Guangdong Tianyu Semiconductor Overview
Guangdong Tianyu Semiconductor is a Dongguan-based pure-play maker of silicon carbide (SiC) epitaxial wafers. These wafers are the active-layer substrates on which SiC MOSFETs, Schottky diodes and power modules are built. Founded in 2009 as China's first specialist SiC epitaxy house, it brought 4-inch epitaxy into mass production in 2014, 6-inch in 2018 and 8-inch in 2023. By 2024 revenue and volume it was the largest self-manufactured SiC epitaxial wafer supplier in China, with a 30.6% revenue share and 32.5% volume share. It was also the third-largest China-based supplier globally, at 6.7% of revenue and 7.8% of volume. The company sells to power-device makers serving electric vehicles, charging, photovoltaics, energy storage, rail, smart grid and, more recently, AI data-centre power supplies. Strategic investors include Huawei's Hubble and BYD. It listed in Hong Kong in December 2025 to fund an expansion toward 800,000 wafers a year, centred on 8-inch capacity at its new Songshan Lake Ecological Park base.
What the company does
Tianyu grows thin, precisely doped single-crystal SiC layers on purchased SiC substrates by chemical vapour deposition (CVD). The result, an epitaxial wafer, is the starting material for SiC power devices. Epitaxy sets the drift-layer thickness and doping that determine a device's blocking voltage, on-resistance and yield. Defect density, thickness uniformity and doping uniformity in the epi layer therefore pass straight through to device performance and cost. Tianyu says it has mastered the full production cycle for epi wafers used in unipolar and bipolar devices rated from 600 V to 30,000 V.
The company's own description in its annual report covers the R&D, production and sale of 4-inch, 6-inch and 8-inch SiC epitaxial wafers, plus value-added services: SiC epitaxial foundry (toll processing on customer-supplied substrates), epitaxial wafer cleaning and SiC-related inspection and testing.
Business and revenue model
| Revenue stream | Model | FY2025 share of revenue (%) |
|---|---|---|
| Self-manufactured 6-inch epitaxial wafers | Product sale, priced per wafer by specification | 45.3 |
| Self-manufactured 8-inch epitaxial wafers | Product sale, priced per wafer by specification | 28.0 |
| Self-manufactured 4-inch epitaxial wafers | Product sale | 0.4 |
| Other sales and services (mainly foundry) | Service fee per processed wafer; cleaning and test fees | 26.3 |
Self-manufactured 6-inch epitaxial wafers: Model: Product sale, priced per wafer by specification; FY2025 share of revenue (%): 45.3
Self-manufactured 8-inch epitaxial wafers: Model: Product sale, priced per wafer by specification; FY2025 share of revenue (%): 28.0
Self-manufactured 4-inch epitaxial wafers: Model: Product sale; FY2025 share of revenue (%): 0.4
Other sales and services (mainly foundry): Model: Service fee per processed wafer; cleaning and test fees; FY2025 share of revenue (%): 26.3
All revenue is product or service. There is no subscription or licensing revenue. The business is capital intensive: CVD reactors, cleanrooms and metrology make up most of the asset base. Substrates are the largest variable cost, and the company has steadily moved them to domestic suppliers.
Value-chain position
The SiC chain runs: high-purity powder → crystal growth and substrate (e.g. SICC/Tianyue Advanced, TanKeBlue, Wolfspeed, Coherent) → epitaxy (Tianyu, Hantian Tiancheng, Resonac, SK Siltron) → device fabrication (Infineon, STMicroelectronics, onsemi, ROHM, BYD Semiconductor, and Chinese fabless and IDM players) → modules → end systems. Tianyu is a merchant epitaxy supplier. Unlike vertically integrated device makers that grow their own epi, it sells to device makers that choose to outsource epitaxy, either fully or for overflow capacity.
Customers and end-markets
Customers are SiC power-device manufacturers (IDMs and foundries) in China and abroad, plus research institutes. End uses include new energy (EV traction inverters and on-board chargers, PV inverters, charging piles, energy storage), rail transit, smart grids, general aviation and home appliances. Since 2026 they also include server and data-centre power: overseas revenue jumped in the first half of 2026, which management linked to AI computing and data-centre demand.
Customer concentration is high. The five largest customers accounted for 73.5%, 61.5% and 77.2% of revenue in 2021, 2022 and 2023, and 91.4% in the first half of 2024. The single largest customer accounted for 30.9%, 21.1%, 42.0% and 52.6% over the same periods. In 2023 one South Korean customer bought RMB491 million of 6-inch epi wafers, 42% of revenue. That customer's orders fell to RMB35.96 million in the first half of 2024, the main cause of the 2024 revenue collapse.
Independent characterisation
Tianyu is a scale-driven, price-taking materials supplier. Its fortunes depend on SiC device demand and on the supply-demand balance for substrates and epi capacity. The company enjoyed first-mover status in China and rapid growth from 2021 to 2023. It then hit a severe price-led downturn in 2024, which forced a RMB315 million inventory write-down, and recovered only partly in 2025. The strategic bet is that 8-inch wafers, foundry services and international customers (Korea, Japan, Europe) will restore utilisation and margins as demand broadens from EVs into AI data-centre power.
Strategy
Stated strategy (FY2025 annual report and 2026 interim report)
Management's stated aim is to "consolidate and expand" Tianyu's leading position in China's SiC epitaxial wafer market. Its recurring strategic themes are:
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8-inch transition. Ramp up 8-inch capacity at the Ecological Park and lead the industry shift from 6-inch to 8-inch, which management expects to speed up from 2026.
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Technology differentiation. 4H-SiC thick-film fast epitaxy, multi-layer epitaxy and thicker wafers for high-voltage devices, plus R&D in gallium oxide and diamond.
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Customised delivery and services. A custom-delivery model and expansion of foundry, cleaning and inspection services.
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Internationalisation. New sales centres in Malaysia, Italy and Japan, and continued expansion in Korea, Japan and Europe.
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Domestic substitution. Localised equipment (more than 80%) and substrates (more than 90%) to cut cost and supply-chain risk.
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New demand vectors. AI data-centre power (800 V HVDC architectures), EVs and charging infrastructure.
Initiatives in the last 24 months
| Date | Initiative | Detail |
|---|---|---|
| Dec 2025 | Hong Kong IPO | Gross proceeds about HK$1.74 billion; 62.5% of net proceeds for capacity expansion over five years, 15.1% for R&D and innovation, and the remainder for strategic investments and acquisitions, the global sales network and working capital |
| Dec 2025 | Ecological Park base | Line commissioned; base underpins the 800,000 wafers-per-year target |
| Jan 2026 | Qinghe Jingyuan alliance | Joint process development of bonded SiC, SOI, POI, 12-inch-plus SiC composite heat-dissipation substrates and interposers |
| Feb 2026 | EYEQ Lab strategic agreement | Long-term SiC epi supply and application partnership with a Korean SiC power-device firm |
| May 2026 | H-share full circulation | CSRC accepted application to convert unlisted shares into H shares |
| Sep 2026 | H-share repurchase programme | Up to 10% of H shares (about 5.9 million shares) under the AGM mandate |
Dec 2025: Initiative: Hong Kong IPO; Detail: Gross proceeds about HK$1.74 billion; 62.5% of net proceeds for capacity expansion over five years, 15.1% for R&D and innovation, and the remainder for strategic investments and acquisitions, the global sales network and working capital
Dec 2025: Initiative: Ecological Park base; Detail: Line commissioned; base underpins the 800,000 wafers-per-year target
Jan 2026: Initiative: Qinghe Jingyuan alliance; Detail: Joint process development of bonded SiC, SOI, POI, 12-inch-plus SiC composite heat-dissipation substrates and interposers
Feb 2026: Initiative: EYEQ Lab strategic agreement; Detail: Long-term SiC epi supply and application partnership with a Korean SiC power-device firm
May 2026: Initiative: H-share full circulation; Detail: CSRC accepted application to convert unlisted shares into H shares
Sep 2026: Initiative: H-share repurchase programme; Detail: Up to 10% of H shares (about 5.9 million shares) under the AGM mandate
Guidance and medium-term targets
The company does not issue numerical revenue or margin guidance. The quantified targets are 800,000 wafers of annual capacity after full Ecological Park ramp-up, continued growth in 8-inch's revenue share, and the allocation of IPO proceeds above. Management expects SiC power-semiconductor demand to keep growing in 2026, led by AI data centres, EVs and charging.
Products & Services
Self-manufactured SiC epitaxial wafers
| Product | Description and key capabilities | Target customers | Mass-production year | Status |
|---|---|---|---|---|
| 4-inch 4H-SiC epitaxial wafers | Legacy diameter; single- and multi-layer epi for diodes and MOSFETs; one of China's first in volume | Research institutes, legacy device lines | 2,014 | Run-off; RMB2.7 million revenue in FY2025. The 4-inch market is expected to shrink from 54 thousand wafers in 2023 to 20 thousand in 2028 |
| 6-inch 4H-SiC epitaxial wafers | Mainstream diameter; thin and thick drift layers for 650 V–3.3 kV devices and above; automotive-grade quality system | EV inverter, OBC, PV, charging and industrial device makers | 2,018 | Largest revenue line through FY2025; ASP under pressure. Industry 6-inch ASP is projected to fall from RMB9,377 per wafer in 2021 to RMB6,560 in 2028 |
| 8-inch 4H-SiC epitaxial wafers | Next-generation diameter with lower cost per die; capacity concentrated at the Ecological Park base | Leading IDMs migrating to 200 mm; Korean and overseas customers | 2,023 | Fastest-growing line; 42.3% of H1-2026 revenue |
| Thick-film, high-voltage epi | Thick-layer fast epitaxy for 3.3 kV–30 kV unipolar and bipolar devices; broke foreign suppliers' hold on thick epi above 3,300 V | Rail traction, smart grid and HVDC device makers | — | Specialty, higher-value niche |
| Multi-layer and custom-structure epi | Multi-layer stacks, buffer layers and trench-fill epitaxy for advanced MOSFET and superjunction structures | Device R&D and advanced-node customers | — | Customised delivery model |
Pricing is per wafer, negotiated by specification (diameter, layer thickness, doping, defect grade). List prices are not publicly disclosed. The prospectus states that the company strategically cut prices to gain market penetration.
Value-added services
| Service | Description | Target customers | Commercial note |
|---|---|---|---|
| SiC epitaxial foundry | Growth of epi layers on customer-supplied substrates; customer keeps substrate ownership | Device makers with their own substrate supply, including vertically integrated substrate makers | Main driver of the 430% jump in other sales and services in FY2025; margin of 1.9% in FY2025 |
| Epitaxial wafer cleaning | Post-epi and pre-process cleaning using in-house cleaning technology | Device fabs | Bundled with foundry and product sales |
| SiC inspection and testing | Defect mapping, thickness and doping metrology and related tests | Device makers, research institutes | Expansion of foundry and inspection services is an explicit 2026 priority |
Development-stage materials
| Programme | Description | Partner | Year announced |
|---|---|---|---|
| Bonded SiC substrates | Bonded SiC wafers to cut substrate cost and enable new device structures | Qinghe Jingyuan | 2,026 |
| SOI and POI | Silicon-on-insulator and piezoelectric-on-insulator bonded substrates | Qinghe Jingyuan | 2,026 |
| 12-inch-plus SiC composite heat-dissipation substrates and interposers | Large-diameter SiC thermal substrates for advanced packaging | Qinghe Jingyuan | 2,026 |
| Gallium oxide and diamond materials | Next-generation ultra-wide-bandgap materials | In-house R&D | 2,026 |
Financial Narrative
Income statement — five-year headline
The FY2021 growth cell is a placeholder of zero because FY2020 revenue has not been published. Revenue CAGR was 46.4% over FY2021–FY2025 and 17.5% over FY2022–FY2025.
Income statement — detailed
EBITDA is operating profit plus depreciation and amortisation as reported in the cash flow statement.
FY2025 income statement detail (RMB thousand, from the FY2025 annual results)
Interim comparison (RMB thousand, from the 2026 interim results)
Commentary. Tianyu's income statement has gone through three phases. From FY2021 to FY2023 it scaled quickly: revenue rose 7.6-fold, wafer shipments climbed from 17,001 to about 131,000, and the company moved from a RMB180 million loss to a RMB95.9 million profit. In 2023, however, that profit rested on one Korean customer that took 42% of revenue. The FY2024 collapse had three causes: that customer's orders evaporated, Chinese 6-inch epi capacity expanded quickly, and prices of both epi wafers and substrates fell sharply. Revenue fell 55.6%, and a RMB315.1 million inventory write-down pushed gross margin to -72%. FY2025 was a partial repair. Revenue grew 36.5% on 8-inch volume and a five-fold rise in foundry services. The write-down provision fell to RMB13.1 million. Cheaper domestic substrates also lowered unit costs, and gross margin returned to 18.8%. The net loss narrowed by 88%, to RMB62.2 million, even as finance costs rose to RMB48.7 million after capitalised interest of RMB20.7 million.
The first half of 2026 reversed much of that progress. Revenue edged up 4.3%, but cost of sales jumped 49.1% for four reasons: 8-inch wafers carry higher unit costs, Q1 seasonality left fixed costs under-absorbed, new inventory write-down provisions were booked, and releases of earlier write-downs fell. The result was a small gross loss. Administrative expenses rose from RMB17.5 million to RMB77.8 million, a trade-receivable impairment of RMB35.4 million was recorded, and a net FX loss of RMB19.1 million turned operating profit into a RMB114.7 million loss. The data show that pricing, not volume, now drives profitability.
Shipments and capacity
The first prospectus reported 132,072 wafers for 2023; the final prospectus gives 130,702. Capacity utilisation was below 58.9% during the 2024 downturn. On full ramp-up of the Ecological Park base, total annual capacity is planned to reach 800,000 epi wafers.
Balance sheet
Zeros in this table mark items not published for that date (lease liabilities and payables at FY2024; PP&E and intangibles at H1-2026). They are not reported values. The company carries no goodwill.
Commentary. The listing transformed the balance sheet. Net current liabilities of RMB523 million at end-2024 became net current assets of RMB1,065 million, and gearing (borrowings to equity) fell from 138.9% to 83.6%. Equity rose to RMB2.71 billion after RMB1.54 billion of net proceeds were credited to share capital and reserves. The quality of the year-end position is weaker than the totals suggest. Trade receivables of RMB742.6 million equal about 105% of FY2025 revenue, reflecting heavy fourth-quarter shipments and rescheduled deliveries. By the date of the annual results the company had collected more than RMB470 million of them. By mid-2026 cash had fallen to RMB570 million after RMB360 million of capex and debt repayment. Inventories had tripled to RMB211.8 million, and gearing stood at 75.0%. Undrawn committed bank facilities of RMB4.82 billion and effective borrowing rates of 2.39%–3.80% give ample refinancing headroom. Pledged assets fell from RMB1,006.4 million at end-2025 to RMB674.1 million.
Cash flow
Commentary. Tianyu has burned between RMB700 million and RMB985 million of free cash flow every year since 2022, a cumulative RMB3.5 billion. Equity (RMB2.9 billion across the Series B and the IPO) and RMB2.3 billion of net new debt have funded it. FY2025 operating cash flow was negative because of a RMB612 million rise in receivables. That reversed in the first half of 2026, when operating cash flow was a positive RMB235 million, up 342% year on year, helped by collections and RMB92.9 million of customer prepayments recorded as contract liabilities. Capex stepped down from a peak of RMB1.02 billion in FY2023 to RMB599 million in FY2025, then rose to RMB360 million in the first half of 2026 as the Ecological Park base was fitted out. Remaining capital commitments were RMB1,193 million at 30 June 2026. Buybacks began only in September 2026.
Ratios
ROE and ROA use total net profit and average balances. Interest coverage on an EBIT basis was negative in both FY2024 and FY2025. The FY2025 year-end cash conversion cycle is inflated by fourth-quarter billing. On the 30 June 2026 balance sheet, annualising first-half revenue, receivable days fall to about 242.
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Grouping Details
| Grouping | Contents |
|---|---|
Self-manufactured SiC epitaxial wafers | 4-inch, 6-inch and 8-inch 4H-SiC epitaxial wafers grown on purchased substrates and sold outright |
Other sales and services | SiC epitaxial foundry (customer-consigned substrates), wafer cleaning, inspection and testing, and other sales |
Products
| Product | FY2024 | FY2025 |
|---|---|---|
6-inch epitaxial wafers (CNY Mn) | 455.8 | 321.4 |
8-inch epitaxial wafers (CNY Mn) | 21.0 | 198.4 |
4-inch epitaxial wafers (CNY Mn) | 7.6 | 2.7 |
Self-manufactured wafers subtotal (CNY Mn) | 484.4 | 522.5 |
Other sales and services (CNY Mn) | 35.2 | 186.7 |
Total revenue (CNY Mn) | 519.6 | 709.2 |
Products — 6-inch share of revenue
| Product | FY2024 | FY2025 |
|---|---|---|
6-inch share of revenue (%) | 87.7 | 45.3 |
8-inch share of revenue (%) | 4.0 | 28.0 |
4-inch share of revenue (%) | 1.5 | 0.4 |
Other sales and services share (%) | 6.8 | 26.3 |
YoY growth FY2025 vs FY2024 | Growth (%) | — |
6-inch | -29.5 | — |
8-inch | 846.8 | — |
4-inch | -64.9 | — |
Self-manufactured subtotal | 7.9 | — |
Other sales and services | 430.4 | — |
Total | 36.5 | — |
Products (Half-Yearly)
| Product | H1-2025 | H1-2026 |
|---|---|---|
8-inch epitaxial wafers (CNY Mn) | 104.7 | 147.1 |
6-inch epitaxial wafers (CNY Mn) | 185.2 | 146.8 |
4-inch epitaxial wafers (CNY Mn) | 2.6 | 1.1 |
Other sales and services (CNY Mn) | 40.9 | 53.0 |
Total revenue (CNY Mn) | 333.4 | 347.9 |
Segment Margins & Growth (%)
| Metric | FY2024 | FY2025 | H1-2025 | H1-2026 |
|---|---|---|---|---|
Self-manufactured wafers gross margin (%) | -72.3 | 25.0 | 38.8 | 3.0 |
Other sales and services gross margin (%) | -64.5 | 1.9 | -34.2 | -19.1 |
Group gross margin (%) | -72.0 | 18.8 | 29.8 | -0.3 |
Revenue by Segment
| Metric | FY2025 | H1-2025 | H1-2026 |
|---|---|---|---|
Self-manufactured wafers gross profit (CNY Mn) | 130.5 | 113.3 | 8.9 |
Other sales and services gross profit (CNY Mn) | 3.6 | -14.0 | -10.1 |
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View Subscription PlansIncome Statement and Margin Analysis (%)
| Metric | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Revenue (CNY Mn) | 154.6 | 436.9 | 1,171.2 | 519.6 | 709.2 |
Revenue growth (%) | 0 | 182.6 | 168.1 | -55.6 | 36.5 |
Gross margin (%) | 15.7 | 20.0 | 18.5 | -72.0 | 18.8 |
Net profit, total (CNY Mn) | -180.3 | 2.8 | 95.9 | -500.3 | -62.2 |
Net margin (%) | -116.6 | 0.6 | 8.2 | -96.3 | -8.8 |
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| Metric | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
Revenue (CNY Mn) | 436.9 | 1,171.2 | 519.6 | 709.2 |
Cost of sales (CNY Mn) | 349.4 | 954.6 | 894.0 | 575.8 |
Gross profit (CNY Mn) | 87.5 | 216.6 | -374.4 | 133.4 |
R&D expense (CNY Mn) | 29 | 55 | 61.0 | 59.6 |
Operating profit (CNY Mn) | 14.2 | 102.7 | -554.6 | -25.3 |
D&A (CNY Mn) | 34.3 | 89.1 | 130.8 | 145.8 |
EBITDA (CNY Mn) | 48.5 | 191.8 | -423.8 | 120.4 |
Pre-tax profit (CNY Mn) | 3.7 | 111.0 | -589.2 | -74.1 |
Net profit, total (CNY Mn) | 2.8 | 95.9 | -500.3 | -62.2 |
Net profit attributable to shareholders (CNY Mn) | 7.0 | 101.4 | -492.5 | -55.6 |
EPS basic and diluted (MYR Bn) | 0.02 | 0.28 | -1.36 | -0.15 |
Dividend per share (MYR Bn) | 0 | 0 | 0 | 0 |
Margin (%)
| Margin (%) | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
Gross margin (%) | 20.0 | 18.5 | -72.0 | 18.8 |
Operating margin (%) | 3.3 | 8.8 | -106.7 | -3.6 |
EBITDA margin (%) | 11.1 | 16.4 | -81.6 | 17.0 |
Net margin (%) | 0.6 | 8.2 | -96.3 | -8.8 |
Business Lines
| Line | FY2024 | FY2025 |
|---|---|---|
Revenue | 519,622 | 709,228 |
Cost of sales | -893,982 | -575,804 |
Gross profit | -374,360 | 133,424 |
Other net income | 13,377 | 27,724 |
Selling and distribution expenses | -19,023 | -19,134 |
Administrative and other operating expenses | -113,599 | -107,714 |
R&D expenses | -61,032 | -59,619 |
Loss from operations | -554,637 | -25,319 |
Finance costs | -34,551 | -48,744 |
Loss before taxation | -589,188 | -74,063 |
Income tax credit | 88,936 | 11,854 |
Loss for the year | -500,252 | -62,209 |
Attributable to equity shareholders | -492,455 | -55,605 |
Attributable to non-controlling interests | -7,797 | -6,604 |
Business Lines (Half-Yearly)
| Line | H1-2025 | H1-2026 |
|---|---|---|
Revenue | 333,404 | 347,888 |
Cost of sales | -234,067 | -349,104 |
Gross profit | 99,337 | -1,216 |
Other net income | 17,076 | 3,956 |
Selling and distribution | -9,104 | -9,717 |
Administrative and other operating | -17,545 | -77,849 |
R&D | -26,984 | -29,874 |
Operating profit | 62,780 | -114,700 |
Finance costs | -24,710 | -29,509 |
Profit before tax | 38,070 | -144,209 |
Income tax | -7,165 | 21,635 |
Profit for the period | 30,905 | -122,574 |
Attributable to equity holders | 34,245 | -119,807 |
EPS basic and diluted (MYR Bn) | 0.09 | -0.30 |
Financial Analysis
| Metric | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|
Epitaxial wafer sales volume incl. foundry (pieces) | 17,001 | 44,515 | 130,702 | 78,928 |
Financial Analysis (FY2022–May-2025)
| Metric | FY2022 | FY2023 | May-2025 |
|---|---|---|---|
Annual epi capacity (thousand wafers) | 50 | 170 | 420 |
Balance Sheet
| Metric | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
Total assets (CNY Mn) | 1,758.5 | 3,043.0 | 3,479.6 | 5,443.1 |
Non-current assets (CNY Mn) | 763.5 | 1,995.9 | 2,877.2 | 3,250.2 |
Current assets (CNY Mn) | 995.0 | 1,047.1 | 602.3 | 2,193.0 |
Current liabilities (CNY Mn) | 143.3 | 786.4 | 1,125.3 | 1,127.7 |
Non-current liabilities (CNY Mn) | 39.9 | 559.9 | 1,134.7 | 1,602.4 |
Total liabilities (CNY Mn) | 183.2 | 1,346.3 | 2,259.9 | 2,730.1 |
Total equity (CNY Mn) | 1,575.4 | 1,696.7 | 1,219.6 | 2,713.0 |
Working capital (CNY Mn) | 851.8 | 260.7 | -523.0 | 1,065.3 |
Balance Sheet (FY2024–H1-2026)
| Metric | FY2024 | FY2025 | H1-2026 |
|---|---|---|---|
Cash and cash equivalents (CNY Mn) | 114.6 | 1,166.3 | 570.4 |
Restricted cash (CNY Mn) | 37.8 | 6.9 | 106.9 |
Short-term borrowings (CNY Mn) | 634.6 | 765.5 | 535.1 |
Long-term borrowings (CNY Mn) | 1,059.6 | 1,501.5 | 1,415.1 |
Total borrowings (CNY Mn) | 1,694.2 | 2,267.0 | 1,950.2 |
Net debt (CNY Mn) | 1,579.6 | 1,100.7 | 1,379.8 |
Lease liabilities (CNY Mn) | 0 | 48.0 | 44.0 |
Property, plant and equipment (CNY Mn) | 2,338.7 | 2,761.1 | 0 |
Intangible assets (CNY Mn) | 3.5 | 5.2 | 0 |
Inventories (CNY Mn) | 183.4 | 69.2 | 211.8 |
Trade and bills receivables (CNY Mn) | 147.5 | 742.6 | 461.0 |
Trade and bills payables (CNY Mn) | 0 | 141.2 | 327.9 |
Contract liabilities (CNY Mn) | 0 | 4.3 | 92.9 |
Cash Flow
| Metric | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
Operating cash flow (CNY Mn) | -262.2 | 87.4 | -62.3 | -386.1 |
Capital expenditure (CNY Mn) | -437.7 | -1,021.0 | -840.3 | -599.3 |
Free cash flow (CNY Mn) | -699.9 | -933.9 | -902.6 | -985.3 |
Investing cash flow (CNY Mn) | -514.5 | -1,090.0 | -842.8 | -601.0 |
Net debt issued/(repaid) (CNY Mn) | -184.1 | 777.8 | 917.8 | 581.6 |
Equity issued (CNY Mn) | 1,394 | 0 | 0 | 1,533 |
Financing cash flow (CNY Mn) | 1,211 | 726.9 | 830.1 | 2,061 |
Dividends paid (CNY Mn) | 0 | 0 | 0 | 0 |
Share buybacks (CNY Mn) | 0 | 0 | 0 | 0 |
Cash interest paid (CNY Mn) | 5.1 | 21.7 | 59.4 | 85.3 |
Share-based compensation (CNY Mn) | 7.9 | 17.2 | 23.2 | 25.8 |
Returns & Leverage Ratios (%) and Financial Ratios (x)
| Ratio | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
ROE (%) | 0.2 | 5.9 | -34.3 | -3.2 |
ROA (%) | 0.2 | 4.0 | -15.3 | -1.4 |
ROIC (%) | 0.9 | 5.1 | -21.3 | -0.1 |
Current ratio (x) | 6.95 | 1.33 | 0.54 | 1.95 |
Borrowings to equity (%) | 1 | 50 | 138.9 | 83.6 |
Asset turnover (x) | 0.25 | 0.49 | 0.16 | 0.16 |
Ratio | FY2025 | — | — | — |
Net debt / EBITDA (x) | 9.1 | — | — | — |
EBITDA / finance costs (x) | 2.5 | — | — | — |
Days sales outstanding, year-end (days) | 382 | — | — | — |
Days inventory outstanding, year-end (days) | 44 | — | — | — |
Days payables outstanding, year-end (days) | 89 | — | — | — |
Cash conversion cycle, year-end (days) | 337 | — | — | — |
Revenue by Region (%)
| Region | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Revenue outside Chinese Mainland (% of total) | 14.7 | 12.6 | 44.2 | 8.6 | 0.6 |
Revenue by Region
| Region | FY2024 | FY2025 | H1-2025 | H1-2026 |
|---|---|---|---|---|
Chinese Mainland (CNY Mn) | 474.9 | 705.4 | 332.2 | 285.4 |
South Korea (CNY Mn) | 39.3 | 1.1 | 0.2 | 60.6 |
Other countries (CNY Mn) | 5.5 | 2.7 | 1.1 | 1.9 |
Total (CNY Mn) | 519.6 | 709.2 | 333.4 | 347.9 |
Growth (%)
| Growth (%) | FY2025 vs FY2024 (%) | H1-2026 vs H1-2025 (%) |
|---|---|---|
Chinese Mainland | 48.5 | -14.1 |
South Korea | -97.2 | 40,321 |
Other countries | -50.9 | 72.6 |
Share Price & Returns
| Reference point | Price (HKD) |
|---|---|
IPO price (5 Dec 2025) | 58.00 |
Day-two intraday high (8 Dec 2025) | 46.16 |
FY2025 year-end close (31 Dec 2025) | 48.00 |
Intraday high on Samsung SiC reports (15 May 2026) | 54.30 |
Post-buyback-announcement level (15 Sep 2026) | 35.44 |
Latest close (6 Nov 2026) | 43.30 |
Performance to 6 Nov 2026 | Return (%) |
Since IPO price | -25.3 |
Year to date (from FY2025 close) | -9.8 |
Valuation Multiples
| Multiple | Tianyu (2658.HK) | Hantian Tiancheng (2726.HK) |
|---|---|---|
P/E, trailing (x) | negative earnings | 532.5 |
P/B (x) | 5.67 | 7.32 |
EV/Sales, trailing (x) | 22.3 | 31.9 |
Market capitalisation (HKD Mn) | 17,029 | 0 |
Enterprise value (HKD Mn) | 18,667 | 0 |
Capital Markets
| Metric | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
Dividend per share (MYR Bn) | 0 | 0 | 0 | 0 |
Debt Maturity Profile
| Maturity | FY2024 | FY2025 | H1-2026 |
|---|---|---|---|
Due within one year (CNY Mn) | 634.6 | 765.5 | 535.1 |
Due after one year (CNY Mn) | 1,059.6 | 1,501.5 | 1,415.1 |
Analyst Conclusions
Management guidance
Management offers qualitative guidance only. It expects SiC power-device demand to keep growing, driven by AI data centres, EVs and charging, and it expects the 6-inch-to-8-inch transition to speed up. It plans to keep ramping 8-inch capacity at the Ecological Park and to grow overseas, foundry and inspection revenue. No numerical revenue, margin or capex guidance has been issued. No formal consensus forecasts are published.
Bull case
-
8-inch inflection. 8-inch revenue went from RMB21 million in FY2024 to RMB147 million in H1-2026 alone. If utilisation rises at the Ecological Park, the 38.8% self-made wafer margin of H1-2025 shows achievable profitability.
-
International re-rating. Korean revenue of RMB60.6 million in H1-2026, together with Samsung's SiC restart and the EYEQ Lab channel, could rebuild the overseas mix that made up 44% of revenue in FY2023, this time with 8-inch and AI-power demand behind it.
-
Pricing-cycle turn. Industry-wide SiC price increases in 2026 and high substrate utilisation, combined with Tianyu's localised cost base, could restore gross margins faster than the market expects. The H1-2026 operating cash inflow of RMB235 million and RMB92.9 million of customer prepayments point to firmer demand.
Bear case
-
Structural price pressure. H1-2026 gross margin of -0.3%, after 18.8% in FY2025, shows the company remains a price taker in an oversupplied Chinese epi market, with 6-inch ASPs still falling.
-
Losing ground to Hantian Tiancheng. The peer grew 92% at a 27.8% gross margin in H1-2026 and holds about 31.6% of global volume, against Tianyu's 7.8%. That suggests share and customer migration toward a stronger 8-inch competitor.
-
Capital intensity and dilution risk. Four consecutive years of free cash outflow (RMB985 million in FY2025), RMB1.19 billion of commitments, falling cash (RMB570 million at mid-2026) and a full-circulation overhang on a 14.94% float could pressure the shares even if operations improve.
Key catalysts (next 12 months)
| Expected timing | Catalyst |
|---|---|
| Q4 2026 – Q1 2027 | Volume and pricing trends in H2-2026, including whether the Q2-2026 order recovery holds |
| Q1 2027 | FY2026 profit alert and annual results; scale of inventory and receivable provisions |
| 2,027 | CSRC decision on H-share full circulation and any conversion of unlisted shares |
| 2,027 | Ecological Park ramp-up toward the 800,000-wafer target |
| 2,027 | New Korean, Japanese and European customer qualifications; progress of the Samsung SiC pilot line |
| Ongoing | Pace of H-share repurchases against the 5.9 million-share mandate |
| Ongoing | Commercial milestones from the Qinghe bonded-substrate programme |
Q4 2026 – Q1 2027: Catalyst: Volume and pricing trends in H2-2026, including whether the Q2-2026 order recovery holds
Q1 2027: Catalyst: FY2026 profit alert and annual results; scale of inventory and receivable provisions
2027: Catalyst: CSRC decision on H-share full circulation and any conversion of unlisted shares
2027: Catalyst: Ecological Park ramp-up toward the 800,000-wafer target
2027: Catalyst: New Korean, Japanese and European customer qualifications; progress of the Samsung SiC pilot line
Ongoing: Catalyst: Pace of H-share repurchases against the 5.9 million-share mandate
Ongoing: Catalyst: Commercial milestones from the Qinghe bonded-substrate programme
Monitorables
Gross margin of self-manufactured wafers by half-year; 8-inch share of revenue; overseas share of revenue; top-five customer concentration; receivable days and impairment charges; inventory levels; capex against commitments; net debt and undrawn facilities; Hantian Tiancheng's growth and margins; industry ASPs for 6- and 8-inch epi.
Analyst verdict
Guangdong Tianyu Semiconductor is a strategically relevant but financially fragile asset. Its claim to relevance is real. It is China's pioneer and largest domestic supplier of SiC epitaxial wafers, has built one of the country's biggest 6- and 8-inch epi capacity bases, has localised most of its equipment and substrate supply, and counts Huawei's Hubble and BYD among its backers. In SiC power semiconductors, epitaxy is a gating step, and demand drivers are widening from 800 V EVs to AI data-centre HVDC power.
The financial record is less reassuring. Revenue has swung from RMB1.17 billion to RMB520 million and back to RMB709 million. Gross margin has moved between +18.5%, -72%, +18.8% and -0.3% within three years, and free cash flow has been deeply negative every year. The swings come from the company's structural position: a merchant supplier squeezed between consolidating substrate makers and device makers that can grow their own epi, serving a handful of large customers in a market whose capacity has run ahead of demand. The first half of 2026 confirmed that position. Volume and Korean revenue recovered, but pricing pushed margins back to zero while the main domestic peer grew 92% at a 28% gross margin.
The IPO has removed near-term solvency risk, buybacks provide some technical support, and the 8-inch ramp and Korean channel give real optionality. A sustained re-rating, however, needs evidence that the company can hold self-manufactured wafer margins above 20% through a full cycle while filling the Ecological Park. That has not yet been shown. At about 22x trailing EV/sales and 5.7x book, the valuation already prices in a good deal of that recovery. The balance of evidence supports a cautious, catalyst-driven stance: positive on the industry's direction, neutral to cautious on Tianyu's ability to capture it profitably until two consecutive halves of positive, rising gross margins confirm the turn.
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View Subscription PlansExecutive Leadership
Board of Directors
| Name | Role | Age | Tenure / background |
|---|---|---|---|
Li Xiguang (李錫光) | Chairman, Executive Director and General Manager | 59 | Co-founder; Chairman and GM since 2009; formerly in audio-visual disc manufacturing |
Au Yeung Chung (歐陽忠) | Non-executive Director | 62 | Co-founder; formerly in audio-visual disc manufacturing |
Jiang Dacai | Non-executive Director | — | Member of the Audit Committee |
He Zhengsheng | Independent Non-executive Director | — | Chairs the Remuneration and Nomination Committees |
Li Min | Independent Non-executive Director | — | Chairs the Audit Committee |
Vincent Chin (Chin Vincent) | Independent Non-executive Director | — | Independent director |
“—” = not publicly disclosed.
Executive Leadership Team
| Name | Title | Age | Background |
|---|---|---|---|
Li Xiguang | General Manager | 59 | As above |
Peng Guanghui | Chief Financial Officer | 55 | COO and CFO from 2015 to June 2019; CFO since July 2019 |
Li Yongmei | Deputy General Manager | 46 | Joined April 2021; oversees supply chain and sales |
Han Jingrui | Deputy General Manager and Head of R&D | 38 | More than 14 years in SiC epitaxy R&D; named on 20 invention and 18 utility-model patents |
Li Zhuoxing | Joint Company Secretary | — | Nephew of Li Xiguang |
Chan Pak Lun | Joint Company Secretary | — | Hong Kong-based joint secretary |
“—” = not publicly disclosed.
Board of Directors — Zhuang Shuguang
| Name | Role |
|---|---|
Zhuang Shuguang | Chair of Supervisory Committee |
Yuan Yi | Supervisor |
Yin Xuefang | Supervisor |
Directors' Remuneration
| Committee | Chair | Members | Meetings in FY2025 |
|---|---|---|---|
Audit | Li Min | He Zhengsheng, Jiang Dacai | 1 |
Remuneration | He Zhengsheng | Au Yeung Chung, Li Min | 1 |
Nomination | He Zhengsheng | Li Xiguang, Li Min | — |
Strategic and ESG | Li Xiguang | Au Yeung Chung, He Zhengsheng | — |
“—” = not publicly disclosed.
Major Shareholders
| Holder | Shares | Class | % of total issued shares |
|---|---|---|---|
Au Yeung Chung | 66,126,373 | Unlisted (non-H) | 16.81 |
Zhuang Shuguang | 28,139,493 | Unlisted (non-H) | 7.16 |
Lee Yuk Ming | 22,349,321 | Unlisted (non-H) | 5.68 |
Lee Yuk Ming | 10,000,000 | H shares | 2.54 |
Shenzhen Hubble Technology Investment Partnership (Huawei) | 19,852,303 | Unlisted (non-H) | 5.05 |
Shenzhen Hubble Technology Investment Partnership (Huawei) | 4,000,000 | H shares | 1.02 |
Competitive Landscape
Key Competitors
| Competitor | Country | Segment overlap | Positioning relative to Tianyu |
|---|---|---|---|
Hantian Tiancheng Electronic Technology (Xiamen) (2726.HK) | China | Merchant SiC epi, 4/6/8-inch | Largest merchant epi supplier globally by volume (31.6% share in 2024); earlier in 8-inch commercial supply; serves 4 of the top 5 SiC device makers |
Resonac (formerly Showa Denko) | Japan | Merchant SiC epi | Long-established automotive-grade epi supplier to global IDMs |
SK Siltron | South Korea | SiC substrates and epi | Korean incumbent; competes in the Korean channel Tianyu is re-entering |
Wolfspeed | United States | Substrates, epi, devices (integrated) | Global substrate leader; sells epi and grows its own |
Coherent | United States | SiC substrates and epi | Vertically integrated materials supplier |
STMicroelectronics | Switzerland/Italy | In-house epi for SiC devices | Leading SiC device maker; partly a customer, partly a self-supplier |
ROHM / SiCrystal | Japan/Germany | Integrated substrate, epi and devices | Captive epitaxy |
Infineon | Germany | In-house epi and devices | Captive supply; price leader in devices |
CETC-affiliated epi suppliers (e.g. Hebei Puxing / CETC 13th and 55th Institutes) | China | Domestic SiC epi | State-linked domestic competitors |
SICC / Tianyue Advanced (2631.HK; 688234.SH) | China | SiC substrates (supplier) | Key upstream supplier; potential forward integration into epi |
Sanan Optoelectronics (Hunan Sanan) | China | Integrated substrate, epi and devices | Captive epi; competes for domestic device customers |
Peer Comparison FY2025
| Metric | Tianyu (2658.HK) | Hantian Tiancheng (2726.HK) |
|---|---|---|
FY2025 revenue (CNY Mn) | 709.2 | 765 |
FY2025 revenue growth (%) | 36.5 | -21.4 |
FY2025 gross margin (%) | 18.8 | 24.8 |
FY2025 net profit attributable (CNY Mn) | -55.6 | 12 |
H1-2026 revenue (CNY Mn) | 347.9 | 578 |
H1-2026 revenue growth (%) | 4.3 | 92.0 |
H1-2026 gross margin (%) | -0.3 | 27.8 |
H1-2026 net profit attributable (CNY Mn) | -119.8 | 48.6 |
2024 global epi share by volume (%) | 7.8 | 31.6 |
Recent Developments
There have been no material litigation, regulatory sanctions, layoffs or leadership departures in the period.



