Siliconware Precision Industries Co. Ltd Overview
Company Headquarters: Taiwan
Founded: 1984
Workforce: ~24,000
Company Overview: Siliconware Precision Industries Co. Ltd (SPIL) is engaged in the provision of semiconductor packaging, assembly, testing, and bumping services. Its assembly services include IC packaging processes for chipsets. SPIL also provides in-house design and consultation services. The company's test services are used to validate the assembly process by utilizing testing solutions for a range of digital and mixed signal devices. The bumping services include direct bumping, re-passivation, redistribution, wafer level CSP, and gold bumping services. Apart from this, the company offers packaging and testing solution including substrate packages and lead-frame packages with either wire bond or flip chip interconnections. The company also uses technologies such as wafer thinning, wire bonding, stacked-die bonding, wafer bumping, fine-pitch, and flip-chip assembly for developing packages including quad- plastic ball grid array (PBGA), thin and fine-pitch ball grid array (TFBGA), stacked-die chip scale package (CSP), flat no-leads (QFN), wafer level chip scale package (WLCSP), memory card, and flip chip ball grid array (FCBGA). The application of these packages could be observed in personal computers, consumer products, hand-held products, and wire communications. The company’s product portfolio comprises ball grid array, chip scale, stacked die, memory cards, and quad and dual leaded packages. The company's subsidiaries include SPIL (B.V.I.) Holding Limited, Siliconware US Inc., SPIL (Cayman) Holding Limited, and Siliconware Technology (Suzhou) Limited. Geographically, the company offers its solutions to the US, China, Taiwan, Europe, and other regions.
