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Texas Instruments Inc.

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Ticker: TXN

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Texas Instruments Inc. - Semiconductor showcase

Year Founded & Workforce

2023

33,000 Employees

Industry

Semiconductor
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Texas Instruments Inc. Overview

Texas Instruments occupies the defensible middle of the semiconductor industry: not the leading-edge logic race, but the foundational analog and embedded chips that condition signals and manage power in virtually every electronic system built. Its moat is four-part and self-reinforcing — internally owned 300mm manufacturing that yields roughly 40% lower unpackaged die cost than 200mm; a catalogue of more than 80,000 products that maximises revenue per design engagement; a direct market-reach channel that now carries over 80% of revenue and generates proprietary demand intelligence; and extreme diversity of products, customers and end markets that removes single-point dependency. The trade-off is capital intensity and cyclicality: TI absorbed six years of elevated capex and a deep 2023–2024 downturn to secure geopolitically dependable capacity. With SM1 in production, capex guided down to $2–3 billion for 2026, and revenue re-accelerating at 23% year over year in Q2 2026, the operating leverage that build-out created is now beginning to appear in free cash flow.

Texas Instruments Incorporated is the world's largest supplier of foundational analog and embedded processing semiconductors, and the largest owner of internal analog manufacturing capacity in the United States. The company sits at an unusual point in the semiconductor value chain: it is neither a fabless designer nor a merchant foundry, but an integrated device manufacturer that designs, fabricates, packages, tests, sells and ships more than 80,000 catalogue products, over 80% of them directly to end customers through its own website and salesforce. Its economics are those of a franchise built on breadth rather than on any single socket — over 100,000 customers, roughly half of revenue from outside its 50 largest accounts, and product lifecycles measured in decades. Management measures itself on a single north-star metric: long-term growth in free cash flow per share. The company is presently emerging from a six-year elevated capital expenditure cycle in which it built out 300mm capacity at Richardson and Sherman, Texas, and Lehi, Utah — a build-out that compressed margins and free cash flow through 2023–2025 and is now inflecting favourably as capital spending falls and revenue re-accelerates.


The company's own description

The FY2025 Form 10-K opens with a deliberately plain statement of the business: TI designs and manufactures semiconductors sold to electronics designers and manufacturers worldwide; operations began in 1930; the company is incorporated in Delaware, headquartered in Dallas, and has design, manufacturing or sales operations in more than 30 countries. It reports two reportable segments, Analog and Embedded Processing, with residual activities in Other, and generated $17.68 billion of revenue in 2025.

Management frames the enterprise around three "ambitions" — to act like owners who will hold the company for decades, to adapt and succeed in a changing world, and to be a company employees are proud of and would want as a neighbour — and around a single financial objective: growth of free cash flow per share over the long term. The strategy to achieve that objective has three stated elements: (i) a business model focused on analog and embedded processing built on four sustainable competitive advantages; (ii) disciplined capital allocation; and (iii) efficiency, defined as more output per dollar spent.

The four competitive advantages, as articulated in Item 7 of the FY2025 Form 10-K, are: a strong foundation of manufacturing and technology providing lower cost and supply-chain control; a broad analog and embedded portfolio offering more opportunity per customer; the reach of market channels giving access to more customers and more design projects; and diversity and longevity of products, markets and customer positions providing less single-point dependency and longer returns on investment.

Independent characterisation

TI is best understood as a high-volume catalogue manufacturer operating with the economics of a distribution business layered onto the economics of a fab. Three structural features distinguish it from peers.

First, it is one of the last large vertically integrated analog players with a genuine cost advantage in the fab itself. TI states that an unpackaged chip built on a 300mm wafer costs roughly 40% less than the same die on 200mm. The company's stated goal is to source more than 95% of wafers internally, with over 80% on 300mm, by 2030. Where competitors have moved to asset-light or hybrid models, TI has doubled down on ownership — accepting depreciation drag and fixed-cost exposure in downturns in exchange for structural gross margin and, increasingly, a geopolitical selling proposition ("geopolitically dependable capacity") that has become commercially valuable since 2022.

Second, the revenue model is almost entirely product sales. There is no subscription, licensing or service revenue of material size. Revenue is recognised at a point in time when control transfers — generally on shipment or delivery, or when a customer pulls product from consignment inventory. The company reports no material intersegment revenue. Royalty and licence income, where it exists, sits in other income and expense rather than revenue. This makes TI's top line an unusually clean read on unit demand and price/mix, and makes gross margin an unusually clean read on factory loading.

Third, the channel has been deliberately re-engineered. In 2019 roughly one third of TI's revenue was transacted directly with customers; in 2025 more than 80% was direct, including TI.com. Less than 20% of 2025 revenue flowed through distributors, and TI now offers a single worldwide distributor plus a few region-specific distributors for order fulfilment. The strategic logic is not margin capture but information: direct relationships give TI visibility into design projects earlier and more completely, which converts into more TI content per design.

Customers and end markets

TI sells to over 100,000 customers. One end customer accounted for 12% of revenue in both 2025 and 2024, recognised primarily in the Analog segment; the customer is not named in the 10-K, though TI's own investment announcements identify Apple, Ford, Medtronic, NVIDIA and SpaceX among its major U.S. customers. No customer reached the 10% threshold in 2023.

In 2025 TI realigned its market reporting into five markets. Industrial and automotive each contributed 33% of revenue, personal electronics 21%, data center 9% and communications equipment 3%, with calculators approximately 1%. Management states that industrial, automotive and data center together represent approximately 75% of the business and are expected to grow faster than the overall semiconductor market.

Value chain position

TI is an upstream component supplier two or three tiers removed from the end consumer. It buys wafers, gases, chemicals, substrates and lead frames from a diversified global supplier base; fabricates in-house at 300mm, 200mm and (until April 2026) 150mm; assembles and tests predominantly in-house in Malaysia, the Philippines, China and Mexico; and ships either directly or via consignment programmes. It selectively uses external foundries and subcontractors to supplement capacity, and has been actively transferring products from external foundries and legacy 150mm lines into its new 300mm fabs.

Strategy

Stated strategy — themes from the FY2025 Form 10-K and shareholder letter

Management's objective is stated without hedging: the best metric for owners to measure progress is growth of free cash flow per share over the long term. The three-element strategy is (1) a business model focused on analog and embedded processing built on four sustainable competitive advantages; (2) discipline in allocating capital to the best opportunities; and (3) efficiency, meaning more output for every dollar spent — explicitly distinguished from cost-cutting to the last dollar.

The 2025 shareholder letter adds several concrete strategic claims: TI "rewired" its order fulfilment engine in 2025; free cash flow grew 96% year over year; the company is nearing the end of its six-year elevated capex cycle and is positioned to deliver dependable low-cost 300mm capacity at scale, scalability of capex including capacity modularity, and free cash flow per share growth across a range of market conditions.

Capital allocation record. Over the ten years from 2016 to 2025 TI allocated $109 billion of capital. The largest portion went to organic growth (R&D, sales and marketing, capital expenditure and inventory working capital), of which approximately $24 billion was capital expenditure. The remainder went to dividends, share repurchases and, at the margin, acquisitions.

Announced strategic initiatives, last 24 months

DateInitiativeDetail and target
Mar 2024Environmental sustainability targets100% renewable electricity for 300mm manufacturing by 2025; 100% U.S. operations by 2027; 100% worldwide by 2030
Nov 2024European distribution centreFully automated facility near Frankfurt; same-day delivery in central Germany, next-day across most of Europe
Dec 2024 / Jan 2025CHIPS Act direct funding agreement finalisedUp to $1.61 billion in direct funding from the U.S. Department of Commerce for three large-scale 300mm fabs in Sherman, Texas and Lehi, Utah, tied to milestone achievement, with covenants and clawback provisions
Jun 2025$60+ billion U.S. manufacturing programmeSeven large-scale connected fabs at three mega-sites; up to $40 billion at Sherman for SM1–SM4; more than 60,000 new U.S. jobs claimed; positioned explicitly as work with the U.S. administration
Jul 2025OBBBA benefitCHIPS investment tax credit increased from 25% to 35% for qualifying assets placed in service after 31 December 2025; U.S. R&D and eligible capex expensing
Aug 2025Expanded Apple partnershipCommitment to support additional tool installations at Lehi and Sherman
Sept–Oct 2025150mm consolidationClosure of remaining 150mm fabs in Dallas and Sherman by 30 April 2026; approximately 400 positions affected; part of transferring products to 300mm
Oct 2025Board leadership transitionIlan named Chairman effective January 2026
Dec 2025SM1 production startFirst Sherman fab in production; will ramp to tens of millions of chips daily
Early 2026SBTi validationScience Based Targets initiative validates TI's greenhouse gas reduction targets
Feb 2026Silicon Labs acquisition$231.00 per share cash, approximately $7.5 billion enterprise value; expected close first half 2027; approximately $450 million of annual run-rate synergies within three years, over 50% from moving Silicon Labs production into TI fabs
2025–2026300mm sourcing goalMore than 95% of wafers sourced internally with over 80% on 300mm by 2030
2,025End-market realignmentFive markets replacing six, elevating data center to a reported market at 9% of revenue

Medium-term financial targets and guidance

Guidance itemDetail
Q3 2026 revenue$5.65 billion to $6.15 billion
Q3 2026 EPS$2.23 to $2.57
2026 capital expenditureApproximately $2 billion to $3 billion
Post-2026 capital expenditureDependent on revenue and growth expectations; management emphasises "capacity modularity" and capex scalability
Effective tax rateExpected to be lower in 2026 and beyond than under prior tax law
Wafer sourcingMore than 95% internal, over 80% on 300mm, by 2030
Shareholder returnsCommitment to return all free cash flow to owners over time; 22 consecutive years of dividend increases through 2025
Silicon Labs synergiesApproximately $450 million annual, within three years of close

TI does not publish multi-year revenue, margin or EPS targets, and has no investor-day-style long-range model of the sort common among peers. Its guidance horizon is a single quarter. This is a long-standing and deliberate practice.

Products & Services

TI's portfolio exceeds 80,000 orderable products. A device-by-device enumeration is not possible in any finite document; what follows is a product-line-by-product-line catalogue at the level of named families and flagship devices, organised by segment as TI organises it. Pricing is catalogue-based and published on TI.com with volume tiers; TI does not disclose product-level pricing in its filings, and no product carries a subscription or licensing revenue model.

ANALOG SEGMENT — POWER PRODUCT LINE

Sub-lineDescription and capabilityNamed families / flagshipsTarget customer
DC/DC switching regulatorsStep-down (buck), step-up (boost), buck-boost converters and modules; the highest-volume power category. Integrated power modules combine inductor, controller and FETs in one package to cut design timeTPS6xxxx buck converters; LMR family; TPSM power modules; TPS62 low-Iq convertersIndustrial control, automotive body, personal electronics, data center rails
Multiphase controllers and power stagesHigh-current core rails for processors and accelerators; 48V-to-core architectures for AI server racksTPS53xxx multiphase controllers; CSD smart power stagesData center compute, networking, rack power
Battery managementFuel gauging, charging, cell balancing, protection for single-cell to high-voltage stacksBQ series gauges, chargers and protectors (e.g. BQ769xx battery monitors)Personal electronics, e-mobility, energy storage, medical
AC/DC and isolated DC/DCOffline power conversion, isolated bias supplies, integrated isolated convertersUCC family PWM controllers; TPSI integrated isolated switches and driversIndustrial power delivery, appliances, EV onboard chargers
Gallium nitride (GaN)Integrated GaN FET plus driver stages delivering higher power density and lower switching loss than siliconLMG series GaN power stages, including LMG3650R for high-density server and industrial suppliesData center power, solar inverters, fast chargers, EV
eFuses and power switchesCircuit protection, hot-swap, load switching with programmable current limitsTPS1685 48V eFuse; TPS2xxx load switchesData center 48V distribution, industrial protection
Linear and LDO regulators, voltage referencesLow-noise, low-dropout regulation and precision references for sensitive analog railsTPS7A low-noise LDOs; REF series referencesTest and measurement, medical imaging, RF
Lighting productsLED drivers for automotive exterior/interior lighting and general illuminationLP and TPS92xxx LED driversAutomotive body and lighting, building automation
Gate driversIsolated and non-isolated drivers for MOSFET, IGBT and SiCUCC21xxx isolated gate driversEV traction inverters, industrial motor drives

Power products help customers manage power across voltage domains. The FY2025 Form 10-K enumerates the constituent sub-lines as: battery-management solutions; DC/DC switching regulators; AC/DC and isolated DC/DC switching regulators; power switches; linear and low-dropout regulators; voltage references; multiphase controllers and power stages; and lighting products.

ANALOG SEGMENT — SIGNAL CHAIN PRODUCT LINE

Sub-lineDescription and capabilityNamed families / flagshipsTarget customer
AmplifiersOperational, instrumentation, current-sense, comparators; precision (low offset/drift) through high-speed GHz-classOPA precision op amps; TLV low-power op amps; INA instrumentation and current-sense amplifiers; THS high-speedTest and measurement, medical, industrial automation, ADAS
Data convertersAnalog-to-digital and digital-to-analog converters spanning delta-sigma precision to GSPS-class high speedADS delta-sigma and SAR ADCs; ADC12/ADC32 high-speed; DAC precision convertersTest and measurement, aerospace and defence, communications infrastructure
InterfaceRS-485/RS-232, CAN, LIN, USB, Ethernet PHY, LVDS, I2C and SPI translationSN65HVD / SN75 transceivers; TCAN CAN-FD transceivers; DP83 Ethernet PHYsIndustrial networking, automotive body and infotainment
IsolationCapacitive galvanic isolation for signal, power and communications, replacing optocouplersISO digital isolators; ISOW integrated signal-and-power isolators; AMC isolated amplifiersEV powertrain, grid infrastructure, industrial drives
Motor driversBrushed DC, stepper, BLDC drivers with integrated FETs and sensorless controlDRV motor driver familyRobotics, appliances, industrial automation, printers
Clocks and timingOscillators, buffers, jitter cleaners, synchronisersLMK jitter cleaners and clock generatorsCommunications equipment, data center networking, test
LogicStandard and translation logic, voltage-level shifters, buffersSN74 logic families; LSF/TXS translatorsUniversal — every end market
SensingTemperature, humidity, magnetic (Hall), inductive, capacitive, current, mmWave-adjacent sensingTMP temperature sensors; HDC humidity; DRV/TMAG Hall sensors; LDC inductive sensingBuilding automation, medical, appliances, automotive

Signal Chain products sense, condition and measure real-world signals and convert them into transferable data. The 10-K names the constituent categories as amplifiers, data converters, interface products, motor drives, clocks, logic and sensing products.

EMBEDDED PROCESSING SEGMENT

Sub-lineDescription and capabilityNamed families / flagshipsTarget customer
General-purpose MCUsArm Cortex-M0+ based cost-optimised MCUs with integrated analog; TI's principal volume MCU push of the current generationMSPM0 familyAppliances, industrial sensors, personal electronics, motor control
Ultra-low-power MCUs16-bit architecture optimised for battery and energy-harvesting applications; long-lived franchiseMSP430 familyMetering, portable medical, building automation
Real-time control MCUsC28x DSP core plus control peripherals for high-frequency control loops in power conversion and tractionC2000 family (e.g. TMS320F28xx)EV traction inverters, solar and energy-storage inverters, industrial drives
Functional-safety MCUsLockstep dual-core Arm Cortex-R architecture for ASIL-D / SIL-3 systemsHercules TMS570 and RM4x familiesAutomotive braking and steering, industrial safety
Arm MCUs and processorsCortex-M4F class MCUs and Cortex-A class applications processors for Linux-based embedded systemsSitara AM2x MCUs; Sitara AM6x processorsFactory automation, HMI, edge gateways, robotics
Automotive ADAS and vision processorsHeterogeneous SoCs combining Arm cores, DSPs and deep-learning accelerators for perceptionJacinto TDA4 family; DRA processors for infotainmentADAS Tier-1 suppliers, OEM infotainment and cluster
mmWave radarSingle-chip 60GHz and 77GHz FMCW radar sensors integrating RF, ADC and processingAWR automotive radar; IWR industrial radarAutomotive corner/cabin radar, building occupancy, industrial level sensing
Wireless connectivitySub-1GHz, Bluetooth Low Energy, Zigbee/Thread/Matter, Wi-FiSimpleLink CC13xx sub-1GHz; CC26xx BLE/multiprotocol; CC33xx Wi-FiSmart home, building automation, industrial IoT, medical wearables
Development ecosystemCode Composer Studio IDE, SDKs, SysConfig, LaunchPad and BoosterPack evaluation hardware, TI Edge AI tooling — provided to drive silicon attach, not sold as a revenue lineCode Composer Studio; SimpleLink SDK; Processor SDKAll embedded customers

The FY2025 Form 10-K describes the segment as containing microcontrollers, processors, wireless connectivity and radar products. Microcontrollers are self-contained systems combining a processor core, memory and peripherals, frequently integrating analog functionality; processors are optimised for specific embedded computing tasks.

Note: the pending Silicon Labs acquisition, if completed, would add approximately 1,200 products to this segment — wireless microcontrollers and IoT-specialised sensor devices — materially deepening the connectivity sub-line.

OTHER

Sub-lineDescription and capabilityNamed families / flagshipsTarget customer
DLP productsDigital Micromirror Device technology projecting high-definition images; also used in 3D printing, industrial lithography, spectroscopy and automotive headlamps/HUDDLP Pico chipsets for compact projection; DLP automotive display and dynamic ground projection chipsetsProjector OEMs, automotive lighting, industrial 3D printing
CalculatorsGraphing and scientific calculators with an entrenched U.S. secondary-education curriculum position; approximately 1% of 2025 revenueTI-84 Plus CE; TI-Nspire CX II; TI-30 scientific seriesEducation (school districts, retail)
Custom ASICsCustomer-specific integrated circuits built on TI process technology; carrying value written down in 2025 via non-cash goodwill impairmentNot individually brandedAerospace and defence, select industrial OEMs

Pricing model. TI publishes list and volume-tier pricing on TI.com for the catalogue portfolio, offers evaluation modules and samples, and negotiates contract pricing with large direct accounts. It has not disclosed segment or product-level average selling prices. Management noted on the Q2 2026 call that the company had implemented its first price increases in several years — a datapoint consistent with tightening supply, and the first evidence in this cycle of pricing acting as a revenue tailwind rather than a headwind.

Financial Narrative

Income statement: notes and sources

EBITDA is calculated as reported operating profit plus total depreciation and amortisation per the cash flow statement; TI does not report EBITDA. FY2021 and FY2022 D&A sourced from aggregated 10-K cash flow data (Macrotrends); FY2023–FY2025 from the FY2025 Form 10-K cash flow statement (depreciation plus amortisation of capitalised software).

Margins and growth

Revenue CAGR FY2021–FY2025: -0.9% per annum. Management's own three-year measure, disclosed in the 2026 proxy for compensation purposes, is a 2023–2025 revenue CAGR of -4.1%, described as below the median of its Semiconductor Peer group — with the caveat that peer growth includes acquisitions while TI's is entirely organic. Average operating profit margin over 2023–2025 was 37.0%, above the peer median.

Balance sheet: notes and sources

FY2023 total borrowings reflect the FY2023 Form 10-K debt lines; aggregator sources report higher totals (approximately $11.8 billion) because they include finance and operating lease obligations. TI reports no material acquisition-related intangible assets remaining; National Semiconductor intangibles were fully amortised by 2022.

Cash flow: notes and sources

TI's free cash flow definition is cash flow from operations less capital expenditures plus proceeds from CHIPS Act incentives.

Ratio analysis: notes and sources

ROIC computed as operating profit multiplied by (1 minus effective tax rate), divided by the sum of ending total borrowings and ending equity. DSO and days of inventory for FY2021, FY2022, FY2024 and FY2025 are as disclosed in the respective Forms 10-K. DPO computed as accounts payable divided by cost of revenue times 365.

Commentary on trends, inflections and drivers

Revenue. The five-year window contains a complete cycle. Revenue peaked at $20.03 billion in 2022 on the post-pandemic shortage, fell 12.5% in 2023 and a further 10.7% in 2024 as industrial and automotive customers worked down inventory, and recovered 13.0% in 2025. Momentum has accelerated sharply since: Q1 2026 revenue was $4.83 billion (+19% year over year), Q2 2026 was $5.46 billion (+23% year over year, +13% sequentially), and Q3 2026 guidance of $5.65–6.15 billion implies continued above-seasonal growth. Trailing-twelve-month revenue to 30 June 2026 was $19.45 billion, already above the 2022 peak on a run-rate basis.

Gross margin. The dominant driver is not price but factory loading and depreciation. Gross margin fell 1,180 basis points from 68.8% in 2022 to 57.0% in 2025. Two forces explain almost all of it: revenue declined 12% over the period while the fixed cost base expanded — depreciation rose from roughly $0.9 billion to $1.9 billion as RFAB2, LFAB and SM1 came onto the books. The 2025 decline from 58.1% to 57.0% occurred despite 13% revenue growth, because new-capacity costs outran the benefit of higher loadings. Trailing-twelve-month gross margin to June 2026 had recovered to 58.3%, and the incremental margin on the Q2 2026 revenue step-up was steep — this is the operating leverage the capex cycle was built to produce.

Operating expenses. R&D discipline is notable: absolute R&D rose every year, from $1,554 million to $2,083 million, a 7.6% CAGR, while revenue was flat. R&D intensity therefore rose from 8.5% to 11.8% of revenue — a deliberate counter-cyclical investment. SG&A grew far more slowly (2.8% CAGR), consistent with management's efficiency emphasis. Combined R&D and SG&A has been effectively held at $3.9 billion across both 2025 and the trailing twelve months to June 2026, meaning the entire Q2 2026 revenue increase dropped through the opex line.

Below the line. Other income and expense swung from $143 million in 2021 to $496 million in 2024 (interest earned on a large cash and short-term investment portfolio) and back to $230 million in 2025 as that portfolio was drawn down to fund capex. Simultaneously interest and debt expense tripled from $184 million to $543 million as TI issued $3.0 billion, $2.98 billion and $1.20 billion of long-term debt in 2023, 2024 and 2025 respectively. The net financing swing between 2024 and 2025 alone was a $301 million headwind to pre-tax income — a meaningful part of why net income grew only 4.2% on 13.0% revenue growth.

Tax. The effective rate has been remarkably stable in a narrow 12.0–12.9% band, well below the 21% U.S. statutory rate because of U.S. tax benefits including foreign-derived income provisions and R&D credits. The 2025 rate rose slightly to 12.4% as a result of the One Big Beautiful Bill Act; management expects both the effective rate and tax-related cash payments in 2026 and beyond to be lower than they would have been under prior law.

Balance sheet inflection. TI moved from a net cash position of $2.0 billion at the end of 2021 to net debt of $9.2 billion at the end of 2025 — a $11.2 billion swing. Every dollar of it is explained by the capex cycle: cumulative capital expenditure across the five years was $19.70 billion against cumulative operating cash flow of $35.76 billion and cumulative shareholder returns that management has held near or above free cash flow throughout. Total cash fell from $9.74 billion to $4.88 billion and total borrowings rose from $7.74 billion to $14.05 billion. Net debt to EBITDA of 1.14x remains conservative in absolute terms, but the direction has been consistently one way, and the pending Silicon Labs acquisition will push it higher.

Inventory. Days of inventory rose from 116 at end-2021 to a peak of 241 at end-2024 before falling to 222 at end-2025. This is deliberate — TI's stated strategy is to build ahead of demand in broad-based products with low obsolescence risk, precisely so that it can capture share when demand recovers. The strategy looks vindicated: TI entered the 2026 upturn with inventory and capacity in place while competitors were lead-time constrained.

Free cash flow. The clearest inflection in the dataset. Free cash flow collapsed from $6.29 billion (34.3% of revenue) in 2021 to $1.35 billion (7.7%) in 2023, recovered to $2.94 billion (16.6%) in 2025, and reached $6.53 billion on a trailing-twelve-month basis at 30 June 2026 with capex down to $3.31 billion. Management guidance of $2–3 billion of capex for 2026 implies a structural step-change in free cash flow conversion from here.

Dividend sustainability. Dividends paid of $4,999 million in 2025 exceeded free cash flow of $2,938 million — a payout of 170% of free cash flow, funded from the balance sheet. This was the third consecutive year in which the dividend exceeded free cash flow. It is the single most important stress point in the financial profile, and it resolves only if the 2026 free cash flow recovery is sustained. On trailing-twelve-month June 2026 numbers ($6.53 billion of free cash flow against roughly $5.2 billion of dividends), it has resolved.

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Financial Detail

Segment revenue (USD Mn)

Segment revenue (USD Mn)FY2021FY2022FY2023FY2024FY2025

Analog

14,05015,35913,04012,16114,006

Embedded Processing

3,0493,2613,3682,5332,697

Other

1,2451,4081,111947979

Total revenue

18,34420,02817,51915,64117,682

Segment operating profit (USD Mn)

Segment operating profit (USD Mn)FY2021FY2022FY2023FY2024FY2025

Analog

7,3938,3595,8214,6085,412

Embedded Processing

1,1741,2531,008352304

Other (includes restructuring/acquisition charges)

393528502505307

Total operating profit

8,96010,1407,3315,4656,023

Segment operating margin (%)

Segment operating margin (%)FY2021FY2022FY2023FY2024FY2025

Analog

52.654.444.637.938.6

Embedded Processing

38.538.429.913.911.3

Other

31.637.545.253.331.4

Total

48.850.641.834.934.1

Segment YoY revenue growth (%)

Segment YoY revenue growth (%)FY2022FY2023FY2024FY2025

Analog

9.3-15.1-6.715.2

Embedded Processing

7.03.3-24.86.5

Other

13.1-21.1-14.83.4

Total

9.2-12.5-10.713.0

Share of total revenue (%)

Share of total revenue (%)FY2021FY2022FY2023FY2024FY2025

Analog

76.676.774.477.879.2

Embedded Processing

16.616.319.216.215.3

Other

6.87.06.36.15.5

FY2025 Segment P&l Details

FY2025 segment P&L (USD Mn)AnalogEmbedded ProcessingOtherTotal

Revenue

14,0062,69797917,682

Cost of revenue

5,7641,4713647,599

Gross profit

8,2421,22661510,083

Research and development

1,494514752,083

Selling, general and administrative

1,3364081161,860

Restructuring charges/other

00117117

Operating profit

5,4123043076,023

Income statement (USD Mn)

Income statement (USD Mn)FY2021FY2022FY2023FY2024FY2025

Revenue

18,34420,02817,51915,64117,682

Cost of revenue

5,9686,2576,5006,5477,599

Gross profit

12,37613,77111,0199,09410,083

Research and development

1,5541,6701,8631,9592,083

Selling, general and administrative

1,6661,7041,8251,7941,860

Acquisition, restructuring and other charges (credits)

1962570-124117

Operating profit

8,96010,1407,3315,4656,023

Other income (expense), net

143106440496230

Interest and debt expense

184214353508543

Income before income taxes

8,91910,0327,4185,4535,710

Provision for income taxes

1,1501,283908654709

Net income

7,7698,7496,5104,7995,001

EBITDA

9,91411,1198,5697,0458,022

Depreciation and amortisation

9549791,2381,5801,999

Effective tax rate (%)

12.912.812.212.012.4

Per-share data (USD)

Per-share data (USD)FY2021FY2022FY2023FY2024FY2025

Diluted EPS

8.269.417.075.205.45

Basic EPS

——7.135.245.47

Dividends declared and paid per share

4.214.695.025.265.50

Diluted weighted average shares (millions)

——916919913

Basic weighted average shares (millions)

——908912909

Margin / growth (%)

Margin / growth (%)FY2021FY2022FY2023FY2024FY2025

Gross margin

67.568.862.958.157.0

Operating margin

48.850.641.834.934.1

EBITDA margin

54.055.548.945.045.4

Net margin

42.443.737.230.728.3

Revenue growth YoY

26.89.2-12.5-10.713.0

R&D as % of revenue

8.58.310.612.511.8

SG&A as % of revenue

9.18.510.411.510.5

Balance Sheet

Balance sheet (USD Mn)FY2021FY2022FY2023FY2024FY2025

Total assets

24,67627,20732,34835,50934,585

Cash and cash equivalents

4,6313,0502,9643,2003,225

Short-term investments

5,1086,0175,6114,3801,656

Total cash and short-term investments

9,7399,0678,5757,5804,881

Accounts receivable, net

1,7011,895—1,7191,963

Inventories

1,9102,757—4,5274,804

Property, plant and equipment, net

5,1416,876—11,34712,320

Goodwill

4,3624,3624,3624,3624,330

Capitalised software licences

85152—257238

Current portion of long-term debt

500500500750500

Long-term debt

7,2418,23510,63112,84613,548

Total borrowings

7,7418,73511,13113,59614,048

Net debt (borrowings less total cash)

-1,998-3322,5566,0169,167

Total stockholders' equity

13,30414,57716,89716,90316,273

Working capital

11,11611,036—11,38310,591

Cash flow (USD Mn)

Cash flow (USD Mn)FY2021FY2022FY2023FY2024FY2025

Cash flow from operations

8,7568,7206,4206,3187,153

Capital expenditures

2,4622,7975,0714,8204,550

Proceeds from CHIPS Act incentives

0000335

Free cash flow (company definition)

6,2945,9231,3491,4982,938

Dividends paid

——4,5574,7954,999

Stock repurchases

——2939291,477

Total returned to shareholders

4,410—4,8505,7246,476

Proceeds from long-term debt issuance

——3,0002,9801,199

Debt repayment

——500600750

Depreciation

——1,1751,5081,918

Stock compensation

——362387419

Free cash flow margin (%)

34.329.67.79.616.6

Returns & Leverage Ratios (%) and Financial Ratios (x)

RatioFY2021FY2022FY2023FY2024FY2025

Return on equity, ending equity basis (%)

58.460.038.528.430.7

Return on assets, ending assets basis (%)

31.532.220.113.514.5

Return on invested capital, after-tax (%)

——24.715.917.5

Current ratio (x)

5.334.70—4.124.35

Debt to equity (x)

0.580.600.660.800.86

Net debt to EBITDA (x)

-0.20-0.030.300.851.14

Interest coverage, operating profit basis (x)

48.747.420.810.811.1

Asset turnover, ending assets basis (x)

0.740.740.540.440.51

Days sales outstanding

3237—3940

Days of inventory

116157—241222

Days payable outstanding

———4636

Cash conversion cycle (days)

———234226

Revenue by geography (USD Mn)

Revenue by geography (USD Mn)FY2023FY2024FY2025

United States

5,8145,9576,763

China

3,2933,0123,781

Europe, Middle East and Africa

4,6423,5193,747

Rest of Asia

1,7211,6811,887

Japan

1,7821,2121,173

Rest of world

267260331

Total

17,51915,64117,682

Revenue mix by geography (%)

Revenue mix by geography (%)FY2023FY2024FY2025

United States

333838

China

191921

Europe, Middle East and Africa

262221

Rest of Asia

101111

Japan

1087

Rest of world

222

Geographic YoY growth (%)

Geographic YoY growth (%)FY2024FY2025

United States

2.513.5

China

-8.525.5

Europe, Middle East and Africa

-24.26.5

Rest of Asia

-2.312.3

Japan

-32.0-3.2

Rest of world

-2.627.3

Total

-10.713.0

Revenue by Region

PP&E by location (USD Mn)FY2024FY2025

United States

8,3428,764

Rest of Asia

1,8772,450

China

737674

Japan

274327

Europe, Middle East and Africa

7471

Rest of world

4334

Total

11,34712,320

Market Data Details

Market dataValue

Closing price, 4 Sep 2026 (USD)

258.44

Market capitalisation (USD Bn)

236.02

Enterprise value (USD Bn)

243.07

Shares outstanding (millions)

913.25

Free float (millions)

911.02

52-week price change (%)

32.03

50-day moving average (USD)

280.03

200-day moving average (USD)

239.38

Beta (5-year)

1.31

Short interest (millions of shares)

19.68

Short interest as % of float

2.16

Average daily volume, 20 days

5,362,427

Institutional ownership (%)

90.96

Insider ownership (%)

0.10

Last stock split

2-for-1 forward, 23 May 2000

Next estimated earnings date

20 Oct 2026, after market close

Valuation Multiples (x)

Valuation metricCurrentFY2025FY2024FY2023FY2022FY2021

P/E ratio (x)

39.2631.7035.8223.9117.2222.50

Forward P/E (x)

26.7129.9833.8726.8220.8723.20

P/S ratio (x)

12.138.9110.948.847.499.49

P/FCF ratio (x)

44.0760.56114.19114.7625.3227.65

P/B ratio (x)

13.10—————

P/tangible book (x)

17.66—————

EV/Sales (x)

12.50—————

EV/EBITDA (x)

25.53—————

EV/EBIT (x)

32.86—————

EV/FCF (x)

45.39—————

PEG ratio (x)

1.12—————

Valuation Snapshot

MetricValue

Consensus rating

Buy

Number of analysts

36

Average price target (USD)

324.71

Implied upside from $258.44 (%)

25.64

Consensus revenue growth forecast, 3-year (%)

15.97

Consensus EPS growth forecast, 3-year (%)

32.47

Dividend metric

Dividend metricFY2021FY2022FY2023FY2024FY2025Current

Dividends per share (USD)

4.214.695.025.265.505.68

DPS growth (%)

13.1711.407.044.784.564.41

Dividend yield (%)

2.563.163.182.943.222.20

Quarterly rate at year end (USD)

1.151.241.301.361.421.42

Current dividend detail

Current dividend detailValue

Annualised dividend per share (USD)

5.68

Dividend yield (%)

2.20

Payout ratio on earnings (%)

86.28

Consecutive years of increases

22

Most recent declaration

$1.42 per share on 16 Jul 2026, payable 11 Aug 2026 to holders of record 31 Jul 2026

Ex-dividend date

31 Jul 2026

Authorisation Details

AuthorisationAmountDate announced

Board authorisation

USD 12.0 billion

20 Sep 2018

Board authorisation

USD 15.0 billion

15 Sep 2022

Remaining capacity at 31 Dec 2025

USD 18.79 billion

No expiration date specified

Q4 2025 Repurchase Activity Details

Q4 2025 repurchase activitySharesAverage price (USD)

October 2025

1,164,512172.04

November 2025

1,207,699159.26

December 2025

63,692170.58

Q4 2025 total

2,435,903—

Capital Markets Data and Share Count (millions)

Annual repurchasesFY2023FY2024FY2025

Amount (USD Mn)

2939291,477

Shares repurchased (millions)

—4.78.5

Credit Ratings

AgencyRatingOutlookDate / context

Moody's

Aa3 (long-term local currency)

Negative (changed from stable in February 2026 on the Silicon Labs transaction); previously affirmed Aa3 stable 14 October 2024

Moody's estimates leverage rising from 1.8x to the upper 2x range of debt/EBITDA, which it considers high for Aa3, while expecting increasingly positive post-dividend free cash flow from 2026 as fab construction completes. Liquidity supported by $4.9 billion of cash and short-term investments at 31 December 2025 and an unused $1 billion revolving facility

S&P Global Ratings

A+

Stable as last affirmed 2 January 2024; a research update was published in February 2026 following the acquisition announcement

Rating level unchanged at A+

Debt structure detail

Debt structure detailValue

Total borrowings at 31 Dec 2025 (USD Mn)

14,048

Current portion (USD Mn)

500

Long-term portion (USD Mn)

13,548

Interest rate structure

Fixed rate on all long-term debt; changes in rates do not affect debt cash flows

Revolving credit facility

Variable rate, undrawn at 31 Dec 2025; approximately $1 billion capacity per Moody's

Commercial paper outstanding

None at 31 Dec 2025

Sensitivity

A 100 basis point rise in rates would reduce long-term debt fair value by $969 million

Recent issuance

23 May 2025: $550 million 4.500% notes due 2030 and $650 million 5.100% notes due 2035; net proceeds $1.199 billion

Debt retired

$750 million matured and repaid in 2025; $600 million in 2024; $500 million in 2023

Acquisition financing

Silicon Labs to be funded with cash on hand plus debt to be arranged prior to closing

Analyst Conclusions

Management guidance

For the third quarter of 2026, TI guides revenue of $5.65–6.15 billion and EPS of $2.23–2.57. Capital expenditure for full-year 2026 is guided to approximately $2–3 billion, against $4.55 billion in 2025 — the explicit signal that the six-year elevated capex cycle is ending. Management expects the effective tax rate and tax-related cash payments to be lower in 2026 and beyond than they would have been under prior tax law, and expects to continue benefiting from the CHIPS Act, including the 35% investment tax credit on qualifying investments placed in service after 31 December 2025 and up to $1.6 billion of direct funding. Beyond 2026, capital expenditure will be dependent on revenue and growth expectations, with management emphasising capacity modularity as the mechanism for scaling spend up or down. TI provides no multi-year revenue or margin targets.

Consensus expectations

The consensus rating across 36 analysts is Buy, with an average price target of $324.71 implying 25.6% upside from the 4 September 2026 close. Consensus embeds three-year revenue growth of 16.0% per annum and three-year EPS growth of 32.5% per annum — the latter implying substantial margin expansion, not merely volume recovery. On a forward P/E of 26.7x against a trailing 39.3x, the market is discounting roughly 47% earnings growth over the next twelve months.

Bull case

1. The capex cliff converts directly into free cash flow. Capital expenditure falls from $4,550 million in 2025 to a guided $2–3 billion in 2026 — a swing of $1.5–2.5 billion straight to free cash flow, on top of operating cash flow that has already risen 35% year over year to $8.67 billion on a trailing basis. Trailing-twelve-month free cash flow reached $6.53 billion at 30 June 2026, versus $1.35 billion in FY2023. If capex settles at $2.5 billion and operating cash flow reaches $9.5 billion on 2027 revenue, free cash flow of $7 billion covers the dividend with roughly $1.8 billion of surplus — restoring the capital return model that broke in 2023.

2. Operating leverage is only beginning to appear. TI held combined R&D and SG&A at $3.9 billion across both FY2025 and the trailing twelve months to June 2026, meaning every dollar of the Q2 2026 revenue increase flowed past opex. Gross margin has recovered from 57.0% (FY2025) to 58.3% trailing, and operating margin from 34.1% to 38.0%. Separately, Embedded Processing at an 11.3% operating margin against 38.5% four years ago represents roughly $500 million of latent operating profit that recovers mechanically as LFAB loads — management has stated this in the 10-K.

3. Data center is a genuinely new growth vector on an old asset base. Data center emerged as a separately reported market at 9% of revenue in 2025 and doubled year over year in Q2 2026. The economics are attractive: 48V rack power, multiphase core rails, eFuses and GaN stages are high-content, performance-differentiated analog sockets, not commodity catalogue parts. TI is monetising the AI build-out without having to win a logic or memory design.

Bear case

1. The valuation already prices the recovery. At 39.3x trailing earnings, 12.1x sales, 44.1x free cash flow and 25.5x EV/EBITDA, TI trades above its own five-year range and above the sales multiple its closest comparator commanded eight months ago — despite carrying a gross margin roughly 1,100 basis points below that comparator. Consensus requires 32.5% annual EPS growth for three years. The market's reaction to the Q2 2026 beat — an 11% decline over the following month — is evidence that good results are no longer sufficient.

2. Leverage is rising into an acquisition at the top of a cycle. Net debt has swung $11.2 billion in four years to $9.17 billion; total borrowings are $14.05 billion; interest expense has tripled to $543 million; and TI is about to add roughly $7.5 billion of cash consideration funded partly by new debt. Moody's has already moved to a negative outlook and estimates leverage reaching the upper 2x range — high for Aa3. TI is paying a 69% premium for Silicon Labs after fifteen years of near-total M&A abstinence, at a moment when its own equity currency and the target's sector are both richly valued. The $450 million synergy target depends on successfully migrating an acquired fabless portfolio into TI fabs, which is exactly the kind of integration risk TI's own risk factors flag.

3. The China exposure is asymmetric and unhedged. Approximately 50% of 2025 revenue shipped into China, roughly 2.5 times the 20% attributable to China-headquartered customers. TI's own risk factors name China's policy-driven domestic analog build-out as something that could prevent it from competing effectively, and identify emerging Asian competitors as a growing threat. Meanwhile China was TI's fastest-growing region in 2025 at +25.5% — meaning the growth that is currently supporting the recovery narrative is concentrated in the geography most vulnerable to policy shock. TI has no obvious hedge: its U.S. manufacturing advantage is worth little to a Chinese OEM being pushed toward domestic suppliers.

Catalysts and monitorables, next twelve months

Date / windowItemWhat to watch
20 Oct 2026Q3 2026 resultsWhether revenue lands in the upper half of the $5.65–6.15 billion range; gross margin trajectory toward 60%; any 2027 capex framing
Sept 2026Annual dividend reviewThe size of the increase is the cleanest management signal on free cash flow confidence. A return to high single digits would confirm the recovery; another sub-5% raise would not
OngoingEmbedded Processing marginThe single highest-leverage line in the P&L. Any quarter showing Embedded operating margin above 20% would materially change the earnings model
OngoingData center revenueWhether the doubling sustains or was a build-out spike
H2 2026 – H1 2027Silicon Labs regulatory clearancesAntitrust review in the U.S., EU and China. Chinese approval is a live geopolitical variable given the acquirer's nationality
Q4 2026 – 2027Moody's outlook resolutionWhether the negative outlook resolves to stable on free cash flow recovery or converts into a downgrade on acquisition financing
30 Apr 2026 onward150mm closure completion and restructuring true-upWhether the $117 million charge proves sufficient
OngoingSM2 equipping and SM3/SM4 decisionsAny commitment to SM3 or SM4 would reverse the capex-decline narrative and should be scrutinised closely
OngoingCHIPS receivables conversion$3.35 billion of receivables at 31 December 2025, falling to $1.16 billion in long-term assets by 30 June 2026. Cash conversion pace and any change in Commerce Department posture
OngoingPricingWhether the first price increases in years hold or reverse as capacity floods back
OngoingTariff and export control developmentsThe largest exogenous variable; approximately 50% of revenue ships into China

Analyst verdict

Texas Instruments has spent six years running an experiment that most of its peers declined to run: borrowing against a pristine balance sheet to build owned, advanced, domestic analog capacity through the deepest inventory correction in a decade, while raising R&D every single year and refusing to cut the dividend. The cost of that experiment is fully visible in the numbers — 1,180 basis points of gross margin, an $11.2 billion swing from net cash to net debt, three consecutive years of paying dividends out of the balance sheet, and a three-year revenue CAGR of negative 4.1% that TI's own compensation committee concedes trailed its peers. Anyone who owned the stock through 2023–2025 paid for the option.

The evidence of 2026 is that the option is beginning to pay. Revenue grew 23% year over year in the June quarter with operating margin back to 38%, trailing free cash flow reached $6.53 billion against $1.35 billion in 2023, capex is guided down by roughly $2 billion, and the first price increases in years have gone through. The mechanical arithmetic from here is favourable: falling depreciation growth, an opex base held flat, an Embedded segment carrying half a billion dollars of suppressed operating profit that recovers as LFAB loads, a 35% investment tax credit on the newest assets, and a lower structural tax rate. Few large-cap franchises have this much identifiable, non-heroic earnings recovery sitting inside their own cost structure.

The problem is price and timing. At 39x trailing earnings and 44x free cash flow, with consensus requiring 32% annual EPS growth for three years, the market has already underwritten the recovery — and the shares' 11% decline after a substantial Q2 beat suggests the bar is now higher than the fundamentals. Layered on top is a $7.5 billion cash acquisition at a 69% premium, financed with new debt, from a management team with no recent integration track record, already sufficient to move Moody's to a negative outlook. And roughly half of revenue still ships into a country whose industrial policy TI names in its own risk factors as a threat to its ability to compete.

The judgement is therefore split between the asset and the security. The asset is close to unimpeachable: the strongest position in a fragmented, slow-moving, annuity-like market, with a structural cost advantage its competitors cannot replicate without spending what TI has just finished spending. The security requires the recovery to run further and faster than currently visible, with an acquisition executed cleanly and no adverse turn in U.S.–China trade. The next dividend decision and the pace of Embedded Processing margin recovery will tell more about the next three years than any guidance TI will issue.

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Executive Leadership

Executive Leadership Team

NameAgePositionExecutive officer since

Ahmad Bahai

63

Senior Vice President (Chief Technology Officer; leads Kilby Labs)

More than five years

Mark Gary

51

Senior Vice President (Analog Power products)

More than five years

Haviv Ilan

57

Director, Chairman of the Board, President and Chief Executive Officer

More than five years

Katie Kane

41

Senior Vice President, Secretary and General Counsel

2024

Hagop Kozanian

43

Senior Vice President (Analog Signal Chain product line)

More than five years

Shanon Leonard

50

Senior Vice President

2022

Rafael Lizardi

53

Senior Vice President and Chief Financial Officer

More than five years

Mark Roberts

50

Senior Vice President

2021

Amichai Ron

48

Senior Vice President (Embedded Processing business)

More than five years

Christine Witzsche

41

Senior Vice President

2021

Mohammad Yunus

48

Senior Vice President

2024

Directors' Remuneration

NEO compensation FY2025 (USD)Haviv IlanRafael LizardiRichard TempletonHagop KozanianAmichai Ron

Salary

1,295,833872,500———

Bonus

2,625,0001,140,00001,375,0001,265,000

Stock awards

9,000,0712,400,1563,750,000——

Option awards

9,000,0172,400,022———

Non-equity incentive (profit sharing)

246,986166,298114,360157,721153,910

All other compensation

501,602134,14373,830——

Total

22,669,5097,113,1198,290,0007,500,0007,430,000

Directors' Remuneration (Annual)

Metric (USD)FY2023FY2024FY2025

Haviv Ilan total compensation

16,199,03719,061,51922,669,509

Rafael Lizardi total compensation

6,994,2186,983,4597,113,119

Board of Directors

DirectorAgeDirector sinceIndependentPrincipal backgroundCommittee

Mark Blinn

642013

Yes

Former CEO and CFO of Flowserve Corporation; prior senior finance roles at FedEx Kinko's and Centex; attorney

Compensation

Todd Bluedorn

622017

Yes

Former Chairman and CEO of Lennox International; former vice chair of Madison Industries; senior roles at United Technologies

Governance and Stockholder Relations (Chair)

Janet Clark

712015

Yes

Former CFO and EVP of Marathon Oil; former CFO of Nuevo Energy and Santa Fe Snyder

Audit (Chair); Lead Director

Carrie Cox

682004

Yes

Former Chairman and CEO of Humacyte; formerly led global pharmaceuticals at Schering-Plough and global prescription at Pharmacia

Compensation

Martin Craighead

662018

Yes

Former Chairman and CEO of Baker Hughes; vice chair of Baker Hughes, a GE company, to 2019

Compensation (Chair)

Reginald DesRoches

582024

Yes

President of Rice University since 2022; professor of engineering; formerly Provost and Dean of Engineering at Rice

Audit

Curtis Farmer

632023

Yes

Former Chairman, President and CEO of Comerica; now vice chair of Fifth Third following the 2026 merger

Audit

Jean Hobby

652016

Yes

Retired PwC partner; former global strategy officer and CFO of PwC; TMT sector leader

Governance and Stockholder Relations

Haviv Ilan

572021

No

Chairman, President and CEO of Texas Instruments

—

Ronald Kirk

712013

Yes

Senior of counsel at Gibson, Dunn & Crutcher; U.S. Trade Representative 2009–2013; former Mayor of Dallas

Compensation

Pamela Patsley

692004

Yes

Former Chairman and CEO of MoneyGram International; former SEVP of First Data; former CEO of Paymentech

Governance and Stockholder Relations

Robert Sanchez

602011

Yes

Chairman and CEO of Ryder System since 2013; previously Ryder's President, COO, CIO and CFO

Audit

Governance Overview

Governance metricDetail

Board size

12 directors

Independent directors

11 of 12 (all except Ilan)

Chair/CEO structure

Combined, with an independent Lead Director (Janet Clark)

Board meetings, 2025

5

Committee meetings, 2025

17 in aggregate (Audit 6, Compensation 5, GSR 6)

Attendance

Every director attended at least 75% of combined board and relevant committee meetings; overall attendance approximately 98%; all directors attended the 2025 annual meeting

Election standard

Annual election; majority of votes cast

Mandatory retirement

Directors cannot stand for election after reaching age 75

Proxy access

Stockholder or group of up to 20 holding 3% for 3 years may nominate up to the greater of two directors or 20% of the board

Audit committee financial expert

Janet Clark

Compensation consultant

Pearl Meyer (determined independent, no conflict, for 2025)

Hedging/pledging

Prohibited for directors and executive officers

Clawback

Dodd-Frank compliant three-year recoupment policy plus discretionary recoupment for fraud or wilful misconduct

Cybersecurity oversight

Board as a whole for strategic/operational risk; Audit Committee reviews risk management including cybersecurity; CIO has primary management oversight with a CISO reporting to the CIO

Directors' Remuneration by Element

Element (USD)Amount

Annual board retainer

110,000

Lead director additional retainer

40,000

Audit committee chair retainer

35,000

Compensation committee chair retainer

25,000

GSR committee chair retainer

20,000

Annual RSU grant (grant date value)

115,000

Annual stock option grant (grant date value)

115,000

Initial election RSU grant

200,000

Per-diem for chairman-designated activities

1,000

Directors' Remuneration — Janet Clark

Director total compensation FY2025 (USD)Amount

Janet Clark (Lead Director, Audit Chair)

431,527

Todd Bluedorn (GSR Chair)

373,193

Carrie Cox

369,860

Pamela Patsley

369,860

Robert Sanchez

369,860

Martin Craighead (Compensation Chair)

367,360

Reginald DesRoches

367,360

Ronald Kirk

364,860

Mark Blinn

339,860

Curtis Farmer

339,860

Jean Hobby

339,860

Major Shareholders

HolderShares beneficially ownedPercent of classBasis

The Vanguard Group

91,377,36410.04

Schedule 13G/A filed 10 June 2024, ownership as of 31 May 2024

BlackRock, Inc.

76,795,0738.5

Schedule 13G/A filed 25 January 2024, ownership as of 31 December 2023

State Street Global Advisors

—

approximately 4.6

Third-party aggregator (Simply Wall St, 2025)

Directors' Shareholdings

Insider ownershipShares

Haviv Ilan

760,717

Richard Templeton (retired Chairman)

2,680,196

All executive officers and directors as a group

5,477,727

Insider ownership as % of shares outstanding

0.10

Board & Management Changes

DateChangeContext

1 Apr 2023

Haviv Ilan succeeds Rich Templeton as President and CEO

Planned internal succession; Templeton remains Chairman

2024

Katie Kane and Mohammad Yunus become executive officers

Kane appointed SVP, Secretary and General Counsel

16 Oct 2025

Templeton announces retirement as Chairman and director effective 31 Dec 2025

45-year TI career; described by Lead Director Janet Clark as a well-planned transition

Jan 2026

Ilan assumes Chairman role in addition to President and CEO

Board reverts to a combined chair/CEO model with Clark as Lead Director

Competitive Landscape

Key Competitors

CompetitorPrimary overlapPositioning versus TI

Analog Devices (ADI)

Analog signal chain, precision analog, power

The closest structural analogue and clear number two in analog. Competes on precision and performance rather than price; gross margins near 69% versus TI's 57–58%. Approximately 75,000 SKUs and 125,000 customers. Third-party estimates put ADI at roughly 13.5% analog share against TI's 17.8–19%

Infineon Technologies

Power discretes and modules, automotive analog, microcontrollers

Number three in power and analog. Strongest in automotive power, SiC and IGBT; building the Dresden Smart Power Fab (approximately EUR 5 billion). Announced acquisition of ams OSRAM's non-optical analog and mixed-signal sensor portfolio in February 2026

STMicroelectronics

Automotive and industrial analog, MCUs, power

European scale competitor with strong MCU (STM32) and automotive positions; investing in Catania for SiC. Competes directly with both TI segments

NXP Semiconductors

Automotive processors, MCUs, connectivity, analog

Strongest automotive processing franchise; heavy in ADAS, radar and secure connectivity — direct overlap with Jacinto, AWR radar and the Silicon Labs assets TI is acquiring

Microchip Technology

Microcontrollers, mixed-signal, analog

The most direct MCU competitor; strong in 8/16-bit legacy and industrial. Deeply affected by the same inventory cycle

ON Semiconductor (onsemi)

Power management, image sensors, automotive power

Strong in EV power (SiC) and automotive imaging; competes principally in the power sub-line

Renesas Electronics

MCUs, analog, automotive

Japanese scale player combining MCUs with analog and power; the principal competitor in TI's declining Japan region

Skyworks Solutions

RF and analog for mobile

Named among the top five analog suppliers by share; overlaps in personal electronics

Qorvo

RF, power management

Named in TI's own Semiconductor Peer set; overlaps in connectivity and power

Monolithic Power Systems

Power management ICs

Fabless challenger competing on power density and integration in data center and industrial power — the most credible high-growth threat in TI's largest sub-line

Allegro MicroSystems

Magnetic sensing, motor drivers

Niche competitor in automotive and industrial sensing

Nexperia, Wingtech, Will Semiconductor, Silergy and other China-based suppliers

Broad analog, discretes, power

The structural threat TI names explicitly: emerging Asian competitors benefiting from Chinese state policy and investment, competing on price in TI's most commoditised catalogue positions

Silicon Laboratories

Wireless MCUs, IoT connectivity

Currently a competitor in embedded wireless; becoming a subsidiary if the pending acquisition closes in H1 2027

Peer Comparison FY2025

Benchmark metricTexas InstrumentsAnalog DevicesNXP Semiconductors

Latest fiscal year revenue (USD Bn)

17.711.012.0

Latest revenue growth (%)

13.017.0—

Gross margin (%)

57.069.0—

Operating margin (%)

34.1——

R&D intensity (% of revenue)

11.8——

Market capitalisation (USD Bn)

157.6132.854.6

Estimated analog market share (%)

17.813.5—

Recent Developments

--

Company Snapshot

$14,383M

Revenue

33,000

Employees

$153,992M

Market Cap

2023

Founded

United States

Headquarters

SWOT Analysis

Strengths

  • Cost-advantaged 300mm capacity at scale. TI states an unpackaged 300mm die costs approximately 40% less than the 200mm equivalent; three new 300mm fabs (RFAB2, LFAB1, SM1) were qualifying or ramping during 2025, with a target of over 80% of wafers on 300mm by 2030 (FY2025 Form 10-K, Item 1).
  • Direct channel transformation. More than 80% of 2025 revenue transacted directly with customers, versus about one third in 2019; less than 20% flowed through distributors (FY2025 Form 10-K, Item 1 and Item 1A).
  • Extreme customer and product diversification. Over 100,000 customers, more than 80,000 products, and about half of revenue from outside the top 50 customers (FY2025 Form 10-K, Item 1).
  • Sustained cash generation through a severe downturn. Operating cash flow never fell below $6.3 billion in any of the five years, even as revenue fell 22% peak to trough; cash flow from operations was 40.5% of revenue in 2025 and 40.4% in 2024 (FY2025 Form 10-K, non-GAAP reconciliation).
  • Counter-cyclical R&D discipline. R&D rose every year from $1,554 million (2021) to $2,083 million (2025) — a 34% increase — while revenue fell 3.6% over the same span (FY2025 Form 10-K income statement).
  • Government-backed capital programme. Up to $1.61 billion in CHIPS direct funding plus a 35% investment tax credit post-OBBBA; CHIPS incentives have already reduced the carrying amount of manufacturing assets by $4.51 billion, of which $1.37 billion in 2025, and cut 2025 cost of revenue by $353 million through lower depreciation (FY2025 Form 10-K, Note 2).
  • Balance sheet quality. Aa3 (Moody's) and A+ (S&P) ratings; undrawn revolving credit facility; no commercial paper outstanding at 31 December 2025; current ratio 4.35x.
  • Dividend record. 22 consecutive years of increases through the 2025 raise to $1.42 per quarter (2026 proxy, compensation discussion).

Weaknesses

  • Gross margin erosion. Down from 68.8% in FY2022 to 57.0% in FY2025 — 1,180 basis points — as depreciation more than doubled from approximately $0.9 billion to $1.9 billion (FY2025 Form 10-K).
  • Embedded Processing margin collapse. Segment operating margin fell from 38.5% in FY2021 to 11.3% in FY2025, with operating profit down 74% from $1,174 million to $304 million while revenue fell only 12% (FY2025 Form 10-K, Note 1).
  • Dividend exceeding free cash flow for three consecutive years. FY2025 dividends paid of $4,999 million against free cash flow of $2,938 million — a 170% payout ratio, funded from the balance sheet (FY2025 Form 10-K cash flow statement).
  • Net debt swing of $11.2 billion. From net cash of $1,998 million at end-FY2021 to net debt of $9,167 million at end-FY2025; interest and debt expense nearly tripled from $184 million to $543 million.
  • Total cash down 36% in one year. Total cash and short-term investments fell $2.70 billion in 2025 to $4.88 billion, with short-term investments alone down from $4,380 million to $1,656 million.
  • Below-median three-year growth. TI's own compensation committee recorded a 2023–2025 revenue CAGR of -4.1%, below the Semiconductor Peer median, and one-year TSR of -4.5%, also below median (2026 proxy).
  • Emerging customer concentration. One end customer at 12% of revenue in both 2025 and 2024, versus no customer above 10% in 2023 (FY2025 Form 10-K, Note 1).
  • Say-on-pay support of approximately 87% in April 2025 — materially below the level associated with uncontested compensation programmes, reflecting the committee's discretion-based approach (2026 proxy).

Opportunities

  • Capex cliff. Capital expenditure guided to $2–3 billion for 2026 against $4,550 million in 2025 — a potential $1.5–2.5 billion direct addition to free cash flow (FY2025 Form 10-K, liquidity discussion).
  • Data center inflection. Data center emerged as a distinct 9%-of-revenue market in 2025 and management reported it doubling year over year in Q2 2026 — the fastest-growing exposure TI has.
  • LFAB loading. Management states explicitly that Embedded margins are depressed until LFAB ramps; recovering Embedded to even half its historical margin on 2025 revenue would add roughly $500 million of operating profit.
  • Silicon Labs synergies. Approximately $450 million of annual run-rate savings within three years of close, over half from moving Silicon Labs production into TI's internal fabs — a direct application of TI's manufacturing advantage to an acquired portfolio.
  • Enhanced investment tax credit. The ITC rose from 25% to 35% for qualifying assets placed in service after 31 December 2025, applying to the largest and latest tranche of the build-out.
  • Pricing power returning. TI implemented its first price increases in several years around Q2 2026 — after a multi-year period in which price was a headwind.
  • Reshoring premium. With SM1 the first major foundational-chip fab online under the CHIPS Act, TI is positioned to command preference from customers and governments prioritising supply provenance.
  • Lower future tax rate. Management expects both the effective tax rate and tax-related cash payments to be lower in 2026 and beyond than under prior law.

Threats

  • China shipment exposure. Approximately 50% of 2025 revenue shipped into China; export controls, tariffs, embargoes or retaliation would strike a far larger base than the 20% China-headquartered customer figure suggests (FY2025 Form 10-K, Item 1A).
  • Chinese domestic substitution. TI names China's policy-driven reshaping of its domestic semiconductor industry as something that "could prevent us from competing effectively" (Item 1A).
  • Fixed-cost operating leverage in reverse. TI states that because it owns much of its capacity, a significant portion of operating cost is fixed and does not decline with reduced demand or factory loadings — the mechanism that produced the 2023–2025 margin compression would repeat in any renewed downturn.
  • Leverage rising into an acquisition. Moody's placed the outlook on negative in February 2026, estimating leverage moving from 1.8x to the upper 2x range of debt/EBITDA on the Silicon Labs financing — high for the Aa3 rating.
  • CHIPS incentive clawback. The Commerce Department agreement contains representations, covenants, events of default and clawback rights; TI carries $3.35 billion of CHIPS receivables on balance sheet at 31 December 2025 ($1.71 billion current, $1.64 billion long-term), and incentives have already reduced manufacturing asset carrying values by $4.51 billion. TI's own risk factors flag possible reduction, modification, clawback or termination.
  • Valuation and expectations. At $258.44 the shares trade on 39.3x trailing earnings, 12.1x sales and 44.1x free cash flow, with an 86% dividend payout ratio — pricing in the recovery that has only just begun to appear.
  • Goodwill exposure. TI carries $4.33 billion of goodwill and states that impairment charges could adversely affect results; the 2025 restructuring charge already included a non-cash goodwill impairment on custom ASIC products.
  • Key materials concentration. TI notes that certain key semiconductor materials are primarily sourced from limited geographies and that governments have adopted or proposed export controls on certain minerals, materials and equipment.

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Key Developments

DateEventSignificance
23 Apr 2025Q1 2025 results: revenue $4.07 billion, net income $1.18 billion, EPS $1.30; Q2 guidance $4.17–4.53 billionFirst clear evidence of cyclical recovery; revenue up 11% year over year
23 May 2025Completed $1.2 billion senior note issuance: $550 million of 4.500% notes due 2030 and $650 million of 5.100% notes due 2035; underwriters Barclays, Morgan Stanley and MUFGPre-funding of the capex programme; raised 2025 interest expense to $543 million
18 Jun 2025Announced plans to invest more than $60 billion across seven U.S. fabs at three mega-sites, up to $40 billion at Sherman; more than 60,000 jobs claimed; Apple, Ford, Medtronic, NVIDIA and SpaceX named as supporting customersThe defining strategic announcement of the period; positions TI as the anchor of U.S. foundational semiconductor policy
4 Jul 2025One Big Beautiful Bill Act enacted; CHIPS ITC raised from 25% to 35% for assets placed in service after 31 December 2025; U.S. R&D and eligible capex expensingRaises the effective subsidy on the remaining build-out; increased 2025 effective tax rate but lowers future rate and cash taxes
22 Jul 2025Q2 2025 results: revenue $4.45 billion (+16% YoY), net income $1.30 billion, EPS $1.43Recovery broadening; stock reaction negative on cautious commentary regarding automotive
Aug 2025Expanded Apple partnership: commitment to support additional tool installations at Lehi and ShermanAnchors loading for the two newest sites
Sept 2025Quarterly dividend raised approximately 4% to $1.42 per share — the 22nd consecutive annual increaseSmallest percentage increase in over a decade, reflecting free-cash-flow constraint during the capex peak
25 Sept – 7 Oct 2025Layoffs announced tied to closure of remaining 150mm fabs in Dallas and Sherman; approximately 400 positions; state filings indicate 163 in December 2025 and approximately 20 in April 2026; at least 60 days of paid leaveFirst material headcount reduction of the cycle; drove part of the $117 million 2025 restructuring charge
16 Oct 2025Rich Templeton announces retirement as Chairman and director effective 31 December 2025 after a 45-year career; Haviv Ilan named Chairman from January 2026Completion of a multi-year succession; consolidates chair and CEO under Ilan with Janet Clark as Lead Director
21 Oct 2025Q3 2025 results: revenue $4.74 billion (+14% YoY), net income $1.36 billion, EPS $1.50; profit margin compressed to 29% from 33% on higher expensesMargin compression despite growth — the clearest single illustration of the depreciation drag
Dec 2025Start of production at SM1, Sherman, three and a half years after groundbreaking; first chips delivered to customers; site to ramp to tens of millions of chips dailyThe single most important operational milestone of the period; first major foundational-chip fab online under the CHIPS Act
31 Dec 2025Templeton retirement effective; 150mm closure programme continues—
Jan 2026Ilan becomes Chairman—
27 Jan 2026Q4 2025 and FY2025 results: Q4 revenue $4.42 billion (+10% YoY, -7% sequential), Q4 net income $1.16 billion, Q4 EPS $1.27 including a 6-cent unguided reduction; FY2025 revenue $17.68 billion, net income $5.00 billion, EPS $5.45; FY2025 free cash flow $2.94 billion (+96%)Full-year results plus a 2026 outlook that triggered a broad analyst re-rating
Late Jan 2026Analyst re-rating: BNP Paribas upgrade to Hold; price target increases from Susquehanna and StifelSentiment inflection after a negative 2025
4 Feb 2026Definitive agreement to acquire Silicon Labs for $231.00 per share cash, approximately $7.5 billion enterprise value; approximately 69% premium; expected close H1 2027; approximately $450 million of synergies within three yearsLargest acquisition since 2011; strategic pivot into embedded wireless connectivity
Early Feb 2026Moody's changes outlook to negative on the Silicon Labs deal while affirming Aa3; estimates leverage rising from 1.8x to the upper 2x range of debt/EBITDAFirst negative rating action of the cycle; agency notes offsetting expectation of positive post-dividend free cash flow from 2026
Feb 2026S&P Global Ratings publishes a research update on the 'A+' ratingRating commentary following the acquisition announcement
Early 2026Science Based Targets initiative validates TI's GHG reduction targets: absolute Scope 1 and 2 down 42% and absolute Scope 3 down 25% by year-end 2030 from a 2023 baseConverts a directional commitment into an externally validated target
4 Mar 2026FY2025 Annual Report and DEF 14A filed; annual meeting called for 16 April 2026 with four items including one shareholder proposal to permit action by written consentGovernance calendar; the written-consent proposal is the only contested item
Feb 2026Third-party reports of a second cleanroom module at Sherman adding approximately 20,000 wafer starts per month by 2028Unconfirmed in TI filings
16 Apr 20262026 annual meeting of stockholders held at 12500 TI Boulevard, DallasAll twelve nominees stood for election
22 Apr 2026Q1 2026 results: revenue $4.83 billion (+19% YoY), net income $1.55 billion (+32% YoY), EPS $1.70 (up from $1.29); revenue beat consensus by 6.6% and EPS by 23%The largest earnings beat of the cycle; profit margin recovered to 32%
22 May 2026Analyst commentary noting the stock up 5.7% since the prior earnings reportSentiment continuing to improve
23 May 2026Seaport Global upgrades TXNContinued analyst re-rating
1 Jul 2026Q2 2026 earnings call scheduled for 22 July—
16 Jul 2026Board declares Q3 2026 dividend of $1.42 per share, payable 11 August 2026 to holders of record 31 July 2026Dividend held flat pending the customary September review
22 Jul 2026Q2 2026 results: revenue $5.46 billion (+23% YoY, +13% sequential) versus $5.24 billion consensus; net income $1.98 billion; EPS $2.14 including a 5-cent unguided benefit; TTM operating cash flow $8.67 billion (+35%); TTM free cash flow $6.53 billion; Q3 guidance $5.65–6.15 billion and EPS $2.23–2.57Broad-based upturn confirmed: industrial recovery, data center revenue doubling, automotive re-accelerating; first price increases in years reported
Late Jul – Aug 2026Stock declines: reported down 11% in a month and 16% from its 52-week high by early August 2026 despite the beatClassic "good results, expensive stock" reaction; the shares had run hard into the print
4 Sept 2026TXN closes at $258.44; market capitalisation $236.0 billion; 50-day moving average $280.03 versus 200-day $239.38Shares consolidating below their recent highs but 32% above year-ago levels

Financial Performance

Explore key financial metrics, segmented revenue, balance sheet health, and performance trends.

Revenue

7 charts
Income Statement: Revenue & Gross Profit: Revenue fell from USD 18,344 Mn in FY2021 to USD 17,682 Mn in FY2025.
Texas Instruments Inc. — Income Statement: Revenue & Gross Profit
Series (USD Mn)FY2021FY2022FY2023FY2024FY2025
Revenue18,34420,02817,51915,64117,682
Cost of revenue5,9686,2576,5006,5477,599
Gross profit12,37613,77111,0199,09410,083

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