Mimasu Semiconductor Industry Overview
Mimasu is a Japanese specialist in precision silicon wafer processing, with a business that began in 1966, before semiconductors were widely known. Its core activity is contract polishing and finishing of prime silicon wafers for Shin-Etsu Handotai, the group's wafer manufacturer, alongside a reclaim business that restores customers' used test and monitor wafers to as-new quality. Two smaller divisions broaden the model. One is a technical trading house selling measuring, testing and semiconductor equipment. The other is an engineering unit building spin processors and wet-process tools, used both by customers and in-house. Revenue reached JPY 95.0 billion in the year to February 2026. The company has concentrated its manufacturing in Takasaki and committed JPY 77 billion to a dedicated 300mm plant. Full ownership by Shin-Etsu since 2024 has turned it from an independent listed processor into an integrated capacity arm of the world's largest silicon wafer group, with far less public disclosure.
The company's own description. The FY5/2024 annual securities report says Mimasu's three divisions are deeply engaged in the semiconductor industry and work together "as a trinity". It puts safety first, conducts fair business and aims to raise corporate value. The stated focus is the core semiconductor materials processing business and continued refinement of the advanced processing technology that underpins the industry, delivering high quality and low cost. The company's name reflects a founding spirit in which shareholders, customers and the company are bound by trust and prosper together.
What the company does. The Semiconductor Division polishes and finishes silicon wafers. Prime wafer processing is commissioned by Shin-Etsu Handotai, which supplies the material. Mimasu therefore earns mainly a processing fee (加工料収入) rather than selling wafers it owns, which is why its balance sheet carries little prime wafer stock relative to revenue. In reclaim, Mimasu collects test and monitor wafers used by device makers and restores them to quality equivalent to new test wafers so they can be used repeatedly.
The Industrial Sales Division (産商事業部) calls itself a "technical trading company". It sells instruments, testing machines, precision equipment and semiconductor process tools from third-party makers, and also sells the Engineering Division's products. The Engineering Division designs and builds automation and wet-process equipment. It has no external revenue of its own, because its products reach customers through Industrial Sales or go to the Semiconductor Division.
Revenue model. Mimasu's income falls into three reported types, shown below from the annual securities reports. Revenue is transactional or contract processing. There is no subscription or licensing line.
Merchandise sales (JPY M): FY2021: 36942; FY2022: 21751; FY2023: 31405; FY2024: 37089
Product sales (JPY M): FY2021: 1581; FY2022: 4235; FY2023: 6087; FY2024: 4943
Processing fees (JPY M): FY2021: 46527; FY2022: 48445; FY2023: 53444; FY2024: 47076
Total sales (JPY M): FY2021: 85051; FY2022: 74432; FY2023: 90936; FY2024: 89109
Fiscal years in this table end on 31 May. From FY5/2022 the revenue recognition standard moved agency transactions to a net basis, which cut that year's sales by JPY 19,488 million, of which JPY 19,433 million fell in Industrial Sales. FY5/2021 was not restated, so the fall in merchandise sales between those two years is mainly accounting.
Value chain position. Mimasu sits between crystal growth and device fabrication. Shin-Etsu Handotai grows and supplies silicon, Mimasu performs high-precision flatness and cleaning steps, and the finished wafers go to device makers. In reclaim it sits after the fab, in a closed loop with device makers. Its equipment and trading activities supply the same fabs and laboratories.
Customer types and end-markets. Shin-Etsu Handotai is the dominant customer. The trade receivable ledger at 31 May 2024 also named Hitachi High-Tech (JPY 7,739 million), Renesas Electronics (JPY 2,223 million), Shin-Etsu Chemical (JPY 1,811 million) and Kioxia (JPY 1,482 million). Notes and electronically recorded receivables named Sony Semiconductor Manufacturing, ROHM, Sanko Shoji, Mitsubishi Materials and Nipro Medical Engineering. Recruitment materials describe customers as domestic and overseas device makers plus private companies, universities and public research institutes. End-markets include logic, memory, power devices, automotive testing and scientific research.
Independent characterization. Mimasu is best understood as a captive-plus business. Its economic core is a capital-intensive processing relationship with its parent, surrounded by a merchant reclaim franchise, a low-capital distribution arm and a niche equipment maker. Since the 2024 buyout, the question for an outside observer is no longer standalone valuation. It is how much of Shin-Etsu's 300mm finishing capacity runs through Takasaki and whether third-party reclaim stays neutral inside a wafer-maker's group.
Strategy
Stated themes. The FY5/2024 report set out the last formal public strategy. The company would allocate resources selectively to semiconductor materials processing and aim to be a strong business not swayed by cycles. By division:
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Semiconductor Division: build on large-diameter processing, establish more precise and productive processes, expand capacity and improve QCDS.
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Industrial Sales Division: anticipate user needs in semiconductors and build a stable base outside them.
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Engineering Division: specialise as a development unit, jointly promote spin processors and develop equipment for in-house use.
Management targeted improvement in return on assets and return on equity, but gave no numeric medium-term targets.
Strategy under Shin-Etsu. The tender documents remain the most detailed public statement of direction. Shin-Etsu and Mimasu identified these aims:
Timely allocation of wafer capacity: Intended effect: Share production technology, equipment and resources; optimise production, inventory and logistics; strengthen supply chains
Talent exchange: Intended effect: Joint development for higher-density, faster, lower-power devices; use of the group's Gunma sites
Broader wafer range: Intended effect: Combine product knowledge, including cross-selling and AI-related wafers
Lower investment cost: Intended effect: Use group funding for large capex rather than external borrowing
Reclaim technology applied to new wafers: Intended effect: Use polishing, cleaning and film technology to cut energy in new wafer production and support green transformation
Spin processor overseas sales: Intended effect: Use Shin-Etsu's overseas customer network
Disaster risk diversification: Intended effect: Spread supply chain and manufacturing risk
Lower listing costs: Intended effect: Redirect listing-related resources to business growth
Mimasu also stated it aims to expand 300mm reclaim share using the group's customers and sales network, and that future investment would be needed for automation and high precision as bonded-wafer and similar technologies advance. Shin-Etsu said the existing business model and customer relationships would stay in place for the time being.
Other initiatives in the last 24 months. These are the Multi-Stakeholder Policy (January 2025), annual updates to environmental data (May 2025 and June 2026) and a Facilities Headquarters (June 2026). The last of these suggests the capacity programme is a standing management priority. Sustainability priorities are environmental protection, products that support sustainable society and a good workplace with long-term talent.
Targets and plan. No current targets are public. The JPY 77 billion plant is the largest project in the company's history. The business plan given to the tender adviser, which management said did not presume the transaction, ran as follows. Fiscal years end May, as planned before the change of year end.
Revenue (JPY M): FY2025: 84367; FY2026: 89891; FY2027: 101983; FY2028: 108218; FY2029: 112533
Operating income (JPY M): FY2025: 10232; FY2026: 11956; FY2027: 14662; FY2028: 16073; FY2029: 17534
EBITDA (JPY M): FY2025: 21232; FY2026: 21026; FY2027: 32666; FY2028: 35133; FY2029: 34597
The plan's implied depreciation doubles from about JPY 9 billion to about JPY 18 billion from FY2027, showing when management expected the new plant to reach the income statement. In practice, sales for the year to February 2026 of JPY 95.0 billion were ahead of the FY2026 plan, while operating income of JPY 9.7 billion was behind it. The periods differ by three months, so the comparison is indicative.
Products & Services
Pricing is not publicly disclosed for any line. The company states it has obtained certification under the international quality management system standard for prime wafer production.
Semiconductor Division
| Offering | Description | Capabilities | Target customer | Timing |
|---|---|---|---|---|
| Prime wafer processing | Contract mirror polishing and finishing of silicon wafers | Leading-edge flatness and cleaning; large-diameter focus, with 300mm the current growth driver; world-class cleanroom production | Shin-Etsu Handotai | Since 1966; 300mm-dedicated plant scheduled for July 2025 |
| Reclaimed wafers | Collection and restoration of used test and monitor wafers to quality equivalent to new test wafers | Enables repeat use; about one-eighth of the CO2 of a new test wafer; 300mm reclaim is a stated strength | Device makers in Japan and overseas | Described as a main business alongside prime wafers |
The company says the CO2 avoided through reclaimed wafers exceeds its total emissions. Shipments of reclaimed wafers have also been shifted from aircraft and truck to ship and rail.
Engineering Division products
| Product | Model | Key specifications | Application |
|---|---|---|---|
| Spin etcher and spin cleaner | MSE4000 / MSC4000 | 2 chambers; 6 and 8 inch; up to two chemicals with temperature control, recovery and circulation | Single-wafer treatment |
| Spin etcher and spin cleaner | MSE5000 / MSC5000 | 2 chambers; 8 and 12 inch; same chemical handling | Single-wafer treatment |
| Spin etcher and spin cleaner | MSE6000 / MSC6000 | 4 chambers; 6 and 8 inch; same chemical handling | Higher-throughput treatment |
| Spin etcher and spin cleaner | MSE9000 / MSC9000 | 8 chambers; 12 inch; same chemical handling | High-throughput 300mm treatment |
| Multi-bath batch cleaner | Carrierless batch cleaning system | Carrierless transport; 25, 13 or 5 wafers per batch; hot-water pull-up with infrared drying; FOUP loader and unloader; reduced chemical and water use; small footprint | Pre-diffusion and other high-cleanliness cleaning |
| Quartz tube cleaner | MQC series | Fully automated; tube rotation and parts-cleaning attachment standard; tubes for 4 to 12 inch wafers | Furnace quartz maintenance |
| Chemical supply system | MSP series | Customised automatic high-purity supply; temperature-controlled circulation filtration; temperature, leak and exhaust sensors; pump or nitrogen-pressure delivery | Acids, alkalis, organic solvents and slurry |
The MSE series handles silicon etching after backgrinding and various metal etches, offers infrared real-time or EL rate-managed thickness endpoint detection, holds warped thin wafers on a fin chuck for simultaneous two-sided rinsing, and uses a "hanging hand" for thin wafer handling. The MSC series handles resist stripping, polymer residue removal and metal impurity cleaning, with two-fluid, ultrasonic and ozone options. Spin processors are used to make IGBTs for electric and hybrid vehicles, and Mimasu's tender documents say they are highly regarded by domestic power semiconductor customers. Launch years by model are not publicly disclosed.
The company site also lists pure water plants and wastewater treatment facilities in the Engineering Division's design scope, along with manufacturing, inspection and test systems.
Industrial Sales Division catalog
| Category | Product families |
|---|---|
| Semiconductor facilities | Pure water systems, cleanrooms, clean benches, vacuum pumps and gauges |
| Semiconductor manufacturing | Ingot orientation and bonding, slicing machines, wire saws, cleaning, epitaxial growth, plasma CVD, ion implantation, etching, sputtering, mask aligners, wafer steppers, wafer feeders, wire bonders, vacuum furnaces, vacuum deposition, freeze dryers |
| Evaluation and inspection | Lifetime testers, oxygen concentration meters, flatness testers, gas analysers, particle counters, film thickness and resistivity meters, mask defect inspection, IC microscopes, helium leak detectors |
| Analytical | Electron microscopes, X-ray microanalysers, Auger, NMR, ESR, surface and mass analysis, FT-IR, ICP, liquid, gas, ion and supercritical chromatography, thermal analysis, electrophoresis, viscoelasticity, particle size and fluorescence instruments |
| Environmental | Water quality monitors, air pollution analysers |
| Optical | Metallurgical, stereo, ultrasonic, laser, probe and industrial microscopes, profile projectors, borescopes, video microscopes, CCD cameras |
| Measuring | Furnace control, tachometers, pressure, displacement, acceleration, vibration, torque and strain instruments, recorders, thermometers, viscometers, seismic monitors, sound level meters, FFT, spectrum and logic analysers, oscilloscopes, multimeters, roughness, roundness and 3D coordinate measurement |
| Testing | Universal materials testers, vibration testers, hardness testers, thermal shock chambers, temperature and humidity chambers, weather meters, fade meters, gas corrosion testers |
| Custom and industrial | Engine fuel injection test systems, engine component leak testers, industrial robots, laser, ultrasonic and EDM machines, insert machines, positioning systems, compressor and automotive performance test systems, remote monitoring, power supplies |
Principal supply partners listed by the company include ULVAC, ESPEC, Evident, Instron Japan, Ono Sokki, Organo, Komatsu NTC, SCREEN Holdings, CHINO, DISCO, Tokyo Seimitsu, Onto Innovation Japan, Nikon, JEOL, JASCO, Pall Japan, Hitachi High-Tech Analysis, Buehler, Mitutoyo and Rion.
Financial Narrative
The last complete statutory financial statements in the public domain cover the five years to 31 May 2024 (Japanese GAAP, non-consolidated). Those years appear as FY2020 to FY2024. Abbreviated results for the two later periods follow from gazette notices. Ratios are calculated from the filed statements. ROE and ROA use average balances, and ROIC uses year-end invested capital.
Income statement
Reported revenue CAGR from FY5/2020 to FY5/2024 was -0.8%. That figure understates activity, since the net-revenue accounting change removed JPY 19,488 million from FY5/2022 alone. On the old basis FY5/2022 sales would have been about JPY 93.9 billion, up about 10% on FY5/2021. No diluted shares exist, so basic and diluted EPS are identical.
The main story is a rising operating margin on flat reported sales. Operating income nearly doubled from FY5/2020 to FY5/2023 for three reasons:
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Semiconductor Division volumes rose on 300mm demand.
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Equipment installed in the earlier build-out rolled off a short three-to-five-year depreciation schedule, and depreciation fell from JPY 18.6 billion to JPY 8.2 billion.
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Net revenue reporting mechanically lifted percentage margins.
EBITDA actually declined over the period, a useful reminder that much of the margin gain was depreciation timing rather than cash earnings. FY5/2022 also absorbed a JPY 2,391 million depreciation increase from shortening the useful life of some air-conditioning equipment. FY5/2024 profits fell as device-market inventory correction cut Semiconductor Division sales by 11.9%.
The gross margin swing in FY5/2023 and FY5/2024 must be read with SG&A. R&D within SG&A was JPY 6,529 million in FY5/2023 and JPY 2,243 million in FY5/2024, moving the two lines in opposite directions. The filings give no reason for the jump, so operating margin is the steadier measure.
Balance sheet
Goodwill was nil in every year. The balance sheet was net cash throughout, with no bank borrowing after the final JPY 100 million repayment in FY5/2021. Construction in progress rose from JPY 1,476 million at May 2022 to JPY 12,862 million at May 2024 as the new plant advanced. A first finance lease of about JPY 1.0 billion appeared in FY5/2024, with terms of up to 15 years.
Cash flow
Operating cash flow fell in FY5/2022 because receivables grew JPY 12,875 million, in part because net revenue reporting leaves gross receivables on a smaller sales line. FY5/2024 recovered on a JPY 4,877 million reduction in receivables. Free cash flow turned negative that year as interim payments on the new plant started. On an accrual basis, FY5/2024 capex was JPY 20,281 million, against JPY 15,436 million in FY5/2023 and JPY 5,395 million in FY5/2022.
Ratios
Interest expense rounded to zero through FY5/2023 and was JPY 10 million in FY5/2024, giving coverage of about 1,000 times. Interest-bearing leverage was therefore not a constraint on the listed company. Receivable and payable days rose from FY5/2022 because balances remain gross while net revenue and related cost fell. Inventory days rose for a real reason: inventories more than doubled from JPY 4,458 million to JPY 11,542 million, with merchandise (including semiconductor materials stock of JPY 2,147 million at May 2024) and spare parts both contributing.
Results after delisting
Gazette notices are the only regular source after delisting. The February 2025 period covers nine months, so growth percentages between it and the following year are not meaningful.
For the year to February 2026 the company reported operating income of JPY 9,659 million, ordinary income of JPY 9,003 million and net assets of JPY 91,740 million. That means an operating margin of 10.2%, a net margin of 6.6% and an equity ratio of about 48%, down from 67.3% at May 2024.
Total assets rose by JPY 79.4 billion in one year and implied liabilities reached about JPY 99.2 billion, against JPY 39.6 billion at May 2024. The timing matches the plant's scheduled completion, and the tender documents anticipated large outlays funded with group support. The composition of that liability is not publicly disclosed. Annualising the nine-month figure suggests underlying sales growth of around 3% in the latest year.
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Segment Overview
| Segment | Contents | Main products |
|---|---|---|
Semiconductor Division | Processing and sale of semiconductor materials | Prime wafer processing, reclaimed wafers |
Industrial Sales Division | Sales of instruments, testing machines and precision equipment; sales of Engineering Division output | Metrology, analytical and optical instruments, testers, semiconductor equipment, in-house spin processors |
Engineering Division | Development, design and manufacture of automation and wet-process equipment | Spin processors, cleaning systems, chemical supply systems, custom machinery |
Segment sales including inter-segment
| Segment sales including inter-segment | FY2020 | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|---|
Semiconductor Division (JPY Mn) | 45,538 | 46,532 | 48,449 | 53,446 | 47,079 |
Industrial Sales Division (JPY Mn) | 46,905 | 39,102 | 27,516 | 39,401 | 43,695 |
Engineering Division (JPY Mn) | 5,797 | 3,203 | 5,089 | 7,823 | 5,690 |
Eliminations (JPY Mn) | -6,165 | -3,786 | -6,623 | -9,734 | -7,356 |
Total sales (JPY Mn) | 92,075 | 85,051 | 74,432 | 90,936 | 89,109 |
External sales
| External sales | FY2020 | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|---|
Semiconductor Division (JPY Mn) | 45,533 | 46,529 | 48,447 | 53,443 | 47,077 |
Industrial Sales Division (JPY Mn) | 46,541 | 38,522 | 25,984 | 37,493 | 42,031 |
Segment operating profit
| Segment operating profit | FY2020 | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|---|
Semiconductor Division (JPY Mn) | 4,356 | 5,071 | 5,720 | 8,201 | 7,249 |
Industrial Sales Division (JPY Mn) | 1,331 | 894 | 1,540 | 2,490 | 2,600 |
Engineering Division (JPY Mn) | 1,000 | 551 | 676 | 1,115 | 866 |
Eliminations (JPY Mn) | -758 | -432 | -380 | -631 | -404 |
Operating income (JPY Mn) | 5,930 | 6,085 | 7,557 | 11,177 | 10,312 |
Segment margin on sales including inter-segment (%)
| Segment margin on sales including inter-segment (%) | FY2020 | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|---|
Semiconductor Division (%) | 9.6 | 10.9 | 11.8 | 15.3 | 15.4 |
Industrial Sales Division (%) | 2.8 | 2.3 | 5.6 | 6.3 | 6.0 |
Engineering Division (%) | 17.2 | 17.2 | 13.3 | 14.3 | 15.2 |
Share of external sales (%)
| Share of external sales (%) | FY2020 | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|---|
Semiconductor Division (%) | 49.5 | 54.7 | 65.1 | 58.8 | 52.8 |
Industrial Sales Division (%) | 50.5 | 45.3 | 34.9 | 41.2 | 47.2 |
Segment year-on-year growth (%)
| Segment year-on-year growth (%) | FY2021 | FY2023 | FY2024 |
|---|---|---|---|
Semiconductor Division sales (%) | 2.2 | 10.3 | -11.9 |
Industrial Sales Division sales (%) | -16.6 | 43.2 | 10.9 |
Engineering Division sales (%) | -44.7 | 53.7 | -27.3 |
Segment Revenue
| Employees by segment | FY2022 | FY2023 | FY2024 |
|---|---|---|---|
Semiconductor Division | 973 | 1,012 | 1,053 |
Industrial Sales Division | 62 | 59 | 58 |
Engineering Division | 38 | 40 | 41 |
Corporate | 32 | 33 | 34 |
Total employees | 1,105 | 1,144 | 1,186 |
Income Statement and Per-Share Data
| Metric | FY2020 | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|---|
Revenue (JPY Mn) | 92,075 | 85,051 | 74,432 | 90,936 | 89,109 |
Gross profit (JPY Mn) | 10,765 | 11,052 | 13,953 | 21,395 | 16,021 |
Operating income (JPY Mn) | 5,930 | 6,085 | 7,557 | 11,177 | 10,312 |
Depreciation (JPY Mn) | 18,585 | 16,505 | 13,219 | 8,239 | 9,983 |
EBITDA, operating income plus depreciation (JPY Mn) | 24,515 | 22,590 | 20,776 | 19,416 | 20,295 |
Ordinary income (JPY Mn) | 5,626 | 6,027 | 7,564 | 11,001 | 10,152 |
Pre-tax income (JPY Mn) | 5,626 | 6,027 | 7,503 | 11,001 | 10,310 |
Net income (JPY Mn) | 3,874 | 4,133 | 5,126 | 7,618 | 7,146 |
EPS basic and diluted (JPY) | 120.60 | 128.68 | 159.59 | 237.16 | 222.47 |
Dividends per share (JPY) | 32 | 33 | 45 | 64 | 32 |
Gross margin (%) | 11.7 | 13.0 | 18.7 | 23.5 | 18.0 |
Operating margin (%) | 6.4 | 7.2 | 10.2 | 12.3 | 11.6 |
EBITDA margin (%) | 26.6 | 26.6 | 27.9 | 21.4 | 22.8 |
Net margin (%) | 4.2 | 4.9 | 6.9 | 8.4 | 8.0 |
Balance Sheet and Per-Share Data
| Metric | FY2020 | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|---|
Total assets (JPY Mn) | 101,576 | 94,135 | 104,280 | 124,339 | 121,181 |
Cash and deposits (JPY Mn) | 18,333 | 23,121 | 25,326 | 27,240 | 20,478 |
Short-term debt including lease obligations (JPY Mn) | 100 | 0 | 0 | 0 | 59 |
Long-term debt including lease obligations (JPY Mn) | 0 | 0 | 0 | 0 | 974 |
Net debt (JPY Mn) | -18,233 | -23,121 | -25,326 | -27,240 | -19,445 |
Equity (JPY Mn) | 63,541 | 66,680 | 70,602 | 76,396 | 81,589 |
Intangible assets (JPY Mn) | 1,135 | 936 | 858 | 809 | 790 |
Working capital (JPY Mn) | 14,106 | 26,491 | 36,583 | 33,324 | 29,578 |
Book value per share (JPY) | 1,977.88 | 2,075.67 | 2,197.78 | 2,378.18 | 2,539.85 |
Cash Flow
| Metric | FY2020 | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|---|
Operating cash flow (JPY Mn) | 22,261 | 22,833 | 9,595 | 14,272 | 18,567 |
Capex, tangible and intangible cash paid (JPY Mn) | 19,982 | 16,834 | 6,165 | 10,261 | 23,128 |
Free cash flow (JPY Mn) | 2,279 | 5,999 | 3,430 | 4,011 | -4,561 |
Dividends paid (JPY Mn) | 995 | 1,026 | 1,155 | 1,861 | 2,055 |
Share buybacks, odd-lot purchases (JPY Mn) | 1 | 2 | 0 | 1 | 1 |
Returns & Leverage Ratios (%) and Financial Ratios (x)
| Metric | FY2020 | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|---|
ROE (%) | 6.2 | 6.3 | 7.5 | 10.4 | 9.0 |
ROA (%) | 3.9 | 4.2 | 5.2 | 6.7 | 5.8 |
ROIC, after tax on equity plus debt less cash (%) | 9.0 | 9.6 | 11.4 | 15.7 | 11.5 |
Current ratio (times) | 1.38 | 2.00 | 2.10 | 1.70 | 1.77 |
Debt to equity (times) | 0.002 | 0 | 0 | 0 | 0.013 |
Net debt to EBITDA (times) | -0.74 | -1.02 | -1.22 | -1.40 | -0.96 |
Asset turnover (times) | 0.93 | 0.87 | 0.75 | 0.80 | 0.73 |
Inventory days | 20 | 24 | 34 | 55 | 58 |
Receivable days | 108 | 104 | 182 | 161 | 144 |
Payable days | 91 | 90 | 146 | 162 | 153 |
Cash conversion cycle (days) | 37 | 37 | 70 | 53 | 49 |
Equity ratio (%) | 62.6 | 70.8 | 67.7 | 61.4 | 67.3 |
Income Statement
| Metric | FY5/2024 | FY2/2025 | FY2/2026 |
|---|---|---|---|
Revenue (JPY Mn) | 89,109 | 69,342 | 95,045 |
Net income (JPY Mn) | 7,146 | 6,864 | 6,243 |
Retained earnings (JPY Mn) | 48,556 | 49,143 | 53,637 |
Total assets (JPY Mn) | 121,181 | 111,587 | 190,943 |
Revenue by Region
| Region (FY to May) | FY2023 | FY2024 |
|---|---|---|
Japan (JPY Mn) | 79,022 | 75,497 |
Asia (JPY Mn) | 8,500 | 9,995 |
Other (JPY Mn) | 3,413 | 3,616 |
Total (JPY Mn) | 90,936 | 89,109 |
Region share and growth (%)
| Region share and growth (%) | FY2023 | FY2024 |
|---|---|---|
Japan share (%) | 86.9 | 84.7 |
Asia share (%) | 9.3 | 11.2 |
Other share (%) | 3.8 | 4.1 |
Revenue by product group
| Revenue by product group | FY2023 | FY2024 |
|---|---|---|
Semiconductor materials (JPY Mn) | 60,198 | 57,601 |
Instruments, testers and other sales (JPY Mn) | 24,650 | 26,563 |
Semiconductor equipment manufacture (JPY Mn) | 6,087 | 4,943 |
Revenue by Region and Revenue by Region (%)
| Dependence on Shin-Etsu | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|
Sales to Shin-Etsu Handotai (JPY Mn) | 46,169 | 41,426 | 50,492 | 45,224 |
Shin-Etsu Handotai share of sales (%) | 54.3 | 55.7 | 55.5 | 50.8 |
Shin-Etsu group share of sales (%) | 57.3 | 58.7 | 59.0 | 55.1 |
Share data
| Share data | FY2020 | FY2021 | FY2022 | FY2023 | FY2024 |
|---|---|---|---|---|---|
High (JPY) | 2,618 | 3,235 | 2,897 | 3,210 | 3,805 |
Low (JPY) | 1,404 | 2,023 | 1,999 | 1,861 | 2,397 |
Year-end P/E (times) | 18.6 | 19.9 | 15.1 | 12.6 | 16.6 |
Total shareholder return from May 2019 (%) | 153.7 | 177.9 | 170.1 | 214.4 | 264.1 |
TOPIX with dividends (%) | 106.2 | 133.3 | 135.8 | 155.4 | 207.0 |
Payout ratio (%) | 26.5 | 25.6 | 28.2 | 27.0 | 14.4 |
Valuation Multiples
| Multiple | Mimasu at tender | RS Technologies, February 2026 |
|---|---|---|
P/E (times) | 16.6 | 11.3 |
P/B (times) | 1.46 | Not used |
EV/EBITDA (times) | 4.9 | Not used |
EV/Sales (times) | 1.12 | Not used |
Price/Sales (times) | 1.33 | 1.37 |
Lease Maturity At May 2024 Details
| Lease maturity at May 2024 | Within 1 year | 1-2 years | 2-3 years | 3-4 years | 4-5 years | Over 5 years |
|---|---|---|---|---|---|---|
Lease obligations (JPY Mn) | 59 | 61 | 62 | 64 | 65 | 719 |
Analyst Conclusions
Guidance and consensus. Mimasu withdrew forecasts in 2024 and now publishes no guidance. There is no consensus. The closest public proxy is Shin-Etsu, which guides FY3/2027 sales of JPY 2,700,000 million (+4.9%), operating income of JPY 700,000 million (+10.2%) and net income of JPY 525,000 million (+10.7%). SEMI expects 2026 wafer shipments to grow 11.8%.
Bull case.
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The 300mm plant arrives into a record wafer market, and management's plan had revenue reaching JPY 112.5 billion and EBITDA about JPY 35 billion by FY2029.
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Reclaim demand rises with advanced nodes, while competitors' plants run full, supporting pricing and share.
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Group integration lowers cost, raises utilization and opens foreign spin processor sales, with funding risk removed.
Bear case.
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Operating margin was already down to 10.2% in the latest year before full depreciation of the new plant, and non-AI demand can remain soft, as SUMCO's 2025 result shows.
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Taiwanese rivals have capacity, customer proximity and margins that a Japan-only reclaim operation will struggle to match.
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Inside a wafer group, Mimasu's profits depend on internal transfer pricing and allocation, so value can move to the parent and third-party reclaim customers may diversify.
Key catalysts and monitorables (next 12 months):
Gazette results for the year to February 2027: Why it matters: First clean year-on-year comparison, and first view of plant depreciation
Any statement on new plant operating status: Why it matters: Confirms ramp timing
Shin-Etsu electronic materials commentary: Why it matters: Shows group wafer demand
SEMI quarterly shipment reports: Why it matters: Leading indicator for prime volumes
RS, Phoenix and Kinik capacity updates: Why it matters: Sets reclaim supply and pricing
Leadership succession: Why it matters: Chairman and president are 83 and 75
Overseas spin processor orders: Why it matters: Test of a named deal synergy
Analyst verdict. Mimasu has completed the transition from a modestly valued, cash-rich listed processor to a strategic asset inside the world's largest silicon wafer group. Its record supports that status. Over the five years to May 2024 it raised operating income by 74% on an almost debt-free balance sheet and returned 264% to shareholders. Yet that record also needs care. EBITDA declined, margins benefited from depreciation run-off and accounting changes, and more than half of sales always depended on one related customer.
The buyout was logical for both sides. Shin-Etsu secured a critical finishing step and reclaim capability, and Mimasu shed the burden of funding a JPY 77 billion plant alone and of defending that spending to public investors. The price of 4.9 times EBITDA looks modest in hindsight, given the strength of AI-led wafer demand and the investment case the tender documents describe.
The next phase will be judged on utilization. The balance sheet has nearly doubled, liabilities have more than doubled and profit has yet to follow: operating income in the latest year was below both the FY5/2023 peak and the pre-deal plan. A strong wafer cycle argues that the plant is well timed, but the economic benefit may be recorded in the parent's wafer segment rather than visibly at Mimasu.
The reclaim franchise is the competitive question. Mimasu's claim to global leadership is now seriously contested, and the fastest capacity growth lies in Taiwan. Holding share in premium 300mm reclaim, without overseas plants, will require group sales reach and technical differentiation.
For suppliers, customers and competitors, the sensible stance is to treat Mimasu as a durable, well-funded and increasingly opaque extension of Shin-Etsu. Execution risk is moderate, financial risk is low and stand-alone visibility will stay limited.
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View Subscription PlansExecutive Leadership
Board of Directors
| Name | Title | Age | Tenure and prior roles |
|---|---|---|---|
Masayuki Nakazawa (中澤 正幸) | Representative Director and Chairman | 83 | Joined Mimasu Sansho 1974; director 1977; president 1993 and again 1999 to 2017; chairman since August 2017 |
Tatsuro Yako (八髙 達郎) | Representative Director and President | 75 | Joined 1985; head of accounting and administration; director 2001; senior managing director 2012; president since August 2023 |
Tetsuo Yamazaki (山﨑 哲生) | Senior Managing Director | 67 | Joined 1980; production manager; head of Semiconductor Division 2016; senior managing director since 2023 |
Fumiaki Maruyama (丸山 文明) | Managing Director, Technology HQ | 59 | Joined 1991; technology manager; head of Technology HQ 2023; director 2023; managing director from May 2026 |
Koichi Imamura (今村 耕一) | Director, Facilities HQ | 58 | Joined 1991; head of Semiconductor Division 2021; director 2023; Facilities HQ from June 2026 |
Teruo Iwakura (岩倉 輝夫) | Corporate Auditor | 64 | Joined 1985; head of accounting and administration; full-time auditor since 2023 |
Directors' Remuneration
| Category (JPY Mn, FY5/2024) | Total | Base | Bonus | Number |
|---|---|---|---|---|
Directors excluding outside | 213 | 147 | 66 | 7 |
Auditors excluding outside | 13 | 13 | 0 | 2 |
Outside officers | 35 | 35 | 0 | 7 |
Board & Management Changes
| Date | Change |
|---|---|
August 2023 | Yako succeeded Nobuaki Hosoya as president; board refreshed with Imamura, Maruyama and three outside directors |
May 2024 | Personnel changes announced before the tender offer |
February to March 2025 | Nagata and Matsuda become executive officers; finance, HR, general affairs, digital technology and engineering managers reshuffled |
August to September 2025 | Sales and administration changes; Yamamoto heads Administration HQ |
May to June 2026 | Maruyama promoted; Imamura to Facilities HQ; Nagata to head Semiconductor Division |
Major Shareholders
| Holder at 31 May 2024 | Shares (thousand) | Stake (%) |
|---|---|---|
Shin-Etsu Chemical Co., Ltd. | 13,733 | 42.75 |
The Master Trust Bank of Japan (trust account) | 2,527 | 7.87 |
Masayuki Nakazawa | 1,979 | 6.16 |
MSIP Client Securities | 1,473 | 4.59 |
Nomura Securities (own transfer account) | 800 | 2.49 |
Custody Bank of Japan (trust account) | 734 | 2.29 |
The Gunma Bank | 701 | 2.18 |
BNYM SA/NV for BNYM GCM Client Accounts M LSCB RD | 477 | 1.49 |
BNYM as Agent Clients 10 Percent | 430 | 1.34 |
JP JPMSE Lux Nomura International PLC 1 Ex Co | 425 | 1.32 |
Competitive Landscape
Key Competitors
| Competitor | Base | Segment | Latest revenue | Positioning |
|---|---|---|---|---|
RS Technologies | Japan | Reclaim, prime wafers | JPY 76,707 M (FY12/2025); reclaim JPY 27,528 M | Pure-play leader; claims about 33% of 12-inch reclaim; plants in Japan, Taiwan and China |
Phoenix Silicon International | Taiwan | Reclaim, wafer thinning | NT$4.5 B (2025) | Fastest-growing large player; 850,000 12-inch wafers per month, targeting 1.2 M |
Kinik | Taiwan | Reclaim, CMP disks, grinding wheels | NT$8,149 M (2025); test and reclaim wafers 46% | 330,000 per month, 400,000 planned; TSMC-linked |
Hamada Rectech | Japan | Reclaim | — | Named top-five player |
Scientech | Taiwan | Reclaim | Reclaim revenue not publicly disclosed | Equipment and reclaim |
Ferrotec | Japan, China | Reclaim, wafers | Reclaim revenue not publicly disclosed | China reclaim capacity |
Pure Wafer | US | Reclaim | — | Western supply |
GST, Topco Scientific, KST World, Xtek, Shinryo, Vatech, OPTIM Wafer Services | Various | Reclaim and related | — | Regional reclaim suppliers |
SUMCO | Japan | Prime wafers, indirect | JPY 409.6 B (2025) | Main rival to Shin-Etsu's wafer group, and hence to Mimasu's prime volumes |
GlobalWafers | Taiwan | Prime wafers, indirect | Operating income NT$8.6 B (2025) | Global expansion in the US and Italy |
SCREEN, Tokyo Electron and similar | Japan | Wet-process tools | Larger scale | Compete with spin processors and cleaners |
“—” = not publicly disclosed.
Peer Comparison FY2012
| Company | Period | Revenue (M, local) | Growth (%) | Operating margin (%) |
|---|---|---|---|---|
Mimasu | FY5/2024 | JPY 89109 | -2.0 | 11.6 |
RS Technologies | FY12/2025 | JPY 76707 | 29.6 | 18.6 |
SUMCO | FY12/2025 | JPY 409600 | 3.3 | 0.3 |
Phoenix Silicon | FY2025 | NT$4500 | 31.5 (first nine months) | 21.9 |
Recent Developments
Mimasu's own disclosure is sparse since delisting, so the register includes industry and parent events that directly affect it.



