Innoscience Overview
Innoscience is the world's largest gallium-nitride (GaN) power semiconductor company by revenue. It is an integrated device manufacturer (IDM) and controls epitaxy, wafer fabrication, device design, packaging, testing and failure analysis in-house. It was the first company in the world to mass-produce 8-inch GaN-on-silicon wafers, and it runs the largest dedicated GaN power fabrication base in the world, in Suzhou and Zhuhai. Its products cover the full voltage range from 15V to 1,200V. They sell into consumer fast-charging, smartphones, household appliances, AI data-centre power, automotive electronics (LiDAR, on-board chargers, 48V systems), industrial motor drives, energy storage and humanoid robots. The company sells finished discrete devices and integrated circuits, power modules and 8-inch GaN wafers. The wafer sales place it in both the power-device market and the GaN epitaxial-wafer market. Revenue rose from RMB68.2 million in FY2021 to RMB1,213.3 million in FY2025. Gross margin turned positive in FY2025, and operating cash flow turned positive in 1H2026. The company is still loss-making at the net level. It is also in a multi-jurisdiction patent conflict with Infineon, the incumbent European GaN leader.
What the company does
Innoscience designs, develops and manufactures GaN power semiconductors on 8-inch (200mm) silicon substrates. Gallium nitride is a wide-bandgap material. Compared with silicon MOSFETs and, at several voltage nodes, silicon carbide, it switches faster, has lower on-resistance per unit area and has lower switching losses. This lets customers build smaller, cooler and more efficient power converters. Innoscience makes GaN-on-Si high-electron-mobility transistors (HEMTs) in its own fabs and sells them in four forms:
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GaN discrete devices and GaN integrated circuits. These are packaged transistors and driver-integrated GaN ICs sold to power-supply makers, OEMs and Tier-1s. They were 42.0% of FY2025 revenue.
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GaN modules. These are system-level power modules combining GaN devices, drivers and passives, sold mainly into charger, adapter and power-supply applications. They were 36.8% of FY2025 revenue.
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GaN wafers. These are 8-inch GaN-on-Si wafers, processed or epitaxial, sold to other semiconductor companies that package or brand devices themselves. STMicroelectronics is a disclosed user of Innoscience 700V wafers. They were 20.9% of FY2025 revenue.
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Other. Services and minor items, 0.3% of FY2025 revenue.
The company's own description
In its listing documents and annual reporting, Innoscience describes itself as a GaN power semiconductor IDM. It says it is the only company with industrial-scale capacity across the full voltage spectrum of GaN-on-Si products and owner of the world's largest GaN power semiconductor production base. It states its mission as leading the "power semiconductor revolution" by bringing GaN into mainstream markets at high performance and low cost.
Independent characterisation
Innoscience is best understood as a volume-and-cost GaN manufacturer that is moving from consumer electronics into higher-value industrial, automotive and AI-infrastructure sockets. Its strategy rests on manufacturing scale. In early 2026 the Suzhou site was reported to run 15,000 8-inch wafers per month at a stable yield of about 97%. Supply-chain reporting suggests its price quotes are around half those of other global GaN suppliers. Most Western GaN competitors (Navitas, EPC, Cambridge GaN Devices, and historically GaN Systems) are fabless or asset-light and depend on foundries such as TSMC, which has said it will leave GaN foundry work by 2027. Innoscience owns its capacity. That gives it a structural cost and supply-assurance advantage. It also means heavy fixed costs: depreciation and amortisation of about RMB500 million a year was the main reason gross margin stayed negative until 2025.
Revenue model
| Revenue type | Share of FY2025 revenue | Notes |
|---|---|---|
| Product sales: discretes and ICs | 42.0% | Per-unit device pricing, design-win driven |
| Product sales: modules | 36.8% | Higher content per end product; fastest-growing line in FY2025 |
| Product sales: wafers | 20.9% | Wafer-level sales to other IDMs and fabless firms |
| Services, licensing, subscription | about 0.3% | Not material |
Product sales: discretes and ICs: Share of FY2025 revenue: 42.0%; Notes: Per-unit device pricing, design-win driven
Product sales: modules: Share of FY2025 revenue: 36.8%; Notes: Higher content per end product; fastest-growing line in FY2025
Product sales: wafers: Share of FY2025 revenue: 20.9%; Notes: Wafer-level sales to other IDMs and fabless firms
Services, licensing, subscription: Share of FY2025 revenue: about 0.3%; Notes: Not material
Revenue is almost all product-based and recognised on shipment. There is no material recurring, subscription or licensing income.
Value-chain position
Innoscience covers the chain from substrate-level epitaxy (MOCVD growth of GaN on silicon) to finished modules. Upstream, it depends on silicon substrates, MOCVD reactors, process gases (ammonia, trimethylgallium and other metal-organic precursors) and lithography and etch tools. Downstream, it sells to:
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charger and adapter brands and ODMs, including Anker and Ugreen;
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smartphone OEMs (OPPO, vivo, Xiaomi), for over-voltage protection and fast charging;
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automotive LiDAR makers (Hesai, RoboSense) and Tier-1s such as United Automotive Electronic Systems (UAES);
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energy-storage and battery companies, with CATL its largest customer in FY2023 at 32.1% of revenue;
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data-centre power supply makers and hyperscaler hardware platforms (Google design-ins; NVIDIA 800 VDC ecosystem);
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other semiconductor companies buying wafers or co-developing, including STMicroelectronics and onsemi.
End-markets served
| End-market | Representative applications | FY2025 / 1H2026 evidence |
|---|---|---|
| Consumer electronics | USB-PD fast chargers, smartphone OVP, laptop adapters, audio, white goods | RMB568.1 million in FY2025, the largest end-market. Air-conditioner and other white-goods revenue rose 924% in 1H2026. |
| AI and data centres | 48V-to-12V bus converters, server PSUs, 800 VDC rack architecture | AI/data-centre sales +180% in 1H2025; chip shipments +183% in 1H2026 |
| Automotive | LiDAR laser drivers, 6.6kW on-board chargers, 48V systems | Automotive-grade revenue RMB57.9 million in FY2025 (doubled); about 20 million LiDAR chips shipped cumulatively |
| Industrial and energy storage | Low-voltage motor drives, BMS (VGaN bidirectional switches), PV MPPT, bidirectional converters | Industrial and storage sales +83% in 1H2026; low-voltage motor-drive revenue +685% |
| Robotics | Humanoid-robot joint motors, dexterous-hand drives | First mass shipments of GaN-equipped humanoid robots in 1H2025; robot chip shipments +50% in 1H2026 |
Consumer electronics: Representative applications: USB-PD fast chargers, smartphone OVP, laptop adapters, audio, white goods; FY2025 / 1H2026 evidence: RMB568.1 million in FY2025, the largest end-market. Air-conditioner and other white-goods revenue rose 924% in 1H2026.
AI and data centres: Representative applications: 48V-to-12V bus converters, server PSUs, 800 VDC rack architecture; FY2025 / 1H2026 evidence: AI/data-centre sales +180% in 1H2025; chip shipments +183% in 1H2026
Automotive: Representative applications: LiDAR laser drivers, 6.6kW on-board chargers, 48V systems; FY2025 / 1H2026 evidence: Automotive-grade revenue RMB57.9 million in FY2025 (doubled); about 20 million LiDAR chips shipped cumulatively
Industrial and energy storage: Representative applications: Low-voltage motor drives, BMS (VGaN bidirectional switches), PV MPPT, bidirectional converters; FY2025 / 1H2026 evidence: Industrial and storage sales +83% in 1H2026; low-voltage motor-drive revenue +685%
Robotics: Representative applications: Humanoid-robot joint motors, dexterous-hand drives; FY2025 / 1H2026 evidence: First mass shipments of GaN-equipped humanoid robots in 1H2025; robot chip shipments +50% in 1H2026
Strategy
Stated strategic themes
Management's stated priorities, from the FY2025 annual results and 1H2026 interim reporting:
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Lead the move to GaN across all voltage classes, 15V to 1,200V. Position GaN as the default replacement for silicon power MOSFETs and, in selected high-voltage uses, silicon carbide.
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Shift the mix toward high-value markets. Focus on AI data centres, new-energy vehicles, industrial and energy storage, and robotics, where qualification barriers and margins are higher than in consumer chargers. In 1H2026 these markets were already 64% of revenue.
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Scale manufacturing and keep the cost lead. Expand from about 15,000 to 20,000 wafers per month, with a stated aspiration of 70,000 wafers per month over several years. Move the process from generation 3.0 to 4.0, and keep yield at about 97%.
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Move up the integration ladder. Shift from bare discretes and wafers to driver-integrated ICs and system modules. IC revenue grew 513% in FY2025.
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Globalise through partnerships rather than greenfield overseas fabs. Use ST for capacity outside China, onsemi for packaging and system integration, and NVIDIA and Google for data-centre ecosystem access.
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Defend and build intellectual property. Litigate across the US, Germany and China, and expand patent filings in ICs and advanced HEMT structures.
Strategic initiatives, last 24 months
| Date | Initiative | Detail |
|---|---|---|
| 31 March 2025 | STMicroelectronics joint development and manufacturing agreement | Joint development of GaN power technology. Innoscience may use ST front-end capacity outside China; ST may use Innoscience capacity in China. |
| 1H2025 | Joint lab with United Automotive Electronic Systems (UAES) | Automotive GaN co-development with a leading Chinese Tier-1 |
| 1H2025 | Humanoid-robot programme | Worked with leading robot makers on GaN chips for joint motors and dexterous-hand drives; first mass-production shipments of GaN-equipped humanoid robots |
| July 2025 | 800 VDC programme with NVIDIA | Full GaN conversion chain from 800V down to the GPU rail, supporting the move to megawatt-scale racks; listed as the only Chinese chip partner |
| July and October 2025 | Equity placings | HK$2.09 billion raised in total. From the October placing: HK$482 million for capacity, HK$376 million for debt repayment, HK$692 million for working capital. |
| October 2025 | 800 VDC white paper | Published a technical case for an all-GaN 800 VDC architecture. Claims GaN cuts drive losses by 80% and switching losses by 50% per switching half-cycle versus SiC at the 800V input, and that data-centre parts are rated for operating lives above 20 years. |
| November 2025 | ST VIPerGaN50W launch | Innoscience 700V wafers used in ST's GaN flyback converter ICs |
| 2 December 2025 | onsemi MoU | Non-binding plan for wafer procurement and wider collaboration on 40–200V GaN devices, aimed at a GaN power TAM of US$2.9 billion by 2030 |
| 3 February 2026 | Google AI hardware | Design-ins completed and compliant supply agreement signed |
| 2025–2026 | Process platform upgrade | Moved from the 3.0 to the 4.0 process platform; first 1,200V volume shipments |
| 2025–2026 | Employee share incentive | 2025 Share Award Scheme, funded by on-market H-share purchases |
| 2,026 | Capacity expansion | Target raised to 70,000 wafers per month over several years |
31 March 2025: Initiative: STMicroelectronics joint development and manufacturing agreement; Detail: Joint development of GaN power technology. Innoscience may use ST front-end capacity outside China; ST may use Innoscience capacity in China.
1H2025: Initiative: Joint lab with United Automotive Electronic Systems (UAES); Detail: Automotive GaN co-development with a leading Chinese Tier-1
1H2025: Initiative: Humanoid-robot programme; Detail: Worked with leading robot makers on GaN chips for joint motors and dexterous-hand drives; first mass-production shipments of GaN-equipped humanoid robots
July 2025: Initiative: 800 VDC programme with NVIDIA; Detail: Full GaN conversion chain from 800V down to the GPU rail, supporting the move to megawatt-scale racks; listed as the only Chinese chip partner
July and October 2025: Initiative: Equity placings; Detail: HK$2.09 billion raised in total. From the October placing: HK$482 million for capacity, HK$376 million for debt repayment, HK$692 million for working capital.
October 2025: Initiative: 800 VDC white paper; Detail: Published a technical case for an all-GaN 800 VDC architecture. Claims GaN cuts drive losses by 80% and switching losses by 50% per switching half-cycle versus SiC at the 800V input, and that data-centre parts are rated for operating lives above 20 years.
November 2025: Initiative: ST VIPerGaN50W launch; Detail: Innoscience 700V wafers used in ST's GaN flyback converter ICs
2 December 2025: Initiative: onsemi MoU; Detail: Non-binding plan for wafer procurement and wider collaboration on 40–200V GaN devices, aimed at a GaN power TAM of US$2.9 billion by 2030
3 February 2026: Initiative: Google AI hardware; Detail: Design-ins completed and compliant supply agreement signed
2025–2026: Initiative: Process platform upgrade; Detail: Moved from the 3.0 to the 4.0 process platform; first 1,200V volume shipments
2025–2026: Initiative: Employee share incentive; Detail: 2025 Share Award Scheme, funded by on-market H-share purchases
2026: Initiative: Capacity expansion; Detail: Target raised to 70,000 wafers per month over several years
ESG commitments
The company presents GaN's efficiency gains as its main sustainability contribution. Examples are lower conversion losses in data centres, less copper use in 800 VDC architectures and lighter EV power electronics. No numeric emissions targets have been published.
Medium-term targets
Management has not issued numeric revenue or margin guidance. Its stated operating aims are continued gross-margin expansion, scaling to 20,000 and then 70,000 wafers per month, and a rising share of revenue from high-value markets. The sell-side expects net break-even around FY2027.
Products & Services
GaN discrete devices (InnoGaN)
| Product family | Description and key specifications | Target customer and application | Status / year |
|---|---|---|---|
| Low-voltage bidirectional GaN (VGaN), 40V class | Single-chip bidirectional switch that replaces back-to-back silicon MOSFETs; smaller footprint, lower resistance | Smartphone OEMs (over-voltage protection in charging paths); battery management systems in energy storage | High volume. VGaN BMS solutions in scaled production at leading storage customers by 1H2026. |
| 100V GaN HEMTs | Low-voltage, high-frequency switches for 48V-to-12V conversion | Server motherboards and PSUs (AI data centres), 48V automotive, motor drives, LiDAR | 48V-to-12V products for server PSUs and boards in mass production from 1H2025. More than 10 million 100V chips shipped in FY2025. |
| 150V / 200V GaN HEMTs | Mid-voltage transistors for motor drives and intermediate bus converters | Humanoid-robot joint motors, dexterous-hand drives, industrial drives, telecom | Shipping to robotics customers from 2025 |
| 650V / 700V GaN HEMTs (third generation) | High-voltage enhancement-mode HEMTs. Third-generation 700V parts cut die area by about 30%, improve switching performance by 20–30% and reduce capacitances by 20–30%. | Fast chargers, adapters, appliance power, PFC, server PSUs, OBCs | Third-generation 700V in mass production by 2025 |
| 1,200V GaN devices | High-voltage GaN aimed at 800 VDC input stages and EV-adjacent applications | 800 VDC AI data-centre front ends, industrial | First in the industry; about 500,000 units shipped in FY2025 |
| Automotive-grade (AEC-Q qualified) discretes | Qualified versions of low- and high-voltage parts | LiDAR laser drivers (Hesai, RoboSense), 6.6kW OBCs, DC-DC | Automotive revenue RMB57.9 million in FY2025. About 20 million LiDAR chips shipped cumulatively by mid-2026. |
GaN integrated circuits (SolidGaN and driver-integrated solutions)
| Product | Description | Target / application | Status |
|---|---|---|---|
| SolidGaN integrated power stages | GaN HEMT co-packaged or integrated with gate driver and protection; simplifies design and reduces parasitics | Chargers, appliances, motor drives, power supplies | IC revenue +513% in FY2025 |
| ISG6127ATP-Q (automotive SolidGaN) | Automotive-grade integrated GaN power device for next-generation EV systems | On-board chargers and EV power conversion | Received the CSPSD 2026 Outstanding Market Performance Award |
| Integrated driver–GaN solutions for 48V | Driver-plus-GaN combinations for intermediate bus converters | AI server boards | Volume shipments from 2025 |
GaN modules
| Product | Description | Target / application | Status |
|---|---|---|---|
| New-generation GaN power modules | System-level modules combining GaN switches, drivers and magnetics/passives | Charger brands, adapter ODMs, appliance power supplies, industrial | Launch drove revenue up 142.6% to RMB446.2 million in FY2025 |
| Data-centre and 800 VDC power reference designs | All-GaN conversion chain from 800V input to 1V point-of-load, supporting the move to megawatt-scale racks | Hyperscalers, PSU makers in NVIDIA's 800 VDC ecosystem, Google AI hardware | Partner status from August 2025; Google design-ins completed February 2026 |
GaN wafers
| Product | Description | Target / application | Status |
|---|---|---|---|
| 8-inch GaN-on-Si wafers (low and high voltage) | Processed or epitaxial wafers from Suzhou and Zhuhai at 97% stable yield | Other IDMs and device makers that brand and package their own parts; STMicroelectronics used Innoscience 700V wafers in its VIPerGaN50W flyback ICs (November 2025) | RMB253.4 million revenue in FY2025 (−9.7%); onsemi MoU covers wafer procurement for 40–200V devices |
Process platforms
| Platform | Description | Timing |
|---|---|---|
| Generation 3.0 GaN-on-Si process | Third-generation HEMT platform behind the current 700V and low-voltage families | Mass production by 2024–2025 |
| Generation 4.0 GaN-on-Si process | Next platform, with further die shrink and cost-down | Moved to 4.0 during FY2025 |
Pricing model
The company does not disclose list prices. Contracts are per-unit, volume-tiered device sales and per-wafer prices. Industry reporting puts Innoscience quotes at about half those of global GaN peers. The company describes its positioning as "high-performance, low-cost".
Financial Narrative
All figures are RMB millions under IFRS for years ended 31 December, unless stated. FY2021–FY2023 come from the HKEX prospectus. FY2024 and FY2025 come from the annual reports.
Income statement
The FY2021 growth cell reads 0 because there is no FY2020 base.
Adjusted EBITDA is the operating loss plus depreciation of property, plant and equipment and right-of-use assets, amortisation of intangibles and land-use rights, equity-settled share-based payments, and non-recurring compliance-related costs.
Revenue CAGR. Revenue compounded at about 105% a year from FY2021 to FY2025 and about 43% a year from FY2023 to FY2025.
Commentary. The income statement shows a capital-heavy IDM moving from start-up losses toward break-even.
FY2021–FY2022 losses: Net losses of RMB3.40 billion and RMB2.21 billion were mainly non-operating. Charges of about RMB2.30 billion in FY2021 and RMB0.90 billion in FY2022 reflect fair-value changes on investor instruments with redemption rights. These charges stopped once the instruments were reclassified to equity, which is why reported equity went from −RMB4.1 billion at end-FY2021 to +RMB3.0 billion at end-FY2022.
Operating losses: Operating losses have stayed around RMB0.8–1.2 billion a year. The constant drag is about RMB0.5 billion of annual D&A on fabs built in 2017–2021, together with heavy R&D (RMB662 million in FY2021) and a step-up in SG&A after the IPO. SG&A was RMB549 million in FY2024, including listing, legal and share-based costs.
Gross margin: The inflection came from volume absorption. Gross margin improved from −289% in FY2022 to +7.3% in FY2025 while cost of sales grew only 13.6% in FY2025 against revenue growth of 46%.
Expenses: Management describes period expenses as broadly stable in FY2025, so most of the gross-profit gain fell through to EBITDA.
Income tax: Tax is negligible (RMB0.34 million in FY2024), so pre-tax and net losses are essentially the same.
Half-year progression
1H2026 was the third straight half-year of gross-margin improvement. The net loss fell 28% year on year to RMB309 million, and basic loss per share was RMB0.34. Operating cash flow was +RMB169 million, against −RMB387 million in 1H2025. Total shipments in 1H2026 were 547 million units, taking cumulative shipments past 2.5 billion.
Balance sheet
There is no goodwill, because the company has not made acquisitions.
Commentary.
FY2025 balance sheet: The FY2025 balance sheet was the strongest in the company's history. Two placings raised about HK$2.09 billion (about RMB1.87 billion), and equity rose to RMB4.21 billion.
Cash versus liquid resources: Reported cash fell to RMB879 million while total current assets almost doubled to RMB4.33 billion. A large part of the placing proceeds sits in short-term deposits and treasury-type investments, and inventory was built up (inventories were up 60.8% in 1H2025). Including short-term investments, liquid resources were roughly RMB2.6 billion at year-end, more than total borrowings of RMB2.23 billion.
Gearing: The company reports net gearing of 32.1% for FY2025 (13.4% in FY2024). The current ratio improved to 5.3x from 2.5x.
Debt mix: Borrowings shifted toward long-term facilities. The current portion fell to RMB336 million, which reduces refinancing risk.
Fixed assets: PP&E has fallen every year since FY2021 because depreciation (about RMB500 million a year) outran maintenance-level capex. This will reverse as the capacity expansion funded by the October 2025 placing (HK$482 million earmarked) is spent.
Cash flow
Commentary.
FY2025 operating cash flow: The outflow worsened to −RMB806 million even though EBITDA improved. The cause was working capital: inventory build ahead of data-centre, automotive and appliance ramps, plus receivables growing with revenue.
1H2026 reversal: Operating cash flow turned positive at +RMB169 million, the first positive half-year. This suggests the FY2025 build was timing rather than structural.
Capex: Capex has been low (RMB172–332 million a year in FY2023–FY2025) because the fabs were largely built by FY2021. Management says future expansion depends mainly on adding bottleneck tools such as MOCVD reactors rather than new cleanrooms, so capex per unit of new capacity should fall.
Share purchases: Shares bought by the share-award trustee are held in trust for employees and are not cancellation buybacks.
Key ratios
The current ratio was 2.5x at end-FY2024, 3.21x at 30 June 2025 and 5.3x at end-FY2025. EBIT interest cover was negative: −8.5x in FY2023 and −11.7x in FY2024. Net debt/EBITDA is not meaningful while reported EBITDA is negative. The company does not report a cash conversion cycle. ROIC is deeply negative in every year because NOPAT has been negative throughout. In 1H2026, the annualised return on equity was about −15% (−7.65% for the half-year).
Trend summary. Every profitability ratio has improved for three years in a row, and the improvement sped up in 1H2026. Asset turnover (0.19x in FY2025) is still well below mature power-semiconductor IDMs, which typically run 0.5–0.8x. Further improvement depends on filling capacity rather than adding it.
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Income Statement and Margin Analysis (%)
| Metric | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Revenue (CNY Mn) | 68.2 | 136.2 | 592.7 | 828.5 | 1,213.3 |
Revenue growth (%) | 0 | 99.6 | 335.3 | 39.8 | 46.4 |
Cost of sales (CNY Mn) | 249.8 | 530.3 | 954.8 | 989.9 | 1,124.5 |
Gross profit (CNY Mn) | -181.5 | -394.1 | -362.1 | -161.4 | 88.8 |
Operating income (CNY Mn) | -1,010.0 | -1,226.0 | -1,008.0 | -984.8 | -798.9 |
Depreciation and amortisation (CNY Mn) | 263.1 | 463.1 | 524.7 | 505.4 | 507.9 |
EBITDA, operating loss plus D&A (CNY Mn) | -746.9 | -762.9 | -483.3 | -479.4 | -291.0 |
Net income (CNY Mn) | -3,399.0 | -2,205.0 | -1,102.0 | -1,045.7 | -840.5 |
Dividends per share (MYR Bn) | 0 | 0 | 0 | 0 | 0 |
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View Subscription PlansMargin (%)
| Margin (%) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Gross margin | -266.1 | -289.4 | -61.1 | -19.5 | 7.3 |
Operating margin | -1,480.5 | -900.4 | -170.1 | -118.9 | -65.8 |
EBITDA margin | -1,094.8 | -560.3 | -81.5 | -57.9 | -24.0 |
Net margin | -4,982.4 | -1,619.3 | -185.9 | -126.2 | -69.3 |
Per-share data (MYR Bn)
| Per-share data (MYR Bn) | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
EPS, basic | -1.38 | -1.28 | -0.95 |
EPS, diluted | -1.38 | -1.28 | -0.95 |
Company-defined adjusted EBITDA (CNY Mn)
| Company-defined adjusted EBITDA (CNY Mn) | FY2024 | FY2025 |
|---|---|---|
Adjusted EBITDA | -148 | 52 |
Operating expense detail (CNY Mn)
| Operating expense detail (CNY Mn) | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|
Research and development | 661.7 | 581.1 | 348.8 | 323.0 |
Selling, general and administrative | 207.5 | 268.6 | 337.2 | 549.1 |
Interest expense | 93.3 | 131.6 | 118.9 | 84.1 |
Income Statement and Margin Analysis (%) (1H2024–1H2026)
| Metric | 1H2024 | 2H2024 | 1H2025 | 2H2025 | 1H2026 |
|---|---|---|---|---|---|
Revenue (CNY Mn) | 385.9 | 442.6 | 553.4 | 659.9 | 834.0 |
Gross profit (CNY Mn) | -83.2 | -78.2 | 37.8 | 51.0 | 97.1 |
Gross margin (%) | -21.6 | -17.7 | 6.8 | 7.7 | 11.6 |
Net loss (CNY Mn) | -488.0 | -557.7 | -428.7 | -411.8 | -309.0 |
Balance Sheet
| Metric | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Cash and cash equivalents (CNY Mn) | 1,279.0 | 710.8 | 329.0 | 1,525.0 | 879.0 |
Total current assets (CNY Mn) | 2,603.0 | 1,927.0 | 1,112.0 | 2,460.0 | 4,333.0 |
Property, plant and equipment (CNY Mn) | 3,452.0 | 3,353.0 | 3,146.0 | 2,859.0 | 2,489.0 |
Intangible assets (CNY Mn) | 402.0 | 345.2 | 272.6 | 197.7 | 118.4 |
Total assets (CNY Mn) | 6,622.0 | 5,695.0 | 4,591.0 | 5,547.0 | 7,071.0 |
Short-term debt and current portion (CNY Mn) | 722.0 | 438.4 | 508.5 | 522.4 | 336.1 |
Long-term debt and investor redemption liabilities (CNY Mn) | 9,107.0 | 1,632.0 | 1,546.0 | 1,401.0 | 1,894.0 |
Total debt (CNY Mn) | 9,829.0 | 2,070.4 | 2,054.5 | 1,923.4 | 2,230.1 |
Net debt, total debt less cash (CNY Mn) | 8,550.0 | 1,359.6 | 1,725.5 | 398.4 | 1,351.1 |
Total liabilities (CNY Mn) | 10,747.0 | 2,735.0 | 2,627.0 | 2,576.0 | 2,860.0 |
Shareholders' equity (CNY Mn) | -4,125.0 | 2,960.0 | 1,964.0 | 2,971.0 | 4,211.0 |
Working capital (CNY Mn) | 1,038.0 | 916.2 | 185.3 | 1,464.0 | 3,513.0 |
Cash Flow
| Metric | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Operating cash flow (CNY Mn) | -562.1 | -936.3 | -593.6 | -336.4 | -806.4 |
Capital expenditure (CNY Mn) | 1,121.0 | 464.6 | 331.3 | 171.8 | 210.6 |
Free cash flow (CNY Mn) | -1,683.0 | -1,401.0 | -924.9 | -508.1 | -1,017.0 |
Share-based compensation (CNY Mn) | 19.7 | 30.6 | 86.4 | 166.9 | 164.2 |
Equity issued (CNY Mn) | 0 | 0 | 20.0 | 1,889.0 | 1,956.0 |
Long-term debt drawn (CNY Mn) | 4,039.0 | 1,268.0 | 266.2 | 392.8 | 1,416.0 |
Long-term debt repaid (CNY Mn) | 81.9 | 672.6 | 305.9 | 530.5 | 1,128.0 |
Dividends paid (CNY Mn) | 0 | 0 | 0 | 0 | 0 |
Share buybacks for cancellation (CNY Mn) | 0 | 0 | 0 | 0 | 0 |
Returns & Leverage Ratios (%) and Financial Ratios (x)
| Ratio | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Return on average equity (%) | -44.8 | -42.4 | -23.4 |
Return on average assets (%) | -21.4 | -20.6 | -13.3 |
Total debt / equity (x) | 1.05 | 0.65 | 0.53 |
Asset turnover (x) | 0.12 | 0.16 | 0.19 |
Region revenue (CNY Mn)
| Region revenue (CNY Mn) | FY2025 |
|---|---|
Mainland China | 1,096.4 |
Overseas | 116.8 |
Total | 1,213.3 |
Region share (%) | FY2025 |
Mainland China | 90.4 |
Overseas | 9.6 |
Overseas revenue | 1H2025 |
Overseas revenue (CNY Mn) | 63.6 |
Overseas share of revenue (%) | 11.5 |
Overseas growth, YoY (%) | 57.8 |
Share Price & Returns
| Reference point | Date | Price (HKD) |
|---|---|---|
IPO price | 30 December 2024 | 30.86 |
Post-results rally | 11 April 2025 | 43.30 |
Pre-NVIDIA news | 16 May 2025 | 34.90 |
Record high (intraday) | 1–3 September 2025 | 98.70 |
After second placing | 21 October 2025 | 74.60 |
Year-end 2025 (implied from YTD change) | 31 December 2025 | 78.40 |
After Google announcement | 4 February 2026 | 55.15 |
Mid-May 2026 | 20 May 2026 | 68.70 |
Mid-July 2026 | 16 July 2026 | 48.00 |
Before Goldman reiteration | 8 September 2026 | 43.20 |
After board renewal | 28 September 2026 | 37.10 |
Latest close | 16 October 2026 | 32.58 |
Return (%) | Value | — |
Since IPO (30 December 2024 to 16 October 2026) | 5.6 | — |
Year to date, 2026 | -58.4 | — |
About one year (21 October 2025 to 16 October 2026) | -56.3 | — |
From record high | -67.0 | — |
Valuation Snapshot
| Multiple | Value |
|---|---|
Market capitalisation (HKD Bn) | 29.8 |
Enterprise value, adding end-FY2025 net debt of MYR Bn1.35 bn (HKD Bn) | 31.3 |
Trailing-12-month revenue to June 2026 (CNY Mn) | 1,493.9 |
Trailing-12-month net loss to June 2026 (CNY Mn) | -720.8 |
EV / Sales, trailing (x) | 19.2 |
Price / Sales, trailing (x) | 18.2 |
Price / Book, on 30 June 2026 book value per share of MYR Bn4.23 (x) | 7.0 |
Analyst Ratings & Targets
| Broker | Date | Rating | Target (HKD) |
|---|---|---|---|
Goldman Sachs | 9 September 2026 | Buy | 114.00 |
CLSA | 7 September 2026 | Outperform | 112.00 |
CMB International | 2 September 2026 | Accumulate | 74.20 |
Soochow Securities International | 6 July 2026 | Buy | 96.90 |
Caitong Securities | 12 April 2026 | Accumulate | — |
Huachuang Securities | 3 April 2026 | Buy | — |
Soochow Securities | 13 March 2026 | Buy | — |
Capital Markets
| Item | Detail |
|---|---|
Dividends | None paid since founding. As a loss-making PRC company with accumulated losses, it cannot distribute profits under PRC company law. No dividend policy announced. |
Buybacks | No cancellation buyback authorisation used. On-market purchases are made by the share-award trustee (4.82 million H shares cumulative). |
Credit ratings | No Moody's, S&P or Fitch ratings; financing comes from PRC bank loans |
Debt maturity (end-FY2025) | RMB336.1 million current and RMB1,894.0 million non-current, out of RMB2,230.1 million total borrowings |
Equity raised since IPO | About HK$1.4 billion (IPO) plus about HK$2.09 billion (two 2025 placings) |
Analyst Conclusions
Management guidance
Management gives no numeric revenue or earnings guidance. It points to:
-
further gross-margin gains from a higher-value mix and scale;
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capacity expansion to 20,000 wafers per month, with a longer-term aspiration of 70,000;
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continued growth in AI data-centre, automotive, industrial and energy-storage, appliance and robotics revenue;
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deeper work with ST, onsemi, NVIDIA and Google.
The 1H2026 results statement says the company has built a clear lead in GaN manufacturing scale, cost, customer coverage and supply chain. It says future growth will increasingly come from higher-quality, higher-margin revenue.
Sell-side forecasts
| Forecast (CNY Mn) | FY2025 | FY2026 | FY2027 | FY2028 |
|---|---|---|---|---|
| Revenue, Sinolink (August 2025) | 1,357 | 2,270 | 3,749 | 0 |
| Net income, Sinolink (August 2025) | -803 | -255 | 291 | 0 |
| Revenue, Soochow Securities International (July 2026) | 1,213 | 2,200 | 3,500 | 7,000 |
Revenue, Sinolink (August 2025): FY2025: 1357; FY2026: 2270; FY2027: 3749; FY2028: 0
Net income, Sinolink (August 2025): FY2025: -803; FY2026: -255; FY2027: 291; FY2028: 0
Revenue, Soochow Securities International (July 2026): FY2025: 1213; FY2026: 2200; FY2027: 3500; FY2028: 7000
FY2025 is reported actual revenue for Soochow. Sinolink published no FY2028 estimate, so its FY2028 cells read 0. Both brokers put net break-even at around FY2027.
Consensus expects revenue growth of 60–80% in FY2026, with net break-even around FY2027. Actual FY2025 revenue (RMB1,213 million) came in about 11% below Sinolink's August 2025 estimate. Meeting the FY2026 estimates would require second-half revenue of about RMB1.37–1.44 billion, roughly 65–72% above 1H2026.
Bull case
-
AI data-centre power becomes the main growth engine. Shipments into AI and data centres rose 180% in 1H2025 and 183% in 1H2026. Innoscience is the only Chinese company in NVIDIA's 800 VDC ecosystem and has Google design-ins. Commercial deployment of 800 VDC from 2027 could add a high-margin revenue stream large enough to change the company's earnings profile.
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Operating leverage is visible. Gross margin has improved for three straight half-years to 11.6%. Adjusted EBITDA turned positive in FY2025 and operating cash flow in 1H2026. D&A on the original fabs is expected to run off in 2026–2027, and expansion capex per wafer is falling. Each extra point of utilisation should convert into profit at a high rate.
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Becoming the merchant GaN wafer supplier for Western IDMs. With ST using its capacity in China and onsemi planning wafer procurement, Innoscience's 8-inch capacity could become a shared industry resource, especially as TSMC leaves GaN foundry work. This would raise utilisation and secure a cost leadership position that is hard to copy.
Bear case
-
IP losses shut out the highest-value Western markets. Infineon has won four rulings (two Munich judgments in 2025 and June 2026, a separate June 2026 utility-model ruling, and the May 2026 ITC determination), and more proceedings are pending. Innoscience's redesigns have worked so far, but each new adverse ruling raises costs and customer qualification risk in exactly the data-centre and automotive markets the bull case depends on.
-
Profitability is still far off. The FY2025 net loss of RMB840.5 million and the 1H2026 loss of RMB309 million compare with a 7–12% gross margin, well below the 38–55% of Western peers. Funding a move to 70,000 wafers per month while still losing money risks further dilution, after two placings in 2025.
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Geopolitical and concentration risk. Over 90% of revenue is booked in China, and US market access depends on "compliant" arrangements and redesigns. Any US policy move against Chinese power semiconductors in hyperscale data centres would hit the main growth driver.
Key catalysts and monitorables, next 12 months
| Catalyst / monitorable | Expected timing | What to watch |
|---|---|---|
| FY2026 annual results | Late March 2027 | Whether full-year revenue reaches the RMB2.2–2.3 billion consensus; full-year gross margin above 12%; whether positive operating cash flow holds |
| NVIDIA 800 VDC deployment | 2027 ramp; design activity through 2026–2027 | Conversion of partner status into volume orders |
| onsemi MoU to definitive agreement | 2026–2027 | Wafer-supply contract terms and volumes |
| Federal Circuit decision on the EPC ITC appeal | Pending | Removal of the exclusion order on legacy products |
| Infineon US district case and further Munich proceedings; German appeals | Pending | Scope of injunctions and damages |
| USPTO review of the remaining Infineon '481 claims | Pending | Possible invalidation of the remaining asserted claims |
| Capacity expansion progress | Ongoing | Additions toward 20,000 wafers per month; capex intensity |
| Automotive design wins | Ongoing | OBC and LiDAR volume; Tier-1 programmes through the UAES joint lab |
| Share-award trustee purchases | Ongoing | Further on-market buying |
| 1H2027 interim results | August 2027 | Path to net break-even |
FY2026 annual results: Expected timing: Late March 2027; What to watch: Whether full-year revenue reaches the RMB2.2–2.3 billion consensus; full-year gross margin above 12%; whether positive operating cash flow holds
NVIDIA 800 VDC deployment: Expected timing: 2027 ramp; design activity through 2026–2027; What to watch: Conversion of partner status into volume orders
onsemi MoU to definitive agreement: Expected timing: 2026–2027; What to watch: Wafer-supply contract terms and volumes
Federal Circuit decision on the EPC ITC appeal: Expected timing: Pending; What to watch: Removal of the exclusion order on legacy products
- Infineon US district case and further Munich proceedings; German appeals — Expected timing: Pending; What to watch: Scope of injunctions and damages
USPTO review of the remaining Infineon '481 claims: Expected timing: Pending; What to watch: Possible invalidation of the remaining asserted claims
Capacity expansion progress: Expected timing: Ongoing; What to watch: Additions toward 20,000 wafers per month; capex intensity
Automotive design wins: Expected timing: Ongoing; What to watch: OBC and LiDAR volume; Tier-1 programmes through the UAES joint lab
Share-award trustee purchases: Expected timing: Ongoing; What to watch: Further on-market buying
1H2027 interim results: Expected timing: August 2027; What to watch: Path to net break-even
Analyst verdict
Innoscience is the most important pure-play GaN power company in the world by volume, capacity and revenue. In 2025–2026 it passed the operating milestones that separate a well-funded start-up from a scaling semiconductor business: positive gross margin, positive adjusted EBITDA and positive half-year operating cash flow. Revenue rose 46% in FY2025 and 51% in 1H2026. The mix is shifting quickly toward AI data-centre, automotive, appliance and industrial uses, which made up about 64% of first-half revenue. Its 8-inch cost position looks increasingly strategic now that TSMC is leaving GaN foundry work and Western IDMs (ST and onsemi) have chosen to partner with it.
The investment case remains contested for three reasons. First, the company is still deeply loss-making: its RMB721 million trailing-12-month net loss is about half its revenue, and gross margin is less than a quarter of Western peers'. Second, the Infineon litigation has gone against Innoscience in Germany and, on legacy designs, at the ITC. Its redesigns and the Suzhou counter-ruling provide only partial protection. Third, the AI data-centre opportunity that drove the 2025 re-rating is real but early. Management itself says the business model, whether selling through PSU vendors or directly to cloud providers, is still being worked out, and 800 VDC volume deployment is a 2027 event.
At HK$32.58 the shares trade about 67% below their September 2025 peak, close to the IPO price and at roughly 18–19x trailing sales. Much of the 2025 enthusiasm has gone out of the price, and every disclosed broker target is more than double the current level. On balance, Innoscience is a high-variance, execution-driven turnaround with real strategic assets. The case for the shares depends on FY2026 revenue landing near RMB2.2 billion, gross margin passing the mid-teens, and IP disputes staying limited to legacy products. If those hold, the operating leverage visible in the half-year data supports a path to break-even around FY2027. If the data-centre ramp slips or Western litigation spreads to current-generation products, losses and dilution are likely to last longer than consensus expects.
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View Subscription PlansExecutive Leadership
Board of Directors
| Name | Board role | Executive / other role | Joined | Background |
|---|---|---|---|---|
Dr. Weiwei Luo | Chairwoman, executive director | Founder; leads overall strategy and business development | Founder; board chair since July 2017 | PhD in applied mathematics, Massey University (New Zealand). About 15 years at a NASA-affiliated research institute, from senior project manager to chief scientist. Founded two earlier advanced-materials companies. Director of Xingyao Semiconductor (micro-display technology). Aged 56 at the time of the prospectus. |
Jay Hyung Son | Executive director | Senior executive | Board since July 2017 | Aged 64 at the time of the prospectus |
Dr. Wu Jingang | Executive director | Chief Executive Officer | Executive director from 2024; CEO | Semiconductor process and technology executive |
Wu Lei | Executive director (employee representative) | Assistant to the CEO; supervisor of the Shanghai, Wuhan, Nanjing and Xuyao subsidiaries | Joined September 2022; director since 23 September 2026 | Master's degree, Zhejiang University (2006). R&D director at SMIC (2009–2021); engineering manager at Shanghai Huahong NEC (2006–2009). Aged 43. Holds 385,000 H shares. |
Dr. Wang Can | Non-executive director | — | Re-elected September 2026 | Investor-nominated director |
Zhang Yanhong | Non-executive director | — | Re-elected September 2026 | Investor-nominated director |
Wong Hin Wing | Independent non-executive director | — | Since 2024 | Hong Kong-based finance and accounting professional |
Dr. Yi Jiming | Independent non-executive director | — | Since 2024 | Legal scholar specialising in intellectual-property law |
Dr. Yang Shining | Independent non-executive director | — | Since 2024 | Senior semiconductor-industry executive with foundry and memory manufacturing leadership experience |
Board & Management Changes
| Date | Change |
|---|---|
21 May 2024 | Board reconstituted with executive, non-executive and independent directors before listing |
18 December 2024 | Zhong Shan formally appointed CFO of the listed company |
| 2025 | 2025 Share Award Scheme adopted. The trustee bought 0.59 million H shares in 2025. |
4 September 2026 | EGM notice for board renewal and Articles amendments |
23 September 2026 | Second board elected. Dr. Luo re-elected chair. Wu Lei joins as employee-representative director. Zhong Shan, Cui Mizi and Dr. Chen Zhenghao leave the board. |
8 July–16 October 2026 | Trustee buys 2,251,100 H shares at an average of HK$45.02 (HK$101.3 million in total). Cumulative trust holding is 4,822,100 H shares. |
Major Shareholders
| Holder | Stake (%) |
|---|---|
Controlling-shareholder group (Dr. Weiwei Luo with InnoHolding, Yingnuoxin, Inno HK, Yingnuo Youpeng and Xinsheng Dapeng) | 34.48 |
Wujiang Industrial Investment (Suzhou state-backed fund) | 6.22 |
Hong Huacan (spouse of CATL founder Zeng Yuqun) | 1.78 |
Competitive Landscape
Key Competitors
| Competitor | Model | GaN position | Relevance to Innoscience |
|---|---|---|---|
Infineon Technologies (Germany) | IDM; acquired GaN Systems in 2023 | Broadest GaN patent portfolio (about 450 families); 300mm GaN roadmap; strong automotive, industrial and data-centre channels | Main high-voltage and data-centre rival; adversary in patent litigation in the US and Germany |
Navitas Semiconductor (US) | Fabless (GaNFast, GeneSiC) | Pioneer in GaN chargers; now repositioning ("Navitas 2.0") toward AI data centres, grid and industrial | Direct rival in chargers and data-centre PSUs; also an NVIDIA 800 VDC partner |
Efficient Power Conversion, EPC (US, private) | Fabless | Low-voltage (15–200V) eGaN leader in DC-DC, LiDAR and motor drives | Direct low-voltage rival; ITC litigant whose patent was invalidated |
Power Integrations (US) | Fabless, with integrated GaN switches in ICs (PowiGaN) | High-voltage GaN integrated into flyback ICs; PowiGaN revenue grew more than 40% in 2025 | Competes in chargers, appliances and industrial auxiliary supplies; also in the 800 VDC ecosystem |
Texas Instruments (US) | IDM | Integrated GaN FETs with drivers | Competes in industrial and data-centre power stages |
STMicroelectronics (Switzerland / France / Italy) | IDM | PowerGaN and VIPerGaN | Partner and part-customer, but also a competitor in end markets |
onsemi (US) | IDM | Building a GaN portfolio, partly through Innoscience wafers | Partner as well as potential competitor |
Renesas Electronics (Japan) | IDM; acquired Transphorm in 2024 | High-voltage cascode and enhancement-mode GaN | Competes in high-voltage industrial and automotive |
ROHM (Japan) | IDM | EcoGaN 150V/650V | Competes in industrial and automotive |
Cambridge GaN Devices (UK) | Fabless | ICeGaN high-voltage | Niche rival in data-centre and automotive high-voltage |
Sanan Optoelectronics, China Resources Microelectronics and other Chinese GaN producers | IDM / foundry | Domestic GaN-on-Si capacity | Domestic price competition |
Peer Comparison FY2025
| Metric | Innoscience (FY2025, MYR Bn) | Infineon (FY Sep-2025, EUR) | Power Integrations (FY2025, USD) | Navitas (FY2025, USD) |
|---|---|---|---|---|
Revenue | RMB1,213 million | €14,662 million | US$443.5 million | US$45.9 million |
Revenue growth | +46.4% | −2% | +6% | −45% |
Gross margin | 7.3% | 39.2% | 54.5% | 38.4% |
Operating margin | −65.8% | 10.3% | Positive (GAAP net income US$22.1 million) | About −100% (operating loss US$46.0 million) |
GaN-specific revenue | 100% GaN | — | PowiGaN not separately disclosed (+40% or more) | Mostly GaN, with SiC |
“—” = not publicly disclosed.



