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Jiangsu HHCK

Company Profile Analysis

Ticker: 688535.SS江苏华海诚科新材料股份有限公司

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Year Founded & Workforce

2010

490 Employees

Industry

Semiconductor
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Jiangsu HHCK Overview

HHCK is China's largest maker of epoxy molding compounds (EMC), the thermoset plastic that encapsulates almost every plastic-packaged semiconductor. In October 2025 it bought Hengsuo Huawei, its larger domestic rival and the former Henkel/Hysol EMC operation in Lianyungang, which has been making EMC since 1983. Together they ship more than 25,000 tonnes of semiconductor EMC a year. On management's account, that makes the group the domestic leader and the world's second-largest EMC shipper by volume, behind Sumitomo Bakelite and ahead of Resonac and the other Japanese and Korean suppliers. The portfolio spans commodity grades for discretes (DO, SMX, TO, DIP), high-performance grades for SOT, SOP, QFP and automotive power devices, and advanced-packaging materials: QFN/BGA EMC, granular molding compound, liquid molding compound, flip-chip underfill and HBM-oriented high-thermal-conductivity grades. Its customers are China's top OSATs (JCET, Tongfu, Huatian) and global IDMs (Infineon, onsemi, Nexperia, STMicroelectronics, Texas Instruments). The investment case rests on import substitution in high-end EMC, AI-driven advanced-packaging demand, and automotive/SiC power modules. These are offset by roughly RMB 1 billion of acquisition goodwill and a still-small overseas business.

Name clarification. "Huawei" in Hengsuo Huawei (衡所华威) comes from the historical Lianyungang "Huawei Electronics" EMC business. It is not part of Huawei Technologies. Separately, Huawei's investment arm, Hubble Technology Investment, was a pre-IPO shareholder in HHCK. Its stake was below the top-ten threshold of 0.92% at 31 December 2025.

Company description

In its 2025 annual report, HHCK describes itself as a research-led high-tech enterprise and a national "Specialised and Sophisticated Little Giant" (专精特新"小巨人"). It says it focuses on the R&D, industrialisation and sale of semiconductor packaging materials. Its main products are epoxy molding compounds and electronic adhesives. They are used in semiconductor packaging, structural-component packaging and board-level assembly. The company says its core technology system gives it a product range covering both traditional and advanced packaging.

EMC is made from an epoxy resin base with high-performance phenolic resin as the hardener, a large proportion of silica (fused or spherical silicon micro-powder) as filler, and a package of additives: coupling agents, flame retardants, stress modifiers, ion scavengers, release agents, carbon black and accelerators. It protects the die from moisture, heat, contamination and mechanical shock. It also provides thermal conduction, electrical insulation, voltage withstand and mechanical support. Plastic encapsulation accounts for more than 95% of integrated-circuit packaging worldwide, which makes EMC a high-volume consumable for every back-end assembly line.

Business model

DimensionModel
Revenue modelAlmost entirely product sales of formulated materials, priced per kilogram or tonne by grade. No meaningful service, subscription or licensing revenue
R&DGrade formulation and process development tailored to package type and customer qualification requirements, followed by customer-specific qualification runs
ProcurementMonthly and weekly material-requirement planning. Qualified suppliers chosen by price comparison for epoxy resins, phenolic resins, silica fillers and additives
ProductionMainly make-to-order, supplemented by demand forecasting. Batch compounding, kneading/extrusion, crushing, tableting or granulation, and cold-chain storage
SalesMainly direct sales to packaging houses and IDMs, with traders as a secondary channel. Key domestic regions are East, Southwest and South China. Hengsuo Huawei runs an overseas sales department and uses distributors for some foreign customers
Qualification moatNew grades usually need 6–24 months of reliability qualification (MSL, TCT, HAST, HTRB, AEC-Q for automotive) at each customer. Once a grade is designed into a package, it is rarely switched

Revenue model: Model: Almost entirely product sales of formulated materials, priced per kilogram or tonne by grade. No meaningful service, subscription or licensing revenue

R&D: Model: Grade formulation and process development tailored to package type and customer qualification requirements, followed by customer-specific qualification runs

Procurement: Model: Monthly and weekly material-requirement planning. Qualified suppliers chosen by price comparison for epoxy resins, phenolic resins, silica fillers and additives

Production: Model: Mainly make-to-order, supplemented by demand forecasting. Batch compounding, kneading/extrusion, crushing, tableting or granulation, and cold-chain storage

Sales: Model: Mainly direct sales to packaging houses and IDMs, with traders as a secondary channel. Key domestic regions are East, Southwest and South China. Hengsuo Huawei runs an overseas sales department and uses distributors for some foreign customers

Qualification moat: Model: New grades usually need 6–24 months of reliability qualification (MSL, TCT, HAST, HTRB, AEC-Q for automotive) at each customer. Once a grade is designed into a package, it is rarely switched

Value-chain position

Upstream suppliers are makers of specialty epoxy resins (o-cresol novolac, biphenyl, DCPD and multifunctional types), phenolic hardeners, spherical silica and alumina fillers, and additives. Downstream customers are outsourced assembly and test companies (OSATs) and integrated device manufacturers (IDMs). End-markets are consumer electronics, industrial and power electronics, automotive (including SiC/IGBT power modules), photovoltaic and new-energy equipment, communications and data-centre/AI hardware, and memory.

Customer types and end-markets

Customer typeNamed customers
Chinese OSATsJCET (长电科技), Tongfu Microelectronics (通富微电), Huatian Technology (华天科技)
Chinese discrete and power device makersYinhe Microelectronics (银河微电), Yangjie Technology (扬杰科技), Silan Microelectronics (士兰微), Lipuxin
Global IDMs (largely through Hengsuo Huawei)Infineon, onsemi, Nexperia, STMicroelectronics, Texas Instruments
Power-module makersA global top-five power-device maker uses Hengsuo's GR750X1 in 1200 V SiC modules

Chinese OSATs: Named customers: JCET (长电科技), Tongfu Microelectronics (通富微电), Huatian Technology (华天科技)

Chinese discrete and power device makers: Named customers: Yinhe Microelectronics (银河微电), Yangjie Technology (扬杰科技), Silan Microelectronics (士兰微), Lipuxin

Global IDMs (largely through Hengsuo Huawei): Named customers: Infineon, onsemi, Nexperia, STMicroelectronics, Texas Instruments

Power-module makers: Named customers: A global top-five power-device maker uses Hengsuo's GR750X1 in 1200 V SiC modules

Independent characterisation

Before the merger, HHCK was a fast-growing but sub-scale domestic challenger. About 93–95% of its revenue came from EMC. It was strongest in commodity discrete packages (DO/SMX/bridge, TO, DIP) and was trying to break into QFN/BGA and fan-out packaging. Buying Hengsuo Huawei changed the company's character. It gained a 40-year-old business with the Hysol brand, over 100 qualified grades, accounts with multinational IDMs, a leading domestic position in automotive-grade and capacitor EMC, and small subsidiaries in South Korea and Malaysia. The combined group is now mainly a story about scale and import substitution, with an option on advanced packaging. In the first half of 2026, Hengsuo Huawei generated more than half of consolidated revenue.

Strategy

Stated strategy

The FY2025 annual report frames the group as a "dual engine" of automotive-grade and advanced-packaging materials. The aim is to consolidate domestic leadership and become the world's second-largest EMC shipper. Management grouped 2025 into four tasks:

  • completing the Hengsuo Huawei acquisition;

  • finishing the IPO projects and bringing three new lines into production;

  • upgrading Hengsuo's south and north plants and building the automotive-grade workshop;

  • going live on SAP and integrating supply chain, R&D and marketing across both companies.

2026 priorities

The 2026 business plan names four focus areas:

  • advanced-packaging materials (QFN, BGA, FOWLP/FOPLP, 2.5D/3D, chiplet);

  • memory packaging materials (NAND and HBM-related);

  • automotive-grade materials (SiC and IGBT power modules);

  • high-reliability adhesives.

It also commits to more production automation and to completing the Hengsuo integration. In the 2026 interim report, management said the company had moved from "integration and investment" to "collaborative R&D, batch supply and order conversion". It described the industry as being in an AI-driven upturn with structurally tight supply.

Initiatives in the last 24 months

InitiativeTimingDetail
Hengsuo Huawei acquisitionNov 2024 – Oct 2025100% for about RMB 1.6 billion in total; consolidated from 1 Nov 2025
RMB 800 million placementDec 2025Funds the cash consideration and four capacity and R&D projects
Equity incentive plan2024–2025Employee share awards; FY2025 charge of roughly RMB 25 million
Share buybackAnnounced 31 Dec 2024RMB 46.5 million repurchased in 2025 for incentives or convertible-bond conversion
SAP integration2,025Single ERP across HHCK and Hengsuo
HBM high-thermal-conductivity EMC2025–2026Developed through Hysol EM in Korea
GMC batch supply2,025High-thermal, low-warpage granular compound for compression molding
Overseas customer expansion2,026One of two stated H1 2026 priorities
Governance reform2025–2026Supervisory board abolished; new director and executive pay policy

Hengsuo Huawei acquisition: Timing: Nov 2024 – Oct 2025; Detail: 100% for about RMB 1.6 billion in total; consolidated from 1 Nov 2025

RMB 800 million placement: Timing: Dec 2025; Detail: Funds the cash consideration and four capacity and R&D projects

Equity incentive plan: Timing: 2024–2025; Detail: Employee share awards; FY2025 charge of roughly RMB 25 million

Share buyback: Timing: Announced 31 Dec 2024; Detail: RMB 46.5 million repurchased in 2025 for incentives or convertible-bond conversion

SAP integration: Timing: 2025; Detail: Single ERP across HHCK and Hengsuo

HBM high-thermal-conductivity EMC: Timing: 2025–2026; Detail: Developed through Hysol EM in Korea

GMC batch supply: Timing: 2025; Detail: High-thermal, low-warpage granular compound for compression molding

Overseas customer expansion: Timing: 2026; Detail: One of two stated H1 2026 priorities

Governance reform: Timing: 2025–2026; Detail: Supervisory board abolished; new director and executive pay policy

Medium-term targets

Management has not published numeric medium-term revenue or margin targets. It has stated a dividend practice of paying out more than 30% of attributable net profit each year.

Products & Services

Epoxy molding compounds: basic grades

Product familyPackagesDescription and specificationsTarget customersStatus
DO/SMX/bridge EMCDO-41, SMA/SMB/SMC, rectifier bridgesLow-cost, high-flow grades with good moldability and reliability for diodes and rectifiers. Largest single category in HHCK's prospectus (36.15% of FY2021 EMC revenue)Discrete and rectifier makersMature; volume leader in China
TO EMC (including PV modules)TO-92/220/247/263, PV junction-box diodesHigher thermal-cycle and voltage-withstand grades; 15.96% of FY2021 EMC revenuePower discrete and PV component makersMature
DIP EMCDIP-8/14/16Through-hole IC encapsulation; 8.02% of FY2021 EMC revenueLegacy IC packagingMature, declining

Foreign suppliers have largely left the DO/SMX/DIP segment, where HHCK, Hengsuo Huawei and Chang Chun lead.

Epoxy molding compounds: high-performance grades

Product familyPackagesDescription and specificationsTarget customersStatus
SOD/SOT EMCSOD-123, SOT-23/223Thin-package, low-stress, high-adhesion grades; 16.93% of FY2021 EMC revenueDiscrete and small-signal device makersVolume
SOP/QFP EMCSOP, TSSOP, LQFP/QFPGreen (halogen-free), low-warpage, high-reliability grades. LQFP grades qualified at JCET and TongfuOSATs, MCU/analog IC makersRamping; Sumitomo Bakelite and Resonac still lead
High-voltage EMCTO, SOP for HVHigh CTI and high dielectric-strength gradesIndustrial and power devicesRamping
Automotive-grade EMC (Hysol GR series)Automotive discretes, IPMs, power modulesAEC-Q-capable grades with high Tg, low ionics and high adhesion to copper and silver-plated framesAutomotive Tier-1 device makersHengsuo has a dominant domestic share
GR750X11200 V SiC power modulesGlass transition temperature about 200 °C, designed for high-temperature, high-voltage SiC operationA global top-five power-device makerIn use
Capacitor EMC (Hysol)Tantalum and ceramic capacitorsMoisture- and heat-resistant encapsulantsPassive-component makersStrong domestic position
Optoelectronic EMCOptocouplers, LED/IR devicesWhite or transparent and light-blocking gradesOptoelectronic device makersVolume

Epoxy molding compounds: advanced-packaging grades

Product familyPackagesDescription and specificationsStatus
QFN/DFN EMCQFN, DFN, matrix arraysLow-warpage, high-adhesion, low-moisture gradesQualified at JCET and Tongfu; small-batch production and sales; volumes rising sharply in 2025
BGA EMCPBGA, FBGALow CTE and low warpage for thin substratesQualified; small-batch production; rapid 2025 growth
GR910 for NAND FlashStacked-die memoryThin-mold, high-flow, low-warpage gradeBatch supply
Granular molding compound (GMC)Fan-out wafer-level and panel-level packaging (FOWLP/FOPLP), compression moldingGranules for compression molding with high thermal conductivity and low warpageBatch supply of high-thermal, low-warpage GMC achieved in 2025
Liquid molding compound (LMC)Wafer-level and 2.5D/3D, chipletLiquid compression-molding materialUnder customer testing
High-thermal-conductivity EMCPower, SiP, HBMAlumina-modified grades above 3 W/m·K; the Korean subsidiary is developing HBM-oriented gradesDevelopment and early supply
SiP and chiplet materialsSiP, 2.5D/3D, chipletMolding materials for heterogeneous integrationDevelopment; foreign suppliers still dominate

Electronic adhesives

ProductApplicationDescriptionStatus
Flip-chip underfillFC-BGA, FC-CSPCapillary underfill to relieve solder-bump stressContinuing breakthroughs in advanced packaging
Die-attach adhesivesLead-frame and substrate die bondingConductive and non-conductive die-attach pastesVolume
Chip-level molding and encapsulation adhesivesChip-on-board, sensor encapsulationLiquid encapsulantsVolume
Board-level assembly adhesivesPCB module assembly, structural bondingCorner bond, edge bond and structural adhesivesVolume
Wind-turbine and new-energy structural materialsStructural-component encapsulationThermoset structural compoundsNiche

Pricing. The company does not publish a price list. EMC is sold per kilogram, and prices rise steeply from commodity DO/SMX grades to advanced-packaging GMC, LMC and underfill. Management said 2026 demand showed "structural tightness with volume and price rising together".

Brands. HHCK uses its own brand. Hengsuo Huawei sells under the Hysol brand, with the KL, GR and MG series covering more than 100 grades.

Financial Narrative

All figures are in RMB millions unless stated otherwise, under PRC Accounting Standards for Business Enterprises. FY2022–FY2025 figures come from the annual reports and the IPO prospectus series. FY2021 revenue was RMB 347 million (IPO prospectus). Hengsuo Huawei is included from 1 November 2025.

Income statement

Revenue CAGR from FY2022 to FY2025 was 14.7%. FY2021 revenue of RMB 347 million was a cyclical peak. Revenue then declined for two years before recovering.

FY2025 operating profit was RMB 20.8 million, down 48.6%. Profit before share-based payment was RMB 49.1 million, up 10.8% from RMB 44.3 million. That points to share-based compensation of roughly RMB 25 million in FY2025. Operating income and EBITDA are not reported as separate lines.

2025 and 2026 quarterly trend

For 9M 2026, revenue was RMB 763.1 million (+173.1%), attributable net profit RMB 78.3 million (+290.5%) and recurring net profit RMB 73.2 million (+290.0%). Basic EPS was RMB 0.55 on the post-bonus share base. H1 2026 gross margin rose to 30.34%. H1 2026 net profit before share-based payment was RMB 46.8 million, up 85.2%.

Balance sheet

Cash and equivalents were RMB 569 million at end-2025 and fell to RMB 196 million by 31 March 2026. That reflects payments for fundraising projects and working-capital build after consolidation. At 31 March 2026, notes and accounts receivable were RMB 420 million and inventory RMB 188 million.

Goodwill from the Hengsuo Huawei acquisition stands at about RMB 993 million, roughly 32% of total assets. The restructuring report had estimated it at RMB 1.081 billion on a pro forma basis.

Interest-bearing debt consists of bank loans plus directed convertible bonds with a face value of RMB 480 million (4,799,900 bonds) issued to the Hengsuo vendors. Interest on these bonds added to finance costs in 2026. The short- and long-term split of borrowings has not been published outside the full annual report. At 30 June 2026, equity attributable to shareholders was RMB 2.264 billion and total assets exceeded RMB 3.0 billion.

Cash flow and capital returns

Operating cash flow was −RMB 23.4 million in Q1 2026 and +RMB 11.1 million for H1 2026, compared with −RMB 2.7 million in H1 2025. Investing cash outflow in H1 2026 was RMB 301.8 million, mostly subsidiaries spending fundraising proceeds on capacity.

In FY2025, dividends plus buybacks totalled RMB 56.0 million, equal to 231% of net profit. Cumulative cash dividends since the 2023 listing reached RMB 64.5 million across four distributions.

Ratios

The annualised H1 2026 total asset turnover was about 0.30x; for the half year alone it was 0.15. Inventory turnover for H1 2026 was 1.72 times.

Commentary

Revenue. Revenue has moved through three phases. FY2021 was a pandemic-era peak of RMB 347 million. FY2022 and FY2023 saw two years of decline as consumer electronics and discrete demand fell and customers destocked. Since FY2024 there has been a recovery: domestic packaging volumes revived, and high-performance EMC gained share from imports. The step-change came from consolidating Hengsuo Huawei from November 2025. Q4 2025 revenue nearly doubled year on year, and 9M 2026 revenue was 2.7 times the prior-year level.

Margins. Gross margin has stayed in a narrow 25–27% band. That reflects a mix still dominated by commodity discrete grades and pass-through of epoxy and phenolic resin costs; in Q3 2024, resin prices rising 1–6% quarter on quarter compressed margin by 0.2 points. The H1 2026 rise to 30.3% is the first clear sign of mix improvement from QFN/BGA, memory and automotive grades.

Profit. Net margin fell from 13.6% in FY2022 to 5.3% in FY2025. Management attributed the FY2025 fall to share-based payment charges, depreciation on new IPO-funded plants, deal advisory fees and higher interest. FY2025 profit of RMB 24.3 million was also well below the roughly RMB 63 million that analysts had expected.

These drags largely reversed in 2026. A full year of Hengsuo Huawei earnings, at a 12–14% net margin in 2025–2026, plus operating leverage on new lines lifted the Q3 2026 net margin to 13.1%.

Balance sheet. The balance sheet more than doubled in FY2025. The acquisition added about RMB 1 billion of goodwill, and the RMB 800 million placement plus the share consideration doubled equity. Leverage remains modest, with liabilities at 31% of assets. However, the balance sheet is now dominated by an intangible whose value depends on Hengsuo's earnings.

Cash conversion. Cash conversion is a weak point. Operating cash flow covered only 7% of net profit in FY2024 and 32% in FY2025. Hengsuo Huawei itself reported negative operating cash flow of RMB 1.2 million in FY2024 against net profit of RMB 45.7 million, because Chinese OSAT customers routinely pay with bank acceptance notes and long credit terms.

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Financial Detail

Group Entities

EntityOwnershipLocationRole

Jiangsu HHCK Advanced Materials Co., Ltd.

Listed parent

Lianyungang ETDZ, Jiangsu

EMC and adhesive production, R&D, sales

Lianyungang HHCK Electronic Materials Co., Ltd. (连云港华海诚科电子材料)

100%

Lianyungang

Capacity expansion vehicle for IPO projects; net loss of RMB 2.99 million in FY2025

Lianyungang Huahai Kexin New Materials Co., Ltd. (连云港华海科鑫新材料)

Subsidiary

Lianyungang

New-materials platform

Hengsuo Huawei Electronics Co., Ltd. (衡所华威电子)

100%

Songtiao Industrial Park, Lianyungang High-tech Zone

EMC manufacturing (Hysol brand), automotive and capacitor EMC

Shanghai Hengsuo Electronics Co., Ltd. (上海珩所电子)

100% via Hengsuo Huawei

Shanghai

R&D base and sales office

Hysol EM Co., Ltd.

100% via Hengsuo Huawei

South Korea

Overseas sales and development, including high-thermal-conductivity EMC for HBM

Hysol Huawei Malaysia Sdn. Bhd.

100% via Hengsuo Huawei

Malaysia

Southeast Asian customer support and sales

Product Lines

Product lineRevenue FY2025 (CNY Mn)Share of revenue (%)

Epoxy molding compound

42893.4

Electronic adhesives and other

306.6

Total

458.1100.0

Revenue by Segment and Segment Margins & Growth (%)

MetricFY2022FY2023FY2024FY2025

Hengsuo Huawei revenue (CNY Mn)

442.8460.0468.0479.8

Hengsuo Huawei net profit (CNY Mn)

30.031.345.758.2

Hengsuo Huawei net margin (%)

6.86.89.812.1

Income Statement and Margin Analysis (%)

MetricFY2022FY2023FY2024FY2025

Revenue (CNY Mn)

303.2282.9331.6458.1

Revenue growth (%)

-12.6-6.717.238.1

Gross margin (%)

—26.925.626.7

Total profit / pre-tax income (CNY Mn)

—33.843.820.1

Net profit attributable (CNY Mn)

41.231.640.124.3

Net profit excl. non-recurring items (CNY Mn)

—27.434.119.7

Net margin, attributable (%)

13.611.212.15.3

Basic EPS (MYR Bn)

—0.420.500.30

Diluted EPS (MYR Bn)

—0.420.500.30

Dividend per share, declared for year (MYR Bn)

—0.300.300.10

R&D expense (CNY Mn)

—24.626.450.1

R&D as % of revenue

—8.717.9610.93

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Income Statement and Margin Analysis (%) (Quarterly)

MetricQ1 2025Q2 2025Q3 2025Q4 2025Q1 2026Q2 2026Q3 2026

Revenue (CNY Mn)

83.995.2100.2178.8222.9245.9293.9

Net profit attributable (CNY Mn)

7.26.66.34.213.526.238.6

Net profit excl. non-recurring items (CNY Mn)

6.66.16.10.9——36.5

Net margin (%)

8.66.96.32.36.110.613.1

Balance Sheet and Margin Analysis (%)

MetricFY2023FY2024FY2025

Total assets (CNY Mn)

1,230.51,402.63,158.3

Total liabilities (CNY Mn)

203.1363.3984.4

Equity attributable to shareholders (CNY Mn)

1,027.31,039.12,173.7

Liabilities-to-assets ratio (%)

16.5125.9031.17

Book value per share (MYR Bn)

12.7312.8922.27

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Dividends & Capital Returns and Per-Share Data

MetricFY2023FY2024FY2025

Operating cash flow (CNY Mn)

31.63.07.7

Operating cash flow per share (MYR Bn)

——0.08

Cash dividends declared for year (CNY Mn)

24.224.19.6

Share buybacks (CNY Mn)

——46.5

Returns & Leverage Ratios (%) and Financial Ratios (x)

RatioFY2023FY2024FY2025

Weighted ROE (%)

3.683.892.22

Weighted ROE excl. non-recurring items (%)

3.193.311.80

ROA, net profit / average total assets (%)

—3.041.06

ROIC (%)

——1.48

Net operating asset return (%)

8.48.81.2

Liabilities / attributable equity (x)

0.200.350.45

Selling + admin + finance expenses as % of revenue

—13.217.6

Region Overview

RegionRevenue FY2025 (CNY Mn)Share (%)

Mainland China

446.497.45

Overseas

11.72.55

Valuation Snapshot

MetricValue

Listing

SSE STAR Market 688535, since 4 April 2023

IPO price

RMB 35.00 (RMB 23.65 adjusted for the 4.8-for-10 bonus issue)

Price at 29 Oct 2026

RMB 67.75

Price at 23 Oct 2026

RMB 75.95

Price at 30 Sep 2026

RMB 97.38

52-week high before the bonus issue (21 Jan 2026)

RMB 128.55 (about RMB 86.9 adjusted)

Return since IPO, bonus-adjusted, excluding dividends

About +186%

Shares outstanding

About 142 million

Market capitalisation

About RMB 9.6 billion

Margin-financing balance (July 2026)

RMB 0.83–1.43 billion

Valuation Snapshot by Multiple

MultipleValue

P/E on trailing four quarters (net profit about MYR Bn 82.5 million)

About 116x

P/S on trailing four quarters (revenue about MYR Bn 942 million)

About 10.2x

P/B (attributable equity about MYR Bn 2.3 billion)

About 4.2x

Dividends & Capital Returns and Returns & Leverage Ratios (%)

MetricFY2023FY2024FY2025

Cash dividends (CNY Mn)

24.224.19.6

Payout ratio (%)

76.560.239.5

Analyst Conclusions

Guidance

Management does not issue numeric guidance. Its qualitative outlook calls for strong 2026 semiconductor growth driven by AI, with structurally tight supply and rising volumes and prices. 2026 priorities are advanced packaging, memory, automotive grades and high-reliability adhesives, plus overseas expansion. A run-rate of RMB 763 million of revenue in the first nine months implies full-year 2026 revenue above RMB 1 billion if Q4 matches Q3. That would be more than double FY2025.

Bull case

  1. Earnings inflection is real. Q3 2026 net margin reached 13.1%, against 2.3% in Q4 2025, and gross margin has risen to 30%. Hengsuo now earns at a 12–14% net margin, and the drag from share-based payments is easing.

  2. Mix upgrade. GMC and GR910 are in batch supply, QFN, BGA and LQFP grades are qualified at JCET and Tongfu, and HBM grades are in development. These point toward the higher-margin advanced-packaging category that Japanese suppliers dominate today.

  3. Global platform. The Hysol brand, Korean and Malaysian subsidiaries, and multinational IDM accounts give a route to raise the overseas share from 2.55% toward the 8–18% seen at domestic peers.

Bear case

  1. Goodwill and no earn-out. About RMB 993 million of goodwill, around 32% of assets, sits on the balance sheet without vendor protection. A downturn at Hengsuo would hit equity directly.

  2. Valuation. At about 116 times trailing earnings and 10 times sales, the shares price in successful advanced-packaging penetration that has not yet shown up in reported product splits.

  3. Cash conversion and selling. Profits have not turned into cash, with negative operating cash flow in Q1 2026. Founders, Huatian and other insiders have been selling into strength.

Catalysts and things to watch (next 12 months)

CatalystExpected timing
FY2026 preliminary results and full-year revenue above RMB 1 billionFeb–Mar 2027
FY2026 annual report: product split, overseas revenue and goodwill impairment testMar–Apr 2027
Volume orders for BGA, FOWLP or LMC at a top OSATRolling
Qualification of HBM high-thermal EMCRolling
Start-up of the automotive-grade and advanced-packaging smart lines2,027
Completion of Huatian's exit and further insider salesOngoing
Gross margin holding at 30% or aboveQuarterly
Operating cash flow turning sustainably positiveQuarterly
  • FY2026 preliminary results and full-year revenue above RMB 1 billion — Expected timing: Feb–Mar 2027

  • FY2026 annual report: product split, overseas revenue and goodwill impairment test — Expected timing: Mar–Apr 2027

Volume orders for BGA, FOWLP or LMC at a top OSAT: Expected timing: Rolling

Qualification of HBM high-thermal EMC: Expected timing: Rolling

  • Start-up of the automotive-grade and advanced-packaging smart lines — Expected timing: 2027

Completion of Huatian's exit and further insider sales: Expected timing: Ongoing

Gross margin holding at 30% or above: Expected timing: Quarterly

Operating cash flow turning sustainably positive: Expected timing: Quarterly

Analyst verdict

HHCK has transformed itself in eighteen months. A sub-scale domestic EMC challenger earning RMB 40 million a year has become, through the RMB 1.6 billion purchase of Hengsuo Huawei, a consolidated national champion. It ships more than 25,000 tonnes a year, owns the Hysol brand and serves both China's leading OSATs and global power-semiconductor IDMs.

The 2026 numbers show the strategic logic working. Nine-month revenue nearly tripled to RMB 763 million, net profit rose nearly fourfold to RMB 78 million, and gross margin improved to the low 30s as automotive, memory and early advanced-packaging grades fed into the mix. A business that historically traded commodity discrete compounds at mid-20s gross margins is starting to look more like a specialty-materials franchise.

The open question is quality. Goodwill accounts for nearly a third of assets, and the vendors gave no earn-out. Cash conversion has lagged reported profit for three years. The highest-value categories (BGA, SiP, fan-out, liquid molding and HBM encapsulants) remain at small-batch or testing stage, where Sumitomo Bakelite, Resonac and Shin-Etsu still dominate. Insider and strategic shareholders, including the founding OSAT investor Huatian, have chosen this period to sell.

At about 116 times trailing earnings, the market is paying in advance for a successful high-end transition. A justified rating requires three things to happen together:

  • sustained net margins in the low-to-mid teens on a revenue base above RMB 1 billion;

  • disclosed, rising revenue from advanced packaging and overseas sales;

  • operating cash flow that finally tracks net income.

If FY2026 results confirm all three, HHCK has a credible claim to be China's long-term answer to the Japanese EMC incumbents and a structural winner from AI and EV packaging demand. If margins stall or Hengsuo's earnings falter, the goodwill and the multiple leave little margin for error. On balance, HHCK is a strategically well-placed but fully valued leader in domestic substitution. Its execution on advanced packaging over the next four quarters will decide whether the 2025 acquisition premium was justified.

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Executive Leadership

Board of Directors

NameRoleCommitteesNotes

Han Jianglong (韩江龙)

Chairman, General Manager, legal representative

Strategy (convener), Nomination

Co-founder. Largest individual shareholder (11.72%) and a member of the controlling concert group. Re-elected chairman on 20 June 2025

Cheng Xingming (成兴明)

Director, Deputy General Manager

Strategy

Co-founder and member of the concert group (3.38%)

Tao Jun (陶军)

Director

Strategy

Member of the concert group (3.62%) and executive partner of Deyufeng

Zhao Jiankun (赵建坤)

Independent director

Nomination (convener), Audit

—

Yang Lin (杨林)

Independent director

Audit (convener), Nomination

—

Yang Qianqian (杨倩倩)

Director

Audit

—

Executive Leadership Team

NameTitleRemuneration FY2023 (CNY K)

Han Jianglong

Chairman and General Manager

672.0

Cheng Xingming

Director and Deputy General Manager

672.0

Yan Jingyi (颜景义)

Deputy General Manager

330.0

Dong Dongfeng (董东峰)

CFO and Board Secretary; with the company for about ten years

214.5

Major Shareholders

RankShareholderSharesStake (%)
1

Han Jianglong

11,253,79911.72
2

Lianyungang Deyufeng Investment LP

10,308,09110.74
3

Yang Senmao (杨森茂)

3,993,8074.16
4

Tao Jun

3,471,5003.62
5

Cheng Xingming

3,243,5153.38
6

Tianshui Huatian Technology Co., Ltd.

2,615,6232.72
7

Shaoxing Shuhui Trading Co., Ltd. (Hengsuo vendor)

2,577,7482.68
8

Shanghai Hengsuo Semiconductor Materials Co., Ltd. (Hengsuo vendor)

2,078,8922.17
9

China Huaren Life Insurance dividend product (中汇人寿)

1,082,1201.13
10

Qian Fangfang (钱方方)

885,4550.92

Competitive Landscape

Key Competitors

CompetitorCountrySegment overlapPositioning relative to HHCK

Sumitomo Bakelite

Japan

All EMC tiers; global leader

Leader in advanced EMC; benchmark for QFN, BGA and automotive

Resonac (formerly Hitachi Chemical)

Japan

High-end EMC, underfill, die-attach film

Strong in memory and advanced packaging

Shin-Etsu Chemical

Japan

EMC, LMC, silicone encapsulants

Strong in compression-molding materials

Kyocera

Japan

EMC

Mid- to high-end discrete and power

Panasonic Industry

Japan

EMC, underfill

High-end and automotive

Nagase ChemteX

Japan

LMC for wafer-level packaging

Leader in liquid molding

KCC

South Korea

EMC

Korean memory and OSAT supply

Samsung SDI

South Korea

EMC

Captive and Korean memory

Chang Chun Plastics (长春塑封料)

Taiwan / China

Basic and high-performance EMC

Domestic peer in discretes

Eternal Materials / Changxing Electronics (长兴电子)

Taiwan / China

EMC

Domestic peer

Zhongke Kehua / Beijing Kehua (中科科化)

China

Basic and high-performance EMC

Pursuing an IPO; overseas sales of RMB 3.9 million in 2025

Darbond Technology (德邦科技)

China

Electronic adhesives and underfill

Peer in adhesives; failed bidder for Hengsuo

Feikai Materials (飞凯材料)

China

Packaging materials

Diversified peer

Kangqiang Electronics (康强电子)

China

Lead frames and bonding wire

Packaging-materials peer with an export base

NAMICS

Japan

Underfill

Underfill leader

Market Share by Competitor

CompanyRevenue FY2025 (CNY Mn)Overseas revenue FY2025 (CNY Mn)Overseas share (%)

HHCK (Hengsuo for two months)

458.111.72.55

Kangqiang Electronics

2,200407.018.50

Feikai Materials

3,226252.67.83

Darbond Technology

1,54929.91.93

Company Snapshot

$63.7M

Revenue

490

Employees

2010

Founded

Lianyungang, China

Headquarters

SWOT Analysis

Strengths

  • Scale leadership: combined semiconductor EMC sales exceed 25,000 tonnes a year, making the group number 1 in China and, by management's account, number 2 globally.
  • Hengsuo Huawei brings 40 years of EMC history, the Hysol brand and more than 100 grades across the KL, GR and MG series.
  • A blue-chip customer base: JCET, Tongfu, Huatian, Infineon, onsemi, Nexperia, STMicroelectronics and Texas Instruments.
  • Automotive and SiC credentials: GR750X1 (Tg about 200 °C) is used in 1200 V SiC modules at a global top-five power-device maker.
  • Earnings momentum: 9M 2026 net profit of RMB 78.3 million was up 290.5%, and H1 2026 gross margin reached 30.3%.
  • A low-leverage balance sheet, with liabilities at 31.2% of assets at end-2025, and a 30%-plus dividend payout practice.

Weaknesses

  • Goodwill of about RMB 993 million, roughly 32% of total assets, with no earn-out or impairment compensation from the vendors.
  • Weak cash conversion: FY2025 operating cash flow of RMB 7.7 million against net profit of RMB 24.3 million, and Q1 2026 operating cash flow of −RMB 23.4 million.
  • Low returns: FY2025 weighted ROE of 2.22% and ROIC of 1.48%.
  • Product concentration: EMC is 93% of revenue.
  • A thin overseas business: 2.55% of FY2025 revenue.
  • Advanced packaging (BGA, SiP, FOWLP/FOPLP) remains at small-batch stage, while foreign suppliers dominate.

Opportunities

  • AI and HBM demand: high-thermal-conductivity EMC is being developed in Korea, and GMC is in batch supply.
  • Import substitution in SOP, QFP and QFN, where foreign suppliers still hold most of China's demand.
  • SiC and IGBT growth in EVs and renewables.
  • Cross-selling HHCK grades to Hengsuo's multinational IDM customers and Hengsuo's automotive grades to HHCK's OSAT customers.
  • Capacity and automation projects funded by the RMB 800 million placement.
  • Consolidation of fragmented domestic peers, such as Zhongke Kehua and smaller Jiangsu producers.

Threats

  • A goodwill impairment of 6.18% or more could have pushed FY2024 pro forma earnings into a loss.
  • Overhang from shareholder exits: Huatian, Yang Senmao and Deyufeng, plus the 14.24 million share unlock in June 2026.
  • Japanese incumbents (Sumitomo Bakelite, Resonac, Shin-Etsu) defending high-end share with better technology.
  • Raw-material inflation: epoxy and phenolic resin prices rose 1–6% quarter on quarter in Q3 2024.
  • A semiconductor downturn, as in FY2022–FY2023, when revenue fell 12.6% and then 6.7%.
  • Geopolitical trade restrictions affecting exports and specialty input supply.

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Key Developments

DateEventSignificance
27 May 2025Board re-election announced; FY2025 audit fee raised to RMB 1.0 millionPrepares for consolidation
20 Jun 2025Fourth board elected; Han Jianglong re-elected chairmanContinuity of founder control
15 Aug 2025Updated draft restructuring report filed; RMB 1.12 billion for 70% confirmedDeal terms fixed
18 Aug 2025Media scrutiny of the no-earn-out structure and RMB 1.08 billion goodwillGovernance overhang
27 Aug 2025H1 2025: revenue RMB 179.1 million (+15.3%), net profit RMB 13.8 million (−44.7%)Profit pressure before the merger
1 Sep 2025SSE M&A Committee approves the dealKey regulatory gate
11 Sep 2025Shareholder sell-down plan announcedOverhang
19 Sep 2025CSRC registration granted; shares up 3%Final approval
9 Oct 2025Buyback tranche updateCapital return
28–29 Oct 202570% of Hengsuo transferred; 9M 2025 resultsHengsuo becomes wholly owned
1 Nov 2025Hengsuo consolidatedRevenue step-change
12 Nov 20255,699,018 consideration shares issued at RMB 56.15Dilution of 6.6%
19 Nov 2025Industry coverage highlights Huawei-linked investors and HHCK's RMB 1.6 billion consolidationRaises investor profile
2 Dec 2025Buyback tranche updateCapital return
10 Dec 2025RMB 800 million placement completed at RMB 83.17Funds capacity and the cash consideration
23 Dec 2025Placement shares registeredShare count reaches 96.0 million
16 Jan 2026Huatian completes a 1% sell-downFounding shareholder reduces stake
21 Jan 2026Shares hit a 52-week high of RMB 128.55 (before the bonus issue); broker "Buy" coverageAdvanced-packaging enthusiasm
28 Feb 2026FY2025 preliminary resultsProfit miss signalled
17 Mar 2026FY2025 annual report: revenue +38.1%, net profit −39.5%; dividend and 4.8-for-10 bonus proposedLowest profit since listing; well below expectations
7 Apr 2026AGM approves distribution and bonus issueShare count rises to about 142 million
24 Apr 2026Yang Senmao plans to sell up to 1%Overhang
28 Apr 2026Q1 2026: revenue +165.6%, net profit +87.7%; operating cash flow −RMB 23.4 millionFirst full quarter with Hengsuo
15 May 2026Deyufeng sells 4.053 million shares at RMB 88.46; concert group falls to 26.62%Founder-group selling
25 May 2026Huatian plans to sell its entire 2.40% stake; stock falls 12% over 26–29 MayIndustry shareholder exits
23 Jun 202614.24 million placement shares unlockSupply overhang
Jul 2026Margin-financing balance about RMB 0.8–1.4 billionHigh retail and leveraged participation
28 Aug 2026H1 2026: revenue RMB 468.8 million (+161.8%), net profit RMB 39.7 million (+188.1%), gross margin 30.3%Integration benefits visible
30 Sep 2026Shares close at RMB 97.38–
23 Oct 2026Shares close at RMB 75.95Sharp pullback
29 Oct 2026Q3 2026: revenue RMB 293.9 million (+193.4%), net profit RMB 38.6 million (+515.3%); shares close at RMB 67.75Record quarterly profit

Financial Performance

Explore key financial metrics, segmented revenue, balance sheet health, and performance trends.

Revenue

1 chart
Revenue by Segment: Hengsuo Huawei revenue rose from CNY 442.8 Mn in FY2022 to CNY 479.8 Mn in FY2025.
Jiangsu HHCK — Revenue by Segment
Series (CNY Mn)FY2022FY2023FY2024FY2025
Hengsuo Huawei revenue442.8460468479.8
Hengsuo Huawei net profit3031.345.758.2

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