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Innoscience

Company Profile Analysis

Ticker: 2577.HK英诺赛科(苏州)科技股份有限公司

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Innoscience - Semiconductor showcase

Year Founded & Workforce

2015

1,359 Employees

Industry

Semiconductor
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Innoscience Employee Contacts

7 verified contactsNames, job titles, seniority and locations

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Innoscience Overview

Innoscience is the world's largest gallium-nitride (GaN) power semiconductor company by revenue. It is an integrated device manufacturer (IDM) and controls epitaxy, wafer fabrication, device design, packaging, testing and failure analysis in-house. It was the first company in the world to mass-produce 8-inch GaN-on-silicon wafers, and it runs the largest dedicated GaN power fabrication base in the world, in Suzhou and Zhuhai. Its products cover the full voltage range from 15V to 1,200V. They sell into consumer fast-charging, smartphones, household appliances, AI data-centre power, automotive electronics (LiDAR, on-board chargers, 48V systems), industrial motor drives, energy storage and humanoid robots. The company sells finished discrete devices and integrated circuits, power modules and 8-inch GaN wafers. The wafer sales place it in both the power-device market and the GaN epitaxial-wafer market. Revenue rose from RMB68.2 million in FY2021 to RMB1,213.3 million in FY2025. Gross margin turned positive in FY2025, and operating cash flow turned positive in 1H2026. The company is still loss-making at the net level. It is also in a multi-jurisdiction patent conflict with Infineon, the incumbent European GaN leader.


What the company does

Innoscience designs, develops and manufactures GaN power semiconductors on 8-inch (200mm) silicon substrates. Gallium nitride is a wide-bandgap material. Compared with silicon MOSFETs and, at several voltage nodes, silicon carbide, it switches faster, has lower on-resistance per unit area and has lower switching losses. This lets customers build smaller, cooler and more efficient power converters. Innoscience makes GaN-on-Si high-electron-mobility transistors (HEMTs) in its own fabs and sells them in four forms:

  1. GaN discrete devices and GaN integrated circuits. These are packaged transistors and driver-integrated GaN ICs sold to power-supply makers, OEMs and Tier-1s. They were 42.0% of FY2025 revenue.

  2. GaN modules. These are system-level power modules combining GaN devices, drivers and passives, sold mainly into charger, adapter and power-supply applications. They were 36.8% of FY2025 revenue.

  3. GaN wafers. These are 8-inch GaN-on-Si wafers, processed or epitaxial, sold to other semiconductor companies that package or brand devices themselves. STMicroelectronics is a disclosed user of Innoscience 700V wafers. They were 20.9% of FY2025 revenue.

  4. Other. Services and minor items, 0.3% of FY2025 revenue.

The company's own description

In its listing documents and annual reporting, Innoscience describes itself as a GaN power semiconductor IDM. It says it is the only company with industrial-scale capacity across the full voltage spectrum of GaN-on-Si products and owner of the world's largest GaN power semiconductor production base. It states its mission as leading the "power semiconductor revolution" by bringing GaN into mainstream markets at high performance and low cost.

Independent characterisation

Innoscience is best understood as a volume-and-cost GaN manufacturer that is moving from consumer electronics into higher-value industrial, automotive and AI-infrastructure sockets. Its strategy rests on manufacturing scale. In early 2026 the Suzhou site was reported to run 15,000 8-inch wafers per month at a stable yield of about 97%. Supply-chain reporting suggests its price quotes are around half those of other global GaN suppliers. Most Western GaN competitors (Navitas, EPC, Cambridge GaN Devices, and historically GaN Systems) are fabless or asset-light and depend on foundries such as TSMC, which has said it will leave GaN foundry work by 2027. Innoscience owns its capacity. That gives it a structural cost and supply-assurance advantage. It also means heavy fixed costs: depreciation and amortisation of about RMB500 million a year was the main reason gross margin stayed negative until 2025.

Revenue model

Revenue typeShare of FY2025 revenueNotes
Product sales: discretes and ICs42.0%Per-unit device pricing, design-win driven
Product sales: modules36.8%Higher content per end product; fastest-growing line in FY2025
Product sales: wafers20.9%Wafer-level sales to other IDMs and fabless firms
Services, licensing, subscriptionabout 0.3%Not material

Product sales: discretes and ICs: Share of FY2025 revenue: 42.0%; Notes: Per-unit device pricing, design-win driven

Product sales: modules: Share of FY2025 revenue: 36.8%; Notes: Higher content per end product; fastest-growing line in FY2025

Product sales: wafers: Share of FY2025 revenue: 20.9%; Notes: Wafer-level sales to other IDMs and fabless firms

Services, licensing, subscription: Share of FY2025 revenue: about 0.3%; Notes: Not material

Revenue is almost all product-based and recognised on shipment. There is no material recurring, subscription or licensing income.

Value-chain position

Innoscience covers the chain from substrate-level epitaxy (MOCVD growth of GaN on silicon) to finished modules. Upstream, it depends on silicon substrates, MOCVD reactors, process gases (ammonia, trimethylgallium and other metal-organic precursors) and lithography and etch tools. Downstream, it sells to:

  • charger and adapter brands and ODMs, including Anker and Ugreen;

  • smartphone OEMs (OPPO, vivo, Xiaomi), for over-voltage protection and fast charging;

  • automotive LiDAR makers (Hesai, RoboSense) and Tier-1s such as United Automotive Electronic Systems (UAES);

  • energy-storage and battery companies, with CATL its largest customer in FY2023 at 32.1% of revenue;

  • data-centre power supply makers and hyperscaler hardware platforms (Google design-ins; NVIDIA 800 VDC ecosystem);

  • other semiconductor companies buying wafers or co-developing, including STMicroelectronics and onsemi.

End-markets served

End-marketRepresentative applicationsFY2025 / 1H2026 evidence
Consumer electronicsUSB-PD fast chargers, smartphone OVP, laptop adapters, audio, white goodsRMB568.1 million in FY2025, the largest end-market. Air-conditioner and other white-goods revenue rose 924% in 1H2026.
AI and data centres48V-to-12V bus converters, server PSUs, 800 VDC rack architectureAI/data-centre sales +180% in 1H2025; chip shipments +183% in 1H2026
AutomotiveLiDAR laser drivers, 6.6kW on-board chargers, 48V systemsAutomotive-grade revenue RMB57.9 million in FY2025 (doubled); about 20 million LiDAR chips shipped cumulatively
Industrial and energy storageLow-voltage motor drives, BMS (VGaN bidirectional switches), PV MPPT, bidirectional convertersIndustrial and storage sales +83% in 1H2026; low-voltage motor-drive revenue +685%
RoboticsHumanoid-robot joint motors, dexterous-hand drivesFirst mass shipments of GaN-equipped humanoid robots in 1H2025; robot chip shipments +50% in 1H2026

Consumer electronics: Representative applications: USB-PD fast chargers, smartphone OVP, laptop adapters, audio, white goods; FY2025 / 1H2026 evidence: RMB568.1 million in FY2025, the largest end-market. Air-conditioner and other white-goods revenue rose 924% in 1H2026.

AI and data centres: Representative applications: 48V-to-12V bus converters, server PSUs, 800 VDC rack architecture; FY2025 / 1H2026 evidence: AI/data-centre sales +180% in 1H2025; chip shipments +183% in 1H2026

Automotive: Representative applications: LiDAR laser drivers, 6.6kW on-board chargers, 48V systems; FY2025 / 1H2026 evidence: Automotive-grade revenue RMB57.9 million in FY2025 (doubled); about 20 million LiDAR chips shipped cumulatively

Industrial and energy storage: Representative applications: Low-voltage motor drives, BMS (VGaN bidirectional switches), PV MPPT, bidirectional converters; FY2025 / 1H2026 evidence: Industrial and storage sales +83% in 1H2026; low-voltage motor-drive revenue +685%

Robotics: Representative applications: Humanoid-robot joint motors, dexterous-hand drives; FY2025 / 1H2026 evidence: First mass shipments of GaN-equipped humanoid robots in 1H2025; robot chip shipments +50% in 1H2026

Strategy

Stated strategic themes

Management's stated priorities, from the FY2025 annual results and 1H2026 interim reporting:

  1. Lead the move to GaN across all voltage classes, 15V to 1,200V. Position GaN as the default replacement for silicon power MOSFETs and, in selected high-voltage uses, silicon carbide.

  2. Shift the mix toward high-value markets. Focus on AI data centres, new-energy vehicles, industrial and energy storage, and robotics, where qualification barriers and margins are higher than in consumer chargers. In 1H2026 these markets were already 64% of revenue.

  3. Scale manufacturing and keep the cost lead. Expand from about 15,000 to 20,000 wafers per month, with a stated aspiration of 70,000 wafers per month over several years. Move the process from generation 3.0 to 4.0, and keep yield at about 97%.

  4. Move up the integration ladder. Shift from bare discretes and wafers to driver-integrated ICs and system modules. IC revenue grew 513% in FY2025.

  5. Globalise through partnerships rather than greenfield overseas fabs. Use ST for capacity outside China, onsemi for packaging and system integration, and NVIDIA and Google for data-centre ecosystem access.

  6. Defend and build intellectual property. Litigate across the US, Germany and China, and expand patent filings in ICs and advanced HEMT structures.

Strategic initiatives, last 24 months

DateInitiativeDetail
31 March 2025STMicroelectronics joint development and manufacturing agreementJoint development of GaN power technology. Innoscience may use ST front-end capacity outside China; ST may use Innoscience capacity in China.
1H2025Joint lab with United Automotive Electronic Systems (UAES)Automotive GaN co-development with a leading Chinese Tier-1
1H2025Humanoid-robot programmeWorked with leading robot makers on GaN chips for joint motors and dexterous-hand drives; first mass-production shipments of GaN-equipped humanoid robots
July 2025800 VDC programme with NVIDIAFull GaN conversion chain from 800V down to the GPU rail, supporting the move to megawatt-scale racks; listed as the only Chinese chip partner
July and October 2025Equity placingsHK$2.09 billion raised in total. From the October placing: HK$482 million for capacity, HK$376 million for debt repayment, HK$692 million for working capital.
October 2025800 VDC white paperPublished a technical case for an all-GaN 800 VDC architecture. Claims GaN cuts drive losses by 80% and switching losses by 50% per switching half-cycle versus SiC at the 800V input, and that data-centre parts are rated for operating lives above 20 years.
November 2025ST VIPerGaN50W launchInnoscience 700V wafers used in ST's GaN flyback converter ICs
2 December 2025onsemi MoUNon-binding plan for wafer procurement and wider collaboration on 40–200V GaN devices, aimed at a GaN power TAM of US$2.9 billion by 2030
3 February 2026Google AI hardwareDesign-ins completed and compliant supply agreement signed
2025–2026Process platform upgradeMoved from the 3.0 to the 4.0 process platform; first 1,200V volume shipments
2025–2026Employee share incentive2025 Share Award Scheme, funded by on-market H-share purchases
2,026Capacity expansionTarget raised to 70,000 wafers per month over several years

31 March 2025: Initiative: STMicroelectronics joint development and manufacturing agreement; Detail: Joint development of GaN power technology. Innoscience may use ST front-end capacity outside China; ST may use Innoscience capacity in China.

1H2025: Initiative: Joint lab with United Automotive Electronic Systems (UAES); Detail: Automotive GaN co-development with a leading Chinese Tier-1

1H2025: Initiative: Humanoid-robot programme; Detail: Worked with leading robot makers on GaN chips for joint motors and dexterous-hand drives; first mass-production shipments of GaN-equipped humanoid robots

July 2025: Initiative: 800 VDC programme with NVIDIA; Detail: Full GaN conversion chain from 800V down to the GPU rail, supporting the move to megawatt-scale racks; listed as the only Chinese chip partner

July and October 2025: Initiative: Equity placings; Detail: HK$2.09 billion raised in total. From the October placing: HK$482 million for capacity, HK$376 million for debt repayment, HK$692 million for working capital.

October 2025: Initiative: 800 VDC white paper; Detail: Published a technical case for an all-GaN 800 VDC architecture. Claims GaN cuts drive losses by 80% and switching losses by 50% per switching half-cycle versus SiC at the 800V input, and that data-centre parts are rated for operating lives above 20 years.

November 2025: Initiative: ST VIPerGaN50W launch; Detail: Innoscience 700V wafers used in ST's GaN flyback converter ICs

2 December 2025: Initiative: onsemi MoU; Detail: Non-binding plan for wafer procurement and wider collaboration on 40–200V GaN devices, aimed at a GaN power TAM of US$2.9 billion by 2030

3 February 2026: Initiative: Google AI hardware; Detail: Design-ins completed and compliant supply agreement signed

2025–2026: Initiative: Process platform upgrade; Detail: Moved from the 3.0 to the 4.0 process platform; first 1,200V volume shipments

2025–2026: Initiative: Employee share incentive; Detail: 2025 Share Award Scheme, funded by on-market H-share purchases

2026: Initiative: Capacity expansion; Detail: Target raised to 70,000 wafers per month over several years

ESG commitments

The company presents GaN's efficiency gains as its main sustainability contribution. Examples are lower conversion losses in data centres, less copper use in 800 VDC architectures and lighter EV power electronics. No numeric emissions targets have been published.

Medium-term targets

Management has not issued numeric revenue or margin guidance. Its stated operating aims are continued gross-margin expansion, scaling to 20,000 and then 70,000 wafers per month, and a rising share of revenue from high-value markets. The sell-side expects net break-even around FY2027.

Products & Services

GaN discrete devices (InnoGaN)

Product familyDescription and key specificationsTarget customer and applicationStatus / year
Low-voltage bidirectional GaN (VGaN), 40V classSingle-chip bidirectional switch that replaces back-to-back silicon MOSFETs; smaller footprint, lower resistanceSmartphone OEMs (over-voltage protection in charging paths); battery management systems in energy storageHigh volume. VGaN BMS solutions in scaled production at leading storage customers by 1H2026.
100V GaN HEMTsLow-voltage, high-frequency switches for 48V-to-12V conversionServer motherboards and PSUs (AI data centres), 48V automotive, motor drives, LiDAR48V-to-12V products for server PSUs and boards in mass production from 1H2025. More than 10 million 100V chips shipped in FY2025.
150V / 200V GaN HEMTsMid-voltage transistors for motor drives and intermediate bus convertersHumanoid-robot joint motors, dexterous-hand drives, industrial drives, telecomShipping to robotics customers from 2025
650V / 700V GaN HEMTs (third generation)High-voltage enhancement-mode HEMTs. Third-generation 700V parts cut die area by about 30%, improve switching performance by 20–30% and reduce capacitances by 20–30%.Fast chargers, adapters, appliance power, PFC, server PSUs, OBCsThird-generation 700V in mass production by 2025
1,200V GaN devicesHigh-voltage GaN aimed at 800 VDC input stages and EV-adjacent applications800 VDC AI data-centre front ends, industrialFirst in the industry; about 500,000 units shipped in FY2025
Automotive-grade (AEC-Q qualified) discretesQualified versions of low- and high-voltage partsLiDAR laser drivers (Hesai, RoboSense), 6.6kW OBCs, DC-DCAutomotive revenue RMB57.9 million in FY2025. About 20 million LiDAR chips shipped cumulatively by mid-2026.

GaN integrated circuits (SolidGaN and driver-integrated solutions)

ProductDescriptionTarget / applicationStatus
SolidGaN integrated power stagesGaN HEMT co-packaged or integrated with gate driver and protection; simplifies design and reduces parasiticsChargers, appliances, motor drives, power suppliesIC revenue +513% in FY2025
ISG6127ATP-Q (automotive SolidGaN)Automotive-grade integrated GaN power device for next-generation EV systemsOn-board chargers and EV power conversionReceived the CSPSD 2026 Outstanding Market Performance Award
Integrated driver–GaN solutions for 48VDriver-plus-GaN combinations for intermediate bus convertersAI server boardsVolume shipments from 2025

GaN modules

ProductDescriptionTarget / applicationStatus
New-generation GaN power modulesSystem-level modules combining GaN switches, drivers and magnetics/passivesCharger brands, adapter ODMs, appliance power supplies, industrialLaunch drove revenue up 142.6% to RMB446.2 million in FY2025
Data-centre and 800 VDC power reference designsAll-GaN conversion chain from 800V input to 1V point-of-load, supporting the move to megawatt-scale racksHyperscalers, PSU makers in NVIDIA's 800 VDC ecosystem, Google AI hardwarePartner status from August 2025; Google design-ins completed February 2026

GaN wafers

ProductDescriptionTarget / applicationStatus
8-inch GaN-on-Si wafers (low and high voltage)Processed or epitaxial wafers from Suzhou and Zhuhai at 97% stable yieldOther IDMs and device makers that brand and package their own parts; STMicroelectronics used Innoscience 700V wafers in its VIPerGaN50W flyback ICs (November 2025)RMB253.4 million revenue in FY2025 (−9.7%); onsemi MoU covers wafer procurement for 40–200V devices

Process platforms

PlatformDescriptionTiming
Generation 3.0 GaN-on-Si processThird-generation HEMT platform behind the current 700V and low-voltage familiesMass production by 2024–2025
Generation 4.0 GaN-on-Si processNext platform, with further die shrink and cost-downMoved to 4.0 during FY2025

Pricing model

The company does not disclose list prices. Contracts are per-unit, volume-tiered device sales and per-wafer prices. Industry reporting puts Innoscience quotes at about half those of global GaN peers. The company describes its positioning as "high-performance, low-cost".

Financial Narrative

All figures are RMB millions under IFRS for years ended 31 December, unless stated. FY2021–FY2023 come from the HKEX prospectus. FY2024 and FY2025 come from the annual reports.

Income statement

The FY2021 growth cell reads 0 because there is no FY2020 base.

Adjusted EBITDA is the operating loss plus depreciation of property, plant and equipment and right-of-use assets, amortisation of intangibles and land-use rights, equity-settled share-based payments, and non-recurring compliance-related costs.

Revenue CAGR. Revenue compounded at about 105% a year from FY2021 to FY2025 and about 43% a year from FY2023 to FY2025.

Commentary. The income statement shows a capital-heavy IDM moving from start-up losses toward break-even.

FY2021–FY2022 losses: Net losses of RMB3.40 billion and RMB2.21 billion were mainly non-operating. Charges of about RMB2.30 billion in FY2021 and RMB0.90 billion in FY2022 reflect fair-value changes on investor instruments with redemption rights. These charges stopped once the instruments were reclassified to equity, which is why reported equity went from −RMB4.1 billion at end-FY2021 to +RMB3.0 billion at end-FY2022.

Operating losses: Operating losses have stayed around RMB0.8–1.2 billion a year. The constant drag is about RMB0.5 billion of annual D&A on fabs built in 2017–2021, together with heavy R&D (RMB662 million in FY2021) and a step-up in SG&A after the IPO. SG&A was RMB549 million in FY2024, including listing, legal and share-based costs.

Gross margin: The inflection came from volume absorption. Gross margin improved from −289% in FY2022 to +7.3% in FY2025 while cost of sales grew only 13.6% in FY2025 against revenue growth of 46%.

Expenses: Management describes period expenses as broadly stable in FY2025, so most of the gross-profit gain fell through to EBITDA.

Income tax: Tax is negligible (RMB0.34 million in FY2024), so pre-tax and net losses are essentially the same.

Half-year progression

1H2026 was the third straight half-year of gross-margin improvement. The net loss fell 28% year on year to RMB309 million, and basic loss per share was RMB0.34. Operating cash flow was +RMB169 million, against −RMB387 million in 1H2025. Total shipments in 1H2026 were 547 million units, taking cumulative shipments past 2.5 billion.

Balance sheet

There is no goodwill, because the company has not made acquisitions.

Commentary.

FY2025 balance sheet: The FY2025 balance sheet was the strongest in the company's history. Two placings raised about HK$2.09 billion (about RMB1.87 billion), and equity rose to RMB4.21 billion.

Cash versus liquid resources: Reported cash fell to RMB879 million while total current assets almost doubled to RMB4.33 billion. A large part of the placing proceeds sits in short-term deposits and treasury-type investments, and inventory was built up (inventories were up 60.8% in 1H2025). Including short-term investments, liquid resources were roughly RMB2.6 billion at year-end, more than total borrowings of RMB2.23 billion.

Gearing: The company reports net gearing of 32.1% for FY2025 (13.4% in FY2024). The current ratio improved to 5.3x from 2.5x.

Debt mix: Borrowings shifted toward long-term facilities. The current portion fell to RMB336 million, which reduces refinancing risk.

Fixed assets: PP&E has fallen every year since FY2021 because depreciation (about RMB500 million a year) outran maintenance-level capex. This will reverse as the capacity expansion funded by the October 2025 placing (HK$482 million earmarked) is spent.

Cash flow

Commentary.

FY2025 operating cash flow: The outflow worsened to −RMB806 million even though EBITDA improved. The cause was working capital: inventory build ahead of data-centre, automotive and appliance ramps, plus receivables growing with revenue.

1H2026 reversal: Operating cash flow turned positive at +RMB169 million, the first positive half-year. This suggests the FY2025 build was timing rather than structural.

Capex: Capex has been low (RMB172–332 million a year in FY2023–FY2025) because the fabs were largely built by FY2021. Management says future expansion depends mainly on adding bottleneck tools such as MOCVD reactors rather than new cleanrooms, so capex per unit of new capacity should fall.

Share purchases: Shares bought by the share-award trustee are held in trust for employees and are not cancellation buybacks.

Key ratios

The current ratio was 2.5x at end-FY2024, 3.21x at 30 June 2025 and 5.3x at end-FY2025. EBIT interest cover was negative: −8.5x in FY2023 and −11.7x in FY2024. Net debt/EBITDA is not meaningful while reported EBITDA is negative. The company does not report a cash conversion cycle. ROIC is deeply negative in every year because NOPAT has been negative throughout. In 1H2026, the annualised return on equity was about −15% (−7.65% for the half-year).

Trend summary. Every profitability ratio has improved for three years in a row, and the improvement sped up in 1H2026. Asset turnover (0.19x in FY2025) is still well below mature power-semiconductor IDMs, which typically run 0.5–0.8x. Further improvement depends on filling capacity rather than adding it.

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Financial Detail

Income Statement and Margin Analysis (%)

MetricFY2021FY2022FY2023FY2024FY2025

Revenue (CNY Mn)

68.2136.2592.7828.51,213.3

Revenue growth (%)

099.6335.339.846.4

Cost of sales (CNY Mn)

249.8530.3954.8989.91,124.5

Gross profit (CNY Mn)

-181.5-394.1-362.1-161.488.8

Operating income (CNY Mn)

-1,010.0-1,226.0-1,008.0-984.8-798.9

Depreciation and amortisation (CNY Mn)

263.1463.1524.7505.4507.9

EBITDA, operating loss plus D&A (CNY Mn)

-746.9-762.9-483.3-479.4-291.0

Net income (CNY Mn)

-3,399.0-2,205.0-1,102.0-1,045.7-840.5

Dividends per share (MYR Bn)

00000

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Margin (%)

Margin (%)FY2021FY2022FY2023FY2024FY2025

Gross margin

-266.1-289.4-61.1-19.57.3

Operating margin

-1,480.5-900.4-170.1-118.9-65.8

EBITDA margin

-1,094.8-560.3-81.5-57.9-24.0

Net margin

-4,982.4-1,619.3-185.9-126.2-69.3

Per-share data (MYR Bn)

Per-share data (MYR Bn)FY2023FY2024FY2025

EPS, basic

-1.38-1.28-0.95

EPS, diluted

-1.38-1.28-0.95

Company-defined adjusted EBITDA (CNY Mn)

Company-defined adjusted EBITDA (CNY Mn)FY2024FY2025

Adjusted EBITDA

-14852

Operating expense detail (CNY Mn)

Operating expense detail (CNY Mn)FY2021FY2022FY2023FY2024

Research and development

661.7581.1348.8323.0

Selling, general and administrative

207.5268.6337.2549.1

Interest expense

93.3131.6118.984.1

Income Statement and Margin Analysis (%) (1H2024–1H2026)

Metric1H20242H20241H20252H20251H2026

Revenue (CNY Mn)

385.9442.6553.4659.9834.0

Gross profit (CNY Mn)

-83.2-78.237.851.097.1

Gross margin (%)

-21.6-17.76.87.711.6

Net loss (CNY Mn)

-488.0-557.7-428.7-411.8-309.0

Balance Sheet

MetricFY2021FY2022FY2023FY2024FY2025

Cash and cash equivalents (CNY Mn)

1,279.0710.8329.01,525.0879.0

Total current assets (CNY Mn)

2,603.01,927.01,112.02,460.04,333.0

Property, plant and equipment (CNY Mn)

3,452.03,353.03,146.02,859.02,489.0

Intangible assets (CNY Mn)

402.0345.2272.6197.7118.4

Total assets (CNY Mn)

6,622.05,695.04,591.05,547.07,071.0

Short-term debt and current portion (CNY Mn)

722.0438.4508.5522.4336.1

Long-term debt and investor redemption liabilities (CNY Mn)

9,107.01,632.01,546.01,401.01,894.0

Total debt (CNY Mn)

9,829.02,070.42,054.51,923.42,230.1

Net debt, total debt less cash (CNY Mn)

8,550.01,359.61,725.5398.41,351.1

Total liabilities (CNY Mn)

10,747.02,735.02,627.02,576.02,860.0

Shareholders' equity (CNY Mn)

-4,125.02,960.01,964.02,971.04,211.0

Working capital (CNY Mn)

1,038.0916.2185.31,464.03,513.0

Cash Flow

MetricFY2021FY2022FY2023FY2024FY2025

Operating cash flow (CNY Mn)

-562.1-936.3-593.6-336.4-806.4

Capital expenditure (CNY Mn)

1,121.0464.6331.3171.8210.6

Free cash flow (CNY Mn)

-1,683.0-1,401.0-924.9-508.1-1,017.0

Share-based compensation (CNY Mn)

19.730.686.4166.9164.2

Equity issued (CNY Mn)

0020.01,889.01,956.0

Long-term debt drawn (CNY Mn)

4,039.01,268.0266.2392.81,416.0

Long-term debt repaid (CNY Mn)

81.9672.6305.9530.51,128.0

Dividends paid (CNY Mn)

00000

Share buybacks for cancellation (CNY Mn)

00000

Returns & Leverage Ratios (%) and Financial Ratios (x)

RatioFY2023FY2024FY2025

Return on average equity (%)

-44.8-42.4-23.4

Return on average assets (%)

-21.4-20.6-13.3

Total debt / equity (x)

1.050.650.53

Asset turnover (x)

0.120.160.19

Region revenue (CNY Mn)

Region revenue (CNY Mn)FY2025

Mainland China

1,096.4

Overseas

116.8

Total

1,213.3

Region share (%)

FY2025

Mainland China

90.4

Overseas

9.6

Overseas revenue

1H2025

Overseas revenue (CNY Mn)

63.6

Overseas share of revenue (%)

11.5

Overseas growth, YoY (%)

57.8

Share Price & Returns

Reference pointDatePrice (HKD)

IPO price

30 December 2024

30.86

Post-results rally

11 April 2025

43.30

Pre-NVIDIA news

16 May 2025

34.90

Record high (intraday)

1–3 September 2025

98.70

After second placing

21 October 2025

74.60

Year-end 2025 (implied from YTD change)

31 December 2025

78.40

After Google announcement

4 February 2026

55.15

Mid-May 2026

20 May 2026

68.70

Mid-July 2026

16 July 2026

48.00

Before Goldman reiteration

8 September 2026

43.20

After board renewal

28 September 2026

37.10

Latest close

16 October 2026

32.58

Return (%)

Value

—

Since IPO (30 December 2024 to 16 October 2026)

5.6—

Year to date, 2026

-58.4—

About one year (21 October 2025 to 16 October 2026)

-56.3—

From record high

-67.0—

Valuation Snapshot

MultipleValue

Market capitalisation (HKD Bn)

29.8

Enterprise value, adding end-FY2025 net debt of MYR Bn1.35 bn (HKD Bn)

31.3

Trailing-12-month revenue to June 2026 (CNY Mn)

1,493.9

Trailing-12-month net loss to June 2026 (CNY Mn)

-720.8

EV / Sales, trailing (x)

19.2

Price / Sales, trailing (x)

18.2

Price / Book, on 30 June 2026 book value per share of MYR Bn4.23 (x)

7.0

Analyst Ratings & Targets

BrokerDateRatingTarget (HKD)

Goldman Sachs

9 September 2026

Buy

114.00

CLSA

7 September 2026

Outperform

112.00

CMB International

2 September 2026

Accumulate

74.20

Soochow Securities International

6 July 2026

Buy

96.90

Caitong Securities

12 April 2026

Accumulate

—

Huachuang Securities

3 April 2026

Buy

—

Soochow Securities

13 March 2026

Buy

—

Capital Markets

ItemDetail

Dividends

None paid since founding. As a loss-making PRC company with accumulated losses, it cannot distribute profits under PRC company law. No dividend policy announced.

Buybacks

No cancellation buyback authorisation used. On-market purchases are made by the share-award trustee (4.82 million H shares cumulative).

Credit ratings

No Moody's, S&P or Fitch ratings; financing comes from PRC bank loans

Debt maturity (end-FY2025)

RMB336.1 million current and RMB1,894.0 million non-current, out of RMB2,230.1 million total borrowings

Equity raised since IPO

About HK$1.4 billion (IPO) plus about HK$2.09 billion (two 2025 placings)

Analyst Conclusions

Management guidance

Management gives no numeric revenue or earnings guidance. It points to:

  • further gross-margin gains from a higher-value mix and scale;

  • capacity expansion to 20,000 wafers per month, with a longer-term aspiration of 70,000;

  • continued growth in AI data-centre, automotive, industrial and energy-storage, appliance and robotics revenue;

  • deeper work with ST, onsemi, NVIDIA and Google.

The 1H2026 results statement says the company has built a clear lead in GaN manufacturing scale, cost, customer coverage and supply chain. It says future growth will increasingly come from higher-quality, higher-margin revenue.

Sell-side forecasts

Forecast (CNY Mn)FY2025FY2026FY2027FY2028
Revenue, Sinolink (August 2025)1,3572,2703,7490
Net income, Sinolink (August 2025)-803-2552910
Revenue, Soochow Securities International (July 2026)1,2132,2003,5007,000

Revenue, Sinolink (August 2025): FY2025: 1357; FY2026: 2270; FY2027: 3749; FY2028: 0

Net income, Sinolink (August 2025): FY2025: -803; FY2026: -255; FY2027: 291; FY2028: 0

Revenue, Soochow Securities International (July 2026): FY2025: 1213; FY2026: 2200; FY2027: 3500; FY2028: 7000

FY2025 is reported actual revenue for Soochow. Sinolink published no FY2028 estimate, so its FY2028 cells read 0. Both brokers put net break-even at around FY2027.

Consensus expects revenue growth of 60–80% in FY2026, with net break-even around FY2027. Actual FY2025 revenue (RMB1,213 million) came in about 11% below Sinolink's August 2025 estimate. Meeting the FY2026 estimates would require second-half revenue of about RMB1.37–1.44 billion, roughly 65–72% above 1H2026.

Bull case

  1. AI data-centre power becomes the main growth engine. Shipments into AI and data centres rose 180% in 1H2025 and 183% in 1H2026. Innoscience is the only Chinese company in NVIDIA's 800 VDC ecosystem and has Google design-ins. Commercial deployment of 800 VDC from 2027 could add a high-margin revenue stream large enough to change the company's earnings profile.

  2. Operating leverage is visible. Gross margin has improved for three straight half-years to 11.6%. Adjusted EBITDA turned positive in FY2025 and operating cash flow in 1H2026. D&A on the original fabs is expected to run off in 2026–2027, and expansion capex per wafer is falling. Each extra point of utilisation should convert into profit at a high rate.

  3. Becoming the merchant GaN wafer supplier for Western IDMs. With ST using its capacity in China and onsemi planning wafer procurement, Innoscience's 8-inch capacity could become a shared industry resource, especially as TSMC leaves GaN foundry work. This would raise utilisation and secure a cost leadership position that is hard to copy.

Bear case

  1. IP losses shut out the highest-value Western markets. Infineon has won four rulings (two Munich judgments in 2025 and June 2026, a separate June 2026 utility-model ruling, and the May 2026 ITC determination), and more proceedings are pending. Innoscience's redesigns have worked so far, but each new adverse ruling raises costs and customer qualification risk in exactly the data-centre and automotive markets the bull case depends on.

  2. Profitability is still far off. The FY2025 net loss of RMB840.5 million and the 1H2026 loss of RMB309 million compare with a 7–12% gross margin, well below the 38–55% of Western peers. Funding a move to 70,000 wafers per month while still losing money risks further dilution, after two placings in 2025.

  3. Geopolitical and concentration risk. Over 90% of revenue is booked in China, and US market access depends on "compliant" arrangements and redesigns. Any US policy move against Chinese power semiconductors in hyperscale data centres would hit the main growth driver.

Key catalysts and monitorables, next 12 months

Catalyst / monitorableExpected timingWhat to watch
FY2026 annual resultsLate March 2027Whether full-year revenue reaches the RMB2.2–2.3 billion consensus; full-year gross margin above 12%; whether positive operating cash flow holds
NVIDIA 800 VDC deployment2027 ramp; design activity through 2026–2027Conversion of partner status into volume orders
onsemi MoU to definitive agreement2026–2027Wafer-supply contract terms and volumes
Federal Circuit decision on the EPC ITC appealPendingRemoval of the exclusion order on legacy products
Infineon US district case and further Munich proceedings; German appealsPendingScope of injunctions and damages
USPTO review of the remaining Infineon '481 claimsPendingPossible invalidation of the remaining asserted claims
Capacity expansion progressOngoingAdditions toward 20,000 wafers per month; capex intensity
Automotive design winsOngoingOBC and LiDAR volume; Tier-1 programmes through the UAES joint lab
Share-award trustee purchasesOngoingFurther on-market buying
1H2027 interim resultsAugust 2027Path to net break-even

FY2026 annual results: Expected timing: Late March 2027; What to watch: Whether full-year revenue reaches the RMB2.2–2.3 billion consensus; full-year gross margin above 12%; whether positive operating cash flow holds

NVIDIA 800 VDC deployment: Expected timing: 2027 ramp; design activity through 2026–2027; What to watch: Conversion of partner status into volume orders

onsemi MoU to definitive agreement: Expected timing: 2026–2027; What to watch: Wafer-supply contract terms and volumes

Federal Circuit decision on the EPC ITC appeal: Expected timing: Pending; What to watch: Removal of the exclusion order on legacy products

  • Infineon US district case and further Munich proceedings; German appeals — Expected timing: Pending; What to watch: Scope of injunctions and damages

USPTO review of the remaining Infineon '481 claims: Expected timing: Pending; What to watch: Possible invalidation of the remaining asserted claims

Capacity expansion progress: Expected timing: Ongoing; What to watch: Additions toward 20,000 wafers per month; capex intensity

Automotive design wins: Expected timing: Ongoing; What to watch: OBC and LiDAR volume; Tier-1 programmes through the UAES joint lab

Share-award trustee purchases: Expected timing: Ongoing; What to watch: Further on-market buying

1H2027 interim results: Expected timing: August 2027; What to watch: Path to net break-even

Analyst verdict

Innoscience is the most important pure-play GaN power company in the world by volume, capacity and revenue. In 2025–2026 it passed the operating milestones that separate a well-funded start-up from a scaling semiconductor business: positive gross margin, positive adjusted EBITDA and positive half-year operating cash flow. Revenue rose 46% in FY2025 and 51% in 1H2026. The mix is shifting quickly toward AI data-centre, automotive, appliance and industrial uses, which made up about 64% of first-half revenue. Its 8-inch cost position looks increasingly strategic now that TSMC is leaving GaN foundry work and Western IDMs (ST and onsemi) have chosen to partner with it.

The investment case remains contested for three reasons. First, the company is still deeply loss-making: its RMB721 million trailing-12-month net loss is about half its revenue, and gross margin is less than a quarter of Western peers'. Second, the Infineon litigation has gone against Innoscience in Germany and, on legacy designs, at the ITC. Its redesigns and the Suzhou counter-ruling provide only partial protection. Third, the AI data-centre opportunity that drove the 2025 re-rating is real but early. Management itself says the business model, whether selling through PSU vendors or directly to cloud providers, is still being worked out, and 800 VDC volume deployment is a 2027 event.

At HK$32.58 the shares trade about 67% below their September 2025 peak, close to the IPO price and at roughly 18–19x trailing sales. Much of the 2025 enthusiasm has gone out of the price, and every disclosed broker target is more than double the current level. On balance, Innoscience is a high-variance, execution-driven turnaround with real strategic assets. The case for the shares depends on FY2026 revenue landing near RMB2.2 billion, gross margin passing the mid-teens, and IP disputes staying limited to legacy products. If those hold, the operating leverage visible in the half-year data supports a path to break-even around FY2027. If the data-centre ramp slips or Western litigation spreads to current-generation products, losses and dilution are likely to last longer than consensus expects.

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Executive Leadership

Board of Directors

NameBoard roleExecutive / other roleJoinedBackground

Dr. Weiwei Luo

Chairwoman, executive director

Founder; leads overall strategy and business development

Founder; board chair since July 2017

PhD in applied mathematics, Massey University (New Zealand). About 15 years at a NASA-affiliated research institute, from senior project manager to chief scientist. Founded two earlier advanced-materials companies. Director of Xingyao Semiconductor (micro-display technology). Aged 56 at the time of the prospectus.

Jay Hyung Son

Executive director

Senior executive

Board since July 2017

Aged 64 at the time of the prospectus

Dr. Wu Jingang

Executive director

Chief Executive Officer

Executive director from 2024; CEO

Semiconductor process and technology executive

Wu Lei

Executive director (employee representative)

Assistant to the CEO; supervisor of the Shanghai, Wuhan, Nanjing and Xuyao subsidiaries

Joined September 2022; director since 23 September 2026

Master's degree, Zhejiang University (2006). R&D director at SMIC (2009–2021); engineering manager at Shanghai Huahong NEC (2006–2009). Aged 43. Holds 385,000 H shares.

Dr. Wang Can

Non-executive director

—

Re-elected September 2026

Investor-nominated director

Zhang Yanhong

Non-executive director

—

Re-elected September 2026

Investor-nominated director

Wong Hin Wing

Independent non-executive director

—

Since 2024

Hong Kong-based finance and accounting professional

Dr. Yi Jiming

Independent non-executive director

—

Since 2024

Legal scholar specialising in intellectual-property law

Dr. Yang Shining

Independent non-executive director

—

Since 2024

Senior semiconductor-industry executive with foundry and memory manufacturing leadership experience

Board & Management Changes

DateChange

21 May 2024

Board reconstituted with executive, non-executive and independent directors before listing

18 December 2024

Zhong Shan formally appointed CFO of the listed company

2025

2025 Share Award Scheme adopted. The trustee bought 0.59 million H shares in 2025.

4 September 2026

EGM notice for board renewal and Articles amendments

23 September 2026

Second board elected. Dr. Luo re-elected chair. Wu Lei joins as employee-representative director. Zhong Shan, Cui Mizi and Dr. Chen Zhenghao leave the board.

8 July–16 October 2026

Trustee buys 2,251,100 H shares at an average of HK$45.02 (HK$101.3 million in total). Cumulative trust holding is 4,822,100 H shares.

Major Shareholders

HolderStake (%)

Controlling-shareholder group (Dr. Weiwei Luo with InnoHolding, Yingnuoxin, Inno HK, Yingnuo Youpeng and Xinsheng Dapeng)

34.48

Wujiang Industrial Investment (Suzhou state-backed fund)

6.22

Hong Huacan (spouse of CATL founder Zeng Yuqun)

1.78

Competitive Landscape

Key Competitors

CompetitorModelGaN positionRelevance to Innoscience

Infineon Technologies (Germany)

IDM; acquired GaN Systems in 2023

Broadest GaN patent portfolio (about 450 families); 300mm GaN roadmap; strong automotive, industrial and data-centre channels

Main high-voltage and data-centre rival; adversary in patent litigation in the US and Germany

Navitas Semiconductor (US)

Fabless (GaNFast, GeneSiC)

Pioneer in GaN chargers; now repositioning ("Navitas 2.0") toward AI data centres, grid and industrial

Direct rival in chargers and data-centre PSUs; also an NVIDIA 800 VDC partner

Efficient Power Conversion, EPC (US, private)

Fabless

Low-voltage (15–200V) eGaN leader in DC-DC, LiDAR and motor drives

Direct low-voltage rival; ITC litigant whose patent was invalidated

Power Integrations (US)

Fabless, with integrated GaN switches in ICs (PowiGaN)

High-voltage GaN integrated into flyback ICs; PowiGaN revenue grew more than 40% in 2025

Competes in chargers, appliances and industrial auxiliary supplies; also in the 800 VDC ecosystem

Texas Instruments (US)

IDM

Integrated GaN FETs with drivers

Competes in industrial and data-centre power stages

STMicroelectronics (Switzerland / France / Italy)

IDM

PowerGaN and VIPerGaN

Partner and part-customer, but also a competitor in end markets

onsemi (US)

IDM

Building a GaN portfolio, partly through Innoscience wafers

Partner as well as potential competitor

Renesas Electronics (Japan)

IDM; acquired Transphorm in 2024

High-voltage cascode and enhancement-mode GaN

Competes in high-voltage industrial and automotive

ROHM (Japan)

IDM

EcoGaN 150V/650V

Competes in industrial and automotive

Cambridge GaN Devices (UK)

Fabless

ICeGaN high-voltage

Niche rival in data-centre and automotive high-voltage

Sanan Optoelectronics, China Resources Microelectronics and other Chinese GaN producers

IDM / foundry

Domestic GaN-on-Si capacity

Domestic price competition

Peer Comparison FY2025

MetricInnoscience (FY2025, MYR Bn)Infineon (FY Sep-2025, EUR)Power Integrations (FY2025, USD)Navitas (FY2025, USD)

Revenue

RMB1,213 million

€14,662 million

US$443.5 million

US$45.9 million

Revenue growth

+46.4%−2%+6%−45%

Gross margin

7.3%39.2%54.5%38.4%

Operating margin

−65.8%10.3%

Positive (GAAP net income US$22.1 million)

About −100% (operating loss US$46.0 million)

GaN-specific revenue

100% GaN

—

PowiGaN not separately disclosed (+40% or more)

Mostly GaN, with SiC

“—” = not publicly disclosed.

Company Snapshot

$168.7M

Revenue

1,359

Employees

2015

Founded

Suzhou, China

Headquarters

SWOT Analysis

Strengths

  • Global scale leadership. Ranked first in GaN power semiconductors with 33.7% revenue share in 2023 (Frost & Sullivan), and about 30% in 2024.
  • Manufacturing excellence. About 15,000 8-inch wafers per month in Suzhou at a stable 97% yield.
  • Full-voltage portfolio. 15V–1,200V in volume, including about 500,000 1,200V units and more than 10 million 100V chips shipped in FY2025.
  • Improving margins. Gross margin moved from −61.1% (FY2023) to −19.5% (FY2024), 7.3% (FY2025) and 11.6% (1H2026).
  • Balance-sheet repair. Equity of RMB4.21 billion, a current ratio of 5.3x at end-FY2025, and HK$2.09 billion raised in 2025.
  • Blue-chip validation. NVIDIA 800 VDC partner, Google design-ins, ST joint development agreement, onsemi MoU, and a joint lab with UAES.

Weaknesses

  • Persistent net losses. RMB840.5 million in FY2025 and RMB309 million in 1H2026. Cumulative losses for FY2021–FY2025 exceed RMB8.5 billion.
  • Low gross margin against peers. 7.3% versus 39.2% at Infineon and 54.5% at Power Integrations.
  • Domestic concentration. 90.4% of FY2025 revenue is from mainland China.
  • Customer concentration history. CATL alone was 32.1% of FY2023 revenue.
  • Working-capital intensity. FY2025 operating cash flow of −RMB806 million despite a RMB188 million year-on-year EBITDA improvement; inventories up 60.8% in 1H2025.
  • Low asset turnover. 0.19x in FY2025, showing under-used fixed assets.

Opportunities

  • 800 VDC AI power. CLSA sizes GaN in AI servers at about US$10 billion. Innoscience is the only Chinese partner in NVIDIA's ecosystem.
  • Automotive growth. Automotive-grade revenue doubled to RMB57.9 million in FY2025, with about 20 million LiDAR chips shipped and 6.6kW OBCs in vehicles.
  • Appliances and industrial. White-goods revenue +924% and low-voltage motor drives +685% in 1H2026.
  • Capacity leverage. The plan to reach 70,000 wafers per month, with capex per unit falling because expansion is MOCVD-bottleneck-driven.
  • Western IDM supply. The onsemi MoU (wafer procurement) and ST reciprocal-capacity agreement could make Innoscience a merchant GaN wafer supplier to Western IDMs.
  • Humanoid robotics. First mass shipments in 2025; robot chip shipments +50% in 1H2026.

Threats

  • Infineon litigation. Four rulings for Infineon (Munich in 2025 and June 2026, plus the ITC in May 2026), with further US and German proceedings pending.
  • 300mm GaN from Infineon. Could erode Innoscience's 8-inch cost lead.
  • US–China technology policy. The prospectus flags US sanctions and export-control exposure. Hyperscaler supply depends on "compliant" supply arrangements.
  • Silicon carbide competition in high-voltage applications (above 650V), where SiC is entrenched in EV traction.
  • Domestic price competition from other Chinese GaN-on-Si producers in consumer chargers.
  • Share-price volatility and dilution. Shares fell from about HK$98.7 (September 2025) to HK$32.58 (October 2026). Short interest is about 4.1% of H shares, and two placings in 2025 increased the share count.

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Key Developments

DateEventSignificance
28 July 2025First placing completes: 13.58 million H shares, HK$545 million netFirst equity raise after the IPO; order book reported several times covered
31 July / 1 August 2025Named NVIDIA 800 VDC partner; shares rise more than 60% intradayRe-rates the stock as an AI-infrastructure play. The company said at the time the work was still at testing stage with no material orders yet.
Late July / August 2025Munich District Court first-instance ruling for Infineon: Innoscience barred from making, selling or marketing the infringing products in Germany and ordered to pay damagesFirst adverse court ruling in Europe
28 August 20251H2025 results: revenue RMB553.4 million (+43.4%), gross margin +6.8% (from −21.6%), net loss RMB428.7 million (−12.2%)First positive gross margin
1–3 September 2025Shares reach a record near HK$98.7, and market value approaches HK$90 billionPeak valuation to date
12 September 20252025 interim report publishedAI/data-centre sales +180%; automotive-grade deliveries +128%
October 2025NVIDIA updates its 800 VDC supplier list at the OCP Summit; Innoscience the only Chinese power-semiconductor companyConfirms ecosystem position
14 October 2025800 VDC all-GaN white paperTechnical marketing to hyperscalers
20 October 2025Second placing: 20.7 million H shares, HK$1.55 billion netFunds capacity and deleveraging
21 October 2025CLSA raises target to HK$113.6 and estimates a US$10 billion GaN TAM in AI serversSell-side support
November 2025ST launches VIPerGaN50W using Innoscience 700V wafersFirst visible product from the ST alliance
2 December 2025onsemi MoU on 40–200V GaNSecond Western IDM alliance
December 2025ITC administrative law judge's initial determination: violation of one Infineon patent; both asserted patents held validRaises US import risk
December 2025IPO lock-up expiresRemoves overhang (CLSA, January 2026)
End-2025Cumulative shipments reach 2 billion unitsScale milestone
3 February 2026Google AI hardware design-ins and supply agreement; shares open up more than 11%Second US hyperscaler-tier validation
20 February 2026US Customs and Border Protection rules redesigned products fall outside the EPC exclusion orderRestores unrestricted US import of current products
27 March 2026FY2025 results: revenue RMB1,213.3 million (+46.4%), gross margin 7.3%, adjusted EBITDA +RMB52 million, net loss RMB840.5 million (−19.6%)First full year with positive gross margin and adjusted EBITDA
March–April 2026Coverage: Soochow Securities (Buy), Huachuang Securities (Buy), Caitong Securities (Accumulate)Broader domestic sell-side coverage
7–8 May 2026ITC final determination in the Infineon case: one patent infringed and import/sales restrictions on infringing chips, subject to 60-day presidential review. Innoscience says current redesigned products fall outside the '481 patent, no violation on the '755 patent, and four further '481 claims invalidated.Mixed. Restrictions mainly cover legacy designs.
27 May 2026Suzhou Intermediate People's Court finds specified Infineon GaN products infringe an Innoscience patentFirst offensive win against Infineon in China
18 June 2026Munich I Regional Court rules for Infineon in two further cases (one patent, one utility model), with a German injunction and damagesThird and fourth adverse rulings; Germany market access constrained
7 July 2026Soochow Securities International starts coverage at Buy, target HK$96.90; forecasts revenue of RMB2.2, 3.5 and 7.0 billion for FY2026–FY2028Bullish growth outlook
8 July 2026Share-award trustee begins a new round of H-share purchasesSupports the stock
Late August 20261H2026 results: revenue RMB834 million (+50.6%), gross margin 11.6%, net loss RMB309 million, operating cash flow +RMB169 millionThird straight half-year of margin gains; first positive operating cash flow
2 September 2026CMB International keeps Accumulate but cuts its target to HK$74.20Estimate trimming
4 September 2026EGM notice for board renewal, Articles amendments and new guarantees to subsidiariesGovernance cycle
7 September 2026CLSA trims target to HK$112 and keeps Outperform; cuts FY2027–FY2028 forecasts by 6%Slower medium-term ramp expected
7–9 September 2026Goldman Sachs meets management in Suzhou and keeps Buy, target HK$114 (stock at HK$43.20); 70,000 wafers-per-month aspiration disclosedCapacity ambition made public
23 September 2026Second board elected; Dr. Luo re-elected chair; Wu Lei addedGovernance continuity
28 September 2026Shares fall about 5.9% to HK$37.10Continued de-rating
16 October 2026Trustee has bought 2.25 million H shares since 8 July (HK$101.3 million in total); cumulative 4.82 millionEmployee incentive funded by on-market purchases
16 October 2026Shares close at HK$32.58, down about 58% year to dateValuation back near the IPO price

Financial Performance

Explore key financial metrics, segmented revenue, balance sheet health, and performance trends.

Revenue

2 charts
Revenue by Region: Total was CNY 1,213.3 Mn in FY2025.
Innoscience — Revenue by Region
Series (CNY Mn)FY2025
Total1,213.3
Mainland China1,096.4
Overseas116.8
Mainland China90.4
Overseas9.6
Overseas revenue63.6

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Sources

  1. InnoScience FY2025 annual results announcement (HKEX, 27 March 2026), via Gelonghui, Tiger Brokers / Bulletin Express, Reuters / PUBT and Quartr summaries
  2. InnoScience 2025 interim results and interim report (HKEX, 28 August and 12 September 2025), via Zhitong Finance, China Securities Journal / Eastmoney and Sinolink Securities research
  3. InnoScience 2026 interim results (August 2026), via Cailian Press (cls.cn) and 10jqka / Caiwen
  4. InnoScience HKEX prospectus (December 2024), via 36Kr, PEdaily, Stockstar, Guandian, AllBright Law and Lixinger director biographies
  5. InnoScience EGM notice (4 September 2026) and board-renewal announcement (23 September 2026), via Caiwen and 10jqka
  6. InnoScience share-award scheme announcement (16 October 2026), via Caiwen
  7. Stockanalysis.com: HKG:2577 income statement, balance sheet and cash-flow statement (FY2021–FY2025)
  8. MarketScreener: 2577 quote and ISIN; Futu: FY2025 revenue by product and region; Lixinger: October 2026 price and short-selling data
  9. STMicroelectronics Form 6-K (31 March 2025) on the GaN joint development agreement; Yicai and ElectronicSpecifier coverage
  10. onsemi press release and investor-relations PDF (2 December 2025) on the Innoscience MoU
  11. TrendForce (9 February 2026; 9 May 2026); SCMP / Yole Group (4 February 2026) on the Google design-ins
  12. Power Electronics News; Tiger Brokers / Stock News (14 October 2025) on NVIDIA 800 VDC
  13. Finnegan press release on the US Customs ruling (February 2026); ACN Newswire Innoscience release on the ITC final determination (8 November 2024); ip fray and AllPCB on the USPTO '294 invalidation
  14. Infineon press releases (Munich rulings, July/August 2025 and 18 June 2026); Semiconductor Today; Compound Semiconductor; Evertiq; ElectronicSpecifier, "Infineon vs. Innoscience: the GaN patent war"; eeNews Europe (KnowMade patent data)
  15. Infineon Annual Report FY2025 and FY2025 results release (12 November 2025)
  16. Navitas Semiconductor Q4 and FY2025 results (8-K, 24 February 2026)
  17. Power Integrations Q4 and FY2025 results (8-K, 5 February 2026)
  18. Sell-side coverage via Gelonghui, 10jqka and Tiger Brokers: Goldman Sachs, CLSA, CMB International, Soochow Securities International, Huachuang Securities
  19. Sidley Austin and AllBright Law deal announcements (2025 placings); CITIC Securities placing release
  20. Wikipedia, "Innoscience" (market share and international expansion); Digitimes (GaN pricing, 800 VDC)

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