made up 26.3% of FY2025 revenue at a 1.9% gross margin.
  • Working-capital strain. Year-end FY2025 receivables of RMB742.6 million, about 105% of annual revenue; RMB35.4 million impairment in the first half of 2026.
  • Governance concentration. Combined chairman and GM role; one executive director; joint company secretary related to the chairman.

Opportunities

  • Korean re-entry. Korean revenue rose from RMB0.15 million in H1-2025 to RMB60.6 million in H1-2026 via EYEQ Lab.
  • AI data-centre power. 800 V HVDC adoption by hyperscalers raises SiC content; management cites AI demand for the overseas surge.
  • Industry price recovery. Industry-wide SiC price increases in 2026, with leading substrate makers' utilisation above 90%.
  • New materials. The Qinghe alliance covers bonded SiC, SOI, POI and 12-inch-plus composite heat-dissipation substrates.
  • International sales centres. Planned offices in Malaysia, Italy and Japan widen the customer base beyond China.
  • Acquisitions. Part of the IPO proceeds is earmarked for strategic investments and acquisitions.

Threats

  • Price competition. H1-2026 gross margin turned negative on ASP declines from what management called stage-wise intensified competition.
  • Stronger peer. Hantian Tiancheng grew H1-2026 revenue 92% at a 27.8% gross margin while Tianyu grew 4.3%.
  • Vertical integration. Device makers and substrate makers (SICC, Wolfspeed, Infineon, ST) can capture epitaxy in-house.
  • Geopolitics. A key US customer cut purchases by about 90% in 2024; export controls and trade policy are explicit prospectus risks.
  • Overhang from full circulation. Conversion of unlisted shares (CSRC application accepted May 2026) could add supply to a 14.94% free float.
  • FX exposure. A net FX loss of RMB19.1 million in H1-2026, with no hedging policy for USD, EUR and JPY.

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Key Developments

DateEventSignificance
23 Jun 2025First Hong Kong listing application lapsesProcess restarted
22 Jul 2025Second HKEX application filed; Jan–May 2025 revenue RMB257 million, net profit RMB9.5 millionReturn to small profit disclosed
21 Oct 2025HKEX listing hearing passedPath to listing cleared
27 Nov 2025IPO launched at HK$58.00; cornerstones commit HK$161.5 millionValuation set at about HK$22.8 billion
28 Nov 2025Retail margin subscription exceeds HK$2.16 billionStrong retail demand
5 Dec 2025Listing on HKEX Main Board; shares trade below issue priceWeak debut
8 Dec 2025Shares rebound more than 12% intraday to HK$45.36, still about 20% below issue priceVolatility after listing
9 Dec 2025Shares fall 5.2% on concerns over losses and customer concentrationInvestor scepticism
19 Dec 2025Ecological Park base line commissionedCapacity expansion phase begins
16 Jan 2026Qinghe Jingyuan strategic cooperation agreementBonded and composite substrate optionality
Feb 2026EYEQ Lab strategic agreementKorean market re-entry
17 Mar 2026Profit alert: FY2025 net loss RMB55–65 millionLoss narrows 87%–89%; delivery reschedules cited
30 Mar 2026FY2025 results: revenue RMB709.2 million (+36.5%), gross margin 18.8%Operating turnaround
27 Apr 20262025 annual report and AGM circular publishedRepurchase and issuance mandates sought
11 May 2026Shares rise more than 10% on EYEQ Lab partnership newsKorea catalyst
15 May 2026Shares jump up to 19% on reports that Samsung is restarting SiC, with a pilot line targeted for 2027Read-across to EYEQ Lab channel
19 May 2026AGM approves amended articles, supervisor change and buyback mandateGovernance update
29 May 2026CSRC accepts H-share full-circulation applicationPossible future H-share supply
12 Jun 2026Shares rise more than 7% as brokers highlight AI power demand for SiCAI data-centre theme
15 Jun 2026Shares rise more than 10% amid industry-wide SiC price increases led by Infineon and STMicroelectronicsPricing-cycle signal
16–22 Jun 2026Rally on reports of early adoption of 800 V HVDC by Nvidia and Google data centresDemand narrative
14 Aug 2026Profit warning: first-half net loss RMB104–123 millionMargin relapse
27 Aug 2026Interim results: revenue +4.3%, gross margin -0.3%, net loss RMB122.6 million; overseas revenue RMB62.5 millionMixed: strong Korea, weak pricing
14 Sep 2026Board approves buyback of up to 10% of H sharesCapital return signal
15 Sep 2026Shares rise more than 8% to HK$35.44Reaction to buyback
15–30 Sep 2026269,700 H shares repurchased into treasuryExecution begins
29 Sep 2026Interim report published; shares rise 6% intradayPositive operating cash flow of RMB235 million
5 Oct 202638,600 H shares repurchased at HK$50.45–51.75Cumulative 348,650 shares
22–27 Oct 2026Daily buybacks; cumulative 868,400 shares, 1.472% of H sharesSustained support
29 Oct 2026Shares fall more than 5% to HK$44.88Continued volatility

Financial Performance

Explore key financial metrics, segmented revenue, balance sheet health, and performance trends.

Revenue

6 charts
Revenue by Segment (FY2024–FY2025): Total revenue rose from CNY 519.6 Mn in FY2024 to CNY 709.2 Mn in FY2025.
Guangdong Tianyu Semiconductor — Revenue by Segment (FY2024–FY2025)
Series (CNY Mn)FY2024FY2025
Total revenue519.6709.2
6-inch epitaxial wafers455.8321.4
8-inch epitaxial wafers21198.4
4-inch epitaxial wafers7.62.7
Self-manufactured wafers subtotal484.4522.5
Other sales and services35.2186.7

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Sources

  1. Guangdong Tianyu Semiconductor, Annual Results Announcement for the year ended 31 December 2025 (30 March 2026)
  2. Guangdong Tianyu Semiconductor, Annual Report 2025 (27 April 2026)
  3. Guangdong Tianyu Semiconductor, Interim Results Announcement for the six months ended 30 June 2026 (27 August 2026)
  4. Guangdong Tianyu Semiconductor, Profit Alert (17 March 2026) and Profit Warning (14 August 2026)
  5. Guangdong Tianyu Semiconductor, Prospectus (27 November 2025) and application proofs (December 2024, July 2025), as reported by CLS, NBD, 36Kr, Laoyaoba, Gelonghui and GMT8
  6. HKEX announcements: repurchase plan (14 September 2026), monthly returns, next-day disclosure returns, CSRC full-circulation acceptance (29 May 2026), Qinghe Jingyuan agreement (16 January 2026)
  7. ETNet (HKEX disclosure of interests; share capital), StockAnalysis (cash flow, ratios, market data to 6 November 2026), Stockopedia
  8. Sidley Austin, Deheng Law, Sundial Law Firm and CBI listing announcements (December 2025)
  9. Hantian Tiancheng (2726.HK) interim and annual results as reported by 10jqka, 36Kr and Guotai Haitong research
  10. 10jqka, Caiwen, Zhitong Finance, AASTOCKS and The Bamboo Works news coverage (2025–2026)

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