Company ProfilePremium

Mimasu Semiconductor Industry

Company Profile Analysis

三益半導体工業株式会社

ESOMAR 23 Corporate BadgeISO Certifications Badge
Mimasu Semiconductor Industry - Semiconductor showcase

Year Founded & Workforce

1963

1,165 Employees

Industry

Semiconductor
Mimasu Semiconductor Industry logo

Mimasu Semiconductor Industry Employee Contacts

We don't hold contact details for this company yet — you can request them.

Request Employee Contacts

Mimasu Semiconductor Industry Overview

Mimasu is a Japanese specialist in precision silicon wafer processing, with a business that began in 1966, before semiconductors were widely known. Its core activity is contract polishing and finishing of prime silicon wafers for Shin-Etsu Handotai, the group's wafer manufacturer, alongside a reclaim business that restores customers' used test and monitor wafers to as-new quality. Two smaller divisions broaden the model. One is a technical trading house selling measuring, testing and semiconductor equipment. The other is an engineering unit building spin processors and wet-process tools, used both by customers and in-house. Revenue reached JPY 95.0 billion in the year to February 2026. The company has concentrated its manufacturing in Takasaki and committed JPY 77 billion to a dedicated 300mm plant. Full ownership by Shin-Etsu since 2024 has turned it from an independent listed processor into an integrated capacity arm of the world's largest silicon wafer group, with far less public disclosure.

The company's own description. The FY5/2024 annual securities report says Mimasu's three divisions are deeply engaged in the semiconductor industry and work together "as a trinity". It puts safety first, conducts fair business and aims to raise corporate value. The stated focus is the core semiconductor materials processing business and continued refinement of the advanced processing technology that underpins the industry, delivering high quality and low cost. The company's name reflects a founding spirit in which shareholders, customers and the company are bound by trust and prosper together.

What the company does. The Semiconductor Division polishes and finishes silicon wafers. Prime wafer processing is commissioned by Shin-Etsu Handotai, which supplies the material. Mimasu therefore earns mainly a processing fee (加工料収入) rather than selling wafers it owns, which is why its balance sheet carries little prime wafer stock relative to revenue. In reclaim, Mimasu collects test and monitor wafers used by device makers and restores them to quality equivalent to new test wafers so they can be used repeatedly.

The Industrial Sales Division (産商事業部) calls itself a "technical trading company". It sells instruments, testing machines, precision equipment and semiconductor process tools from third-party makers, and also sells the Engineering Division's products. The Engineering Division designs and builds automation and wet-process equipment. It has no external revenue of its own, because its products reach customers through Industrial Sales or go to the Semiconductor Division.

Revenue model. Mimasu's income falls into three reported types, shown below from the annual securities reports. Revenue is transactional or contract processing. There is no subscription or licensing line.

Merchandise sales (JPY M): FY2021: 36942; FY2022: 21751; FY2023: 31405; FY2024: 37089

Product sales (JPY M): FY2021: 1581; FY2022: 4235; FY2023: 6087; FY2024: 4943

Processing fees (JPY M): FY2021: 46527; FY2022: 48445; FY2023: 53444; FY2024: 47076

Total sales (JPY M): FY2021: 85051; FY2022: 74432; FY2023: 90936; FY2024: 89109

Fiscal years in this table end on 31 May. From FY5/2022 the revenue recognition standard moved agency transactions to a net basis, which cut that year's sales by JPY 19,488 million, of which JPY 19,433 million fell in Industrial Sales. FY5/2021 was not restated, so the fall in merchandise sales between those two years is mainly accounting.

Value chain position. Mimasu sits between crystal growth and device fabrication. Shin-Etsu Handotai grows and supplies silicon, Mimasu performs high-precision flatness and cleaning steps, and the finished wafers go to device makers. In reclaim it sits after the fab, in a closed loop with device makers. Its equipment and trading activities supply the same fabs and laboratories.

Customer types and end-markets. Shin-Etsu Handotai is the dominant customer. The trade receivable ledger at 31 May 2024 also named Hitachi High-Tech (JPY 7,739 million), Renesas Electronics (JPY 2,223 million), Shin-Etsu Chemical (JPY 1,811 million) and Kioxia (JPY 1,482 million). Notes and electronically recorded receivables named Sony Semiconductor Manufacturing, ROHM, Sanko Shoji, Mitsubishi Materials and Nipro Medical Engineering. Recruitment materials describe customers as domestic and overseas device makers plus private companies, universities and public research institutes. End-markets include logic, memory, power devices, automotive testing and scientific research.

Independent characterization. Mimasu is best understood as a captive-plus business. Its economic core is a capital-intensive processing relationship with its parent, surrounded by a merchant reclaim franchise, a low-capital distribution arm and a niche equipment maker. Since the 2024 buyout, the question for an outside observer is no longer standalone valuation. It is how much of Shin-Etsu's 300mm finishing capacity runs through Takasaki and whether third-party reclaim stays neutral inside a wafer-maker's group.

Strategy

Stated themes. The FY5/2024 report set out the last formal public strategy. The company would allocate resources selectively to semiconductor materials processing and aim to be a strong business not swayed by cycles. By division:

  • Semiconductor Division: build on large-diameter processing, establish more precise and productive processes, expand capacity and improve QCDS.

  • Industrial Sales Division: anticipate user needs in semiconductors and build a stable base outside them.

  • Engineering Division: specialise as a development unit, jointly promote spin processors and develop equipment for in-house use.

Management targeted improvement in return on assets and return on equity, but gave no numeric medium-term targets.

Strategy under Shin-Etsu. The tender documents remain the most detailed public statement of direction. Shin-Etsu and Mimasu identified these aims:

Timely allocation of wafer capacity: Intended effect: Share production technology, equipment and resources; optimise production, inventory and logistics; strengthen supply chains

Talent exchange: Intended effect: Joint development for higher-density, faster, lower-power devices; use of the group's Gunma sites

Broader wafer range: Intended effect: Combine product knowledge, including cross-selling and AI-related wafers

Lower investment cost: Intended effect: Use group funding for large capex rather than external borrowing

Reclaim technology applied to new wafers: Intended effect: Use polishing, cleaning and film technology to cut energy in new wafer production and support green transformation

Spin processor overseas sales: Intended effect: Use Shin-Etsu's overseas customer network

Disaster risk diversification: Intended effect: Spread supply chain and manufacturing risk

Lower listing costs: Intended effect: Redirect listing-related resources to business growth

Mimasu also stated it aims to expand 300mm reclaim share using the group's customers and sales network, and that future investment would be needed for automation and high precision as bonded-wafer and similar technologies advance. Shin-Etsu said the existing business model and customer relationships would stay in place for the time being.

Other initiatives in the last 24 months. These are the Multi-Stakeholder Policy (January 2025), annual updates to environmental data (May 2025 and June 2026) and a Facilities Headquarters (June 2026). The last of these suggests the capacity programme is a standing management priority. Sustainability priorities are environmental protection, products that support sustainable society and a good workplace with long-term talent.

Targets and plan. No current targets are public. The JPY 77 billion plant is the largest project in the company's history. The business plan given to the tender adviser, which management said did not presume the transaction, ran as follows. Fiscal years end May, as planned before the change of year end.

Revenue (JPY M): FY2025: 84367; FY2026: 89891; FY2027: 101983; FY2028: 108218; FY2029: 112533

Operating income (JPY M): FY2025: 10232; FY2026: 11956; FY2027: 14662; FY2028: 16073; FY2029: 17534

EBITDA (JPY M): FY2025: 21232; FY2026: 21026; FY2027: 32666; FY2028: 35133; FY2029: 34597

The plan's implied depreciation doubles from about JPY 9 billion to about JPY 18 billion from FY2027, showing when management expected the new plant to reach the income statement. In practice, sales for the year to February 2026 of JPY 95.0 billion were ahead of the FY2026 plan, while operating income of JPY 9.7 billion was behind it. The periods differ by three months, so the comparison is indicative.

Products & Services

Pricing is not publicly disclosed for any line. The company states it has obtained certification under the international quality management system standard for prime wafer production.

Semiconductor Division

OfferingDescriptionCapabilitiesTarget customerTiming
Prime wafer processingContract mirror polishing and finishing of silicon wafersLeading-edge flatness and cleaning; large-diameter focus, with 300mm the current growth driver; world-class cleanroom productionShin-Etsu HandotaiSince 1966; 300mm-dedicated plant scheduled for July 2025
Reclaimed wafersCollection and restoration of used test and monitor wafers to quality equivalent to new test wafersEnables repeat use; about one-eighth of the CO2 of a new test wafer; 300mm reclaim is a stated strengthDevice makers in Japan and overseasDescribed as a main business alongside prime wafers

The company says the CO2 avoided through reclaimed wafers exceeds its total emissions. Shipments of reclaimed wafers have also been shifted from aircraft and truck to ship and rail.

Engineering Division products

ProductModelKey specificationsApplication
Spin etcher and spin cleanerMSE4000 / MSC40002 chambers; 6 and 8 inch; up to two chemicals with temperature control, recovery and circulationSingle-wafer treatment
Spin etcher and spin cleanerMSE5000 / MSC50002 chambers; 8 and 12 inch; same chemical handlingSingle-wafer treatment
Spin etcher and spin cleanerMSE6000 / MSC60004 chambers; 6 and 8 inch; same chemical handlingHigher-throughput treatment
Spin etcher and spin cleanerMSE9000 / MSC90008 chambers; 12 inch; same chemical handlingHigh-throughput 300mm treatment
Multi-bath batch cleanerCarrierless batch cleaning systemCarrierless transport; 25, 13 or 5 wafers per batch; hot-water pull-up with infrared drying; FOUP loader and unloader; reduced chemical and water use; small footprintPre-diffusion and other high-cleanliness cleaning
Quartz tube cleanerMQC seriesFully automated; tube rotation and parts-cleaning attachment standard; tubes for 4 to 12 inch wafersFurnace quartz maintenance
Chemical supply systemMSP seriesCustomised automatic high-purity supply; temperature-controlled circulation filtration; temperature, leak and exhaust sensors; pump or nitrogen-pressure deliveryAcids, alkalis, organic solvents and slurry

The MSE series handles silicon etching after backgrinding and various metal etches, offers infrared real-time or EL rate-managed thickness endpoint detection, holds warped thin wafers on a fin chuck for simultaneous two-sided rinsing, and uses a "hanging hand" for thin wafer handling. The MSC series handles resist stripping, polymer residue removal and metal impurity cleaning, with two-fluid, ultrasonic and ozone options. Spin processors are used to make IGBTs for electric and hybrid vehicles, and Mimasu's tender documents say they are highly regarded by domestic power semiconductor customers. Launch years by model are not publicly disclosed.

The company site also lists pure water plants and wastewater treatment facilities in the Engineering Division's design scope, along with manufacturing, inspection and test systems.

Industrial Sales Division catalog

CategoryProduct families
Semiconductor facilitiesPure water systems, cleanrooms, clean benches, vacuum pumps and gauges
Semiconductor manufacturingIngot orientation and bonding, slicing machines, wire saws, cleaning, epitaxial growth, plasma CVD, ion implantation, etching, sputtering, mask aligners, wafer steppers, wafer feeders, wire bonders, vacuum furnaces, vacuum deposition, freeze dryers
Evaluation and inspectionLifetime testers, oxygen concentration meters, flatness testers, gas analysers, particle counters, film thickness and resistivity meters, mask defect inspection, IC microscopes, helium leak detectors
AnalyticalElectron microscopes, X-ray microanalysers, Auger, NMR, ESR, surface and mass analysis, FT-IR, ICP, liquid, gas, ion and supercritical chromatography, thermal analysis, electrophoresis, viscoelasticity, particle size and fluorescence instruments
EnvironmentalWater quality monitors, air pollution analysers
OpticalMetallurgical, stereo, ultrasonic, laser, probe and industrial microscopes, profile projectors, borescopes, video microscopes, CCD cameras
MeasuringFurnace control, tachometers, pressure, displacement, acceleration, vibration, torque and strain instruments, recorders, thermometers, viscometers, seismic monitors, sound level meters, FFT, spectrum and logic analysers, oscilloscopes, multimeters, roughness, roundness and 3D coordinate measurement
TestingUniversal materials testers, vibration testers, hardness testers, thermal shock chambers, temperature and humidity chambers, weather meters, fade meters, gas corrosion testers
Custom and industrialEngine fuel injection test systems, engine component leak testers, industrial robots, laser, ultrasonic and EDM machines, insert machines, positioning systems, compressor and automotive performance test systems, remote monitoring, power supplies

Principal supply partners listed by the company include ULVAC, ESPEC, Evident, Instron Japan, Ono Sokki, Organo, Komatsu NTC, SCREEN Holdings, CHINO, DISCO, Tokyo Seimitsu, Onto Innovation Japan, Nikon, JEOL, JASCO, Pall Japan, Hitachi High-Tech Analysis, Buehler, Mitutoyo and Rion.

Financial Narrative

The last complete statutory financial statements in the public domain cover the five years to 31 May 2024 (Japanese GAAP, non-consolidated). Those years appear as FY2020 to FY2024. Abbreviated results for the two later periods follow from gazette notices. Ratios are calculated from the filed statements. ROE and ROA use average balances, and ROIC uses year-end invested capital.

Income statement

Reported revenue CAGR from FY5/2020 to FY5/2024 was -0.8%. That figure understates activity, since the net-revenue accounting change removed JPY 19,488 million from FY5/2022 alone. On the old basis FY5/2022 sales would have been about JPY 93.9 billion, up about 10% on FY5/2021. No diluted shares exist, so basic and diluted EPS are identical.

The main story is a rising operating margin on flat reported sales. Operating income nearly doubled from FY5/2020 to FY5/2023 for three reasons:

  • Semiconductor Division volumes rose on 300mm demand.

  • Equipment installed in the earlier build-out rolled off a short three-to-five-year depreciation schedule, and depreciation fell from JPY 18.6 billion to JPY 8.2 billion.

  • Net revenue reporting mechanically lifted percentage margins.

EBITDA actually declined over the period, a useful reminder that much of the margin gain was depreciation timing rather than cash earnings. FY5/2022 also absorbed a JPY 2,391 million depreciation increase from shortening the useful life of some air-conditioning equipment. FY5/2024 profits fell as device-market inventory correction cut Semiconductor Division sales by 11.9%.

The gross margin swing in FY5/2023 and FY5/2024 must be read with SG&A. R&D within SG&A was JPY 6,529 million in FY5/2023 and JPY 2,243 million in FY5/2024, moving the two lines in opposite directions. The filings give no reason for the jump, so operating margin is the steadier measure.

Balance sheet

Goodwill was nil in every year. The balance sheet was net cash throughout, with no bank borrowing after the final JPY 100 million repayment in FY5/2021. Construction in progress rose from JPY 1,476 million at May 2022 to JPY 12,862 million at May 2024 as the new plant advanced. A first finance lease of about JPY 1.0 billion appeared in FY5/2024, with terms of up to 15 years.

Cash flow

Operating cash flow fell in FY5/2022 because receivables grew JPY 12,875 million, in part because net revenue reporting leaves gross receivables on a smaller sales line. FY5/2024 recovered on a JPY 4,877 million reduction in receivables. Free cash flow turned negative that year as interim payments on the new plant started. On an accrual basis, FY5/2024 capex was JPY 20,281 million, against JPY 15,436 million in FY5/2023 and JPY 5,395 million in FY5/2022.

Ratios

Interest expense rounded to zero through FY5/2023 and was JPY 10 million in FY5/2024, giving coverage of about 1,000 times. Interest-bearing leverage was therefore not a constraint on the listed company. Receivable and payable days rose from FY5/2022 because balances remain gross while net revenue and related cost fell. Inventory days rose for a real reason: inventories more than doubled from JPY 4,458 million to JPY 11,542 million, with merchandise (including semiconductor materials stock of JPY 2,147 million at May 2024) and spare parts both contributing.

Results after delisting

Gazette notices are the only regular source after delisting. The February 2025 period covers nine months, so growth percentages between it and the following year are not meaningful.

For the year to February 2026 the company reported operating income of JPY 9,659 million, ordinary income of JPY 9,003 million and net assets of JPY 91,740 million. That means an operating margin of 10.2%, a net margin of 6.6% and an equity ratio of about 48%, down from 67.3% at May 2024.

Total assets rose by JPY 79.4 billion in one year and implied liabilities reached about JPY 99.2 billion, against JPY 39.6 billion at May 2024. The timing matches the plant's scheduled completion, and the tender documents anticipated large outlays funded with group support. The composition of that liability is not publicly disclosed. Annualising the nine-month figure suggests underlying sales growth of around 3% in the latest year.

Unlock Company Financials

Unlock this company profile to view its financial data.

View Subscription Plans

Financial Detail

Segment Overview

SegmentContentsMain products

Semiconductor Division

Processing and sale of semiconductor materials

Prime wafer processing, reclaimed wafers

Industrial Sales Division

Sales of instruments, testing machines and precision equipment; sales of Engineering Division output

Metrology, analytical and optical instruments, testers, semiconductor equipment, in-house spin processors

Engineering Division

Development, design and manufacture of automation and wet-process equipment

Spin processors, cleaning systems, chemical supply systems, custom machinery

Segment sales including inter-segment

Segment sales including inter-segmentFY2020FY2021FY2022FY2023FY2024

Semiconductor Division (JPY Mn)

45,53846,53248,44953,44647,079

Industrial Sales Division (JPY Mn)

46,90539,10227,51639,40143,695

Engineering Division (JPY Mn)

5,7973,2035,0897,8235,690

Eliminations (JPY Mn)

-6,165-3,786-6,623-9,734-7,356

Total sales (JPY Mn)

92,07585,05174,43290,93689,109

External sales

External salesFY2020FY2021FY2022FY2023FY2024

Semiconductor Division (JPY Mn)

45,53346,52948,44753,44347,077

Industrial Sales Division (JPY Mn)

46,54138,52225,98437,49342,031

Segment operating profit

Segment operating profitFY2020FY2021FY2022FY2023FY2024

Semiconductor Division (JPY Mn)

4,3565,0715,7208,2017,249

Industrial Sales Division (JPY Mn)

1,3318941,5402,4902,600

Engineering Division (JPY Mn)

1,0005516761,115866

Eliminations (JPY Mn)

-758-432-380-631-404

Operating income (JPY Mn)

5,9306,0857,55711,17710,312

Segment margin on sales including inter-segment (%)

Segment margin on sales including inter-segment (%)FY2020FY2021FY2022FY2023FY2024

Semiconductor Division (%)

9.610.911.815.315.4

Industrial Sales Division (%)

2.82.35.66.36.0

Engineering Division (%)

17.217.213.314.315.2

Share of external sales (%)

Share of external sales (%)FY2020FY2021FY2022FY2023FY2024

Semiconductor Division (%)

49.554.765.158.852.8

Industrial Sales Division (%)

50.545.334.941.247.2

Segment year-on-year growth (%)

Segment year-on-year growth (%)FY2021FY2023FY2024

Semiconductor Division sales (%)

2.210.3-11.9

Industrial Sales Division sales (%)

-16.643.210.9

Engineering Division sales (%)

-44.753.7-27.3

Segment Revenue

Employees by segmentFY2022FY2023FY2024

Semiconductor Division

9731,0121,053

Industrial Sales Division

625958

Engineering Division

384041

Corporate

323334

Total employees

1,1051,1441,186

Income Statement and Per-Share Data

MetricFY2020FY2021FY2022FY2023FY2024

Revenue (JPY Mn)

92,07585,05174,43290,93689,109

Gross profit (JPY Mn)

10,76511,05213,95321,39516,021

Operating income (JPY Mn)

5,9306,0857,55711,17710,312

Depreciation (JPY Mn)

18,58516,50513,2198,2399,983

EBITDA, operating income plus depreciation (JPY Mn)

24,51522,59020,77619,41620,295

Ordinary income (JPY Mn)

5,6266,0277,56411,00110,152

Pre-tax income (JPY Mn)

5,6266,0277,50311,00110,310

Net income (JPY Mn)

3,8744,1335,1267,6187,146

EPS basic and diluted (JPY)

120.60128.68159.59237.16222.47

Dividends per share (JPY)

3233456432

Gross margin (%)

11.713.018.723.518.0

Operating margin (%)

6.47.210.212.311.6

EBITDA margin (%)

26.626.627.921.422.8

Net margin (%)

4.24.96.98.48.0

Balance Sheet and Per-Share Data

MetricFY2020FY2021FY2022FY2023FY2024

Total assets (JPY Mn)

101,57694,135104,280124,339121,181

Cash and deposits (JPY Mn)

18,33323,12125,32627,24020,478

Short-term debt including lease obligations (JPY Mn)

10000059

Long-term debt including lease obligations (JPY Mn)

0000974

Net debt (JPY Mn)

-18,233-23,121-25,326-27,240-19,445

Equity (JPY Mn)

63,54166,68070,60276,39681,589

Intangible assets (JPY Mn)

1,135936858809790

Working capital (JPY Mn)

14,10626,49136,58333,32429,578

Book value per share (JPY)

1,977.882,075.672,197.782,378.182,539.85

Cash Flow

MetricFY2020FY2021FY2022FY2023FY2024

Operating cash flow (JPY Mn)

22,26122,8339,59514,27218,567

Capex, tangible and intangible cash paid (JPY Mn)

19,98216,8346,16510,26123,128

Free cash flow (JPY Mn)

2,2795,9993,4304,011-4,561

Dividends paid (JPY Mn)

9951,0261,1551,8612,055

Share buybacks, odd-lot purchases (JPY Mn)

12011

Returns & Leverage Ratios (%) and Financial Ratios (x)

MetricFY2020FY2021FY2022FY2023FY2024

ROE (%)

6.26.37.510.49.0

ROA (%)

3.94.25.26.75.8

ROIC, after tax on equity plus debt less cash (%)

9.09.611.415.711.5

Current ratio (times)

1.382.002.101.701.77

Debt to equity (times)

0.0020000.013

Net debt to EBITDA (times)

-0.74-1.02-1.22-1.40-0.96

Asset turnover (times)

0.930.870.750.800.73

Inventory days

2024345558

Receivable days

108104182161144

Payable days

9190146162153

Cash conversion cycle (days)

3737705349

Equity ratio (%)

62.670.867.761.467.3

Income Statement

MetricFY5/2024FY2/2025FY2/2026

Revenue (JPY Mn)

89,10969,34295,045

Net income (JPY Mn)

7,1466,8646,243

Retained earnings (JPY Mn)

48,55649,14353,637

Total assets (JPY Mn)

121,181111,587190,943

Revenue by Region

Region (FY to May)FY2023FY2024

Japan (JPY Mn)

79,02275,497

Asia (JPY Mn)

8,5009,995

Other (JPY Mn)

3,4133,616

Total (JPY Mn)

90,93689,109

Region share and growth (%)

Region share and growth (%)FY2023FY2024

Japan share (%)

86.984.7

Asia share (%)

9.311.2

Other share (%)

3.84.1

Revenue by product group

Revenue by product groupFY2023FY2024

Semiconductor materials (JPY Mn)

60,19857,601

Instruments, testers and other sales (JPY Mn)

24,65026,563

Semiconductor equipment manufacture (JPY Mn)

6,0874,943

Revenue by Region and Revenue by Region (%)

Dependence on Shin-EtsuFY2021FY2022FY2023FY2024

Sales to Shin-Etsu Handotai (JPY Mn)

46,16941,42650,49245,224

Shin-Etsu Handotai share of sales (%)

54.355.755.550.8

Shin-Etsu group share of sales (%)

57.358.759.055.1

Share data

Share dataFY2020FY2021FY2022FY2023FY2024

High (JPY)

2,6183,2352,8973,2103,805

Low (JPY)

1,4042,0231,9991,8612,397

Year-end P/E (times)

18.619.915.112.616.6

Total shareholder return from May 2019 (%)

153.7177.9170.1214.4264.1

TOPIX with dividends (%)

106.2133.3135.8155.4207.0

Payout ratio (%)

26.525.628.227.014.4

Valuation Multiples

MultipleMimasu at tenderRS Technologies, February 2026

P/E (times)

16.611.3

P/B (times)

1.46

Not used

EV/EBITDA (times)

4.9

Not used

EV/Sales (times)

1.12

Not used

Price/Sales (times)

1.331.37

Lease Maturity At May 2024 Details

Lease maturity at May 2024Within 1 year1-2 years2-3 years3-4 years4-5 yearsOver 5 years

Lease obligations (JPY Mn)

5961626465719

Analyst Conclusions

Guidance and consensus. Mimasu withdrew forecasts in 2024 and now publishes no guidance. There is no consensus. The closest public proxy is Shin-Etsu, which guides FY3/2027 sales of JPY 2,700,000 million (+4.9%), operating income of JPY 700,000 million (+10.2%) and net income of JPY 525,000 million (+10.7%). SEMI expects 2026 wafer shipments to grow 11.8%.

Bull case.

  1. The 300mm plant arrives into a record wafer market, and management's plan had revenue reaching JPY 112.5 billion and EBITDA about JPY 35 billion by FY2029.

  2. Reclaim demand rises with advanced nodes, while competitors' plants run full, supporting pricing and share.

  3. Group integration lowers cost, raises utilization and opens foreign spin processor sales, with funding risk removed.

Bear case.

  1. Operating margin was already down to 10.2% in the latest year before full depreciation of the new plant, and non-AI demand can remain soft, as SUMCO's 2025 result shows.

  2. Taiwanese rivals have capacity, customer proximity and margins that a Japan-only reclaim operation will struggle to match.

  3. Inside a wafer group, Mimasu's profits depend on internal transfer pricing and allocation, so value can move to the parent and third-party reclaim customers may diversify.

Key catalysts and monitorables (next 12 months):

Gazette results for the year to February 2027: Why it matters: First clean year-on-year comparison, and first view of plant depreciation

Any statement on new plant operating status: Why it matters: Confirms ramp timing

Shin-Etsu electronic materials commentary: Why it matters: Shows group wafer demand

SEMI quarterly shipment reports: Why it matters: Leading indicator for prime volumes

RS, Phoenix and Kinik capacity updates: Why it matters: Sets reclaim supply and pricing

Leadership succession: Why it matters: Chairman and president are 83 and 75

Overseas spin processor orders: Why it matters: Test of a named deal synergy

Analyst verdict. Mimasu has completed the transition from a modestly valued, cash-rich listed processor to a strategic asset inside the world's largest silicon wafer group. Its record supports that status. Over the five years to May 2024 it raised operating income by 74% on an almost debt-free balance sheet and returned 264% to shareholders. Yet that record also needs care. EBITDA declined, margins benefited from depreciation run-off and accounting changes, and more than half of sales always depended on one related customer.

The buyout was logical for both sides. Shin-Etsu secured a critical finishing step and reclaim capability, and Mimasu shed the burden of funding a JPY 77 billion plant alone and of defending that spending to public investors. The price of 4.9 times EBITDA looks modest in hindsight, given the strength of AI-led wafer demand and the investment case the tender documents describe.

The next phase will be judged on utilization. The balance sheet has nearly doubled, liabilities have more than doubled and profit has yet to follow: operating income in the latest year was below both the FY5/2023 peak and the pre-deal plan. A strong wafer cycle argues that the plant is well timed, but the economic benefit may be recorded in the parent's wafer segment rather than visibly at Mimasu.

The reclaim franchise is the competitive question. Mimasu's claim to global leadership is now seriously contested, and the fastest capacity growth lies in Taiwan. Holding share in premium 300mm reclaim, without overseas plants, will require group sales reach and technical differentiation.

For suppliers, customers and competitors, the sensible stance is to treat Mimasu as a durable, well-funded and increasingly opaque extension of Shin-Etsu. Execution risk is moderate, financial risk is low and stand-alone visibility will stay limited.

Unlock Company Financials

Unlock this company profile to view its financial data.

View Subscription Plans

Executive Leadership

Board of Directors

NameTitleAgeTenure and prior roles

Masayuki Nakazawa (中澤 正幸)

Representative Director and Chairman

83

Joined Mimasu Sansho 1974; director 1977; president 1993 and again 1999 to 2017; chairman since August 2017

Tatsuro Yako (八髙 達郎)

Representative Director and President

75

Joined 1985; head of accounting and administration; director 2001; senior managing director 2012; president since August 2023

Tetsuo Yamazaki (山﨑 哲生)

Senior Managing Director

67

Joined 1980; production manager; head of Semiconductor Division 2016; senior managing director since 2023

Fumiaki Maruyama (丸山 文明)

Managing Director, Technology HQ

59

Joined 1991; technology manager; head of Technology HQ 2023; director 2023; managing director from May 2026

Koichi Imamura (今村 耕一)

Director, Facilities HQ

58

Joined 1991; head of Semiconductor Division 2021; director 2023; Facilities HQ from June 2026

Teruo Iwakura (岩倉 輝夫)

Corporate Auditor

64

Joined 1985; head of accounting and administration; full-time auditor since 2023

Directors' Remuneration

Category (JPY Mn, FY5/2024)TotalBaseBonusNumber

Directors excluding outside

213147667

Auditors excluding outside

131302

Outside officers

353507

Board & Management Changes

DateChange

August 2023

Yako succeeded Nobuaki Hosoya as president; board refreshed with Imamura, Maruyama and three outside directors

May 2024

Personnel changes announced before the tender offer

February to March 2025

Nagata and Matsuda become executive officers; finance, HR, general affairs, digital technology and engineering managers reshuffled

August to September 2025

Sales and administration changes; Yamamoto heads Administration HQ

May to June 2026

Maruyama promoted; Imamura to Facilities HQ; Nagata to head Semiconductor Division

Major Shareholders

Holder at 31 May 2024Shares (thousand)Stake (%)

Shin-Etsu Chemical Co., Ltd.

13,73342.75

The Master Trust Bank of Japan (trust account)

2,5277.87

Masayuki Nakazawa

1,9796.16

MSIP Client Securities

1,4734.59

Nomura Securities (own transfer account)

8002.49

Custody Bank of Japan (trust account)

7342.29

The Gunma Bank

7012.18

BNYM SA/NV for BNYM GCM Client Accounts M LSCB RD

4771.49

BNYM as Agent Clients 10 Percent

4301.34

JP JPMSE Lux Nomura International PLC 1 Ex Co

4251.32

Competitive Landscape

Key Competitors

CompetitorBaseSegmentLatest revenuePositioning

RS Technologies

Japan

Reclaim, prime wafers

JPY 76,707 M (FY12/2025); reclaim JPY 27,528 M

Pure-play leader; claims about 33% of 12-inch reclaim; plants in Japan, Taiwan and China

Phoenix Silicon International

Taiwan

Reclaim, wafer thinning

NT$4.5 B (2025)

Fastest-growing large player; 850,000 12-inch wafers per month, targeting 1.2 M

Kinik

Taiwan

Reclaim, CMP disks, grinding wheels

NT$8,149 M (2025); test and reclaim wafers 46%

330,000 per month, 400,000 planned; TSMC-linked

Hamada Rectech

Japan

Reclaim

—

Named top-five player

Scientech

Taiwan

Reclaim

Reclaim revenue not publicly disclosed

Equipment and reclaim

Ferrotec

Japan, China

Reclaim, wafers

Reclaim revenue not publicly disclosed

China reclaim capacity

Pure Wafer

US

Reclaim

—

Western supply

GST, Topco Scientific, KST World, Xtek, Shinryo, Vatech, OPTIM Wafer Services

Various

Reclaim and related

—

Regional reclaim suppliers

SUMCO

Japan

Prime wafers, indirect

JPY 409.6 B (2025)

Main rival to Shin-Etsu's wafer group, and hence to Mimasu's prime volumes

GlobalWafers

Taiwan

Prime wafers, indirect

Operating income NT$8.6 B (2025)

Global expansion in the US and Italy

SCREEN, Tokyo Electron and similar

Japan

Wet-process tools

Larger scale

Compete with spin processors and cleaners

“—” = not publicly disclosed.

Peer Comparison FY2012

CompanyPeriodRevenue (M, local)Growth (%)Operating margin (%)

Mimasu

FY5/2024

JPY 89109

-2.011.6

RS Technologies

FY12/2025

JPY 76707

29.618.6

SUMCO

FY12/2025

JPY 409600

3.30.3

Phoenix Silicon

FY2025

NT$4500

31.5 (first nine months)

21.9

Recent Developments

Mimasu's own disclosure is sparse since delisting, so the register includes industry and parent events that directly affect it.

Company Snapshot

$588.6M

Revenue

1,165

Employees

1963

Founded

Takasaki, Japan

Headquarters

SWOT Analysis

Strengths

  • Shin-Etsu's 100% ownership gives access to group capital, removing the funding risk on a JPY 77 billion project.
  • Sales to the group of 55.1% of the total in FY5/2024 provide secure base volume.
  • Over 60 years of wafer processing experience since 1966 underpin the claim to world-leading flatness and cleaning.
  • Semiconductor Division margin rose from 9.6% in FY5/2020 to 15.4% in FY5/2024.
  • Mimasu's in-house equipment arm supported 15.2% margins and gives process know-how that pure processors lack.
  • Waste recycling reached 99% of waste generated in 2025 (8,724 t of 8,812 t).
  • A net cash position of JPY 19.4 billion at May 2024 preceded the investment cycle.

Weaknesses

  • Shin-Etsu Handotai alone was 50.8% of FY5/2024 sales.
  • All production is in Takasaki, with Kamigo holding JPY 34,953 million of the book value.
  • No plants exist outside Japan, while reclaim rivals operate in Taiwan and China.
  • Free cash flow was JPY -4,561 million in FY5/2024 and leverage has risen.
  • Industrial Sales' margin was only 6.0% in FY5/2024.
  • EBITDA fell from JPY 24,515 million in FY5/2020 to JPY 20,295 million in FY5/2024.
  • Chairman and president are 83 and 75, a clear succession matter despite recent promotions.

Opportunities

  • SEMI projects record wafer shipments through 2029.
  • Reclaim consumption rises with node shrink, at 2.7 wafers per 2nm wafer per Phoenix.
  • Shin-Etsu's overseas network could open foreign sales of spin processors, a named synergy.
  • Asia sales grew 17.6% in FY5/2024 to JPY 9,995 million.
  • Reclaimed wafers emit about one-eighth of the CO2 of new test wafers, supporting fab decarbonisation.
  • Power device demand supports IGBT-related tool sales, where Mimasu lists 12-inch spin tools.
  • Order backlog of JPY 22,704 million at May 2024 was 2.3 times the prior year's, led by Industrial Sales at JPY 17,052 million.

Threats

  • Phoenix targets 1.2 million wafers per month, and RS Technologies targets 12-inch reclaim expansion across three countries.
  • Kinik is adding 70,000 12-inch wafers per month from Q3 2026.
  • SUMCO's near-zero 2025 operating income shows how harsh non-AI wafer conditions can be.
  • Depreciation in management's own plan roughly doubles from FY2027, and a shortfall in volume would hit margins.
  • Prolonged water restrictions were named as a medium-term risk, with 8.0 million cubic metres used in 2025.
  • The company's 2024 audit-triggered correction showed retroactive pricing can change reported results.

Unlock Company Financials

Unlock this company profile to view its financial data.

View Subscription Plans

Key Developments

DateEventSignificance
28 May 2025Environmental activity page updatedAnnual disclosure continues without a listing requirement
July 2025Scheduled completion month of the 300mm plantLargest investment in company history
18 July 2025Personnel changes effective 1 AugustSales and business management reshuffle
21 August 2025Personnel changes effective 1 SeptemberYamamoto becomes Administration HQ head; quality assurance head named
9 October 2025Press reports Phoenix Silicon overtaking RS Technologies in reclaim, with a NT$1.85 billion Taichung plant plannedSharper Taiwanese capacity competition
28 October 2025SEMI forecasts wafer shipment recovery through 2028Supportive volume outlook
31 December 2025Press reports TSMC 2nm expansion lifting reclaim capacity plans at Phoenix and KinikAdvanced nodes use more reclaimed wafers
10 February 2026SEMI reports 2025 wafer shipments +5.8% and revenue -1.2%Volume improved, pricing did not
10 February 2026SUMCO reports operating income of only JPY 1.3 billion for 2025Non-AI wafer demand remained weak
16 February 2026RS Technologies posts record 2025 results and a 2026 to 2028 planMain Japanese reclaim rival accelerates investment
28 February 2026Fiscal year closes; sales JPY 95,045 million; 1,165 employeesFirst full February year
28 April 2026Shin-Etsu reports FY3/2026 operating income down 14.4%, with electronic materials upParent's semiconductor segment remains its growth area
29 April 2026SEMI reports Q1 2026 wafer shipments +13.1%AI-led recovery broadens
May 2026RS Technologies says Sanbongi and Tainan reclaim plants ran at full capacity in Q1Tight reclaim market
May 2026Kinik reports 12-inch reclaim capacity of 330,000 per month fully used, with 400,000 planned from Q3Further capacity entering in 2026
25 May 2026Maruyama promoted to managing directorTechnology leadership elevated
1 June 2026New organisation; Imamura to Facilities HQ; Nagata to Semiconductor DivisionManagement focus on facilities and generational transition
1 June 2026Environmental page updated with 2025 dataGHG and waste data refreshed
29 July 2026SEMI reports Q2 2026 shipments +7.4% to 3,573 MSIDemand broadening to power, photonics, automotive and industrial
26 August 2026Recruiting profile updated for 2027 graduate intakeContinued hiring for production, technical and sales roles
21 October 2026SEMI forecasts 2026 shipments +11.8% to 14,420 MSI with records through 2029Strong backdrop for ramping new capacity

Financial Performance

Explore key financial metrics, segmented revenue, balance sheet health, and performance trends.

Revenue

7 charts
Segment Sales Including Inter-segment: Total sales fell from JPY 92,075 Mn in FY2020 to JPY 89,109 Mn in FY2024.
Mimasu Semiconductor Industry — Segment Sales Including Inter-segment
Series (JPY Mn)FY2020FY2021FY2022FY2023FY2024
Total sales92,07585,05174,43290,93689,109
Semiconductor Division45,53846,53248,44953,44647,079
Industrial Sales Division46,90539,10227,51639,40143,695
Engineering Division5,7973,2035,0897,8235,690
Eliminations-6,165-3,786-6,623-9,734-7,356

Unlock Company Financials

Unlock this company profile to view its financial data.

View Subscription Plans

Sources

  1. FY5/2024 annual securities report (disclosure2dl.edinet-fsa.go.jp)
  2. FY5/2023 annual securities report (disclosure2dl.edinet-fsa.go.jp)
  3. FY5/2022 annual securities report (disclosure2dl.edinet-fsa.go.jp)
  4. FY5/2024 earnings release (www2.jpx.co.jp)
  5. FY5/2023 earnings release (www2.infomart.co.jp)
  6. FY5/2022 earnings release (www2.jpx.co.jp)
  7. FY5/2021 earnings release (www2.jpx.co.jp)
  8. Q1 FY5/2025 earnings release (www2.jpx.co.jp)
  9. Amended Q3 FY5/2024 quarterly report (disclosure2dl.edinet-fsa.go.jp)
  10. Tender offer opinion, April 2024 (www2.jpx.co.jp)
  11. Tender commencement notice (www2.infomart.co.jp)
  12. Share consolidation notices: and: www2.jpx.co.jp · www2.jpx.co.jp
  13. Extraordinary meeting voting results (disclosure2dl.edinet-fsa.go.jp)
  14. Delisting notice (www2.jpx.co.jp)
  15. Shin-Etsu annual securities reports: and: disclosure2dl.edinet-fsa.go.jp · disclosure2dl.edinet-fsa.go.jp
  16. Shin-Etsu FY3/2025 earnings release (www2.jpx.co.jp)
  17. Company website pages (outline, officers, sites, history, businesses, sustainability, environment, environmental data) (mimasu.co.jp)
  18. Company personnel notices 2025 (mimasu.co.jp)
  19. Gazette results (catr.jp)
  20. Recruitment profile (job.mynavi.jp)
  21. Personnel appointments 2026 (nikkei.com)
  22. New plant coverage: and: setsubitoushi-journal.com · newswitch.jp
  23. Deal coverage: and: eetimes.itmedia.co.jp · nihon-ma.co.jp
  24. RS Technologies: and: japanir.jp · envalith.com · finance.technews.tw · www2.infomart.co.jp
  25. Phoenix Silicon: and: taipeitimes.com · taiwannews.com.tw · ctee.com.tw · craft.co
  26. Kinik: and: financialreports.eu · moneyweekly.com.tw
  27. SUMCO (quartr.com)
  28. GlobalWafers (quartr.com)
  29. Shin-Etsu results and guidance: and: dempa-digital.com · tousaiblog.org · scouter.monex.co.jp
  30. SEMI: and: semi.org · eenewseurope.com · iconnect007.com · iconnect007.com
  31. Reclaim market research: and: imarcgroup.com · hackmd.io · pdf.marketpublishers.com · sphericalinsights.com

Unlock Company Contacts

Connect with Key Decision-Makers

Access verified employee contacts and decision-maker information from this company to support your sales, lead generation, and business development efforts.