Jiangsu HHCK Overview
HHCK is China's largest maker of epoxy molding compounds (EMC), the thermoset plastic that encapsulates almost every plastic-packaged semiconductor. In October 2025 it bought Hengsuo Huawei, its larger domestic rival and the former Henkel/Hysol EMC operation in Lianyungang, which has been making EMC since 1983. Together they ship more than 25,000 tonnes of semiconductor EMC a year. On management's account, that makes the group the domestic leader and the world's second-largest EMC shipper by volume, behind Sumitomo Bakelite and ahead of Resonac and the other Japanese and Korean suppliers. The portfolio spans commodity grades for discretes (DO, SMX, TO, DIP), high-performance grades for SOT, SOP, QFP and automotive power devices, and advanced-packaging materials: QFN/BGA EMC, granular molding compound, liquid molding compound, flip-chip underfill and HBM-oriented high-thermal-conductivity grades. Its customers are China's top OSATs (JCET, Tongfu, Huatian) and global IDMs (Infineon, onsemi, Nexperia, STMicroelectronics, Texas Instruments). The investment case rests on import substitution in high-end EMC, AI-driven advanced-packaging demand, and automotive/SiC power modules. These are offset by roughly RMB 1 billion of acquisition goodwill and a still-small overseas business.
Name clarification. "Huawei" in Hengsuo Huawei (衡所华威) comes from the historical Lianyungang "Huawei Electronics" EMC business. It is not part of Huawei Technologies. Separately, Huawei's investment arm, Hubble Technology Investment, was a pre-IPO shareholder in HHCK. Its stake was below the top-ten threshold of 0.92% at 31 December 2025.
Company description
In its 2025 annual report, HHCK describes itself as a research-led high-tech enterprise and a national "Specialised and Sophisticated Little Giant" (专精特新"小巨人"). It says it focuses on the R&D, industrialisation and sale of semiconductor packaging materials. Its main products are epoxy molding compounds and electronic adhesives. They are used in semiconductor packaging, structural-component packaging and board-level assembly. The company says its core technology system gives it a product range covering both traditional and advanced packaging.
EMC is made from an epoxy resin base with high-performance phenolic resin as the hardener, a large proportion of silica (fused or spherical silicon micro-powder) as filler, and a package of additives: coupling agents, flame retardants, stress modifiers, ion scavengers, release agents, carbon black and accelerators. It protects the die from moisture, heat, contamination and mechanical shock. It also provides thermal conduction, electrical insulation, voltage withstand and mechanical support. Plastic encapsulation accounts for more than 95% of integrated-circuit packaging worldwide, which makes EMC a high-volume consumable for every back-end assembly line.
Business model
| Dimension | Model |
|---|---|
| Revenue model | Almost entirely product sales of formulated materials, priced per kilogram or tonne by grade. No meaningful service, subscription or licensing revenue |
| R&D | Grade formulation and process development tailored to package type and customer qualification requirements, followed by customer-specific qualification runs |
| Procurement | Monthly and weekly material-requirement planning. Qualified suppliers chosen by price comparison for epoxy resins, phenolic resins, silica fillers and additives |
| Production | Mainly make-to-order, supplemented by demand forecasting. Batch compounding, kneading/extrusion, crushing, tableting or granulation, and cold-chain storage |
| Sales | Mainly direct sales to packaging houses and IDMs, with traders as a secondary channel. Key domestic regions are East, Southwest and South China. Hengsuo Huawei runs an overseas sales department and uses distributors for some foreign customers |
| Qualification moat | New grades usually need 6–24 months of reliability qualification (MSL, TCT, HAST, HTRB, AEC-Q for automotive) at each customer. Once a grade is designed into a package, it is rarely switched |
Revenue model: Model: Almost entirely product sales of formulated materials, priced per kilogram or tonne by grade. No meaningful service, subscription or licensing revenue
R&D: Model: Grade formulation and process development tailored to package type and customer qualification requirements, followed by customer-specific qualification runs
Procurement: Model: Monthly and weekly material-requirement planning. Qualified suppliers chosen by price comparison for epoxy resins, phenolic resins, silica fillers and additives
Production: Model: Mainly make-to-order, supplemented by demand forecasting. Batch compounding, kneading/extrusion, crushing, tableting or granulation, and cold-chain storage
Sales: Model: Mainly direct sales to packaging houses and IDMs, with traders as a secondary channel. Key domestic regions are East, Southwest and South China. Hengsuo Huawei runs an overseas sales department and uses distributors for some foreign customers
Qualification moat: Model: New grades usually need 6–24 months of reliability qualification (MSL, TCT, HAST, HTRB, AEC-Q for automotive) at each customer. Once a grade is designed into a package, it is rarely switched
Value-chain position
Upstream suppliers are makers of specialty epoxy resins (o-cresol novolac, biphenyl, DCPD and multifunctional types), phenolic hardeners, spherical silica and alumina fillers, and additives. Downstream customers are outsourced assembly and test companies (OSATs) and integrated device manufacturers (IDMs). End-markets are consumer electronics, industrial and power electronics, automotive (including SiC/IGBT power modules), photovoltaic and new-energy equipment, communications and data-centre/AI hardware, and memory.
Customer types and end-markets
| Customer type | Named customers |
|---|---|
| Chinese OSATs | JCET (长电科技), Tongfu Microelectronics (通富微电), Huatian Technology (华天科技) |
| Chinese discrete and power device makers | Yinhe Microelectronics (银河微电), Yangjie Technology (扬杰科技), Silan Microelectronics (士兰微), Lipuxin |
| Global IDMs (largely through Hengsuo Huawei) | Infineon, onsemi, Nexperia, STMicroelectronics, Texas Instruments |
| Power-module makers | A global top-five power-device maker uses Hengsuo's GR750X1 in 1200 V SiC modules |
Chinese OSATs: Named customers: JCET (长电科技), Tongfu Microelectronics (通富微电), Huatian Technology (华天科技)
Chinese discrete and power device makers: Named customers: Yinhe Microelectronics (银河微电), Yangjie Technology (扬杰科技), Silan Microelectronics (士兰微), Lipuxin
Global IDMs (largely through Hengsuo Huawei): Named customers: Infineon, onsemi, Nexperia, STMicroelectronics, Texas Instruments
Power-module makers: Named customers: A global top-five power-device maker uses Hengsuo's GR750X1 in 1200 V SiC modules
Independent characterisation
Before the merger, HHCK was a fast-growing but sub-scale domestic challenger. About 93–95% of its revenue came from EMC. It was strongest in commodity discrete packages (DO/SMX/bridge, TO, DIP) and was trying to break into QFN/BGA and fan-out packaging. Buying Hengsuo Huawei changed the company's character. It gained a 40-year-old business with the Hysol brand, over 100 qualified grades, accounts with multinational IDMs, a leading domestic position in automotive-grade and capacitor EMC, and small subsidiaries in South Korea and Malaysia. The combined group is now mainly a story about scale and import substitution, with an option on advanced packaging. In the first half of 2026, Hengsuo Huawei generated more than half of consolidated revenue.
Strategy
Stated strategy
The FY2025 annual report frames the group as a "dual engine" of automotive-grade and advanced-packaging materials. The aim is to consolidate domestic leadership and become the world's second-largest EMC shipper. Management grouped 2025 into four tasks:
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completing the Hengsuo Huawei acquisition;
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finishing the IPO projects and bringing three new lines into production;
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upgrading Hengsuo's south and north plants and building the automotive-grade workshop;
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going live on SAP and integrating supply chain, R&D and marketing across both companies.
2026 priorities
The 2026 business plan names four focus areas:
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advanced-packaging materials (QFN, BGA, FOWLP/FOPLP, 2.5D/3D, chiplet);
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memory packaging materials (NAND and HBM-related);
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automotive-grade materials (SiC and IGBT power modules);
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high-reliability adhesives.
It also commits to more production automation and to completing the Hengsuo integration. In the 2026 interim report, management said the company had moved from "integration and investment" to "collaborative R&D, batch supply and order conversion". It described the industry as being in an AI-driven upturn with structurally tight supply.
Initiatives in the last 24 months
| Initiative | Timing | Detail |
|---|---|---|
| Hengsuo Huawei acquisition | Nov 2024 – Oct 2025 | 100% for about RMB 1.6 billion in total; consolidated from 1 Nov 2025 |
| RMB 800 million placement | Dec 2025 | Funds the cash consideration and four capacity and R&D projects |
| Equity incentive plan | 2024–2025 | Employee share awards; FY2025 charge of roughly RMB 25 million |
| Share buyback | Announced 31 Dec 2024 | RMB 46.5 million repurchased in 2025 for incentives or convertible-bond conversion |
| SAP integration | 2,025 | Single ERP across HHCK and Hengsuo |
| HBM high-thermal-conductivity EMC | 2025–2026 | Developed through Hysol EM in Korea |
| GMC batch supply | 2,025 | High-thermal, low-warpage granular compound for compression molding |
| Overseas customer expansion | 2,026 | One of two stated H1 2026 priorities |
| Governance reform | 2025–2026 | Supervisory board abolished; new director and executive pay policy |
Hengsuo Huawei acquisition: Timing: Nov 2024 – Oct 2025; Detail: 100% for about RMB 1.6 billion in total; consolidated from 1 Nov 2025
RMB 800 million placement: Timing: Dec 2025; Detail: Funds the cash consideration and four capacity and R&D projects
Equity incentive plan: Timing: 2024–2025; Detail: Employee share awards; FY2025 charge of roughly RMB 25 million
Share buyback: Timing: Announced 31 Dec 2024; Detail: RMB 46.5 million repurchased in 2025 for incentives or convertible-bond conversion
SAP integration: Timing: 2025; Detail: Single ERP across HHCK and Hengsuo
HBM high-thermal-conductivity EMC: Timing: 2025–2026; Detail: Developed through Hysol EM in Korea
GMC batch supply: Timing: 2025; Detail: High-thermal, low-warpage granular compound for compression molding
Overseas customer expansion: Timing: 2026; Detail: One of two stated H1 2026 priorities
Governance reform: Timing: 2025–2026; Detail: Supervisory board abolished; new director and executive pay policy
Medium-term targets
Management has not published numeric medium-term revenue or margin targets. It has stated a dividend practice of paying out more than 30% of attributable net profit each year.
Products & Services
Epoxy molding compounds: basic grades
| Product family | Packages | Description and specifications | Target customers | Status |
|---|---|---|---|---|
| DO/SMX/bridge EMC | DO-41, SMA/SMB/SMC, rectifier bridges | Low-cost, high-flow grades with good moldability and reliability for diodes and rectifiers. Largest single category in HHCK's prospectus (36.15% of FY2021 EMC revenue) | Discrete and rectifier makers | Mature; volume leader in China |
| TO EMC (including PV modules) | TO-92/220/247/263, PV junction-box diodes | Higher thermal-cycle and voltage-withstand grades; 15.96% of FY2021 EMC revenue | Power discrete and PV component makers | Mature |
| DIP EMC | DIP-8/14/16 | Through-hole IC encapsulation; 8.02% of FY2021 EMC revenue | Legacy IC packaging | Mature, declining |
Foreign suppliers have largely left the DO/SMX/DIP segment, where HHCK, Hengsuo Huawei and Chang Chun lead.
Epoxy molding compounds: high-performance grades
| Product family | Packages | Description and specifications | Target customers | Status |
|---|---|---|---|---|
| SOD/SOT EMC | SOD-123, SOT-23/223 | Thin-package, low-stress, high-adhesion grades; 16.93% of FY2021 EMC revenue | Discrete and small-signal device makers | Volume |
| SOP/QFP EMC | SOP, TSSOP, LQFP/QFP | Green (halogen-free), low-warpage, high-reliability grades. LQFP grades qualified at JCET and Tongfu | OSATs, MCU/analog IC makers | Ramping; Sumitomo Bakelite and Resonac still lead |
| High-voltage EMC | TO, SOP for HV | High CTI and high dielectric-strength grades | Industrial and power devices | Ramping |
| Automotive-grade EMC (Hysol GR series) | Automotive discretes, IPMs, power modules | AEC-Q-capable grades with high Tg, low ionics and high adhesion to copper and silver-plated frames | Automotive Tier-1 device makers | Hengsuo has a dominant domestic share |
| GR750X1 | 1200 V SiC power modules | Glass transition temperature about 200 °C, designed for high-temperature, high-voltage SiC operation | A global top-five power-device maker | In use |
| Capacitor EMC (Hysol) | Tantalum and ceramic capacitors | Moisture- and heat-resistant encapsulants | Passive-component makers | Strong domestic position |
| Optoelectronic EMC | Optocouplers, LED/IR devices | White or transparent and light-blocking grades | Optoelectronic device makers | Volume |
Epoxy molding compounds: advanced-packaging grades
| Product family | Packages | Description and specifications | Status |
|---|---|---|---|
| QFN/DFN EMC | QFN, DFN, matrix arrays | Low-warpage, high-adhesion, low-moisture grades | Qualified at JCET and Tongfu; small-batch production and sales; volumes rising sharply in 2025 |
| BGA EMC | PBGA, FBGA | Low CTE and low warpage for thin substrates | Qualified; small-batch production; rapid 2025 growth |
| GR910 for NAND Flash | Stacked-die memory | Thin-mold, high-flow, low-warpage grade | Batch supply |
| Granular molding compound (GMC) | Fan-out wafer-level and panel-level packaging (FOWLP/FOPLP), compression molding | Granules for compression molding with high thermal conductivity and low warpage | Batch supply of high-thermal, low-warpage GMC achieved in 2025 |
| Liquid molding compound (LMC) | Wafer-level and 2.5D/3D, chiplet | Liquid compression-molding material | Under customer testing |
| High-thermal-conductivity EMC | Power, SiP, HBM | Alumina-modified grades above 3 W/m·K; the Korean subsidiary is developing HBM-oriented grades | Development and early supply |
| SiP and chiplet materials | SiP, 2.5D/3D, chiplet | Molding materials for heterogeneous integration | Development; foreign suppliers still dominate |
Electronic adhesives
| Product | Application | Description | Status |
|---|---|---|---|
| Flip-chip underfill | FC-BGA, FC-CSP | Capillary underfill to relieve solder-bump stress | Continuing breakthroughs in advanced packaging |
| Die-attach adhesives | Lead-frame and substrate die bonding | Conductive and non-conductive die-attach pastes | Volume |
| Chip-level molding and encapsulation adhesives | Chip-on-board, sensor encapsulation | Liquid encapsulants | Volume |
| Board-level assembly adhesives | PCB module assembly, structural bonding | Corner bond, edge bond and structural adhesives | Volume |
| Wind-turbine and new-energy structural materials | Structural-component encapsulation | Thermoset structural compounds | Niche |
Pricing. The company does not publish a price list. EMC is sold per kilogram, and prices rise steeply from commodity DO/SMX grades to advanced-packaging GMC, LMC and underfill. Management said 2026 demand showed "structural tightness with volume and price rising together".
Brands. HHCK uses its own brand. Hengsuo Huawei sells under the Hysol brand, with the KL, GR and MG series covering more than 100 grades.
Financial Narrative
All figures are in RMB millions unless stated otherwise, under PRC Accounting Standards for Business Enterprises. FY2022–FY2025 figures come from the annual reports and the IPO prospectus series. FY2021 revenue was RMB 347 million (IPO prospectus). Hengsuo Huawei is included from 1 November 2025.
Income statement
Revenue CAGR from FY2022 to FY2025 was 14.7%. FY2021 revenue of RMB 347 million was a cyclical peak. Revenue then declined for two years before recovering.
FY2025 operating profit was RMB 20.8 million, down 48.6%. Profit before share-based payment was RMB 49.1 million, up 10.8% from RMB 44.3 million. That points to share-based compensation of roughly RMB 25 million in FY2025. Operating income and EBITDA are not reported as separate lines.
2025 and 2026 quarterly trend
For 9M 2026, revenue was RMB 763.1 million (+173.1%), attributable net profit RMB 78.3 million (+290.5%) and recurring net profit RMB 73.2 million (+290.0%). Basic EPS was RMB 0.55 on the post-bonus share base. H1 2026 gross margin rose to 30.34%. H1 2026 net profit before share-based payment was RMB 46.8 million, up 85.2%.
Balance sheet
Cash and equivalents were RMB 569 million at end-2025 and fell to RMB 196 million by 31 March 2026. That reflects payments for fundraising projects and working-capital build after consolidation. At 31 March 2026, notes and accounts receivable were RMB 420 million and inventory RMB 188 million.
Goodwill from the Hengsuo Huawei acquisition stands at about RMB 993 million, roughly 32% of total assets. The restructuring report had estimated it at RMB 1.081 billion on a pro forma basis.
Interest-bearing debt consists of bank loans plus directed convertible bonds with a face value of RMB 480 million (4,799,900 bonds) issued to the Hengsuo vendors. Interest on these bonds added to finance costs in 2026. The short- and long-term split of borrowings has not been published outside the full annual report. At 30 June 2026, equity attributable to shareholders was RMB 2.264 billion and total assets exceeded RMB 3.0 billion.
Cash flow and capital returns
Operating cash flow was −RMB 23.4 million in Q1 2026 and +RMB 11.1 million for H1 2026, compared with −RMB 2.7 million in H1 2025. Investing cash outflow in H1 2026 was RMB 301.8 million, mostly subsidiaries spending fundraising proceeds on capacity.
In FY2025, dividends plus buybacks totalled RMB 56.0 million, equal to 231% of net profit. Cumulative cash dividends since the 2023 listing reached RMB 64.5 million across four distributions.
Ratios
The annualised H1 2026 total asset turnover was about 0.30x; for the half year alone it was 0.15. Inventory turnover for H1 2026 was 1.72 times.
Commentary
Revenue. Revenue has moved through three phases. FY2021 was a pandemic-era peak of RMB 347 million. FY2022 and FY2023 saw two years of decline as consumer electronics and discrete demand fell and customers destocked. Since FY2024 there has been a recovery: domestic packaging volumes revived, and high-performance EMC gained share from imports. The step-change came from consolidating Hengsuo Huawei from November 2025. Q4 2025 revenue nearly doubled year on year, and 9M 2026 revenue was 2.7 times the prior-year level.
Margins. Gross margin has stayed in a narrow 25–27% band. That reflects a mix still dominated by commodity discrete grades and pass-through of epoxy and phenolic resin costs; in Q3 2024, resin prices rising 1–6% quarter on quarter compressed margin by 0.2 points. The H1 2026 rise to 30.3% is the first clear sign of mix improvement from QFN/BGA, memory and automotive grades.
Profit. Net margin fell from 13.6% in FY2022 to 5.3% in FY2025. Management attributed the FY2025 fall to share-based payment charges, depreciation on new IPO-funded plants, deal advisory fees and higher interest. FY2025 profit of RMB 24.3 million was also well below the roughly RMB 63 million that analysts had expected.
These drags largely reversed in 2026. A full year of Hengsuo Huawei earnings, at a 12–14% net margin in 2025–2026, plus operating leverage on new lines lifted the Q3 2026 net margin to 13.1%.
Balance sheet. The balance sheet more than doubled in FY2025. The acquisition added about RMB 1 billion of goodwill, and the RMB 800 million placement plus the share consideration doubled equity. Leverage remains modest, with liabilities at 31% of assets. However, the balance sheet is now dominated by an intangible whose value depends on Hengsuo's earnings.
Cash conversion. Cash conversion is a weak point. Operating cash flow covered only 7% of net profit in FY2024 and 32% in FY2025. Hengsuo Huawei itself reported negative operating cash flow of RMB 1.2 million in FY2024 against net profit of RMB 45.7 million, because Chinese OSAT customers routinely pay with bank acceptance notes and long credit terms.
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Group Entities
| Entity | Ownership | Location | Role |
|---|---|---|---|
Jiangsu HHCK Advanced Materials Co., Ltd. | Listed parent | Lianyungang ETDZ, Jiangsu | EMC and adhesive production, R&D, sales |
Lianyungang HHCK Electronic Materials Co., Ltd. (连云港华海诚科电子材料) | 100% | Lianyungang | Capacity expansion vehicle for IPO projects; net loss of RMB 2.99 million in FY2025 |
Lianyungang Huahai Kexin New Materials Co., Ltd. (连云港华海科鑫新材料) | Subsidiary | Lianyungang | New-materials platform |
Hengsuo Huawei Electronics Co., Ltd. (衡所华威电子) | 100% | Songtiao Industrial Park, Lianyungang High-tech Zone | EMC manufacturing (Hysol brand), automotive and capacitor EMC |
Shanghai Hengsuo Electronics Co., Ltd. (上海珩所电子) | 100% via Hengsuo Huawei | Shanghai | R&D base and sales office |
Hysol EM Co., Ltd. | 100% via Hengsuo Huawei | South Korea | Overseas sales and development, including high-thermal-conductivity EMC for HBM |
Hysol Huawei Malaysia Sdn. Bhd. | 100% via Hengsuo Huawei | Malaysia | Southeast Asian customer support and sales |
Product Lines
| Product line | Revenue FY2025 (CNY Mn) | Share of revenue (%) |
|---|---|---|
Epoxy molding compound | 428 | 93.4 |
Electronic adhesives and other | 30 | 6.6 |
Total | 458.1 | 100.0 |
Revenue by Segment and Segment Margins & Growth (%)
| Metric | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
Hengsuo Huawei revenue (CNY Mn) | 442.8 | 460.0 | 468.0 | 479.8 |
Hengsuo Huawei net profit (CNY Mn) | 30.0 | 31.3 | 45.7 | 58.2 |
Hengsuo Huawei net margin (%) | 6.8 | 6.8 | 9.8 | 12.1 |
Income Statement and Margin Analysis (%)
| Metric | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
Revenue (CNY Mn) | 303.2 | 282.9 | 331.6 | 458.1 |
Revenue growth (%) | -12.6 | -6.7 | 17.2 | 38.1 |
Gross margin (%) | — | 26.9 | 25.6 | 26.7 |
Total profit / pre-tax income (CNY Mn) | — | 33.8 | 43.8 | 20.1 |
Net profit attributable (CNY Mn) | 41.2 | 31.6 | 40.1 | 24.3 |
Net profit excl. non-recurring items (CNY Mn) | — | 27.4 | 34.1 | 19.7 |
Net margin, attributable (%) | 13.6 | 11.2 | 12.1 | 5.3 |
Basic EPS (MYR Bn) | — | 0.42 | 0.50 | 0.30 |
Diluted EPS (MYR Bn) | — | 0.42 | 0.50 | 0.30 |
Dividend per share, declared for year (MYR Bn) | — | 0.30 | 0.30 | 0.10 |
R&D expense (CNY Mn) | — | 24.6 | 26.4 | 50.1 |
R&D as % of revenue | — | 8.71 | 7.96 | 10.93 |
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View Subscription PlansIncome Statement and Margin Analysis (%) (Quarterly)
| Metric | Q1 2025 | Q2 2025 | Q3 2025 | Q4 2025 | Q1 2026 | Q2 2026 | Q3 2026 |
|---|---|---|---|---|---|---|---|
Revenue (CNY Mn) | 83.9 | 95.2 | 100.2 | 178.8 | 222.9 | 245.9 | 293.9 |
Net profit attributable (CNY Mn) | 7.2 | 6.6 | 6.3 | 4.2 | 13.5 | 26.2 | 38.6 |
Net profit excl. non-recurring items (CNY Mn) | 6.6 | 6.1 | 6.1 | 0.9 | — | — | 36.5 |
Net margin (%) | 8.6 | 6.9 | 6.3 | 2.3 | 6.1 | 10.6 | 13.1 |
Balance Sheet and Margin Analysis (%)
| Metric | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Total assets (CNY Mn) | 1,230.5 | 1,402.6 | 3,158.3 |
Total liabilities (CNY Mn) | 203.1 | 363.3 | 984.4 |
Equity attributable to shareholders (CNY Mn) | 1,027.3 | 1,039.1 | 2,173.7 |
Liabilities-to-assets ratio (%) | 16.51 | 25.90 | 31.17 |
Book value per share (MYR Bn) | 12.73 | 12.89 | 22.27 |
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View Subscription PlansDividends & Capital Returns and Per-Share Data
| Metric | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Operating cash flow (CNY Mn) | 31.6 | 3.0 | 7.7 |
Operating cash flow per share (MYR Bn) | — | — | 0.08 |
Cash dividends declared for year (CNY Mn) | 24.2 | 24.1 | 9.6 |
Share buybacks (CNY Mn) | — | — | 46.5 |
Returns & Leverage Ratios (%) and Financial Ratios (x)
| Ratio | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Weighted ROE (%) | 3.68 | 3.89 | 2.22 |
Weighted ROE excl. non-recurring items (%) | 3.19 | 3.31 | 1.80 |
ROA, net profit / average total assets (%) | — | 3.04 | 1.06 |
ROIC (%) | — | — | 1.48 |
Net operating asset return (%) | 8.4 | 8.8 | 1.2 |
Liabilities / attributable equity (x) | 0.20 | 0.35 | 0.45 |
Selling + admin + finance expenses as % of revenue | — | 13.2 | 17.6 |
Region Overview
| Region | Revenue FY2025 (CNY Mn) | Share (%) |
|---|---|---|
Mainland China | 446.4 | 97.45 |
Overseas | 11.7 | 2.55 |
Valuation Snapshot
| Metric | Value |
|---|---|
Listing | SSE STAR Market 688535, since 4 April 2023 |
IPO price | RMB 35.00 (RMB 23.65 adjusted for the 4.8-for-10 bonus issue) |
Price at 29 Oct 2026 | RMB 67.75 |
Price at 23 Oct 2026 | RMB 75.95 |
Price at 30 Sep 2026 | RMB 97.38 |
52-week high before the bonus issue (21 Jan 2026) | RMB 128.55 (about RMB 86.9 adjusted) |
Return since IPO, bonus-adjusted, excluding dividends | About +186% |
Shares outstanding | About 142 million |
Market capitalisation | About RMB 9.6 billion |
Margin-financing balance (July 2026) | RMB 0.83–1.43 billion |
Valuation Snapshot by Multiple
| Multiple | Value |
|---|---|
P/E on trailing four quarters (net profit about MYR Bn 82.5 million) | About 116x |
P/S on trailing four quarters (revenue about MYR Bn 942 million) | About 10.2x |
P/B (attributable equity about MYR Bn 2.3 billion) | About 4.2x |
Dividends & Capital Returns and Returns & Leverage Ratios (%)
| Metric | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Cash dividends (CNY Mn) | 24.2 | 24.1 | 9.6 |
Payout ratio (%) | 76.5 | 60.2 | 39.5 |
Analyst Conclusions
Guidance
Management does not issue numeric guidance. Its qualitative outlook calls for strong 2026 semiconductor growth driven by AI, with structurally tight supply and rising volumes and prices. 2026 priorities are advanced packaging, memory, automotive grades and high-reliability adhesives, plus overseas expansion. A run-rate of RMB 763 million of revenue in the first nine months implies full-year 2026 revenue above RMB 1 billion if Q4 matches Q3. That would be more than double FY2025.
Bull case
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Earnings inflection is real. Q3 2026 net margin reached 13.1%, against 2.3% in Q4 2025, and gross margin has risen to 30%. Hengsuo now earns at a 12–14% net margin, and the drag from share-based payments is easing.
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Mix upgrade. GMC and GR910 are in batch supply, QFN, BGA and LQFP grades are qualified at JCET and Tongfu, and HBM grades are in development. These point toward the higher-margin advanced-packaging category that Japanese suppliers dominate today.
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Global platform. The Hysol brand, Korean and Malaysian subsidiaries, and multinational IDM accounts give a route to raise the overseas share from 2.55% toward the 8–18% seen at domestic peers.
Bear case
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Goodwill and no earn-out. About RMB 993 million of goodwill, around 32% of assets, sits on the balance sheet without vendor protection. A downturn at Hengsuo would hit equity directly.
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Valuation. At about 116 times trailing earnings and 10 times sales, the shares price in successful advanced-packaging penetration that has not yet shown up in reported product splits.
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Cash conversion and selling. Profits have not turned into cash, with negative operating cash flow in Q1 2026. Founders, Huatian and other insiders have been selling into strength.
Catalysts and things to watch (next 12 months)
| Catalyst | Expected timing |
|---|---|
| FY2026 preliminary results and full-year revenue above RMB 1 billion | Feb–Mar 2027 |
| FY2026 annual report: product split, overseas revenue and goodwill impairment test | Mar–Apr 2027 |
| Volume orders for BGA, FOWLP or LMC at a top OSAT | Rolling |
| Qualification of HBM high-thermal EMC | Rolling |
| Start-up of the automotive-grade and advanced-packaging smart lines | 2,027 |
| Completion of Huatian's exit and further insider sales | Ongoing |
| Gross margin holding at 30% or above | Quarterly |
| Operating cash flow turning sustainably positive | Quarterly |
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FY2026 preliminary results and full-year revenue above RMB 1 billion — Expected timing: Feb–Mar 2027
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FY2026 annual report: product split, overseas revenue and goodwill impairment test — Expected timing: Mar–Apr 2027
Volume orders for BGA, FOWLP or LMC at a top OSAT: Expected timing: Rolling
Qualification of HBM high-thermal EMC: Expected timing: Rolling
- Start-up of the automotive-grade and advanced-packaging smart lines — Expected timing: 2027
Completion of Huatian's exit and further insider sales: Expected timing: Ongoing
Gross margin holding at 30% or above: Expected timing: Quarterly
Operating cash flow turning sustainably positive: Expected timing: Quarterly
Analyst verdict
HHCK has transformed itself in eighteen months. A sub-scale domestic EMC challenger earning RMB 40 million a year has become, through the RMB 1.6 billion purchase of Hengsuo Huawei, a consolidated national champion. It ships more than 25,000 tonnes a year, owns the Hysol brand and serves both China's leading OSATs and global power-semiconductor IDMs.
The 2026 numbers show the strategic logic working. Nine-month revenue nearly tripled to RMB 763 million, net profit rose nearly fourfold to RMB 78 million, and gross margin improved to the low 30s as automotive, memory and early advanced-packaging grades fed into the mix. A business that historically traded commodity discrete compounds at mid-20s gross margins is starting to look more like a specialty-materials franchise.
The open question is quality. Goodwill accounts for nearly a third of assets, and the vendors gave no earn-out. Cash conversion has lagged reported profit for three years. The highest-value categories (BGA, SiP, fan-out, liquid molding and HBM encapsulants) remain at small-batch or testing stage, where Sumitomo Bakelite, Resonac and Shin-Etsu still dominate. Insider and strategic shareholders, including the founding OSAT investor Huatian, have chosen this period to sell.
At about 116 times trailing earnings, the market is paying in advance for a successful high-end transition. A justified rating requires three things to happen together:
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sustained net margins in the low-to-mid teens on a revenue base above RMB 1 billion;
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disclosed, rising revenue from advanced packaging and overseas sales;
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operating cash flow that finally tracks net income.
If FY2026 results confirm all three, HHCK has a credible claim to be China's long-term answer to the Japanese EMC incumbents and a structural winner from AI and EV packaging demand. If margins stall or Hengsuo's earnings falter, the goodwill and the multiple leave little margin for error. On balance, HHCK is a strategically well-placed but fully valued leader in domestic substitution. Its execution on advanced packaging over the next four quarters will decide whether the 2025 acquisition premium was justified.
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View Subscription PlansExecutive Leadership
Board of Directors
| Name | Role | Committees | Notes |
|---|---|---|---|
Han Jianglong (韩江龙) | Chairman, General Manager, legal representative | Strategy (convener), Nomination | Co-founder. Largest individual shareholder (11.72%) and a member of the controlling concert group. Re-elected chairman on 20 June 2025 |
Cheng Xingming (成兴明) | Director, Deputy General Manager | Strategy | Co-founder and member of the concert group (3.38%) |
Tao Jun (陶军) | Director | Strategy | Member of the concert group (3.62%) and executive partner of Deyufeng |
Zhao Jiankun (赵建坤) | Independent director | Nomination (convener), Audit | — |
Yang Lin (杨林) | Independent director | Audit (convener), Nomination | — |
Yang Qianqian (杨倩倩) | Director | Audit | — |
Executive Leadership Team
| Name | Title | Remuneration FY2023 (CNY K) |
|---|---|---|
Han Jianglong | Chairman and General Manager | 672.0 |
Cheng Xingming | Director and Deputy General Manager | 672.0 |
Yan Jingyi (颜景义) | Deputy General Manager | 330.0 |
Dong Dongfeng (董东峰) | CFO and Board Secretary; with the company for about ten years | 214.5 |
Major Shareholders
| Rank | Shareholder | Shares | Stake (%) |
|---|---|---|---|
| 1 | Han Jianglong | 11,253,799 | 11.72 |
| 2 | Lianyungang Deyufeng Investment LP | 10,308,091 | 10.74 |
| 3 | Yang Senmao (杨森茂) | 3,993,807 | 4.16 |
| 4 | Tao Jun | 3,471,500 | 3.62 |
| 5 | Cheng Xingming | 3,243,515 | 3.38 |
| 6 | Tianshui Huatian Technology Co., Ltd. | 2,615,623 | 2.72 |
| 7 | Shaoxing Shuhui Trading Co., Ltd. (Hengsuo vendor) | 2,577,748 | 2.68 |
| 8 | Shanghai Hengsuo Semiconductor Materials Co., Ltd. (Hengsuo vendor) | 2,078,892 | 2.17 |
| 9 | China Huaren Life Insurance dividend product (中汇人寿) | 1,082,120 | 1.13 |
| 10 | Qian Fangfang (钱方方) | 885,455 | 0.92 |
Competitive Landscape
Key Competitors
| Competitor | Country | Segment overlap | Positioning relative to HHCK |
|---|---|---|---|
Sumitomo Bakelite | Japan | All EMC tiers; global leader | Leader in advanced EMC; benchmark for QFN, BGA and automotive |
Resonac (formerly Hitachi Chemical) | Japan | High-end EMC, underfill, die-attach film | Strong in memory and advanced packaging |
Shin-Etsu Chemical | Japan | EMC, LMC, silicone encapsulants | Strong in compression-molding materials |
Kyocera | Japan | EMC | Mid- to high-end discrete and power |
Panasonic Industry | Japan | EMC, underfill | High-end and automotive |
Nagase ChemteX | Japan | LMC for wafer-level packaging | Leader in liquid molding |
KCC | South Korea | EMC | Korean memory and OSAT supply |
Samsung SDI | South Korea | EMC | Captive and Korean memory |
Chang Chun Plastics (长春塑封料) | Taiwan / China | Basic and high-performance EMC | Domestic peer in discretes |
Eternal Materials / Changxing Electronics (长兴电子) | Taiwan / China | EMC | Domestic peer |
Zhongke Kehua / Beijing Kehua (中科科化) | China | Basic and high-performance EMC | Pursuing an IPO; overseas sales of RMB 3.9 million in 2025 |
Darbond Technology (德邦科技) | China | Electronic adhesives and underfill | Peer in adhesives; failed bidder for Hengsuo |
Feikai Materials (飞凯材料) | China | Packaging materials | Diversified peer |
Kangqiang Electronics (康强电子) | China | Lead frames and bonding wire | Packaging-materials peer with an export base |
NAMICS | Japan | Underfill | Underfill leader |
Market Share by Competitor
| Company | Revenue FY2025 (CNY Mn) | Overseas revenue FY2025 (CNY Mn) | Overseas share (%) |
|---|---|---|---|
HHCK (Hengsuo for two months) | 458.1 | 11.7 | 2.55 |
Kangqiang Electronics | 2,200 | 407.0 | 18.50 |
Feikai Materials | 3,226 | 252.6 | 7.83 |
Darbond Technology | 1,549 | 29.9 | 1.93 |



