KLA Corp Overview
KLA Corporation is the world's dominant supplier of process control and yield management systems to the semiconductor and electronics manufacturing industries. It is not a generalist wafer fabrication equipment ("WFE") vendor; it occupies a narrow, defensible band of the fab — inspection, metrology, reticle qualification, chemistry process control and the analytics layer that sits on top of them — where it converts rising manufacturing complexity into pricing power and recurring service annuities. That position has produced a financial profile without close peer: 61.3% gross margin, 41.7% operating margin and 35.6% net margin in FY2026, with $3.77 billion of free cash flow on $13.58 billion of revenue. The company sits on the critical path of the AI infrastructure buildout — leading-edge foundry/logic, high-bandwidth memory and advanced packaging all raise process control intensity — and management has committed publicly to a calendar-2030 revenue target of $26 billion. Order backlog rose 60% in a single year, from $7.86 billion to $12.57 billion. The principal offsets are a highly concentrated customer base, a China revenue line that has fallen from 43% to 30% of the total under successive U.S. export-control regimes, and a valuation that has priced in a great deal of that optimism.
The company's own characterisation
In the FY2026 Form 10-K, KLA describes itself as a supplier of "industry-leading equipment and services that enable innovation throughout the electronics industry," providing "advanced process control and process-enabling solutions for manufacturing wafers, reticles/masks, chemicals/materials, integrated circuits, packaged ICs and printed circuit boards, as well as comprehensive support and services across our installed base." Management frames the value proposition as helping customers "achieve their technology advancement and high-volume production goals by improving yields while reducing waste, risks and costs," which in turn "improves our customers' overall profitability and return on investment." The services business is described as providing "maintenance and other services to maximize uptime, productivity and tool life," and accounted for approximately 23% of total revenues in fiscal 2026 (22% in fiscal 2025).
Independent characterisation
KLA sells the fab's quality-assurance layer. A modern logic wafer passes through hundreds of process steps; a leading-edge fabrication facility now costs "well above $10 billion" to construct, per KLA's own 10-K language. In that environment the economic value of finding a defect early — before hundreds of subsequent steps compound the loss — scales superlinearly with process complexity and wafer cost. KLA monetises that asymmetry.
Three structural features distinguish the business model from that of a conventional capital equipment vendor:
First, it is a monopoly-adjacent franchise inside a competitive industry. KLA does not compete across deposition, etch, lithography, implant or clean. It competes in inspection, metrology and process analytics, where management stated at its March 2026 Investor Day that its share of process control had reached approximately 58% and that KLA is roughly 7.5 times the size of its nearest competitor in the category. That concentration is what produces the margin structure.
Second, the served market grows faster than the equipment market. "Process control intensity" — the share of a fab's equipment budget directed to inspection and metrology — rose from 5.3% of the WFE market six years before calendar 2025 to 7.4% in calendar 2025, per KLA's Investor Day disclosure, with a 2030 target of 9%. This gives KLA a structural growth vector independent of WFE unit growth: even a flat equipment market would deliver KLA revenue growth if intensity keeps rising. The drivers cited are EUV adoption in high-volume manufacturing, gate-all-around transistor architectures, larger die sizes for AI accelerators, 3D memory stacking and heterogeneous advanced packaging.
Third, an installed-base annuity now provides roughly a quarter of revenue. Service revenue was $3.126 billion in FY2026 (23.0% of total), up from $2.683 billion in FY2025 (22.1%). Management stated at Investor Day that over 80% of service revenue derives from multi-year contracts and targeted a 13–15% services CAGR to nearly $6 billion by 2030. Because the installed base only grows, service revenue is structurally counter-cyclical relative to systems and materially dampens the amplitude of the semiconductor capex cycle in KLA's P&L.
Revenue model
*Source: Q4 FY2026 earnings release, Condensed Consolidated Unaudited Statements of Operations.
Revenue is recognised predominantly from direct sales of capital systems (multi-million-dollar tools sold to a concentrated set of chipmakers), plus multi-year service contracts, spare parts, upgrades, refurbished ("KLA Pro") systems and software licences. KLA does not disclose a discrete subscription or licensing revenue line; software solutions such as Klarity, 5D Analyzer, I-PAT and PROLITH are embedded within Semiconductor Process Control revenue. Deferred revenue at 30 June 2026 stood at $932.9 million (current deferred system) plus $604.1 million (current deferred service) and $238.1 million (non-current deferred service), reflecting the substantial customer prepayments KLA takes in certain jurisdictions.
Value chain position and customers
KLA sits between the materials/subassembly supply base and the chipmaker. It performs system design, final assembly and test in-house while outsourcing component and major subassembly manufacture — an asset-light approach that explains capital expenditure of only 2.8% of revenue in FY2026 and helps drive return on invested capital above 60%.
Customer types comprise leading-edge foundries and logic IDMs, DRAM and NAND memory manufacturers, wafer/substrate producers, reticle and mask shops, outsourced assembly and test (OSAT) providers, IC substrate and PCB manufacturers, chemical and materials suppliers, and research institutions. Taiwan Semiconductor Manufacturing Company accounted for more than 10% of total revenues in each of fiscal 2024, 2025 and 2026 per the FY2026 10-K customer concentration disclosure. Prior-year filings also identified Samsung Electronics Co., Ltd. in the >10% category; whether Samsung exceeded the threshold in fiscal 2026 could not be confirmed from the extract reviewed and is therefore flagged as unverified.
End markets served, in KLA's own framing: high-performance computing and data centres (AI-driven, and explicitly identified as the dominant growth driver into fiscal 2027), smartphones and consumer electronics, automotive (electrification and in-vehicle intelligence), industrial and power semiconductors, 5G communications, healthcare electronics, and specialty categories including MEMS, RF and photonics.
Strategy
Stated strategy
KLA's strategic articulation centres on what management calls the KLA Operating Model — a framework presented in depth at the March 2026 Investor Day covering "strategies to deliver sustainable outperformance," with separate in-depth reviews of the Systems and Services businesses.
The core themes, in management's own framing from FY2026 disclosures and the Q3 FY2026 shareholder letter:
Process control as the enabling layer of AI infrastructure. Wallace at Q4 FY2026: "KLA remains uniquely positioned on the critical path of AI infrastructure expansion, where the increasing number and sophistication of leading-edge designs across foundry/logic and the rising complexity and performance specifications in memory are driving greater demand for process control." At Investor Day he put it more bluntly: "KLA wins no matter who wins. It doesn't matter which hyperscaler wins. Doesn't happen without process control." This is the central strategic claim — that KLA is agnostic to which end customer prevails in the AI race because process control is a toll on all of them.
Process control intensity expansion. The 10-K frames the industry thesis: chip fabrication "requires new substrate and film materials, new transistor architectures, advanced multi-patterning optical and extreme ultraviolet lithography, and advanced packaging," which "has significantly increased both the performance and cost requirements of the capital equipment," making "accelerating the yield ramp and reaching high-volume production ahead of competitors... critical to manufacturers' revenue and profitability."
Services as a growth and stability engine. Raised from a 12–14% long-term CAGR target to 13–15%, with an explicit target of nearly doubling service revenue to approximately $6 billion by 2030.
The 2030 target model (introduced 12 March 2026)
Underlying assumptions disclosed by management:
Higgins provided the historical calibration on the Q3 FY2026 call: "In the last five years, we gained 160-ish basis points of share, and that translated into about a 6.5% growth rate for KLA above the market baseline... we thought we could gain another 150 basis points plus share of the overall wafer equipment market, and that translated into a 4.5% growth for the company over the market baseline if WFE grew up to 12%."
That is a materially important disclosure for anyone modelling the target: management is guiding to slower incremental outperformance than it delivered historically (4.5 points above market versus 6.5 points achieved), on a larger base. The 2030 model is therefore not an extrapolation of the past five years but a partial deceleration of it — which is more conservative than the headline $26 billion figure implies.
Announced strategic initiatives, last 24 months
Guidance
Q1 FY2027 guidance (quarter ending 30 September 2026), issued 28 July 2026:
The Q1 FY2027 revenue midpoint of $4.0 billion represents 24.7% year-over-year growth against Q1 FY2026 revenue of $3.21 billion, and 9.4% sequential growth. This is an acceleration from the 11.7% full-year FY2026 growth rate and is consistent with Wallace's Q4 FY2026 statement that "we see momentum across our business accelerating in the second half of calendar 2026 and continuing through 2027."
KLA does not provide full-year revenue or EPS guidance; it guides one quarter forward. Medium-term direction is supplied only through the 2030 target model.
Products & Services
The following catalogue is drawn from the product tables in the FY2026 Form 10-K, Item 1, supplemented by product launch announcements. KLA does not publicly disclose list prices, discounting structures, or per-tool average selling prices for any product line; pricing is negotiated per customer and per configuration. Every "pricing model if disclosed" entry below is therefore not publicly disclosed, and this is stated once rather than repeated.
Semiconductor Process Control — Chip Manufacturing: Defect Inspection and Review
These tools identify, locate, characterise, review and analyse defects on patterned and unpatterned wafer surfaces. They are the historical heart of the company and the largest revenue contributor within SPC.
Semiconductor Process Control — Chip Manufacturing: Metrology
Metrology systems measure pattern dimensions, film thickness and stress, layer-to-layer alignment (overlay), pattern placement, surface topography and electro-optical properties.
Semiconductor Process Control — Chemistry Process Control
Acquired substantially through ECI Technology (February 2022, $431.5 million). These systems qualify incoming chemical supplies, manage tool inputs, adjust chamber and bath conditions and monitor process waste — a category with a materially higher consumable/recurring content than capital tools.
Semiconductor Process Control — In-Situ Process Management
Semiconductor Process Control — Wafer/Substrate Manufacturing
Systems sold to silicon and compound-substrate makers rather than to chipmakers. Supported substrate types per the 10-K: silicon, prime silicon-on-insulator, sapphire, glass and wide bandgap materials including silicon carbide and gallium nitride.
Semiconductor Process Control — Reticle/Mask Manufacturing
Reticle inspection is one of KLA's most defensible niches; the principal named competitor in the 10-K for this category is Lasertec.
Semiconductor Process Control — Packaging Manufacturing
The fastest-growing product cluster. Advanced packaging revenue grew approximately 70% year over year in FY2025 per company commentary; management stated at Investor Day that KLA's advanced packaging market share had risen from under 1% to over 6% in recent years, with packaging revenue expected to reach approximately $1 billion.
Semiconductor Process Control — Software Solutions
Semiconductor Process Control — KLA Pro (Certified and Remanufactured)
Refurbished and certified systems targeting larger design node chip manufacturing and ≤200mm wafer lines: Surfscan® Series, 2835, 2367 Pro, ASET-F5x Pro, Archer™ Series. Strategically important as it extends monetisation of legacy platforms into trailing-edge fabs, including in geographies where new leading-edge tool sales are restricted.
Semiconductor Process Control — General Purpose and Laboratory
HRP®-260 (high-resolution profilometry), Zeta™ Series (3D optical profiling), Tencor® P Series (stylus profilers — the oldest surviving Tencor product lineage), Nano Indenter® G200X, iMicro, iNano®, NanoFlip (nanomechanical/material strength characterisation), Alpha-Step® Series (benchtop profilers), Filmetrics® F Series / R Series / Profilm3D® Series (thin film thickness and 3D optical profiling). Target customers are laboratories, universities, materials researchers and specialty manufacturers — a lower-margin, higher-unit-volume adjacency.
Specialty Semiconductor Process segment
Etch, plasma dicing, deposition and other wafer processing technologies for semiconductor and microelectronics manufacturing.
PCB and Component Inspection segment
PCB and IC substrate — direct imaging, inspection, shaping, inkjet and CAM/CAE: Serena™ (introduced October 2024; direct imaging for fine-line patterning of large, high-layer-count organic substrates), Orbotech Corus™ Series (direct imaging platform extended in 2024 with next-generation optics and lasers for HDI and IC substrate applications), Orbotech Infinitum™ Series, Orbotech Nuvogo™ Fine / Nuvogo™ Series, Orbotech Diamond™ Series, Lumina™, Orbotech Ultra Dimension™ Series, Orbotech Ultra Fusion™ / Fusion™ Series, Orbotech Discovery™ II Series, Orbotech Precise™ Series, Orbotech Ultra PerFix™ / PerFix™ Series, Orbotech Neos™ Series, Orbotech Sprint™ Series, Orbotech Magna™ Series, and the Frontline product family (CAM/CAE software).
Component inspection and metrology: ICOS™ F26x, ICOS™ Tx Series (including the T3 tray-output and T7 tape-output configurations, reconfigurable between formats, with automatic reel changer on T7 and deep-learning defect binning), Zeta™-5xx/6xx.
Services
KLA Global Services, led by EVP Brian Lorig, provides maintenance, spare parts, upgrades, applications support and training across the installed base of wafer, reticle, IC and PCB production tools. Service revenue reached $3.126 billion in FY2026, 23% of total revenue. Management's disclosed characteristics: over 80% of service revenue under multi-year contract, a 13–15% targeted CAGR through calendar 2030, and a target of nearly $6 billion in service revenue by 2030. KLA also continues to service the installed base of discontinued Display product lines despite exiting manufacture.
Product Portfolio
| Platform / family | Description and capability | Target customer |
|---|---|---|
39xx Series | Broadband plasma patterned wafer inspection — KLA's flagship leading-edge defect inspection platform, used for the most sensitive process development and production monitoring applications at advanced logic and DRAM nodes. | Leading-edge foundry/logic, DRAM |
29xx Series | Broadband plasma inspection positioned below the 39xx for high-volume production monitoring at somewhat relaxed sensitivity and lower cost of ownership. | Foundry/logic, memory |
R9xx Series | Review and classification systems paired with inspection output. | All IC manufacturers |
C30x Series | Patterned wafer inspection for defined production monitoring applications. | IC manufacturers |
eSixx™ Series | E-beam inspection systems for defect types below optical resolution limits, particularly voltage-contrast defects. | Leading-edge logic and memory |
eSVx00™ Series | E-beam inspection/review class systems. | Leading-edge logic and memory |
eDRX™ Series, eDR7xxx™ Series | Electron-beam defect review and classification; eDR7xxxAP variant serves advanced packaging. | IC, wafer, packaging manufacturers |
Voyager® Series | Unpatterned/blanket wafer and film inspection for process tool qualification and monitoring. | IC manufacturers, equipment OEMs |
8 Series | Patterned wafer inspection platform. | IC manufacturers |
Puma™ Series | Darkfield patterned wafer inspection for high-throughput production monitoring. | IC manufacturers |
Surfscan® Series | Unpatterned surface inspection — the industry reference standard for particle and surface-defect measurement, used in both chip and wafer/substrate manufacturing and in the KLA Pro refurbished line. | IC and substrate manufacturers |
CIRCL™ Series | Modular multi-technology wafer inspection and metrology cluster; the CIRCL-AP variant serves advanced packaging. | IC and packaging manufacturers |
Micro-SR™ | High-resolution defect review, deployed in both chip and packaging manufacturing flows. | IC and packaging manufacturers |
Castor™ | Defect inspection platform within the chip manufacturing portfolio. | IC manufacturers |
| Platform / family | Description and capability | Target customer |
|---|---|---|
Archer™ Series | Overlay metrology — measurement of layer-to-layer alignment. The dominant platform in its category and a direct beneficiary of EUV and multi-patterning complexity. Also offered in the KLA Pro refurbished line. | Leading-edge logic and memory |
ATL™ Series | Metrology platform for advanced patterning applications. | Leading-edge logic |
Axion® Series | Optical critical dimension and pattern metrology. | Logic and memory |
SpectraShape™ Series | Scatterometry-based 3D profile and critical dimension metrology for complex transistor architectures including gate-all-around. | Leading-edge logic, 3D NAND |
SpectraFilm™ Series | Optical film thickness and composition metrology. | IC manufacturers |
eM™ Series | E-beam metrology for dimensional measurement below optical limits. | Leading-edge logic and memory |
Aleris® Series | Film and dimensional metrology platform. | IC manufacturers |
PWG™ Series / PWG5™ with XT Option | Patterned wafer geometry — measurement of wafer shape, flatness and overlay-relevant distortion; the XT option extends the platform into advanced packaging warpage control. | IC and packaging manufacturers |
Therma-Probe® Series | Non-contact implant dose and anneal monitoring. | IC manufacturers |
OmniMap® RS-xxx Series | Sheet resistance and resistivity mapping; also deployed in packaging manufacturing. | IC and packaging manufacturers |
MicroSense® product family | Capacitive displacement and wafer geometry measurement. | Wafer and IC manufacturers |
CAPRES product family | Micro-four-point-probe electrical characterisation for ultra-thin films. | IC manufacturers, R&D |
| Platform / family | Description and capability | Target customer |
|---|---|---|
QualiSurf® Series | Wet chemical process monitoring for surface preparation; deployed in both chip and packaging manufacturing. | IC and packaging manufacturers |
Quali-Line Quanta® Series | In-line chemical bath analysis and control. | IC manufacturers |
Quali-Line® Prima® Series | In-line chemical concentration monitoring and control. | IC manufacturers |
QualiLab Elite® Series | Laboratory-grade chemical analysis for incoming quality control; deployed in chip, packaging and IC substrate flows. | IC, packaging, ICS manufacturers |
Quali-Fill® Libra® Series | Chemistry management for wafer-level and panel-level packaging and IC substrate plating baths. | Packaging and ICS manufacturers |
| Platform / family | Description and capability | Target customer |
|---|---|---|
SensArray® product family | Wired and wireless instrumented sensor wafers and reticles that travel through production equipment capturing temperature, pressure, gap, vibration and other process conditions. Also used for materials-handling diagnostics to detect and predict mechanical behaviours that damage wafers. Deployed across chip, wafer, reticle and packaging manufacturing. | IC, wafer, reticle, packaging manufacturers; equipment OEMs |
| Platform / family | Description and capability | Target customer |
|---|---|---|
Surfscan® Series | Surface quality and particle inspection — the reference standard for incoming and outgoing wafer quality control. | Wafer/substrate manufacturers |
WaferSight™ Series | Interferometric wafer geometry, flatness, nanotopography and thickness metrology. | Wafer/substrate manufacturers |
Candela® Series | Surface inspection for compound semiconductors, sapphire, SiC/GaN and specialty substrates. | Compound substrate manufacturers |
MicroSense® wafer geometry family | Capacitive wafer geometry measurement. | Wafer manufacturers |
eDRX™ / eDR7xxx™ Series | Defect review for substrate manufacturing. | Wafer manufacturers |
| Platform / family | Description and capability | Target customer |
|---|---|---|
Teron™ SL6xx Series | Reticle blank and patterned reticle inspection for EUV and optical masks. | Mask shops, leading-edge IC manufacturers |
Teron™ 6xx Series | Patterned reticle qualification inspection. | Mask shops |
TeraScan™ 5xx Series | High-resolution reticle defect inspection. | Mask shops |
X5.x™ Series | Reticle inspection platform. | Mask shops |
FlashScan® Series | Reticle inspection for production quality control. | Mask shops |
LMS IPRO Series | Reticle pattern placement metrology and registration measurement. | Mask shops |
| Platform / family | Description and capability | Target customer |
|---|---|---|
Kronos™ Series (incl. Kronos™ 1190, 1190XR) | Patterned wafer inspection for advanced wafer-level packaging — 3D IC, high-density fan-out, hybrid bonding. The 1190XR adds high-resolution optics for best-in-class sensitivity in AWLP process development and production monitoring. Incorporates the DefectWise™ AI classification and DesignWise™ design-context engines. | OSATs, foundries with packaging operations, memory makers (HBM) |
CIRCL™-AP | Modular inspection and metrology cluster configured for advanced packaging. | OSATs, IDMs |
irArcher® Series | Infrared overlay metrology for bonded and stacked structures. | 3D IC and HBM manufacturers |
PWG5™ with XT Option | Panel and wafer warpage/geometry control for packaging. | Packaging manufacturers |
eDR7xxxAP™ | E-beam defect review configured for packaging. | Packaging manufacturers |
Lumina™ | Introduced October 2024. Inspection and metrology for advanced IC substrates including glass core and panel-based interposers; high-sensitivity detection plus scanning metrology, with AI-based review and classification generating an actionable defect Pareto without operator input, and integration with KLA's copper shaping solutions. | IC substrate and interposer manufacturers |
ICOS™ F160XP | Die sorting and inspection system. | OSATs |
ICOS™ T890 | Packaged component inspection deployed in IC substrate workflows. | OSATs, substrate makers |
| Platform / family | Description and capability |
|---|---|
Klarity® product family | Yield management and defect data analysis — the fab-wide data spine into which KLA inspection output feeds. |
5D Analyzer® | Run-time process control and lithography/patterning correction using measurement feedback. |
OVALiS | Overlay control and correction analytics. |
aiSIGHT™ | AI-based automated defect classification. |
Anchor product family | Design-based process control and pattern analytics (acquired with Anchor Semiconductor, 2021). |
I-PAT® | Inline part average testing — screening latent-defect die, particularly relevant to automotive quality requirements. |
RDC | Reticle data control. |
FabVision® Series | Fab-level visualisation and monitoring. |
ProDATA™ | Process data management. |
PROLITH™ | Lithography simulation for evaluating advanced patterning approaches including EUV and multiple patterning. |
ProETCH® | Etch process simulation. |
SPOT® | Process optimisation software. |
| Platform / family | Description | Target customer |
|---|---|---|
SPTS Omega® Series | Plasma etch systems. | MEMS, RF, power semiconductor manufacturers |
SPTS Sigma® Series | Physical vapour deposition. | MEMS, RF, advanced packaging |
SPTS Delta™ Series | Chemical vapour deposition / dielectric deposition. | MEMS, power devices |
SPTS Osprey® Series | Deposition platform. | Specialty semiconductor manufacturers |
SPTS Mosaic™ Series | Process platform for specialty applications. | Specialty semiconductor manufacturers |
Primaxx® Series | Vapour HF release etch for MEMS structures. | MEMS manufacturers |
Xactix® Series | Xenon difluoride isotropic silicon etch. | MEMS, R&D |
MVD Series | Molecular vapour deposition for anti-stiction and surface modification coatings. | MEMS manufacturers |
Financial Narrative
All figures in USD millions except per-share data and ratios. Fiscal years end 30 June. Sources: FY2022–FY2026 Forms 10-K and the Q4 FY2026 earnings release, with multi-year standardised series cross-checked against S&P Global Market Intelligence data.
Income statement
Notes: (a) FY2026 R&D and SG&A are as reported in the Q4 FY2026 release ($1,532.1m and $1,131.5m); FY2025 as reported ($1,360.3m and $1,029.7m); FY2022–FY2023 R&D and FY2024 SG&A are as reported in the respective 10-K MD&A ($1,105.3m, $1,296.7m, $969.5m). FY2024 R&D of $1,279m is derived as gross profit less operating income less SG&A and is flagged as a derivation, not a directly extracted figure. (b) Weighted average diluted share counts for FY2022–FY2024 are derived from reported net income and diluted EPS and are approximate. (c) "Operating income" is not a subtotal KLA presents on the face of its income statement; it is computed here as revenue less cost of revenues, R&D and SG&A. Including the FY2025 impairment, GAAP operating income for FY2025 was $4,775m. (d) The FY2022 effective tax rate of 4.8% reflects discrete benefits and is not representative.
Margins
Revenue CAGR, FY2022 to FY2026: 10.2%. Net income CAGR over the same window: 9.8%. Diluted EPS CAGR: 13.7% — the 350 basis point spread between earnings and per-share earnings growth is the arithmetic contribution of buybacks, which retired approximately 7.8% of the diluted share count over four years.
Balance sheet
Note: "Total debt" of $6,152m at FY2026 exceeds the $5,887m long-term debt line on the face of the balance sheet because it includes finance lease obligations and unamortised discount/issuance-cost adjustments in the standardised presentation.
Cash flow
The difference between the cash flow statement repurchase line and the company's "capital returns" definition arises because the former includes tax withholding payments on vested restricted stock units. Both are presented rather than reconciled to a single number.
Ratio analysis
ROIC is computed as operating income multiplied by (1 minus the effective tax rate), divided by total debt plus ending equity less cash and investments. Interest coverage for FY2022–FY2024 uses cash interest paid as a proxy for interest expense and is flagged accordingly; FY2025 and FY2026 use reported interest expense of $302.2m and $284.4m respectively.
Commentary on trends, inflections and drivers
The FY2024 trough was shallow and revealing. Revenue fell 6.5% and net income fell 18.5% in a year when the broader WFE market contracted meaningfully and China restrictions bit hardest. Gross margin nonetheless rose 20 basis points to 60.0%. A capital equipment business that holds gross margin flat through a down year is telling you that its pricing is not volume-dependent — a direct consequence of near-monopoly positioning in reticle inspection, overlay metrology and broadband plasma inspection. The FY2024 net margin compression to 28.2% was driven below the operating line: a $295 million adverse swing in other expense and a step-up in the effective tax rate from 10.6% to 13.4%.
The FY2025 recovery was exceptional and the FY2026 follow-through was solid rather than spectacular. FY2025 revenue rose 23.9% and net income 47.1%. FY2026 added 11.7% revenue and 18.9% net income. The deceleration is real but the composition improved: FY2026 gross margin reached a five-year high of 61.3% and operating margin a five-year high of 41.7%, while the FY2025 comparison was flattered by a low base.
Gross margin is grinding higher, and the reasons are structural. From 59.8% in FY2023 to 61.3% in FY2026 despite explicit tariff pressure on imported components into U.S. manufacturing. Three drivers: mix shift toward leading-edge process control (higher ASP, higher margin); the FY2024 exit from flat panel display, which management stated would have an "immaterially favourable" margin effect and clearly has; and the growing service mix, which carries a stable margin and rising scale.
Operating leverage is now visible. SG&A fell from 9.9% of revenue in FY2024 to 8.3% in FY2026, a 160 basis point improvement — real cost discipline through a period of 38% cumulative revenue growth. R&D fell from 13.0% to 11.3% of revenue over the same window in percentage terms while rising 20% in absolute dollars, from $1,279 million to $1,532 million. This is the correct pattern: absolute investment growing, intensity declining as the revenue base scales. Management's 2030 model of 45–47% operating margin is predicated on continuing this.
Free cash flow conversion deteriorated in FY2026 and this is the single most important detail in the accounts. Operating cash flow grew only 1.5% (to $4,143 million) against 18.9% net income growth. Free cash flow grew 0.55%. FCF margin fell 310 basis points to 27.7%, the lowest in the five-year window. The cause is unambiguous from the cash flow statement: a $1,476 million working capital drain in FY2026 versus $646 million in FY2025. Accounts receivable consumed $642 million and inventory $466 million.
The benign interpretation is that this is a growth signal: backlog rose 60% to $12.57 billion, and building inventory and extending receivables ahead of a large shipment ramp is exactly what a company facing $12.6 billion of orders and extended equipment lead times should do. DSO of 81 days is high by KLA's own history (65 days in FY2023) but not alarming for a business shipping multi-million-dollar tools into Asia. Days inventory of 253 is elevated but below the FY2024 peak of 282.
The less benign interpretation is that a 291-day cash conversion cycle in a cyclical industry is a genuine risk container. If demand inflects downward, that inventory becomes an obsolescence exposure and the working capital release, while cash-generative in the moment, arrives alongside declining revenue. This is the mechanism by which capital equipment companies convert a demand miss into an earnings miss twice over. It warrants monitoring quarterly.
The balance sheet has repaired dramatically. Net debt fell from $4,066 million in FY2022 to $1,249 million in FY2026; net debt/EBITDA from 1.01x to 0.21x; debt/equity from 4.84x to 0.97x. Tangible book value swung from negative $2,113 million to positive $4,305 million as goodwill and intangibles amortised down from $3,514 million to $2,045 million while retained earnings compounded. KLA now has more financial flexibility than at any point since the Orbotech acquisition, and the A2/A-/A ratings reflect that.
Return on equity is declining for a good reason. From 237.5% in FY2022 to 76.1% in FY2026 — not because profitability deteriorated (ROA rose from 26.4% to 26.9% and ROIC remains above 64%) but because the equity base quadrupled as the company stopped running a negative-tangible-equity, buyback-financed capital structure. This is de-risking, correctly read.
Financial Detail
Segment Revenue
| Segment revenue (USD M) | FY2022 | FY2023 | FY2024 | FY2025 | FY2026 |
|---|---|---|---|---|---|
Semiconductor Process Control | 7925 | 9324 | 8734 | 10947 | 12245 |
Specialty Semiconductor Process | 457 | 543 | 529 | 587 | 584 |
PCB and Component Inspection | 832 | 632 | 552 | 622 | 750 |
Corporate and unallocated / FX effects | -2 | -3 | -3 | 0 | 0 |
Total revenues | 9212 | 10496 | 9812 | 12156 | 13579 |
Segment Revenue
| Metric (%) | FY2022 | FY2023 | FY2024 | FY2025 | FY2026 |
|---|---|---|---|---|---|
SPC share of total revenue | 86.0 | 88.8 | 89.0 | 90.1 | 90.2 |
SSP share of total revenue | 5.0 | 5.2 | 5.4 | 4.8 | 4.3 |
PCB and Component Inspection share of total revenue | 9.0 | 6.0 | 5.6 | 5.1 | 5.5 |
SPC revenue growth YoY | — | 17.7 | -6.3 | 25.3 | 11.9 |
SSP revenue growth YoY | — | 19.0 | -2.7 | 11.0 | -0.5 |
PCB and Component Inspection growth YoY | — | -24.1 | -12.5 | 12.5 | 20.7 |
Segment Revenue
| Segment gross profit (USD M) | FY2022 | FY2023 | FY2024 |
|---|---|---|---|
Semiconductor Process Control | 5168 | 5958 | 5629 |
Specialty Semiconductor Process | 243 | 282 | 283 |
PCB, Display and Component Inspection | 379 | 221 | 159 |
Segment Revenue
| Segment gross margin (%) | FY2022 | FY2023 | FY2024 |
|---|---|---|---|
Semiconductor Process Control | 65.2 | 63.9 | 64.5 |
Specialty Semiconductor Process | 53.1 | 51.9 | 53.5 |
PCB, Display and Component Inspection | 45.5 | 35.0 | 28.8 |
Segment Revenue
| Item (USD M) | FY2024 | FY2025 | FY2026 |
|---|---|---|---|
Total segment profit (operating segments) | 3388 | — | — |
Unallocated amounts | 42 | 45 | -5 |
Financial Analysis
| Metric | FY2022 | FY2023 | FY2024 | FY2025 | FY2026 |
|---|---|---|---|---|---|
Total revenues (USD M) | 9212 | 10496 | 9812 | 12156 | 13579 |
Revenue growth (%) | 33.1 | 13.9 | -6.5 | 23.9 | 11.7 |
Cost of revenues (USD M) | 3593 | 4218 | 3928 | 4752 | 5255 |
Gross profit (USD M) | 5619 | 6278 | 5884 | 7404 | 8324 |
Research and development (USD M) | 1105 | 1297 | 1279 | 1360 | 1532 |
Selling, general and administrative (USD M) | 860 | 986 | 970 | 1030 | 1132 |
Goodwill and intangible impairment (USD M) | 0 | 0 | 0 | 239 | 0 |
Operating income before impairment (USD M) | 3654 | 3995 | 3636 | 5014 | 5661 |
Depreciation and amortisation (USD M) | 363 | 415 | 402 | 394 | 394 |
EBITDA before impairment (USD M) | 4017 | 4410 | 4038 | 5408 | 6055 |
Income before income taxes (USD M) | 3490 | 3789 | 3190 | 4644 | 5606 |
Provision for income taxes (USD M) | 167 | 402 | 428 | 583 | 775 |
Effective tax rate (%) | 4.8 | 10.6 | 13.4 | 12.6 | 13.8 |
Net income (USD M) | 3322 | 3387 | 2762 | 4062 | 4831 |
Non-GAAP net income (USD M) | — | — | — | 4452 | 4959 |
Basic EPS (USD, post-split) | 2.22 | 2.45 | 2.05 | 3.05 | 3.68 |
Diluted EPS (USD, post-split) | 2.19 | 2.42 | 2.03 | 3.04 | 3.66 |
Non-GAAP diluted EPS (USD, post-split) | — | — | — | 3.33 | 3.76 |
Diluted EPS (USD, pre-split equivalent) | 21.92 | 24.15 | 20.28 | 30.37 | 36.60 |
Dividends declared per share (USD, post-split) | 0.420 | 0.520 | 0.565 | 0.675 | 0.800 |
Weighted average diluted shares (M, post-split) | 1517 | 1400 | 1361 | 1338 | 1320 |
Financial Analysis
| Margin (%) | FY2022 | FY2023 | FY2024 | FY2025 | FY2026 |
|---|---|---|---|---|---|
Gross margin | 61.0 | 59.8 | 60.0 | 60.9 | 61.3 |
R&D as % of revenue | 12.0 | 12.4 | 13.0 | 11.2 | 11.3 |
SG&A as % of revenue | 9.3 | 9.4 | 9.9 | 8.5 | 8.3 |
Operating margin (before impairment) | 39.7 | 38.1 | 37.1 | 41.2 | 41.7 |
EBITDA margin | 43.6 | 42.0 | 41.1 | 44.5 | 44.6 |
Pre-tax margin | 37.9 | 36.1 | 32.5 | 38.2 | 41.3 |
Net margin | 36.1 | 32.3 | 28.2 | 33.4 | 35.6 |
Free cash flow margin | 32.6 | 31.7 | 30.9 | 30.8 | 27.7 |
Financial Analysis
| Metric (USD M) | FY2022 | FY2023 | FY2024 | FY2025 | FY2026 |
|---|---|---|---|---|---|
Cash and cash equivalents | 1585 | 1928 | 1977 | 2079 | 1650 |
Marketable securities / short-term investments | 1123 | 1315 | 2527 | 2416 | 3253 |
Cash and investments | 2708 | 3243 | 4504 | 4495 | 4902 |
Accounts receivable | 1927 | 1870 | 1902 | 2369 | 3021 |
Inventories | 2147 | 2877 | 3035 | 3212 | 3649 |
Total current assets | 7169 | 8372 | 10031 | 10699 | 12382 |
Land, property and equipment, net | 976 | 1241 | 1342 | 1522 | 1716 |
Goodwill | 2320 | 2279 | 2016 | 1792 | 1789 |
Purchased intangible assets, net | 1194 | 935 | 669 | 445 | 256 |
Goodwill and intangibles combined | 3514 | 3214 | 2685 | 2237 | 2045 |
Total assets | 12597 | 14072 | 15434 | 16068 | 17952 |
Accounts payable | 443 | 371 | 359 | 459 | 624 |
Total current liabilities | 2871 | 3743 | 4661 | 4086 | 4305 |
Short-term debt | 0 | 0 | 750 | 0 | 0 |
Long-term debt | 6661 | 5891 | 5880 | 5884 | 5887 |
Total debt | 6774 | 6063 | 6820 | 6088 | 6152 |
Net debt | 4066 | 2820 | 2316 | 1594 | 1249 |
Total liabilities | 11198 | 11153 | 12065 | 11375 | 11602 |
Total stockholders equity | 1399 | 2920 | 3368 | 4692 | 6350 |
Working capital | 4298 | 4629 | 5370 | 6613 | 8077 |
Book value per share (USD, post-split) | 0.99 | 2.14 | 2.51 | 3.55 | 4.86 |
Tangible book value | -2113 | -294 | 684 | 2455 | 4305 |
Order backlog | not disclosed | not disclosed | not disclosed | 7860 | 12570 |
Financial Analysis
| Metric (USD M) | FY2022 | FY2023 | FY2024 | FY2025 | FY2026 |
|---|---|---|---|---|---|
Net cash provided by operating activities | 3313 | 3670 | 3309 | 4082 | 4143 |
Capital expenditures | 307 | 342 | 277 | 335 | 376 |
Free cash flow | 3005 | 3328 | 3031 | 3747 | 3767 |
Stock-based compensation | 127 | 171 | 213 | 265 | 310 |
Change in working capital | -305 | 10 | -201 | -646 | -1476 |
Dividends paid | 639 | 733 | 773 | 905 | 1058 |
Share repurchases (cash flow statement) | 4052 | 1407 | 1879 | 2283 | 2495 |
Share repurchases (company "capital returns" definition) | — | — | — | 2150 | 2290 |
Total capital returned (company definition) | — | — | 2510 | 3055 | 3348 |
Capital returns as % of free cash flow | not calculated | not calculated | 82.8 | 81.5 | 88.9 |
Cash interest paid | 155 | 224 | 277 | 293 | 283 |
Cash income tax paid | 465 | 495 | 831 | 887 | 781 |
Capex as % of revenue | 3.3 | 3.3 | 2.8 | 2.8 | 2.8 |
Financial Analysis
| Ratio | FY2022 | FY2023 | FY2024 | FY2025 | FY2026 |
|---|---|---|---|---|---|
Return on equity, ending equity (%) | 237.5 | 116.0 | 82.0 | 86.6 | 76.1 |
Return on assets, ending assets (%) | 26.4 | 24.1 | 17.9 | 25.3 | 26.9 |
Return on invested capital (%) | 63.6 | 62.2 | 55.4 | 69.7 | 64.2 |
Current ratio (x) | 2.50 | 2.24 | 2.15 | 2.62 | 2.88 |
Debt to equity (x) | 4.84 | 2.08 | 2.02 | 1.30 | 0.97 |
Net debt to EBITDA (x) | 1.01 | 0.64 | 0.57 | 0.29 | 0.21 |
Interest coverage, EBIT/interest (x) | 23.6 | 17.8 | 13.1 | 16.6 | 19.9 |
Asset turnover (x) | 0.73 | 0.75 | 0.64 | 0.76 | 0.76 |
Days sales outstanding | 76 | 65 | 71 | 71 | 81 |
Days inventory outstanding | 218 | 249 | 282 | 247 | 253 |
Days payables outstanding | 45 | 32 | 33 | 35 | 43 |
Cash conversion cycle (days) | 249 | 282 | 319 | 283 | 291 |
Geographic Revenue
| Region revenue (USD M) | FY2024 | FY2025 | FY2026 |
|---|---|---|---|
China | 4197 | 4043 | 4048 |
Taiwan | 1738 | 3205 | 3644 |
Korea | 907 | 1453 | 1834 |
North America | 1071 | 1362 | 1757 |
Japan | 963 | 1133 | 915 |
Europe and Israel | 540 | 574 | 727 |
Rest of Asia | 396 | 386 | 654 |
Total revenues | 9812 | 12156 | 13579 |
Geographic Revenue
| Region share of revenue (%) | FY2024 | FY2025 | FY2026 |
|---|---|---|---|
China | 42.8 | 33.3 | 29.8 |
Taiwan | 17.7 | 26.4 | 26.8 |
Korea | 9.2 | 11.9 | 13.5 |
North America | 10.9 | 11.2 | 13.0 |
Japan | 9.8 | 9.3 | 6.7 |
Europe and Israel | 5.6 | 4.7 | 5.4 |
Rest of Asia | 4.0 | 3.2 | 4.8 |
Geographic Revenue
| Region growth YoY (%) | FY2025 | FY2026 |
|---|---|---|
China | -3.7 | 0.1 |
Taiwan | 84.4 | 13.7 |
Korea | 60.2 | 26.2 |
North America | 27.2 | 29.0 |
Japan | 17.6 | -19.2 |
Europe and Israel | 6.3 | 26.6 |
Rest of Asia | -2.6 | 69.6 |
Total | 23.9 | 11.7 |
Capital Markets
| Metric | Value as of 8 September 2026 |
|---|---|
Share price (USD) | 188.20 |
Market capitalisation (USD bn) | 245.89 |
Shares outstanding (M) | 1306.5 (as of 3 August 2026) |
52-week range (USD) | 90.67 – 307.37 |
Discount to 52-week high (%) | 38.8 |
Premium to 52-week low (%) | 107.6 |
Beta | 1.44 |
Average daily volume (shares) | 5,646,225 |
Public float value (USD bn) | 159.3 (as of 31 December 2025) |
Next earnings date | 28 October 2026 |
Capital Markets
| Multiple | KLA (8 Sep 2026) |
|---|---|
P/E, trailing (x) | 50.7 |
P/E, forward (x) | 34.0 |
P/Sales (x) | 18.1 |
P/Book (x) | 38.7 |
P/Free cash flow (x) | 65.8 |
Enterprise value (USD bn) | 247.1 |
EV/EBITDA (x) | 40.8 |
EV/Sales (x) | 18.2 |
Dividend yield (%) | 0.49 |
Capital Markets
| Multiple | FY2022 | FY2023 | FY2024 | FY2025 | FY2026 |
|---|---|---|---|---|---|
P/E ratio (x) | 14.3 | 19.7 | 40.2 | 29.2 | 81.6 |
Forward P/E (x) | 13.4 | 25.0 | 30.5 | 27.4 | 63.3 |
P/Sales (x) | 5.2 | 6.3 | 11.3 | 9.7 | 29.0 |
P/FCF (x) | 15.8 | 20.0 | 36.6 | 31.6 | 104.6 |
Capital Markets
| Metric | Value |
|---|---|
Analysts covering | 29 |
Consensus rating | Buy |
Average 12-month price target (USD) | 233.77 |
Implied upside from $188.20 (%) | 24.2 |
Capital Markets
| Firm | Rating | Price target (USD) |
|---|---|---|
BofA (Vivek Arya) | Buy | 260 |
Morgan Stanley (Shane Brett) | Overweight | 253 |
Stifel | Buy | 250 |
Wells Fargo | Overweight | 245 |
JPMorgan (Harlan Sur) | Overweight | 238 |
Susquehanna (Mehdi Hosseini) | Neutral | 215 |
Jefferies | Buy | 210 |
UBS (Timothy Arcuri) | Neutral | 200 |
RBC Capital | Sector Perform | 180 |
Capital Markets
| Metric | FY2022 | FY2023 | FY2024 | FY2025 | FY2026 |
|---|---|---|---|---|---|
Dividends per share (USD, post-split) | 0.420 | 0.520 | 0.565 | 0.675 | 0.800 |
Dividend per share growth (%) | 16.7 | 23.8 | 8.7 | 19.5 | 18.5 |
Total dividends paid (USD M) | 639 | 733 | 773 | 905 | 1058 |
Dividend payout ratio, % of net income | 19.2 | 21.6 | 28.0 | 22.3 | 21.9 |
Dividend payout ratio, % of free cash flow | 21.3 | 22.0 | 25.5 | 24.1 | 28.1 |
Capital Markets
| Metric (USD M) | FY2022 | FY2023 | FY2024 | FY2025 | FY2026 |
|---|---|---|---|---|---|
Share repurchases (cash flow statement) | 4052 | 1407 | 1879 | 2283 | 2495 |
Shares outstanding at year end (M, post-split) | 1418 | 1368 | 1344 | 1320 | 1307 |
Shares retired during the year (M) | not calculated | 50 | 24 | 24 | 13 |
Share count reduction (%) | not calculated | 3.5 | 1.8 | 1.8 | 1.0 |
Capital Markets
| Agency | Rating | Outlook |
|---|---|---|
Moody's | A2 | — |
S&P Global Ratings | A- | — |
Fitch Ratings | A | — |
Capital Markets
| Debt metric | FY2025 | FY2026 |
|---|---|---|
Long-term debt, balance sheet carrying value (USD M) | 5884 | 5887 |
Short-term debt (USD M) | 0 | 0 |
Total debt including leases (USD M) | 6088 | 6152 |
Cash and investments (USD M) | 4495 | 4902 |
Net debt (USD M) | 1594 | 1249 |
Interest expense (USD M) | 302 | 284 |
Cash interest paid (USD M) | 293 | 283 |
Net debt to EBITDA (x) | 0.29 | 0.21 |
Interest coverage (x) | 16.6 | 19.9 |
Analyst Conclusions
Management guidance summary
Near term (Q1 FY2027, quarter ending 30 September 2026): revenue of $4.0 billion ± $200 million, implying 24.7% year-over-year growth; GAAP gross margin 61.6% ± 1.0%; non-GAAP gross margin 62.5% ± 1.0%; GAAP diluted EPS $1.14 ± $0.10; non-GAAP diluted EPS $1.16 ± $0.10 on 1,312 million assumed diluted shares.
Medium term: management does not guide beyond one quarter. The only forward framework is the 2030 target model: $26 billion ± $2.5 billion of revenue at a 13–17% CAGR, 45–47% non-GAAP operating margin, $84 ± $8 pre-split non-GAAP diluted EPS ($8.40 ± $0.80 post-split), services revenue of nearly $6 billion at a 13–15% CAGR, and capital returns exceeding 90% of free cash flow.
Management's qualitative posture, per Wallace on 28 July 2026: "KLA's June quarter results reinforce that the trends driving our growth are strengthening, and we see momentum across our business accelerating in the second half of calendar 2026 and continuing through 2027." Guidance is consistent with that statement: the Q1 FY2027 midpoint represents 9.4% sequential growth off a record quarter.
Consensus expectations
Twenty-nine analysts maintain a consensus Buy rating with an average 12-month price target of $233.77, implying 24.2% upside from $188.20. Forward P/E of 34.0x against trailing 50.7x implies consensus expects approximately 49% EPS growth over the forward twelve months — a demanding but not implausible figure given the Q1 FY2027 guidance midpoint of $1.14 implies an annualised run-rate around $4.56, or 25% above FY2026's $3.66, before any further acceleration.
Bull case
1. Backlog conversion is a near-mechanical earnings driver. Backlog rose 60% to $12.57 billion at 30 June 2026, from $7.86 billion. At the FY2026 revenue run-rate that is eleven months of coverage. KLA's historical disclosure practice indicates it expects to recognise roughly 71–76% of remaining performance obligations within twelve months. Applied to $12.57 billion, that mechanically supports revenue well above the FY2026 base before any new orders. The Q1 FY2027 guide of 24.7% year-over-year growth is the first evidence of this converting.
2. Process control intensity is a growth vector independent of the WFE cycle. Intensity rose from 5.3% to 7.4% of WFE over roughly six years and management targets 9% by 2030. Even in a flat $140 billion WFE market, moving from 7.4% to 9.0% intensity would grow KLA's system TAM by 22%. Combined with a targeted 150 basis points of additional WFE share, the company has two independent levers that do not require the equipment market to grow at all. Critically, management's 2030 model assumes 4.5 points of growth above the market baseline versus 6.5 points actually delivered over the prior five years — the target is calibrated below demonstrated performance.
3. The services annuity converts a cyclical business into a partially recurring one, and it is compounding faster than the whole. Service revenue grew 16.5% in FY2026 to $3.126 billion versus 10.4% for product, reached 23.0% of total revenue, and is over 80% contracted on multi-year terms. Doubling it to nearly $6 billion by 2030 would put roughly 23% of the target revenue base into a stream with negligible cyclical amplitude, which justifies a structurally higher multiple than a pure capital equipment vendor deserves — and which materially reduces the downside in any AI capex digestion scenario.
Bear case
1. Free cash flow has stopped growing, and the working capital build is a leveraged bet on demand persisting. FY2026 free cash flow grew 0.55% to $3,767 million against 18.9% net income growth. FCF margin fell 310 basis points to 27.7%, the worst of the five-year window. Q4 FY2026 free cash flow of $817 million was 23% below the prior-year quarter's $1,065 million. The cause is a $1,476 million working capital drain, with receivables up 27.5% and inventory up 13.6% year over year, pushing the cash conversion cycle to 291 days. If the AI capex cycle digests — and every prior semiconductor cycle has — that inventory becomes obsolescence risk and those receivables become collection risk, precisely when revenue is falling. At 65.8x price to free cash flow, the market is not paying for a business whose cash generation has plateaued.
2. Thirty percent of revenue sits in a jurisdiction where policy risk is unidirectional and has already destroyed 13 percentage points of revenue mix. China fell from 42.8% of revenue in FY2024 to 29.8% in FY2026. Absolute China revenue has been flat at approximately $4.05 billion for three years while everything else grew 74%. Export controls have tightened five times in four years; the Affiliates Rule is suspended only until November 2026; products are being held at U.S. Customs; the Section 232 investigation is unresolved; and the 10-K concedes that restrictions "make it easier for our China-based competitors to develop and sell their own products and take market share from us." There is no scenario in which this risk resolves favourably through KLA's own actions, and a 30% revenue exposure to a policy variable outside management's control does not belong in a 50x multiple.
3. The two smaller segments have destroyed value, and the fastest-growing part of the portfolio is the part where KLA is weakest. Specialty Semiconductor Process revenue declined 0.5% in FY2026 to $584 million — no growth in four years on any meaningful basis. PCB and Component Inspection at $750 million remains below its FY2022 level of $832 million and generated a $239.1 million impairment along the way. Meanwhile advanced packaging, the highest-growth category and a central pillar of the 2030 model, is a market where KLA holds just over 6% share against Onto Innovation (guiding to over 50% advanced packaging growth in 2026, with the Dragonfly G5 qualified at a leading 2.5D logic customer and a pipeline of 15+ applications across 10+ customers), Camtek and Applied Materials. KLA is a 58%-share monopolist in a maturing category and a 6%-share challenger in the growing one. The 2030 bridge depends on winning the fight it is currently losing.
Catalysts and monitorables, next twelve months
Analyst verdict
KLA is one of the highest-quality industrial franchises in global equity markets, and it is currently priced as though that quality is unconditional. Both halves of that sentence matter.
The quality is not in dispute. A 58% share of process control at roughly 7.5 times the nearest competitor, gross margins of 61.3% that expanded through a revenue decline, return on invested capital above 64%, net leverage of 0.21x, seventeen consecutive dividend increases, an installed-base annuity growing faster than the whole and now 23% of revenue, and backlog up 60% to $12.57 billion — this is not a cyclical equipment vendor with good years. It is a toll road on semiconductor complexity, and complexity is the one variable in this industry that only moves in one direction. Management's 2030 model, closely read, is more conservative than its headline: it assumes 4.5 points of annual growth above the market baseline versus the 6.5 points actually delivered over the prior five years. That is a company underwriting its own promise.
The price is the problem, and so is the cash. At 50.7x trailing earnings, 65.8x free cash flow and 40.8x EV/EBITDA, the market is capitalising a 10.2% four-year revenue CAGR at a multiple normally reserved for software. The stock fell approximately 9% on a quarter that beat guidance and raised the outlook, and posted its worst month since 1987 in August 2026 — the market has already begun to answer the question of whether the multiple was right. Underneath that, the FY2026 accounts contain the one genuinely uncomfortable fact in this dossier: free cash flow grew 0.55% while net income grew 18.9%, with a $1,476 million working capital drain pushing the cash conversion cycle to 291 days. The charitable reading is that this is a growth company building inventory into a 60% backlog increase. The uncharitable reading is that in a cyclical business, a 253-day inventory position and 81-day receivables are the mechanism by which a demand miss becomes an earnings disaster. Both readings are available on current evidence, and the Q1 FY2027 print on 28 October 2026 will discriminate between them.
The structural bear case is narrower but harder to dismiss: 30% of revenue sits in China, where policy has tightened five times in four years, where absolute revenue has been flat for three years, and where KLA's own 10-K concedes the restrictions are cultivating its future competitors. And the 2030 bridge depends materially on advanced packaging — a market where KLA holds just over 6% share and where Onto Innovation is guiding to over 50% growth with a qualified platform at a leading 2.5D customer. KLA is a monopolist in the maturing category and a challenger in the growing one.
Verdict: a superb business at a price that requires the AI infrastructure cycle to run without interruption through at least calendar 2028. The 24.2% consensus upside to $233.77 is achievable if backlog converts and free cash flow reconverts; the $180 low end of the target range is equally defensible if either fails. Investors underwriting KLA at these levels should be explicit with themselves that they are making a bet on AI capex durability, not on process control dominance — the latter is proven, the former is not. The monitorable that matters most is not revenue. It is operating cash flow.
End of dossier. All valuation and market data are as of 8 September 2026 and will move.
Executive Leadership
| Name | Title | Tenure and background | Education |
|---|---|---|---|
Richard P. ("Rick") Wallace | President and Chief Executive Officer; Director | Joined KLA Instruments as an applications engineer in 1988; 30+ years with the company across general management roles; CEO since 2006. Prior: Ultratech Stepper, Cypress Semiconductor. Director of Marvell Technology, Inc. Former director of Splunk, Proofpoint, NetApp; former Chairman of SEMI. | BS Electrical Engineering, University of Michigan; MS Engineering Management, Santa Clara University |
Bren D. Higgins | Executive Vice President and Chief Financial Officer | With KLA since 1999; CFO since August 2013. Previously division controller (multiple divisions), group controller for KLA's largest business group, senior director of FP&A, VP corporate finance (treasury, IR, corporate business development). Scope extends beyond finance to global manufacturing, logistics, supply chain, business development and M&A, workplace services, IT and investor relations. | BA, University of California Santa Barbara; MBA (Finance), University of California Davis |
Ahmad Khan | President, Semiconductor Products and Customers | Joined KLA 2004 in business development; GM Optical Films Metrology 2007; Group VP Patterning Division (reticle inspection, optical CD, overlay, 5D process control). Prior: Applied Materials. Leads the combined product and customer organisation covering ~90% of revenue. | BS Electronics Engineering Technology, DeVry University |
Brian Lorig | Executive Vice President, KLA Global Services | Joined 1998; previously VP U.S. Manufacturing and Operations Group and VP Global Support and Services Field Operations. | BS Supply Chain Management, Arizona State University; MBA, Santa Clara University |
Ben Tsai, PhD | Chief Technical Officer and Executive Vice President, Corporate Alliances | Over 40 years at KLA; former VP/GM wafer inspection division; named CTO in 1994. Previously SVP of technology at Tokyo Electron Limited. Holds approximately 60 patents in inspection and metrology. | BS EE, National Taiwan University; MS and PhD EE, University of Illinois Urbana-Champaign |
Bobby Bell | Executive Vice President, Government Affairs and Head of KLA Europe | Joined 1994 as a senior applications engineer; roles across global customer operations, corporate sales, service, Wafer Inspection Group and the Semiconductor Business Organization. Most recently Chief Strategy Officer, where he led government affairs, IT, cyber, communications, real estate and ESG, the corporate rebranding, and the Ann Arbor site selection and ramp. Prior: AT&T Microelectronics, SEMATECH. Serves on the Silicon Valley Leadership Group board and SEMI Board of Industry Leaders. | BS EE, University of Arkansas; MS EE, University of Missouri |
MaryBeth Wilkinson | Executive Vice President, Chief Legal Officer and Corporate Secretary | Joined September 2020. Previously SVP, General Counsel and Corporate Secretary of O-I Glass Inc.; before that a Chicago-based partner at an international law firm. Based in Ann Arbor. | BA summa cum laude, Saint Mary's College; JD, Northwestern University Pritzker School of Law; Stanford Executive Program |
John Van Camp | Executive Vice President and Chief Human Resources Officer | Prior: HR leadership at General Electric; VP Human Resources at Gap Inc. | BS Industrial and Labor Relations, Cornell University; MBA, University of Connecticut |
Randi Polanich | Senior Vice President and Chief Communications Officer | Joined 2019. Oversees brand and reputation strategy, ESG and the KLA Foundation. 20+ years in communications; previously GE, Hewlett Packard Enterprise, SAP. | BA Journalism and Public Relations, San Diego State University |
| Executive | Title | FY2025 total compensation (USD M) |
|---|---|---|
Richard Wallace | President and CEO | 25.09 |
Bren Higgins | EVP and CFO | 7.71 |
Ahmad Khan | President, Semiconductor Products and Customers | 7.71 |
Oreste Donzella | Former EVP and Chief Strategy Officer | 6.54 |
Brian Lorig | EVP, KLA Global Services | 5.00 |
MaryBeth Wilkinson | EVP, Chief Legal Officer and Corporate Secretary | 3.13 |
| Director | Role | Principal background | Other public boards |
|---|---|---|---|
Robert Calderoni | Board Chair; leads the Audit Committee | Former Chairman and interim CEO/President of Citrix Systems; former President of SAP AG's cloud business following the Ariba acquisition, where he was Chairman and CEO; former CFO of Avery Dennison; SVP Finance at Apple; VP Finance at IBM. | Ansys, Inc. |
Jason Conley | Director | EVP and CFO of Roper Technologies since February 2023; joined Roper 2006 as Chief Accounting Officer with roles in FP&A, IR and operating-company CFO. Prior: Honeywell International, Deloitte. | — |
Tracy Embree | Director | Former President of Otis Americas (Oct 2023 – Apr 2025); 23 years at Cummins Inc. including President of the Distribution Business. | Lennox International Inc. (since June 2025); formerly Louisiana-Pacific (2016–2025) |
Jeneanne Hanley | Director | Former SVP and President, E-Systems Division at Lear Corporation; previously Corporate VP Global Surface Materials, Corporate VP Americas Seating, VP Global Strategy and Business Development. | QuantumScape Corporation |
Kevin Kennedy, PhD | Director | Non-executive Chair of Quanergy Systems; former President and CEO of Avaya; former President and CEO of JDS Uniphase; former COO of Openwave Systems; Cisco Systems and Bell Laboratories. Congressional Fellow (House Science, Space and Technology); appointed to the President's National Security Telecommunications Advisory Committee. | Digital Realty Trust, Inc. |
Michael R. McMullen | Director | President (since 2014) and CEO (since 2015) of Agilent Technologies; 30-year Agilent/HP career including President of the Chemical Analysis Group. | Agilent Technologies (CEO) |
Victor Peng | Director | Interim CEO of PsiQuantum since February 2026; former President, Adaptive and Embedded Computing Group at AMD (Feb 2023 – Aug 2024); 14 years at Xilinx including President and CEO; earlier roles at AMD, TZero, MIPS, SGI, Digital Equipment. Holds four U.S. patents. | PsiQuantum, Microchip Technology, Inc. |
Jamie Samath | Director | EVP, CFO and Head of Business Technology at Intuitive Surgical; 12 years at Intuitive including SVP Finance, Corporate Controller and Principal Accounting Officer. Prior: VP Finance and Corporate Controller at Atmel; National Semiconductor. CPA. | — |
Susan Taylor | Director | Chief Accounting Officer of Meta Platforms (Apr 2017 – Jun 2023); previously CAO of LinkedIn, Silver Spring Networks; Senior Director Accounting Policy at Yahoo!; 13+ years at PricewaterhouseCoopers. CPA (inactive, California). | Pure Storage, Inc. (since 2018) |
Richard P. Wallace | Director; President and CEO | — | Marvell Technology, Inc. |
| Holder | Approximate ownership (%) | Notes |
|---|---|---|
The Vanguard Group, Inc. | ~10.2–10.5 | Largest holder; passive index management |
BlackRock, Inc. | ~8.9–9.0 | Passive index management |
Capital Research and Management Company | ~7.9 | Active manager |
State Street Global Advisors, Inc. | ~4.6–4.7 | Passive index management |
PRIMECAP Management Company | ~3.9 | Active manager, long-duration holder |
Holders 6–25 | balance to ~53–57% for top 25 | — |
Institutions in aggregate | ~88–91 | — |
Individual insiders | ~0.09–0.11 | — |
General public / retail | ~9–12 | — |
Competitive Landscape
| Competitor | Primary overlap with KLA | Competitive position |
|---|---|---|
Applied Materials, Inc. (NASDAQ: AMAT) | Process control (PDC business unit), advanced packaging, e-beam metrology | The largest WFE company overall and the most credible broad-based challenger. Its process control business is a fraction of KLA's but sits inside an enormously larger installed relationship. Its advanced packaging portfolio extends beyond process control into deposition, etch, hybrid bonding and integration — and it agreed to acquire ASMPT's NEXX panel-level packaging deposition business |
ASML Holding N.V. (AMS/NASDAQ: ASML) | Overlay and CD metrology (YieldStar), computational lithography, e-beam (HMI) | The only company with more pricing power than KLA, but in an adjacent category. Its metrology business is bundled with lithography, giving it a structural attach advantage at leading-edge customers. Simultaneously a competitor and a demand driver: EUV adoption raises process control intensity |
Onto Innovation, Inc. (NYSE: ONTO) | Advanced packaging inspection and metrology, macro defect inspection, lithography for panel-level packaging | The most direct pure-play competitor and the principal threat in the advanced packaging category where KLA is growing fastest. Expects advanced packaging revenue growth above 50% in 2026, with the Dragonfly G5 platform qualified at a leading 2.5D logic customer, growing 3DI metrology adoption for micro-bump inspection, JetStep lithography wins in panel-level packaging, and a pipeline of over 15 applications across more than 10 customers |
Lasertec, Inc. (TSE: 6920) | EUV mask blank and patterned mask inspection (actinic) | The single most concentrated competitive threat in a specific high-value niche. Lasertec's actinic patterned mask inspection has a technology position that KLA's Teron platform must contest directly |
Hitachi High-Tech Corporation | CD-SEM metrology, e-beam review | Dominant in CD-SEM in Japan and strong across Asian memory; the historical share leader in critical dimension SEM |
Camtek Ltd. (NASDAQ: CAMT) | Advanced packaging and compound semiconductor inspection | Israeli specialist growing rapidly on HBM and advanced packaging inspection demand |
Nova Ltd. (NASDAQ: NVMI) | Optical CD, integrated and standalone dimensional metrology, materials metrology | Israeli specialist with a strong integrated metrology position and growing standalone OCD share |
Tokyo Electron Limited (TSE: 8035) | Wafer probe, some inspection adjacencies; the largest overall WFE competitor for customer capital budget | Not a direct process control competitor but a major competitor for the same fab capex dollar |
SCREEN Holdings Co., Ltd. (TSE: 7735) | Wafer inspection adjacencies, cleaning-integrated metrology | Japanese multi-line equipment supplier |
Veeco Instruments Inc. (NASDAQ: VECO) | Metrology and specialty process; competes with SSP in some deposition applications | Niche |
Bruker Corporation (NASDAQ: BRKR) | Materials characterisation, X-ray metrology, atomic force microscopy | Competes primarily in the general purpose / lab portfolio |
Nordson Corporation / Test & Inspection | PCB and electronics inspection | Competes with parts of PCB&CI |
Chinese domestic entrants (e.g. Skyverse, Yuwei, Zhongke Feice) | Wafer inspection at trailing nodes | Not yet material to KLA's numbers, but the 10-K explicitly warns that export restrictions "may reduce the need for our products and make it easier for our China-based competitors to develop and sell their own products and take market share from us." This is the most important medium-term competitive risk |
| Metric | KLA (FY2026, ended Jun 2026) | Applied Materials (FY2026, ending Oct 2026) | Lam Research (FY2026, ended Jun 2026) | ASML (FY2025, calendar) |
|---|---|---|---|---|
Revenue (USD bn) | 13.58 | ~34 (implied) | — | ~35.3 |
Revenue growth (%) | 11.7 | ~25 (Q3 YoY) | — | — |
Gross margin (%) | 61.3 | 50.3 (Q3 GAAP) | — | — |
Operating margin (%) | 41.7 | ~30 (Q1 non-GAAP) | 35.0 (latest quarter) | — |
Net margin (%) | 35.6 | — | — | — |
R&D as % of revenue | 11.3 | — | — | — |
Market capitalisation (USD bn) | 245.9 (8 Sep 2026) | ~394 (Aug 2026) | — | ~589 (May 2026) |



