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Winbond Electronics Corporation

Company Profile Analysis

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Winbond Electronics Corporation - Semiconductor showcase

Year Founded & Workforce

1987

4,800 Employees

Industry

Semiconductor

Services

DRAMSerial NOR Flash
W

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Winbond Electronics Corporation Overview

Company Headquarters: Taiwan

Founded: 1987

Workforce: ~4,800

Company Working: Winbond Electronics Corporation is a Taiwan-based company that develops, manufactures, designs, and sells integrated circuits (ICs) and very-large-scale integration (VLSI) for microelectronic applications. The company operates in three segments namely dynamic random-access memory (DRAM) IC product, flash memory product, and logic IC product. The company provides mobile DRAM devices such as low power double-data-rate synchronous dynamic random-access memory (DDR SDRAM), low power SDR, pseudo-static random-access memory (SRAM), and low power DDR2 SDRAM products. DRAM products cover DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, SDRAM, and KGD. The company also provides flash memory products, serial NOR, parallel NOR, serial NAND, SLC NAND, and secure flash memory products such as TrustME. The company’s products are used in various applications such as mobile/networking, computing, consumer, automotive, and industrial, and wearable devices. In 2018, the company developed an advanced 3xnm process in order to secure its leading position in serial NOR flash memory. The company operates in Asia, Europe, the Americas, and other regions across the world.

Strategy

Winbond Electronics Corporation implements rigorous process control and quality control, strengthening analysis, and supply chain management to meet consumer demands. Moreover, the company invests in R&D activities for developing new products with a focus on semiconductor designs and manufacturing. In 2018, the company developed an advanced 3xnm process in order to secure its leading position in serial NOR flash memory.

Company Snapshot

$684.6M

Revenue

4,800

Employees

1987

Founded

Taiwan

Headquarters

SWOT Analysis

Strengths

  • High investments
  • Wide product portfolio
  • Established market presence
  • Broad product & services portfolio
  • Strong investment capabilities

Weaknesses

  • Substantial debts
  • Largely dependent on the Asia-Pacific market

Opportunities

  • Strategic acquisitions and partnerships
  • Investments in research and development
  • New trends in consumer behavior/purchasing patterns
  • Strategic acquisition and partnership

Threats

  • Intense competition
  • Uncertain economic conditions

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Key Developments

DateApproachDevelopment
–Product LaunchWinbond Electronics Corporation announced the launch of innovative SpiStack dual-die NOR+NAND code storage product which has been included on NXP Semiconductors FRWY-LS1012A board to be used with its Layerscape LS1012A communications processor, which provides 16Mbits of serial NOR Flash memory for the board’s boot code, and 1Gbit of serial NAND for its Linux operating system.
–Product LaunchWinbond Electronics Corporation announced that it is bringing the power-saving benefits of its 1.2V W25Q-ND series of SpiFlash memory products to a wider range of applications with the introduction of parts with bigger memory capacities.
–Product LaunchWinbond Electronics Corporation announced a dramatic expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date, which provides designers with serial flash memories for audio, wearable, IoT, and other applications that call for low power in small packages.

Product Offering

  • Winbond Electronics Corporation
    • DRAM
    • Serial NOR Flash

Financial Performance

Explore key financial metrics, segmented revenue, balance sheet health, and performance trends.

By Business Segment: DRAM IC product was USD 684.6 Mn in 2017.
Winbond Electronics Corporation — By Business Segment
Series (USD Mn)2017
DRAM IC product684.6
Flash Memory product610.9
Logic IC product306

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