Texas Instruments Inc. Overview
Texas Instruments occupies the defensible middle of the semiconductor industry: not the leading-edge logic race, but the foundational analog and embedded chips that condition signals and manage power in virtually every electronic system built. Its moat is four-part and self-reinforcing — internally owned 300mm manufacturing that yields roughly 40% lower unpackaged die cost than 200mm; a catalogue of more than 80,000 products that maximises revenue per design engagement; a direct market-reach channel that now carries over 80% of revenue and generates proprietary demand intelligence; and extreme diversity of products, customers and end markets that removes single-point dependency. The trade-off is capital intensity and cyclicality: TI absorbed six years of elevated capex and a deep 2023–2024 downturn to secure geopolitically dependable capacity. With SM1 in production, capex guided down to $2–3 billion for 2026, and revenue re-accelerating at 23% year over year in Q2 2026, the operating leverage that build-out created is now beginning to appear in free cash flow.
Texas Instruments Incorporated is the world's largest supplier of foundational analog and embedded processing semiconductors, and the largest owner of internal analog manufacturing capacity in the United States. The company sits at an unusual point in the semiconductor value chain: it is neither a fabless designer nor a merchant foundry, but an integrated device manufacturer that designs, fabricates, packages, tests, sells and ships more than 80,000 catalogue products, over 80% of them directly to end customers through its own website and salesforce. Its economics are those of a franchise built on breadth rather than on any single socket — over 100,000 customers, roughly half of revenue from outside its 50 largest accounts, and product lifecycles measured in decades. Management measures itself on a single north-star metric: long-term growth in free cash flow per share. The company is presently emerging from a six-year elevated capital expenditure cycle in which it built out 300mm capacity at Richardson and Sherman, Texas, and Lehi, Utah — a build-out that compressed margins and free cash flow through 2023–2025 and is now inflecting favourably as capital spending falls and revenue re-accelerates.
The company's own description
The FY2025 Form 10-K opens with a deliberately plain statement of the business: TI designs and manufactures semiconductors sold to electronics designers and manufacturers worldwide; operations began in 1930; the company is incorporated in Delaware, headquartered in Dallas, and has design, manufacturing or sales operations in more than 30 countries. It reports two reportable segments, Analog and Embedded Processing, with residual activities in Other, and generated $17.68 billion of revenue in 2025.
Management frames the enterprise around three "ambitions" — to act like owners who will hold the company for decades, to adapt and succeed in a changing world, and to be a company employees are proud of and would want as a neighbour — and around a single financial objective: growth of free cash flow per share over the long term. The strategy to achieve that objective has three stated elements: (i) a business model focused on analog and embedded processing built on four sustainable competitive advantages; (ii) disciplined capital allocation; and (iii) efficiency, defined as more output per dollar spent.
The four competitive advantages, as articulated in Item 7 of the FY2025 Form 10-K, are: a strong foundation of manufacturing and technology providing lower cost and supply-chain control; a broad analog and embedded portfolio offering more opportunity per customer; the reach of market channels giving access to more customers and more design projects; and diversity and longevity of products, markets and customer positions providing less single-point dependency and longer returns on investment.
Independent characterisation
TI is best understood as a high-volume catalogue manufacturer operating with the economics of a distribution business layered onto the economics of a fab. Three structural features distinguish it from peers.
First, it is one of the last large vertically integrated analog players with a genuine cost advantage in the fab itself. TI states that an unpackaged chip built on a 300mm wafer costs roughly 40% less than the same die on 200mm. The company's stated goal is to source more than 95% of wafers internally, with over 80% on 300mm, by 2030. Where competitors have moved to asset-light or hybrid models, TI has doubled down on ownership — accepting depreciation drag and fixed-cost exposure in downturns in exchange for structural gross margin and, increasingly, a geopolitical selling proposition ("geopolitically dependable capacity") that has become commercially valuable since 2022.
Second, the revenue model is almost entirely product sales. There is no subscription, licensing or service revenue of material size. Revenue is recognised at a point in time when control transfers — generally on shipment or delivery, or when a customer pulls product from consignment inventory. The company reports no material intersegment revenue. Royalty and licence income, where it exists, sits in other income and expense rather than revenue. This makes TI's top line an unusually clean read on unit demand and price/mix, and makes gross margin an unusually clean read on factory loading.
Third, the channel has been deliberately re-engineered. In 2019 roughly one third of TI's revenue was transacted directly with customers; in 2025 more than 80% was direct, including TI.com. Less than 20% of 2025 revenue flowed through distributors, and TI now offers a single worldwide distributor plus a few region-specific distributors for order fulfilment. The strategic logic is not margin capture but information: direct relationships give TI visibility into design projects earlier and more completely, which converts into more TI content per design.
Customers and end markets
TI sells to over 100,000 customers. One end customer accounted for 12% of revenue in both 2025 and 2024, recognised primarily in the Analog segment; the customer is not named in the 10-K, though TI's own investment announcements identify Apple, Ford, Medtronic, NVIDIA and SpaceX among its major U.S. customers. No customer reached the 10% threshold in 2023.
In 2025 TI realigned its market reporting into five markets. Industrial and automotive each contributed 33% of revenue, personal electronics 21%, data center 9% and communications equipment 3%, with calculators approximately 1%. Management states that industrial, automotive and data center together represent approximately 75% of the business and are expected to grow faster than the overall semiconductor market.
Value chain position
TI is an upstream component supplier two or three tiers removed from the end consumer. It buys wafers, gases, chemicals, substrates and lead frames from a diversified global supplier base; fabricates in-house at 300mm, 200mm and (until April 2026) 150mm; assembles and tests predominantly in-house in Malaysia, the Philippines, China and Mexico; and ships either directly or via consignment programmes. It selectively uses external foundries and subcontractors to supplement capacity, and has been actively transferring products from external foundries and legacy 150mm lines into its new 300mm fabs.
Strategy
Stated strategy — themes from the FY2025 Form 10-K and shareholder letter
Management's objective is stated without hedging: the best metric for owners to measure progress is growth of free cash flow per share over the long term. The three-element strategy is (1) a business model focused on analog and embedded processing built on four sustainable competitive advantages; (2) discipline in allocating capital to the best opportunities; and (3) efficiency, meaning more output for every dollar spent — explicitly distinguished from cost-cutting to the last dollar.
The 2025 shareholder letter adds several concrete strategic claims: TI "rewired" its order fulfilment engine in 2025; free cash flow grew 96% year over year; the company is nearing the end of its six-year elevated capex cycle and is positioned to deliver dependable low-cost 300mm capacity at scale, scalability of capex including capacity modularity, and free cash flow per share growth across a range of market conditions.
Capital allocation record. Over the ten years from 2016 to 2025 TI allocated $109 billion of capital. The largest portion went to organic growth (R&D, sales and marketing, capital expenditure and inventory working capital), of which approximately $24 billion was capital expenditure. The remainder went to dividends, share repurchases and, at the margin, acquisitions.
Announced strategic initiatives, last 24 months
| Date | Initiative | Detail and target |
|---|---|---|
| Mar 2024 | Environmental sustainability targets | 100% renewable electricity for 300mm manufacturing by 2025; 100% U.S. operations by 2027; 100% worldwide by 2030 |
| Nov 2024 | European distribution centre | Fully automated facility near Frankfurt; same-day delivery in central Germany, next-day across most of Europe |
| Dec 2024 / Jan 2025 | CHIPS Act direct funding agreement finalised | Up to $1.61 billion in direct funding from the U.S. Department of Commerce for three large-scale 300mm fabs in Sherman, Texas and Lehi, Utah, tied to milestone achievement, with covenants and clawback provisions |
| Jun 2025 | $60+ billion U.S. manufacturing programme | Seven large-scale connected fabs at three mega-sites; up to $40 billion at Sherman for SM1–SM4; more than 60,000 new U.S. jobs claimed; positioned explicitly as work with the U.S. administration |
| Jul 2025 | OBBBA benefit | CHIPS investment tax credit increased from 25% to 35% for qualifying assets placed in service after 31 December 2025; U.S. R&D and eligible capex expensing |
| Aug 2025 | Expanded Apple partnership | Commitment to support additional tool installations at Lehi and Sherman |
| Sept–Oct 2025 | 150mm consolidation | Closure of remaining 150mm fabs in Dallas and Sherman by 30 April 2026; approximately 400 positions affected; part of transferring products to 300mm |
| Oct 2025 | Board leadership transition | Ilan named Chairman effective January 2026 |
| Dec 2025 | SM1 production start | First Sherman fab in production; will ramp to tens of millions of chips daily |
| Early 2026 | SBTi validation | Science Based Targets initiative validates TI's greenhouse gas reduction targets |
| Feb 2026 | Silicon Labs acquisition | $231.00 per share cash, approximately $7.5 billion enterprise value; expected close first half 2027; approximately $450 million of annual run-rate synergies within three years, over 50% from moving Silicon Labs production into TI fabs |
| 2025–2026 | 300mm sourcing goal | More than 95% of wafers sourced internally with over 80% on 300mm by 2030 |
| 2,025 | End-market realignment | Five markets replacing six, elevating data center to a reported market at 9% of revenue |
Medium-term financial targets and guidance
| Guidance item | Detail |
|---|---|
| Q3 2026 revenue | $5.65 billion to $6.15 billion |
| Q3 2026 EPS | $2.23 to $2.57 |
| 2026 capital expenditure | Approximately $2 billion to $3 billion |
| Post-2026 capital expenditure | Dependent on revenue and growth expectations; management emphasises "capacity modularity" and capex scalability |
| Effective tax rate | Expected to be lower in 2026 and beyond than under prior tax law |
| Wafer sourcing | More than 95% internal, over 80% on 300mm, by 2030 |
| Shareholder returns | Commitment to return all free cash flow to owners over time; 22 consecutive years of dividend increases through 2025 |
| Silicon Labs synergies | Approximately $450 million annual, within three years of close |
TI does not publish multi-year revenue, margin or EPS targets, and has no investor-day-style long-range model of the sort common among peers. Its guidance horizon is a single quarter. This is a long-standing and deliberate practice.
Products & Services
TI's portfolio exceeds 80,000 orderable products. A device-by-device enumeration is not possible in any finite document; what follows is a product-line-by-product-line catalogue at the level of named families and flagship devices, organised by segment as TI organises it. Pricing is catalogue-based and published on TI.com with volume tiers; TI does not disclose product-level pricing in its filings, and no product carries a subscription or licensing revenue model.
ANALOG SEGMENT — POWER PRODUCT LINE
| Sub-line | Description and capability | Named families / flagships | Target customer |
|---|---|---|---|
| DC/DC switching regulators | Step-down (buck), step-up (boost), buck-boost converters and modules; the highest-volume power category. Integrated power modules combine inductor, controller and FETs in one package to cut design time | TPS6xxxx buck converters; LMR family; TPSM power modules; TPS62 low-Iq converters | Industrial control, automotive body, personal electronics, data center rails |
| Multiphase controllers and power stages | High-current core rails for processors and accelerators; 48V-to-core architectures for AI server racks | TPS53xxx multiphase controllers; CSD smart power stages | Data center compute, networking, rack power |
| Battery management | Fuel gauging, charging, cell balancing, protection for single-cell to high-voltage stacks | BQ series gauges, chargers and protectors (e.g. BQ769xx battery monitors) | Personal electronics, e-mobility, energy storage, medical |
| AC/DC and isolated DC/DC | Offline power conversion, isolated bias supplies, integrated isolated converters | UCC family PWM controllers; TPSI integrated isolated switches and drivers | Industrial power delivery, appliances, EV onboard chargers |
| Gallium nitride (GaN) | Integrated GaN FET plus driver stages delivering higher power density and lower switching loss than silicon | LMG series GaN power stages, including LMG3650R for high-density server and industrial supplies | Data center power, solar inverters, fast chargers, EV |
| eFuses and power switches | Circuit protection, hot-swap, load switching with programmable current limits | TPS1685 48V eFuse; TPS2xxx load switches | Data center 48V distribution, industrial protection |
| Linear and LDO regulators, voltage references | Low-noise, low-dropout regulation and precision references for sensitive analog rails | TPS7A low-noise LDOs; REF series references | Test and measurement, medical imaging, RF |
| Lighting products | LED drivers for automotive exterior/interior lighting and general illumination | LP and TPS92xxx LED drivers | Automotive body and lighting, building automation |
| Gate drivers | Isolated and non-isolated drivers for MOSFET, IGBT and SiC | UCC21xxx isolated gate drivers | EV traction inverters, industrial motor drives |
Power products help customers manage power across voltage domains. The FY2025 Form 10-K enumerates the constituent sub-lines as: battery-management solutions; DC/DC switching regulators; AC/DC and isolated DC/DC switching regulators; power switches; linear and low-dropout regulators; voltage references; multiphase controllers and power stages; and lighting products.
ANALOG SEGMENT — SIGNAL CHAIN PRODUCT LINE
| Sub-line | Description and capability | Named families / flagships | Target customer |
|---|---|---|---|
| Amplifiers | Operational, instrumentation, current-sense, comparators; precision (low offset/drift) through high-speed GHz-class | OPA precision op amps; TLV low-power op amps; INA instrumentation and current-sense amplifiers; THS high-speed | Test and measurement, medical, industrial automation, ADAS |
| Data converters | Analog-to-digital and digital-to-analog converters spanning delta-sigma precision to GSPS-class high speed | ADS delta-sigma and SAR ADCs; ADC12/ADC32 high-speed; DAC precision converters | Test and measurement, aerospace and defence, communications infrastructure |
| Interface | RS-485/RS-232, CAN, LIN, USB, Ethernet PHY, LVDS, I2C and SPI translation | SN65HVD / SN75 transceivers; TCAN CAN-FD transceivers; DP83 Ethernet PHYs | Industrial networking, automotive body and infotainment |
| Isolation | Capacitive galvanic isolation for signal, power and communications, replacing optocouplers | ISO digital isolators; ISOW integrated signal-and-power isolators; AMC isolated amplifiers | EV powertrain, grid infrastructure, industrial drives |
| Motor drivers | Brushed DC, stepper, BLDC drivers with integrated FETs and sensorless control | DRV motor driver family | Robotics, appliances, industrial automation, printers |
| Clocks and timing | Oscillators, buffers, jitter cleaners, synchronisers | LMK jitter cleaners and clock generators | Communications equipment, data center networking, test |
| Logic | Standard and translation logic, voltage-level shifters, buffers | SN74 logic families; LSF/TXS translators | Universal — every end market |
| Sensing | Temperature, humidity, magnetic (Hall), inductive, capacitive, current, mmWave-adjacent sensing | TMP temperature sensors; HDC humidity; DRV/TMAG Hall sensors; LDC inductive sensing | Building automation, medical, appliances, automotive |
Signal Chain products sense, condition and measure real-world signals and convert them into transferable data. The 10-K names the constituent categories as amplifiers, data converters, interface products, motor drives, clocks, logic and sensing products.
EMBEDDED PROCESSING SEGMENT
| Sub-line | Description and capability | Named families / flagships | Target customer |
|---|---|---|---|
| General-purpose MCUs | Arm Cortex-M0+ based cost-optimised MCUs with integrated analog; TI's principal volume MCU push of the current generation | MSPM0 family | Appliances, industrial sensors, personal electronics, motor control |
| Ultra-low-power MCUs | 16-bit architecture optimised for battery and energy-harvesting applications; long-lived franchise | MSP430 family | Metering, portable medical, building automation |
| Real-time control MCUs | C28x DSP core plus control peripherals for high-frequency control loops in power conversion and traction | C2000 family (e.g. TMS320F28xx) | EV traction inverters, solar and energy-storage inverters, industrial drives |
| Functional-safety MCUs | Lockstep dual-core Arm Cortex-R architecture for ASIL-D / SIL-3 systems | Hercules TMS570 and RM4x families | Automotive braking and steering, industrial safety |
| Arm MCUs and processors | Cortex-M4F class MCUs and Cortex-A class applications processors for Linux-based embedded systems | Sitara AM2x MCUs; Sitara AM6x processors | Factory automation, HMI, edge gateways, robotics |
| Automotive ADAS and vision processors | Heterogeneous SoCs combining Arm cores, DSPs and deep-learning accelerators for perception | Jacinto TDA4 family; DRA processors for infotainment | ADAS Tier-1 suppliers, OEM infotainment and cluster |
| mmWave radar | Single-chip 60GHz and 77GHz FMCW radar sensors integrating RF, ADC and processing | AWR automotive radar; IWR industrial radar | Automotive corner/cabin radar, building occupancy, industrial level sensing |
| Wireless connectivity | Sub-1GHz, Bluetooth Low Energy, Zigbee/Thread/Matter, Wi-Fi | SimpleLink CC13xx sub-1GHz; CC26xx BLE/multiprotocol; CC33xx Wi-Fi | Smart home, building automation, industrial IoT, medical wearables |
| Development ecosystem | Code Composer Studio IDE, SDKs, SysConfig, LaunchPad and BoosterPack evaluation hardware, TI Edge AI tooling — provided to drive silicon attach, not sold as a revenue line | Code Composer Studio; SimpleLink SDK; Processor SDK | All embedded customers |
The FY2025 Form 10-K describes the segment as containing microcontrollers, processors, wireless connectivity and radar products. Microcontrollers are self-contained systems combining a processor core, memory and peripherals, frequently integrating analog functionality; processors are optimised for specific embedded computing tasks.
Note: the pending Silicon Labs acquisition, if completed, would add approximately 1,200 products to this segment — wireless microcontrollers and IoT-specialised sensor devices — materially deepening the connectivity sub-line.
OTHER
| Sub-line | Description and capability | Named families / flagships | Target customer |
|---|---|---|---|
| DLP products | Digital Micromirror Device technology projecting high-definition images; also used in 3D printing, industrial lithography, spectroscopy and automotive headlamps/HUD | DLP Pico chipsets for compact projection; DLP automotive display and dynamic ground projection chipsets | Projector OEMs, automotive lighting, industrial 3D printing |
| Calculators | Graphing and scientific calculators with an entrenched U.S. secondary-education curriculum position; approximately 1% of 2025 revenue | TI-84 Plus CE; TI-Nspire CX II; TI-30 scientific series | Education (school districts, retail) |
| Custom ASICs | Customer-specific integrated circuits built on TI process technology; carrying value written down in 2025 via non-cash goodwill impairment | Not individually branded | Aerospace and defence, select industrial OEMs |
Pricing model. TI publishes list and volume-tier pricing on TI.com for the catalogue portfolio, offers evaluation modules and samples, and negotiates contract pricing with large direct accounts. It has not disclosed segment or product-level average selling prices. Management noted on the Q2 2026 call that the company had implemented its first price increases in several years — a datapoint consistent with tightening supply, and the first evidence in this cycle of pricing acting as a revenue tailwind rather than a headwind.
Financial Narrative
Income statement: notes and sources
EBITDA is calculated as reported operating profit plus total depreciation and amortisation per the cash flow statement; TI does not report EBITDA. FY2021 and FY2022 D&A sourced from aggregated 10-K cash flow data (Macrotrends); FY2023–FY2025 from the FY2025 Form 10-K cash flow statement (depreciation plus amortisation of capitalised software).
Margins and growth
Revenue CAGR FY2021–FY2025: -0.9% per annum. Management's own three-year measure, disclosed in the 2026 proxy for compensation purposes, is a 2023–2025 revenue CAGR of -4.1%, described as below the median of its Semiconductor Peer group — with the caveat that peer growth includes acquisitions while TI's is entirely organic. Average operating profit margin over 2023–2025 was 37.0%, above the peer median.
Balance sheet: notes and sources
FY2023 total borrowings reflect the FY2023 Form 10-K debt lines; aggregator sources report higher totals (approximately $11.8 billion) because they include finance and operating lease obligations. TI reports no material acquisition-related intangible assets remaining; National Semiconductor intangibles were fully amortised by 2022.
Cash flow: notes and sources
TI's free cash flow definition is cash flow from operations less capital expenditures plus proceeds from CHIPS Act incentives.
Ratio analysis: notes and sources
ROIC computed as operating profit multiplied by (1 minus effective tax rate), divided by the sum of ending total borrowings and ending equity. DSO and days of inventory for FY2021, FY2022, FY2024 and FY2025 are as disclosed in the respective Forms 10-K. DPO computed as accounts payable divided by cost of revenue times 365.
Commentary on trends, inflections and drivers
Revenue. The five-year window contains a complete cycle. Revenue peaked at $20.03 billion in 2022 on the post-pandemic shortage, fell 12.5% in 2023 and a further 10.7% in 2024 as industrial and automotive customers worked down inventory, and recovered 13.0% in 2025. Momentum has accelerated sharply since: Q1 2026 revenue was $4.83 billion (+19% year over year), Q2 2026 was $5.46 billion (+23% year over year, +13% sequentially), and Q3 2026 guidance of $5.65–6.15 billion implies continued above-seasonal growth. Trailing-twelve-month revenue to 30 June 2026 was $19.45 billion, already above the 2022 peak on a run-rate basis.
Gross margin. The dominant driver is not price but factory loading and depreciation. Gross margin fell 1,180 basis points from 68.8% in 2022 to 57.0% in 2025. Two forces explain almost all of it: revenue declined 12% over the period while the fixed cost base expanded — depreciation rose from roughly $0.9 billion to $1.9 billion as RFAB2, LFAB and SM1 came onto the books. The 2025 decline from 58.1% to 57.0% occurred despite 13% revenue growth, because new-capacity costs outran the benefit of higher loadings. Trailing-twelve-month gross margin to June 2026 had recovered to 58.3%, and the incremental margin on the Q2 2026 revenue step-up was steep — this is the operating leverage the capex cycle was built to produce.
Operating expenses. R&D discipline is notable: absolute R&D rose every year, from $1,554 million to $2,083 million, a 7.6% CAGR, while revenue was flat. R&D intensity therefore rose from 8.5% to 11.8% of revenue — a deliberate counter-cyclical investment. SG&A grew far more slowly (2.8% CAGR), consistent with management's efficiency emphasis. Combined R&D and SG&A has been effectively held at $3.9 billion across both 2025 and the trailing twelve months to June 2026, meaning the entire Q2 2026 revenue increase dropped through the opex line.
Below the line. Other income and expense swung from $143 million in 2021 to $496 million in 2024 (interest earned on a large cash and short-term investment portfolio) and back to $230 million in 2025 as that portfolio was drawn down to fund capex. Simultaneously interest and debt expense tripled from $184 million to $543 million as TI issued $3.0 billion, $2.98 billion and $1.20 billion of long-term debt in 2023, 2024 and 2025 respectively. The net financing swing between 2024 and 2025 alone was a $301 million headwind to pre-tax income — a meaningful part of why net income grew only 4.2% on 13.0% revenue growth.
Tax. The effective rate has been remarkably stable in a narrow 12.0–12.9% band, well below the 21% U.S. statutory rate because of U.S. tax benefits including foreign-derived income provisions and R&D credits. The 2025 rate rose slightly to 12.4% as a result of the One Big Beautiful Bill Act; management expects both the effective rate and tax-related cash payments in 2026 and beyond to be lower than they would have been under prior law.
Balance sheet inflection. TI moved from a net cash position of $2.0 billion at the end of 2021 to net debt of $9.2 billion at the end of 2025 — a $11.2 billion swing. Every dollar of it is explained by the capex cycle: cumulative capital expenditure across the five years was $19.70 billion against cumulative operating cash flow of $35.76 billion and cumulative shareholder returns that management has held near or above free cash flow throughout. Total cash fell from $9.74 billion to $4.88 billion and total borrowings rose from $7.74 billion to $14.05 billion. Net debt to EBITDA of 1.14x remains conservative in absolute terms, but the direction has been consistently one way, and the pending Silicon Labs acquisition will push it higher.
Inventory. Days of inventory rose from 116 at end-2021 to a peak of 241 at end-2024 before falling to 222 at end-2025. This is deliberate — TI's stated strategy is to build ahead of demand in broad-based products with low obsolescence risk, precisely so that it can capture share when demand recovers. The strategy looks vindicated: TI entered the 2026 upturn with inventory and capacity in place while competitors were lead-time constrained.
Free cash flow. The clearest inflection in the dataset. Free cash flow collapsed from $6.29 billion (34.3% of revenue) in 2021 to $1.35 billion (7.7%) in 2023, recovered to $2.94 billion (16.6%) in 2025, and reached $6.53 billion on a trailing-twelve-month basis at 30 June 2026 with capex down to $3.31 billion. Management guidance of $2–3 billion of capex for 2026 implies a structural step-change in free cash flow conversion from here.
Dividend sustainability. Dividends paid of $4,999 million in 2025 exceeded free cash flow of $2,938 million — a payout of 170% of free cash flow, funded from the balance sheet. This was the third consecutive year in which the dividend exceeded free cash flow. It is the single most important stress point in the financial profile, and it resolves only if the 2026 free cash flow recovery is sustained. On trailing-twelve-month June 2026 numbers ($6.53 billion of free cash flow against roughly $5.2 billion of dividends), it has resolved.
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Segment revenue (USD Mn)
| Segment revenue (USD Mn) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Analog | 14,050 | 15,359 | 13,040 | 12,161 | 14,006 |
Embedded Processing | 3,049 | 3,261 | 3,368 | 2,533 | 2,697 |
Other | 1,245 | 1,408 | 1,111 | 947 | 979 |
Total revenue | 18,344 | 20,028 | 17,519 | 15,641 | 17,682 |
Segment operating profit (USD Mn)
| Segment operating profit (USD Mn) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Analog | 7,393 | 8,359 | 5,821 | 4,608 | 5,412 |
Embedded Processing | 1,174 | 1,253 | 1,008 | 352 | 304 |
Other (includes restructuring/acquisition charges) | 393 | 528 | 502 | 505 | 307 |
Total operating profit | 8,960 | 10,140 | 7,331 | 5,465 | 6,023 |
Segment operating margin (%)
| Segment operating margin (%) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Analog | 52.6 | 54.4 | 44.6 | 37.9 | 38.6 |
Embedded Processing | 38.5 | 38.4 | 29.9 | 13.9 | 11.3 |
Other | 31.6 | 37.5 | 45.2 | 53.3 | 31.4 |
Total | 48.8 | 50.6 | 41.8 | 34.9 | 34.1 |
Segment YoY revenue growth (%)
| Segment YoY revenue growth (%) | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
Analog | 9.3 | -15.1 | -6.7 | 15.2 |
Embedded Processing | 7.0 | 3.3 | -24.8 | 6.5 |
Other | 13.1 | -21.1 | -14.8 | 3.4 |
Total | 9.2 | -12.5 | -10.7 | 13.0 |
Share of total revenue (%)
| Share of total revenue (%) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Analog | 76.6 | 76.7 | 74.4 | 77.8 | 79.2 |
Embedded Processing | 16.6 | 16.3 | 19.2 | 16.2 | 15.3 |
Other | 6.8 | 7.0 | 6.3 | 6.1 | 5.5 |
FY2025 Segment P&l Details
| FY2025 segment P&L (USD Mn) | Analog | Embedded Processing | Other | Total |
|---|---|---|---|---|
Revenue | 14,006 | 2,697 | 979 | 17,682 |
Cost of revenue | 5,764 | 1,471 | 364 | 7,599 |
Gross profit | 8,242 | 1,226 | 615 | 10,083 |
Research and development | 1,494 | 514 | 75 | 2,083 |
Selling, general and administrative | 1,336 | 408 | 116 | 1,860 |
Restructuring charges/other | 0 | 0 | 117 | 117 |
Operating profit | 5,412 | 304 | 307 | 6,023 |
Income statement (USD Mn)
| Income statement (USD Mn) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Revenue | 18,344 | 20,028 | 17,519 | 15,641 | 17,682 |
Cost of revenue | 5,968 | 6,257 | 6,500 | 6,547 | 7,599 |
Gross profit | 12,376 | 13,771 | 11,019 | 9,094 | 10,083 |
Research and development | 1,554 | 1,670 | 1,863 | 1,959 | 2,083 |
Selling, general and administrative | 1,666 | 1,704 | 1,825 | 1,794 | 1,860 |
Acquisition, restructuring and other charges (credits) | 196 | 257 | 0 | -124 | 117 |
Operating profit | 8,960 | 10,140 | 7,331 | 5,465 | 6,023 |
Other income (expense), net | 143 | 106 | 440 | 496 | 230 |
Interest and debt expense | 184 | 214 | 353 | 508 | 543 |
Income before income taxes | 8,919 | 10,032 | 7,418 | 5,453 | 5,710 |
Provision for income taxes | 1,150 | 1,283 | 908 | 654 | 709 |
Net income | 7,769 | 8,749 | 6,510 | 4,799 | 5,001 |
EBITDA | 9,914 | 11,119 | 8,569 | 7,045 | 8,022 |
Depreciation and amortisation | 954 | 979 | 1,238 | 1,580 | 1,999 |
Effective tax rate (%) | 12.9 | 12.8 | 12.2 | 12.0 | 12.4 |
Per-share data (USD)
| Per-share data (USD) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Diluted EPS | 8.26 | 9.41 | 7.07 | 5.20 | 5.45 |
Basic EPS | — | — | 7.13 | 5.24 | 5.47 |
Dividends declared and paid per share | 4.21 | 4.69 | 5.02 | 5.26 | 5.50 |
Diluted weighted average shares (millions) | — | — | 916 | 919 | 913 |
Basic weighted average shares (millions) | — | — | 908 | 912 | 909 |
Margin / growth (%)
| Margin / growth (%) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Gross margin | 67.5 | 68.8 | 62.9 | 58.1 | 57.0 |
Operating margin | 48.8 | 50.6 | 41.8 | 34.9 | 34.1 |
EBITDA margin | 54.0 | 55.5 | 48.9 | 45.0 | 45.4 |
Net margin | 42.4 | 43.7 | 37.2 | 30.7 | 28.3 |
Revenue growth YoY | 26.8 | 9.2 | -12.5 | -10.7 | 13.0 |
R&D as % of revenue | 8.5 | 8.3 | 10.6 | 12.5 | 11.8 |
SG&A as % of revenue | 9.1 | 8.5 | 10.4 | 11.5 | 10.5 |
Balance Sheet
| Balance sheet (USD Mn) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Total assets | 24,676 | 27,207 | 32,348 | 35,509 | 34,585 |
Cash and cash equivalents | 4,631 | 3,050 | 2,964 | 3,200 | 3,225 |
Short-term investments | 5,108 | 6,017 | 5,611 | 4,380 | 1,656 |
Total cash and short-term investments | 9,739 | 9,067 | 8,575 | 7,580 | 4,881 |
Accounts receivable, net | 1,701 | 1,895 | — | 1,719 | 1,963 |
Inventories | 1,910 | 2,757 | — | 4,527 | 4,804 |
Property, plant and equipment, net | 5,141 | 6,876 | — | 11,347 | 12,320 |
Goodwill | 4,362 | 4,362 | 4,362 | 4,362 | 4,330 |
Capitalised software licences | 85 | 152 | — | 257 | 238 |
Current portion of long-term debt | 500 | 500 | 500 | 750 | 500 |
Long-term debt | 7,241 | 8,235 | 10,631 | 12,846 | 13,548 |
Total borrowings | 7,741 | 8,735 | 11,131 | 13,596 | 14,048 |
Net debt (borrowings less total cash) | -1,998 | -332 | 2,556 | 6,016 | 9,167 |
Total stockholders' equity | 13,304 | 14,577 | 16,897 | 16,903 | 16,273 |
Working capital | 11,116 | 11,036 | — | 11,383 | 10,591 |
Cash flow (USD Mn)
| Cash flow (USD Mn) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Cash flow from operations | 8,756 | 8,720 | 6,420 | 6,318 | 7,153 |
Capital expenditures | 2,462 | 2,797 | 5,071 | 4,820 | 4,550 |
Proceeds from CHIPS Act incentives | 0 | 0 | 0 | 0 | 335 |
Free cash flow (company definition) | 6,294 | 5,923 | 1,349 | 1,498 | 2,938 |
Dividends paid | — | — | 4,557 | 4,795 | 4,999 |
Stock repurchases | — | — | 293 | 929 | 1,477 |
Total returned to shareholders | 4,410 | — | 4,850 | 5,724 | 6,476 |
Proceeds from long-term debt issuance | — | — | 3,000 | 2,980 | 1,199 |
Debt repayment | — | — | 500 | 600 | 750 |
Depreciation | — | — | 1,175 | 1,508 | 1,918 |
Stock compensation | — | — | 362 | 387 | 419 |
Free cash flow margin (%) | 34.3 | 29.6 | 7.7 | 9.6 | 16.6 |
Returns & Leverage Ratios (%) and Financial Ratios (x)
| Ratio | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Return on equity, ending equity basis (%) | 58.4 | 60.0 | 38.5 | 28.4 | 30.7 |
Return on assets, ending assets basis (%) | 31.5 | 32.2 | 20.1 | 13.5 | 14.5 |
Return on invested capital, after-tax (%) | — | — | 24.7 | 15.9 | 17.5 |
Current ratio (x) | 5.33 | 4.70 | — | 4.12 | 4.35 |
Debt to equity (x) | 0.58 | 0.60 | 0.66 | 0.80 | 0.86 |
Net debt to EBITDA (x) | -0.20 | -0.03 | 0.30 | 0.85 | 1.14 |
Interest coverage, operating profit basis (x) | 48.7 | 47.4 | 20.8 | 10.8 | 11.1 |
Asset turnover, ending assets basis (x) | 0.74 | 0.74 | 0.54 | 0.44 | 0.51 |
Days sales outstanding | 32 | 37 | — | 39 | 40 |
Days of inventory | 116 | 157 | — | 241 | 222 |
Days payable outstanding | — | — | — | 46 | 36 |
Cash conversion cycle (days) | — | — | — | 234 | 226 |
Revenue by geography (USD Mn)
| Revenue by geography (USD Mn) | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
United States | 5,814 | 5,957 | 6,763 |
China | 3,293 | 3,012 | 3,781 |
Europe, Middle East and Africa | 4,642 | 3,519 | 3,747 |
Rest of Asia | 1,721 | 1,681 | 1,887 |
Japan | 1,782 | 1,212 | 1,173 |
Rest of world | 267 | 260 | 331 |
Total | 17,519 | 15,641 | 17,682 |
Revenue mix by geography (%)
| Revenue mix by geography (%) | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
United States | 33 | 38 | 38 |
China | 19 | 19 | 21 |
Europe, Middle East and Africa | 26 | 22 | 21 |
Rest of Asia | 10 | 11 | 11 |
Japan | 10 | 8 | 7 |
Rest of world | 2 | 2 | 2 |
Geographic YoY growth (%)
| Geographic YoY growth (%) | FY2024 | FY2025 |
|---|---|---|
United States | 2.5 | 13.5 |
China | -8.5 | 25.5 |
Europe, Middle East and Africa | -24.2 | 6.5 |
Rest of Asia | -2.3 | 12.3 |
Japan | -32.0 | -3.2 |
Rest of world | -2.6 | 27.3 |
Total | -10.7 | 13.0 |
Revenue by Region
| PP&E by location (USD Mn) | FY2024 | FY2025 |
|---|---|---|
United States | 8,342 | 8,764 |
Rest of Asia | 1,877 | 2,450 |
China | 737 | 674 |
Japan | 274 | 327 |
Europe, Middle East and Africa | 74 | 71 |
Rest of world | 43 | 34 |
Total | 11,347 | 12,320 |
Market Data Details
| Market data | Value |
|---|---|
Closing price, 4 Sep 2026 (USD) | 258.44 |
Market capitalisation (USD Bn) | 236.02 |
Enterprise value (USD Bn) | 243.07 |
Shares outstanding (millions) | 913.25 |
Free float (millions) | 911.02 |
52-week price change (%) | 32.03 |
50-day moving average (USD) | 280.03 |
200-day moving average (USD) | 239.38 |
Beta (5-year) | 1.31 |
Short interest (millions of shares) | 19.68 |
Short interest as % of float | 2.16 |
Average daily volume, 20 days | 5,362,427 |
Institutional ownership (%) | 90.96 |
Insider ownership (%) | 0.10 |
Last stock split | 2-for-1 forward, 23 May 2000 |
Next estimated earnings date | 20 Oct 2026, after market close |
Valuation Multiples (x)
| Valuation metric | Current | FY2025 | FY2024 | FY2023 | FY2022 | FY2021 |
|---|---|---|---|---|---|---|
P/E ratio (x) | 39.26 | 31.70 | 35.82 | 23.91 | 17.22 | 22.50 |
Forward P/E (x) | 26.71 | 29.98 | 33.87 | 26.82 | 20.87 | 23.20 |
P/S ratio (x) | 12.13 | 8.91 | 10.94 | 8.84 | 7.49 | 9.49 |
P/FCF ratio (x) | 44.07 | 60.56 | 114.19 | 114.76 | 25.32 | 27.65 |
P/B ratio (x) | 13.10 | — | — | — | — | — |
P/tangible book (x) | 17.66 | — | — | — | — | — |
EV/Sales (x) | 12.50 | — | — | — | — | — |
EV/EBITDA (x) | 25.53 | — | — | — | — | — |
EV/EBIT (x) | 32.86 | — | — | — | — | — |
EV/FCF (x) | 45.39 | — | — | — | — | — |
PEG ratio (x) | 1.12 | — | — | — | — | — |
Valuation Snapshot
| Metric | Value |
|---|---|
Consensus rating | Buy |
Number of analysts | 36 |
Average price target (USD) | 324.71 |
Implied upside from $258.44 (%) | 25.64 |
Consensus revenue growth forecast, 3-year (%) | 15.97 |
Consensus EPS growth forecast, 3-year (%) | 32.47 |
Dividend metric
| Dividend metric | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 | Current |
|---|---|---|---|---|---|---|
Dividends per share (USD) | 4.21 | 4.69 | 5.02 | 5.26 | 5.50 | 5.68 |
DPS growth (%) | 13.17 | 11.40 | 7.04 | 4.78 | 4.56 | 4.41 |
Dividend yield (%) | 2.56 | 3.16 | 3.18 | 2.94 | 3.22 | 2.20 |
Quarterly rate at year end (USD) | 1.15 | 1.24 | 1.30 | 1.36 | 1.42 | 1.42 |
Current dividend detail
| Current dividend detail | Value |
|---|---|
Annualised dividend per share (USD) | 5.68 |
Dividend yield (%) | 2.20 |
Payout ratio on earnings (%) | 86.28 |
Consecutive years of increases | 22 |
Most recent declaration | $1.42 per share on 16 Jul 2026, payable 11 Aug 2026 to holders of record 31 Jul 2026 |
Ex-dividend date | 31 Jul 2026 |
Authorisation Details
| Authorisation | Amount | Date announced |
|---|---|---|
Board authorisation | USD 12.0 billion | 20 Sep 2018 |
Board authorisation | USD 15.0 billion | 15 Sep 2022 |
Remaining capacity at 31 Dec 2025 | USD 18.79 billion | No expiration date specified |
Q4 2025 Repurchase Activity Details
| Q4 2025 repurchase activity | Shares | Average price (USD) |
|---|---|---|
October 2025 | 1,164,512 | 172.04 |
November 2025 | 1,207,699 | 159.26 |
December 2025 | 63,692 | 170.58 |
Q4 2025 total | 2,435,903 | — |
Capital Markets Data and Share Count (millions)
| Annual repurchases | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Amount (USD Mn) | 293 | 929 | 1,477 |
Shares repurchased (millions) | — | 4.7 | 8.5 |
Credit Ratings
| Agency | Rating | Outlook | Date / context |
|---|---|---|---|
Moody's | Aa3 (long-term local currency) | Negative (changed from stable in February 2026 on the Silicon Labs transaction); previously affirmed Aa3 stable 14 October 2024 | Moody's estimates leverage rising from 1.8x to the upper 2x range of debt/EBITDA, which it considers high for Aa3, while expecting increasingly positive post-dividend free cash flow from 2026 as fab construction completes. Liquidity supported by $4.9 billion of cash and short-term investments at 31 December 2025 and an unused $1 billion revolving facility |
S&P Global Ratings | A+ | Stable as last affirmed 2 January 2024; a research update was published in February 2026 following the acquisition announcement | Rating level unchanged at A+ |
Debt structure detail
| Debt structure detail | Value |
|---|---|
Total borrowings at 31 Dec 2025 (USD Mn) | 14,048 |
Current portion (USD Mn) | 500 |
Long-term portion (USD Mn) | 13,548 |
Interest rate structure | Fixed rate on all long-term debt; changes in rates do not affect debt cash flows |
Revolving credit facility | Variable rate, undrawn at 31 Dec 2025; approximately $1 billion capacity per Moody's |
Commercial paper outstanding | None at 31 Dec 2025 |
Sensitivity | A 100 basis point rise in rates would reduce long-term debt fair value by $969 million |
Recent issuance | 23 May 2025: $550 million 4.500% notes due 2030 and $650 million 5.100% notes due 2035; net proceeds $1.199 billion |
Debt retired | $750 million matured and repaid in 2025; $600 million in 2024; $500 million in 2023 |
Acquisition financing | Silicon Labs to be funded with cash on hand plus debt to be arranged prior to closing |
Analyst Conclusions
Management guidance
For the third quarter of 2026, TI guides revenue of $5.65–6.15 billion and EPS of $2.23–2.57. Capital expenditure for full-year 2026 is guided to approximately $2–3 billion, against $4.55 billion in 2025 — the explicit signal that the six-year elevated capex cycle is ending. Management expects the effective tax rate and tax-related cash payments to be lower in 2026 and beyond than they would have been under prior tax law, and expects to continue benefiting from the CHIPS Act, including the 35% investment tax credit on qualifying investments placed in service after 31 December 2025 and up to $1.6 billion of direct funding. Beyond 2026, capital expenditure will be dependent on revenue and growth expectations, with management emphasising capacity modularity as the mechanism for scaling spend up or down. TI provides no multi-year revenue or margin targets.
Consensus expectations
The consensus rating across 36 analysts is Buy, with an average price target of $324.71 implying 25.6% upside from the 4 September 2026 close. Consensus embeds three-year revenue growth of 16.0% per annum and three-year EPS growth of 32.5% per annum — the latter implying substantial margin expansion, not merely volume recovery. On a forward P/E of 26.7x against a trailing 39.3x, the market is discounting roughly 47% earnings growth over the next twelve months.
Bull case
1. The capex cliff converts directly into free cash flow. Capital expenditure falls from $4,550 million in 2025 to a guided $2–3 billion in 2026 — a swing of $1.5–2.5 billion straight to free cash flow, on top of operating cash flow that has already risen 35% year over year to $8.67 billion on a trailing basis. Trailing-twelve-month free cash flow reached $6.53 billion at 30 June 2026, versus $1.35 billion in FY2023. If capex settles at $2.5 billion and operating cash flow reaches $9.5 billion on 2027 revenue, free cash flow of $7 billion covers the dividend with roughly $1.8 billion of surplus — restoring the capital return model that broke in 2023.
2. Operating leverage is only beginning to appear. TI held combined R&D and SG&A at $3.9 billion across both FY2025 and the trailing twelve months to June 2026, meaning every dollar of the Q2 2026 revenue increase flowed past opex. Gross margin has recovered from 57.0% (FY2025) to 58.3% trailing, and operating margin from 34.1% to 38.0%. Separately, Embedded Processing at an 11.3% operating margin against 38.5% four years ago represents roughly $500 million of latent operating profit that recovers mechanically as LFAB loads — management has stated this in the 10-K.
3. Data center is a genuinely new growth vector on an old asset base. Data center emerged as a separately reported market at 9% of revenue in 2025 and doubled year over year in Q2 2026. The economics are attractive: 48V rack power, multiphase core rails, eFuses and GaN stages are high-content, performance-differentiated analog sockets, not commodity catalogue parts. TI is monetising the AI build-out without having to win a logic or memory design.
Bear case
1. The valuation already prices the recovery. At 39.3x trailing earnings, 12.1x sales, 44.1x free cash flow and 25.5x EV/EBITDA, TI trades above its own five-year range and above the sales multiple its closest comparator commanded eight months ago — despite carrying a gross margin roughly 1,100 basis points below that comparator. Consensus requires 32.5% annual EPS growth for three years. The market's reaction to the Q2 2026 beat — an 11% decline over the following month — is evidence that good results are no longer sufficient.
2. Leverage is rising into an acquisition at the top of a cycle. Net debt has swung $11.2 billion in four years to $9.17 billion; total borrowings are $14.05 billion; interest expense has tripled to $543 million; and TI is about to add roughly $7.5 billion of cash consideration funded partly by new debt. Moody's has already moved to a negative outlook and estimates leverage reaching the upper 2x range — high for Aa3. TI is paying a 69% premium for Silicon Labs after fifteen years of near-total M&A abstinence, at a moment when its own equity currency and the target's sector are both richly valued. The $450 million synergy target depends on successfully migrating an acquired fabless portfolio into TI fabs, which is exactly the kind of integration risk TI's own risk factors flag.
3. The China exposure is asymmetric and unhedged. Approximately 50% of 2025 revenue shipped into China, roughly 2.5 times the 20% attributable to China-headquartered customers. TI's own risk factors name China's policy-driven domestic analog build-out as something that could prevent it from competing effectively, and identify emerging Asian competitors as a growing threat. Meanwhile China was TI's fastest-growing region in 2025 at +25.5% — meaning the growth that is currently supporting the recovery narrative is concentrated in the geography most vulnerable to policy shock. TI has no obvious hedge: its U.S. manufacturing advantage is worth little to a Chinese OEM being pushed toward domestic suppliers.
Catalysts and monitorables, next twelve months
| Date / window | Item | What to watch |
|---|---|---|
| 20 Oct 2026 | Q3 2026 results | Whether revenue lands in the upper half of the $5.65–6.15 billion range; gross margin trajectory toward 60%; any 2027 capex framing |
| Sept 2026 | Annual dividend review | The size of the increase is the cleanest management signal on free cash flow confidence. A return to high single digits would confirm the recovery; another sub-5% raise would not |
| Ongoing | Embedded Processing margin | The single highest-leverage line in the P&L. Any quarter showing Embedded operating margin above 20% would materially change the earnings model |
| Ongoing | Data center revenue | Whether the doubling sustains or was a build-out spike |
| H2 2026 – H1 2027 | Silicon Labs regulatory clearances | Antitrust review in the U.S., EU and China. Chinese approval is a live geopolitical variable given the acquirer's nationality |
| Q4 2026 – 2027 | Moody's outlook resolution | Whether the negative outlook resolves to stable on free cash flow recovery or converts into a downgrade on acquisition financing |
| 30 Apr 2026 onward | 150mm closure completion and restructuring true-up | Whether the $117 million charge proves sufficient |
| Ongoing | SM2 equipping and SM3/SM4 decisions | Any commitment to SM3 or SM4 would reverse the capex-decline narrative and should be scrutinised closely |
| Ongoing | CHIPS receivables conversion | $3.35 billion of receivables at 31 December 2025, falling to $1.16 billion in long-term assets by 30 June 2026. Cash conversion pace and any change in Commerce Department posture |
| Ongoing | Pricing | Whether the first price increases in years hold or reverse as capacity floods back |
| Ongoing | Tariff and export control developments | The largest exogenous variable; approximately 50% of revenue ships into China |
Analyst verdict
Texas Instruments has spent six years running an experiment that most of its peers declined to run: borrowing against a pristine balance sheet to build owned, advanced, domestic analog capacity through the deepest inventory correction in a decade, while raising R&D every single year and refusing to cut the dividend. The cost of that experiment is fully visible in the numbers — 1,180 basis points of gross margin, an $11.2 billion swing from net cash to net debt, three consecutive years of paying dividends out of the balance sheet, and a three-year revenue CAGR of negative 4.1% that TI's own compensation committee concedes trailed its peers. Anyone who owned the stock through 2023–2025 paid for the option.
The evidence of 2026 is that the option is beginning to pay. Revenue grew 23% year over year in the June quarter with operating margin back to 38%, trailing free cash flow reached $6.53 billion against $1.35 billion in 2023, capex is guided down by roughly $2 billion, and the first price increases in years have gone through. The mechanical arithmetic from here is favourable: falling depreciation growth, an opex base held flat, an Embedded segment carrying half a billion dollars of suppressed operating profit that recovers as LFAB loads, a 35% investment tax credit on the newest assets, and a lower structural tax rate. Few large-cap franchises have this much identifiable, non-heroic earnings recovery sitting inside their own cost structure.
The problem is price and timing. At 39x trailing earnings and 44x free cash flow, with consensus requiring 32% annual EPS growth for three years, the market has already underwritten the recovery — and the shares' 11% decline after a substantial Q2 beat suggests the bar is now higher than the fundamentals. Layered on top is a $7.5 billion cash acquisition at a 69% premium, financed with new debt, from a management team with no recent integration track record, already sufficient to move Moody's to a negative outlook. And roughly half of revenue still ships into a country whose industrial policy TI names in its own risk factors as a threat to its ability to compete.
The judgement is therefore split between the asset and the security. The asset is close to unimpeachable: the strongest position in a fragmented, slow-moving, annuity-like market, with a structural cost advantage its competitors cannot replicate without spending what TI has just finished spending. The security requires the recovery to run further and faster than currently visible, with an acquisition executed cleanly and no adverse turn in U.S.–China trade. The next dividend decision and the pace of Embedded Processing margin recovery will tell more about the next three years than any guidance TI will issue.
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View Subscription PlansExecutive Leadership
Executive Leadership Team
| Name | Age | Position | Executive officer since |
|---|---|---|---|
Ahmad Bahai | 63 | Senior Vice President (Chief Technology Officer; leads Kilby Labs) | More than five years |
Mark Gary | 51 | Senior Vice President (Analog Power products) | More than five years |
Haviv Ilan | 57 | Director, Chairman of the Board, President and Chief Executive Officer | More than five years |
Katie Kane | 41 | Senior Vice President, Secretary and General Counsel | 2024 |
Hagop Kozanian | 43 | Senior Vice President (Analog Signal Chain product line) | More than five years |
Shanon Leonard | 50 | Senior Vice President | 2022 |
Rafael Lizardi | 53 | Senior Vice President and Chief Financial Officer | More than five years |
Mark Roberts | 50 | Senior Vice President | 2021 |
Amichai Ron | 48 | Senior Vice President (Embedded Processing business) | More than five years |
Christine Witzsche | 41 | Senior Vice President | 2021 |
Mohammad Yunus | 48 | Senior Vice President | 2024 |
Directors' Remuneration
| NEO compensation FY2025 (USD) | Haviv Ilan | Rafael Lizardi | Richard Templeton | Hagop Kozanian | Amichai Ron |
|---|---|---|---|---|---|
Salary | 1,295,833 | 872,500 | — | — | — |
Bonus | 2,625,000 | 1,140,000 | 0 | 1,375,000 | 1,265,000 |
Stock awards | 9,000,071 | 2,400,156 | 3,750,000 | — | — |
Option awards | 9,000,017 | 2,400,022 | — | — | — |
Non-equity incentive (profit sharing) | 246,986 | 166,298 | 114,360 | 157,721 | 153,910 |
All other compensation | 501,602 | 134,143 | 73,830 | — | — |
Total | 22,669,509 | 7,113,119 | 8,290,000 | 7,500,000 | 7,430,000 |
Directors' Remuneration (Annual)
| Metric (USD) | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Haviv Ilan total compensation | 16,199,037 | 19,061,519 | 22,669,509 |
Rafael Lizardi total compensation | 6,994,218 | 6,983,459 | 7,113,119 |
Board of Directors
| Director | Age | Director since | Independent | Principal background | Committee |
|---|---|---|---|---|---|
Mark Blinn | 64 | 2013 | Yes | Former CEO and CFO of Flowserve Corporation; prior senior finance roles at FedEx Kinko's and Centex; attorney | Compensation |
Todd Bluedorn | 62 | 2017 | Yes | Former Chairman and CEO of Lennox International; former vice chair of Madison Industries; senior roles at United Technologies | Governance and Stockholder Relations (Chair) |
Janet Clark | 71 | 2015 | Yes | Former CFO and EVP of Marathon Oil; former CFO of Nuevo Energy and Santa Fe Snyder | Audit (Chair); Lead Director |
Carrie Cox | 68 | 2004 | Yes | Former Chairman and CEO of Humacyte; formerly led global pharmaceuticals at Schering-Plough and global prescription at Pharmacia | Compensation |
Martin Craighead | 66 | 2018 | Yes | Former Chairman and CEO of Baker Hughes; vice chair of Baker Hughes, a GE company, to 2019 | Compensation (Chair) |
Reginald DesRoches | 58 | 2024 | Yes | President of Rice University since 2022; professor of engineering; formerly Provost and Dean of Engineering at Rice | Audit |
Curtis Farmer | 63 | 2023 | Yes | Former Chairman, President and CEO of Comerica; now vice chair of Fifth Third following the 2026 merger | Audit |
Jean Hobby | 65 | 2016 | Yes | Retired PwC partner; former global strategy officer and CFO of PwC; TMT sector leader | Governance and Stockholder Relations |
Haviv Ilan | 57 | 2021 | No | Chairman, President and CEO of Texas Instruments | — |
Ronald Kirk | 71 | 2013 | Yes | Senior of counsel at Gibson, Dunn & Crutcher; U.S. Trade Representative 2009–2013; former Mayor of Dallas | Compensation |
Pamela Patsley | 69 | 2004 | Yes | Former Chairman and CEO of MoneyGram International; former SEVP of First Data; former CEO of Paymentech | Governance and Stockholder Relations |
Robert Sanchez | 60 | 2011 | Yes | Chairman and CEO of Ryder System since 2013; previously Ryder's President, COO, CIO and CFO | Audit |
Governance Overview
| Governance metric | Detail |
|---|---|
Board size | 12 directors |
Independent directors | 11 of 12 (all except Ilan) |
Chair/CEO structure | Combined, with an independent Lead Director (Janet Clark) |
Board meetings, 2025 | 5 |
Committee meetings, 2025 | 17 in aggregate (Audit 6, Compensation 5, GSR 6) |
Attendance | Every director attended at least 75% of combined board and relevant committee meetings; overall attendance approximately 98%; all directors attended the 2025 annual meeting |
Election standard | Annual election; majority of votes cast |
Mandatory retirement | Directors cannot stand for election after reaching age 75 |
Proxy access | Stockholder or group of up to 20 holding 3% for 3 years may nominate up to the greater of two directors or 20% of the board |
Audit committee financial expert | Janet Clark |
Compensation consultant | Pearl Meyer (determined independent, no conflict, for 2025) |
Hedging/pledging | Prohibited for directors and executive officers |
Clawback | Dodd-Frank compliant three-year recoupment policy plus discretionary recoupment for fraud or wilful misconduct |
Cybersecurity oversight | Board as a whole for strategic/operational risk; Audit Committee reviews risk management including cybersecurity; CIO has primary management oversight with a CISO reporting to the CIO |
Directors' Remuneration by Element
| Element (USD) | Amount |
|---|---|
Annual board retainer | 110,000 |
Lead director additional retainer | 40,000 |
Audit committee chair retainer | 35,000 |
Compensation committee chair retainer | 25,000 |
GSR committee chair retainer | 20,000 |
Annual RSU grant (grant date value) | 115,000 |
Annual stock option grant (grant date value) | 115,000 |
Initial election RSU grant | 200,000 |
Per-diem for chairman-designated activities | 1,000 |
Directors' Remuneration — Janet Clark
| Director total compensation FY2025 (USD) | Amount |
|---|---|
Janet Clark (Lead Director, Audit Chair) | 431,527 |
Todd Bluedorn (GSR Chair) | 373,193 |
Carrie Cox | 369,860 |
Pamela Patsley | 369,860 |
Robert Sanchez | 369,860 |
Martin Craighead (Compensation Chair) | 367,360 |
Reginald DesRoches | 367,360 |
Ronald Kirk | 364,860 |
Mark Blinn | 339,860 |
Curtis Farmer | 339,860 |
Jean Hobby | 339,860 |
Major Shareholders
| Holder | Shares beneficially owned | Percent of class | Basis |
|---|---|---|---|
The Vanguard Group | 91,377,364 | 10.04 | Schedule 13G/A filed 10 June 2024, ownership as of 31 May 2024 |
BlackRock, Inc. | 76,795,073 | 8.5 | Schedule 13G/A filed 25 January 2024, ownership as of 31 December 2023 |
State Street Global Advisors | — | approximately 4.6 | Third-party aggregator (Simply Wall St, 2025) |
Directors' Shareholdings
| Insider ownership | Shares |
|---|---|
Haviv Ilan | 760,717 |
Richard Templeton (retired Chairman) | 2,680,196 |
All executive officers and directors as a group | 5,477,727 |
Insider ownership as % of shares outstanding | 0.10 |
Board & Management Changes
| Date | Change | Context |
|---|---|---|
1 Apr 2023 | Haviv Ilan succeeds Rich Templeton as President and CEO | Planned internal succession; Templeton remains Chairman |
| 2024 | Katie Kane and Mohammad Yunus become executive officers | Kane appointed SVP, Secretary and General Counsel |
16 Oct 2025 | Templeton announces retirement as Chairman and director effective 31 Dec 2025 | 45-year TI career; described by Lead Director Janet Clark as a well-planned transition |
Jan 2026 | Ilan assumes Chairman role in addition to President and CEO | Board reverts to a combined chair/CEO model with Clark as Lead Director |
Competitive Landscape
Key Competitors
| Competitor | Primary overlap | Positioning versus TI |
|---|---|---|
Analog Devices (ADI) | Analog signal chain, precision analog, power | The closest structural analogue and clear number two in analog. Competes on precision and performance rather than price; gross margins near 69% versus TI's 57–58%. Approximately 75,000 SKUs and 125,000 customers. Third-party estimates put ADI at roughly 13.5% analog share against TI's 17.8–19% |
Infineon Technologies | Power discretes and modules, automotive analog, microcontrollers | Number three in power and analog. Strongest in automotive power, SiC and IGBT; building the Dresden Smart Power Fab (approximately EUR 5 billion). Announced acquisition of ams OSRAM's non-optical analog and mixed-signal sensor portfolio in February 2026 |
STMicroelectronics | Automotive and industrial analog, MCUs, power | European scale competitor with strong MCU (STM32) and automotive positions; investing in Catania for SiC. Competes directly with both TI segments |
NXP Semiconductors | Automotive processors, MCUs, connectivity, analog | Strongest automotive processing franchise; heavy in ADAS, radar and secure connectivity — direct overlap with Jacinto, AWR radar and the Silicon Labs assets TI is acquiring |
Microchip Technology | Microcontrollers, mixed-signal, analog | The most direct MCU competitor; strong in 8/16-bit legacy and industrial. Deeply affected by the same inventory cycle |
ON Semiconductor (onsemi) | Power management, image sensors, automotive power | Strong in EV power (SiC) and automotive imaging; competes principally in the power sub-line |
Renesas Electronics | MCUs, analog, automotive | Japanese scale player combining MCUs with analog and power; the principal competitor in TI's declining Japan region |
Skyworks Solutions | RF and analog for mobile | Named among the top five analog suppliers by share; overlaps in personal electronics |
Qorvo | RF, power management | Named in TI's own Semiconductor Peer set; overlaps in connectivity and power |
Monolithic Power Systems | Power management ICs | Fabless challenger competing on power density and integration in data center and industrial power — the most credible high-growth threat in TI's largest sub-line |
Allegro MicroSystems | Magnetic sensing, motor drivers | Niche competitor in automotive and industrial sensing |
Nexperia, Wingtech, Will Semiconductor, Silergy and other China-based suppliers | Broad analog, discretes, power | The structural threat TI names explicitly: emerging Asian competitors benefiting from Chinese state policy and investment, competing on price in TI's most commoditised catalogue positions |
Silicon Laboratories | Wireless MCUs, IoT connectivity | Currently a competitor in embedded wireless; becoming a subsidiary if the pending acquisition closes in H1 2027 |
Peer Comparison FY2025
| Benchmark metric | Texas Instruments | Analog Devices | NXP Semiconductors |
|---|---|---|---|
Latest fiscal year revenue (USD Bn) | 17.7 | 11.0 | 12.0 |
Latest revenue growth (%) | 13.0 | 17.0 | — |
Gross margin (%) | 57.0 | 69.0 | — |
Operating margin (%) | 34.1 | — | — |
R&D intensity (% of revenue) | 11.8 | — | — |
Market capitalisation (USD Bn) | 157.6 | 132.8 | 54.6 |
Estimated analog market share (%) | 17.8 | 13.5 | — |
Recent Developments
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