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X-FAB Silicon Foundries SE

Company Profile Analysis

Ticker: XFAB.PA

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X-FAB Silicon Foundries SE - Semiconductor showcase

Year Founded & Workforce

1992

4,200 Employees

Industry

Semiconductor

Services

MEMS Sensors
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X-FAB Silicon Foundries SE Overview

X-FAB is Europe's largest pure-play specialty foundry. It manufactures analog/mixed-signal, high-voltage, SOI, MEMS/microsystems, photonics and wide-bandgap (SiC and GaN) semiconductors on mature 150mm and 200mm lines across six fabs in Germany, France, Malaysia and the United States. It does not compete in the leading-edge node race. Instead, it supplies long-lifecycle technologies, from 1.0µm down to 110nm, with automotive-grade qualification, modular process options and deep design-kit support. Fabless and fab-lite chip companies in automotive, industrial and medical markets use these technologies; those three core markets generated 94% of FY2025 revenue [PR Q4-25].

The company has just completed a roughly USD 1.1bn, three-year capacity programme (2023–25). It is now in a cyclical trough: Q2 2026 EBITDA margin was 16.8%, against a long-term target above 30%. Management is repositioning the portfolio toward three pillars: Smart CMOS & SOI, Microsystems & Photonics, and Wide Bandgap. It is targeting data-centre power and optical connectivity as a new growth vector worth about USD 300m in long-term annual revenue potential [PR Q2-26].


What the company does

X-FAB is a contract manufacturer (foundry) of silicon wafers. Customers design integrated circuits, sensors, MEMS devices or power discretes using X-FAB's process design kits (PDKs) and IP libraries. X-FAB then processes the wafers in its fabs and ships finished, tested wafers to the customer or its assembly partner. The company sells ex-works: delivery occurs at X-FAB's premises, and cost and risk pass to the buyer from that point. Management has stated that tariffs therefore have no direct effect on its operations (KBC/Bolero commentary, Apr 2025).

Company's own description (paraphrased from latest releases)

In its 2026 boilerplate, X-FAB describes itself as a global foundry group offering a broad set of specialty technologies and design IP. These are manufactured in six wafer fabs in Malaysia, Germany, France and the US. Its expertise spans analog/mixed-signal, microsystems, photonics, SiC and GaN, and it acts as development and manufacturing partner mainly to automotive, industrial and medical customers [PR Q2-26]. At the September 2025 Investor Day, the company branded itself as "the European specialty foundry for the analog world" [PR ID-25].

Business and revenue model

Revenue elementDescriptionShare / evidence
Wafer productionVolume wafer sales priced per wafer, depending on technology, mask layers and options≈90.6% of revenue (ABC Bourse, citing latest annual report)
Prototyping / engineering servicesMulti-project wafer (MPW) runs, engineering lots, NRE and customer-specific process development≈9.4% of revenue (same source). Prototyping revenue was USD 108.8m in FY2023 [PR Q4-23] and USD 17.7m in Q2 2026 [PR Q2-26]
Long-term agreements (LTAs)Capacity-reservation contracts, partly with customer prepaymentsSeven LTAs worth USD 1.4bn over three years covered a large part of 200mm CMOS capacity (Feb 2023) [PR Q4-22]
Licensing / subscriptionsNot a material separate revenue lineNot publicly disclosed as separate revenue

Revenue is recognised partly over time under IFRS 15. This creates quarterly "impact from revenue recognised over time" adjustments, ranging from −10.3m in Q1 2026 to +4.2m in Q4 2025.

Currency mix in FY2025 was 57% USD and 43% EUR. The company describes its business as naturally hedged at EBITDA level [PR Q4-25].

Value-chain position

X-FAB sits between fabless/fab-lite designers (upstream) and OSAT/module makers (downstream). Raw materials are silicon wafers, SiC substrates (partly customer-consigned), gases and chemicals. Its differentiation comes from four sources:

  1. Mature-node specialty process breadth. These include high-voltage, SOI, embedded NVM, optical sensors and MEMS.

  2. Automotive-grade quality and long product life. Customers can rely on processes being supported for many years.

  3. Multi-site process duplication. For example, 180nm is run in France and Malaysia for business continuity.

  4. Design ecosystem tools. These include FeatureXplorer, ResourceXplorer, X-CHAIN and the IP Portal.

Customer types and end-markets

End-marketFY2025 Revenue* (USD Mn)Share of Revenue*Key applications cited
Automotive558.364.3%Battery and thermal management, on-board chargers, ADAS, next-generation headlamps
Industrial184.621.3%SiC power for renewables/UPS, last-time-buy legacy CMOS, photonics prototyping
Medical71.38.2%DNA sequencing, ultrasound/echography, contactless temperature sensors, pacemakers
CCC (Consumer, Communications & Computer)52.76.1%Legacy consumer and communications ICs (declining by design)
Others0.90.1%—

Customers are fabless semiconductor firms, IDMs outsourcing specialty steps, and system companies developing ASICs. Melexis NV is a historically important customer and related party; the same founding families are its shareholders.

Source: [PR Q4-25] quarterly tables, summed by analyst.

Independent characterisation

X-FAB is a capital-intensive, mid-cycle analog foundry with very high operating leverage. Its cost base is about 75–85% fixed (depreciation plus staff). As a result, a 10% revenue swing has moved the EBITDA margin by 5–10 percentage points, as seen between 2023 and 2024.

Its strategic value lies in four areas:

  • European sovereignty in mature-node supply, reflected in the EUR 127.4m Chips Act grant.

  • Automotive qualification moats.

  • Unusual technology adjacency (CMOS plus MEMS plus SiC/GaN plus photonics under one roof).

  • A cost-competitive Malaysian 200mm site.

Its structural weaknesses are:

  • Concentration in automotive.

  • No 300mm footprint, a point raised by Deutsche Bank in November 2025.

  • Exposure to Chinese mature-node overcapacity.

  • A thin free float controlled by founding families and the Sarawak state.

Strategy

Stated strategy (paraphrased themes)

  1. Three technology pillars (Investor Day, Sep 2025): Smart CMOS & SOI (power), Microsystems & Photonics (sensing), and Wide Bandgap (SiC/GaN). The company aligns these with two megatrends, which it calls "electrification of everything" and "sensors everywhere".

  2. Specialisation and diversification (CEO, Q2 2026). The aim is to move away from commodity CMOS toward hard-to-replicate processes, and to broaden the end-market mix beyond automotive.

  3. Data-centre push. Relevant products include power management, protection devices, monitoring sensors, optical connectivity, cooling actuators and timing ICs. Long-term annual revenue potential is put at about USD 300m. The 800V data-centre power transition supports SiC/GaN demand [PR Q2-26].

  4. Site specialisation:

    • Erfurt becomes the Microsystems hub.

    • Lubbock becomes the SiC site.

    • Malaysia and France provide 180nm/SOI volume, with dual sourcing for business continuity.

  5. European sovereignty positioning, illustrated by the Chips Act funding.

  6. Capital discipline after the expansion programme. 2026 capex is about USD 100m, down from 204m in 2025 and 510m in 2024; long-term capex is targeted at 10–15% of revenue.

Initiatives in the last 24 months (Oct 2024 to Oct 2026)

InitiativeDateDetail / target
Target reset (Capital Markets Update)3 Dec 20242026: USD 1.05bn revenue, 30% EBITDA margin. 2030: USD 1.5bn revenue, 35% EBITDA margin. Replaced the earlier target of USD 1.5bn and 30–35% by 2026 (Reuters via Stockopedia)
Completion of USD 1bn+ capacity programmeMid-2025All tools installed and qualified [PR Q4-25]
Malaysia cleanroom start-upSep 2025Ramp to 40k wafer starts per month by end-2026
Investor Day: new long-term framework9 Sep 2025High-single-digit average growth across cycles; EBITDA margin above 30%; capex 10–15% of revenue. FY2025 guidance: USD 840–870m revenue, 24–27% EBITDA margin, capex USD 250m [PR ID-25]
Leadership transitionOct 2025 – Feb 2026Macq succeeds De Winter
Cost-efficiency programmeFeb 2026High-single-digit % headcount cut in 2026; gradual opex reduction; about USD 6m per quarter of savings by Q4 2026 [PR Q4-25]
Reporting redesignQ1 2026New technology lines; photonics and GaN brought into reported revenue
GaN developmentQ1 20261,200V GaN prototype on a 200mm engineered substrate; vertical GaN customer project
Data-centre programme2,026Design wins in Smart CMOS/SOI; three SiC data-centre design wins in Q2 2026
Fab4Micro (Chips Act)Jun–Oct 2026EUR 127.4m grant; groundbreaking; production by end-2028
Photonics roadmapOngoingVolume production targeted from 2028
ESGOngoingCO2 footprint reduction programme (see Section 20)

Medium-term targets and guidance

HorizonRevenueEBITDA marginCapexStatus
FY2025 guidance (Jul/Sep 2025)USD 840–870m (later 863–873m Revenue*)24–27%USD 250mRevenue* of 867.6m met guidance. EBITDA margin was 22.6% (23.6% ex one-off), below the range. Capex was 204.1m
2026 target (Dec 2024)USD 1.05bn30%—Effectively superseded. No FY2026 guidance was given (Feb 2026); H1 2026 revenue was 395.4m
2030 target (Dec 2024)USD 1.5bn35%—Not explicitly reiterated in 2026 releases; the Investor Day 2025 framework replaced it with high-single-digit growth and a margin above 30%
Long-term (Sep 2025)High-single-digit average growth across cyclesAbove 30%10–15% of revenueCurrent framework
Q3 2026 guidanceUSD 195–205m Revenue*17–20%—Based on USD/EUR 1.14, excluding IFRS 15 [PR Q2-26]
FY2026 capex——About USD 100m[PR Q4-25]

Products & Services

Note: X-FAB sells process technologies and manufacturing services, not branded end products. Pricing is per-wafer and per-project; list prices are not publicly disclosed. Process code names below are those publicly used by X-FAB on its website and in technical literature.

Smart CMOS & SOI

OfferingDescription / capabilitiesTarget customerStatus / timing
180nm high-voltage CMOS platform (XH018 family)Modular 0.18µm analog/mixed-signal process with HV options, e-NVM and automotive qualification. The company's "popular 180nm automotive technology"Automotive IC vendors (battery management, sensor interfaces, motor drivers)Run in France (converted from legacy CCC capacity) and in the new Malaysia cleanroom (ramping since Sep 2025) [PR Q4-23; PR Q4-25]
180nm BCD-on-SOI (XT018)Deep-trench SOI for high-voltage isolation, robustness and harsh environments; key for data-centre power and automotivePower management and automotive/industrial gate driversBCD-on-SOI revenue was about 14% of 2024 revenue, with management projecting 2.5x growth over five years (Investor Day 2025, via Quartr summary)
110nm CMOS platformMost advanced X-FAB node; major 2025 design wins, especially for sensingSensor and ASIC designersDesign wins in 2025 [PR Q4-25]
0.35µm HV and analog platforms (XH035 and related)Mature analog/HV, optical sensor optionsIndustrial and medicalOngoing
0.6µm CMOS technologiesLegacy nodeIndustrial and other legacy customersTerminating early 2027. Last-time-buy announced more than a year before Feb 2026; elevated LTB production is lifting 2025–26 industrial revenue [PR Q4-25]
e-NVM optionsEmbedded non-volatile memory (EEPROM/flash-type) on CMOS platformsAutomotive MCUs/ASICs needing trimming or calibration memoryOngoing (website technology menu)
Optical / image sensor optionsPhotodiodes, IR-sensitive optionsMedical (contactless thermometers), industrialOngoing

Microsystems & Photonics

OfferingDescriptionTarget customerStatus
MEMS foundry (Itzehoe, Erfurt)Custom and standard MEMS: pressure, inertial, and MEMS sensors combined with CMOSAutomotive, industrial and medical sensor companiesMore than USD 100m revenue in FY2025 [PR Q4-25]
Silicon-based microfluidicsWafer-level microfluidic structuresDiagnostics/blood analysis, DNA sequencingNew high-volume blood-analysis application won in Q2 2026 [PR Q2-26]
Aluminium nitride (AlN) piezoPiezoelectric thin film for actuators and ultrasoundIndustrial and medical (ultrasound)New opportunities in Q2 2026 [PR Q2-26]
WLP & 3D integrationWafer-level packaging, through-silicon integrationSensor/MEMS customersOngoing (website)
Silicon photonicsPhotonic integrated circuits; opportunities in co-packaged optics, quantum computing, AR/VR, datacomData-centre optical connectivity, quantum, AR/VRPrototyping now; volume production expected from 2028 [PR Q2-26]
Fab4Micro (Erfurt)New cleanroom for MEMS, highly integrated microsystems and photonicsGroup-level capacity projectGrant of EUR 127.4m; groundbreaking Oct 2026; initial production by end-2028 [PR Chips; Evertiq]

Wide Bandgap (SiC and GaN)

OfferingDescriptionTarget customerStatus
SiC foundry (Lubbock, Texas; XbloX platform)150mm SiC MOSFET and diode processing, with customer-supplied or X-FAB-procured substratesFabless SiC power companies (EV, renewables, data-centre power)Lubbock transitioning to SiC [PR Q4-25]; 2023 plan targeted 17k wafer starts per month of SiC capacity by 2025 [PR Q4-22]; 3 data-centre SiC design wins in Q2 2026
GaN-on-Si (Dresden)200mm GaN power processPower-conversion IC firmsGaN revenue included from Q1 2026
1,200V GaN on engineered substrateFirst prototype delivered on a customised 200mm engineered substrateHigh-voltage power (EV, industrial)First prototype in Q1 2026 [PR Q1-26]
Vertical GaNCustomer project for a next-generation vertical GaN technologyAdvanced powerStarted Q1 2026 [PR Q1-26]
MOSFET technologies (M-MOS)Silicon trench MOSFET know-how acquired with M-MOSDiscrete powerAcquired Dec 2023 / 2024

Services and design-support tools

OfferingDescription
Prototyping / MPWScheduled multi-project wafer shuttles to lower entry cost (MPW schedule on website)
FeatureXplorerOnline process feature and option selector
ResourceXplorerDesign resource/PDK library access
X-CHAINSupply-chain service offering (website "Tools")
IP PortalLibrary of analog/digital/NVM IP blocks
My X-FABCustomer portal
Quality / automotive qualificationAutomotive-grade quality system (detailed certifications not re-verified)

Financial Narrative

All figures are USD m, IFRS, fiscal years ending 31 December.

Sources: FY2021–22 from [PR Q4-22] (FY2021 audited, FY2022 unaudited at release); FY2023 from [PR Q4-23] (unaudited at release); FY2024–25 from [PR Q4-25] (FY2024 audited, FY2025 unaudited at release). Minor differences to final audited annual reports may exist.

Income statement

Notes:

  • Diluted EPS is equal to basic EPS; no dilutive instruments are disclosed.

  • No dividends were paid in any year (none in the cash-flow statements).

  • FY2022 "other income/expense" includes the USD 36.8m Q3 2022 arbitration one-off [PR Q3-22].

  • FY2025 EBITDA includes a USD 9.3m SiC one-off in Q4 2025 [PR Q4-25].

Margins and growth

Revenue CAGR FY2021–FY2025: about 7.3% a year (657.8 to 870.3).

Adjusted EBITDA margins: FY2022 excludes the USD 36.8m arbitration one-off (company figure 23.4%). FY2025 excludes the USD 9.3m Q4 one-off (analyst calculation, 23.7%).

H1 2026 vs H1 2025 (latest interim, unaudited)

Source: [PR Q2-26]. H1 2026 net income includes a USD 11.0m non-cash derecognition of Malaysian deferred tax assets.

Balance sheet (year-end)

Notes:

  • No goodwill is reported; intangible assets only.

  • "Other current liabilities and provisions" rose from 68.5m (FY2021) to 387.6m (FY2023) and 354.9m (FY2025). Analyst interpretation: this largely reflects customer prepayments and capacity-reservation liabilities under LTAs. That interpretation should be confirmed in the annual report notes.

  • Debt figures include leases and sale-and-leaseback liabilities.

  • Company-reported net debt for end-2025 is implied at USD 284.8m, since Q1 2026 net debt was 291.4m, up 6.6m [PR Q1-26]. The analyst calculation of 286.1m differs slightly.

Q2 2026: cash 163.6m; debt 475.9m (255.5m current, 220.4m non-current); net debt 312.3m; equity 1,039.8m [PR Q2-26].

Cash flow

The FY2023 operating cash flow of USD 410m was inflated by a USD 277.8m increase in "other liabilities", consistent with LTA prepayments [PR Q4-23]. Capex guidance for 2026 is about USD 100m (net of Chips Act funding per the Q2 call) [PR Q4-25; Investing.com].

Key ratios

All ratios are analyst calculations from the figures above. ROIC uses a notional 25% tax rate because reported effective tax rates are distorted by deferred-tax recognition: tax was a credit in 2021–23. FY2022 interest paid includes interest relating to the supplier arbitration.

On an LTM basis to Q2 2026, EBITDA was about USD 164.0m (FY2025 196.8, less H1 2025 100.7, plus H1 2026 67.8). Net debt/EBITDA was therefore about 1.9x at 30 June 2026.

Commentary on trends, inflections and drivers

1. Up-cycle (2021–2023).

Revenue rose 38% from 657.8m to 906.8m on four drivers:

  • Automotive electrification.

  • Price increases. Q3 2022 bookings already reflected 2023 price levels, and price rises offset cost inflation [PR Q3-22; PR Q4-22].

  • Conversion of the French fab from legacy CCC products to the 180nm automotive platform. The share of the French site's revenue on X-FAB technologies rose from 56% in Q3 2022 to 93% in Q4 2023.

  • SiC growth.

EBITDA margin peaked at 27.1% in FY2023, slightly above the 23–27% guidance [PR Q4-23].

2. Destocking and the capex peak (2024).

Revenue fell 10%. Automotive and industrial customers cut inventory, and demand for 150mm CMOS collapsed. Capex hit a record USD 509.5m because the expansion programme had been committed. Free cash flow was −313m and the balance sheet swung from a net cash position of 144.7m to net debt of 198.3m.

3. Partial recovery with margin dilution (2025).

Revenue grew 6.6%, led by industrial (+19%) and medical (+26%), while automotive grew only 1%. EBIT nonetheless fell 11% to 76.4m because depreciation rose by USD 17m as new tools came online.

The net financial result deteriorated to −35.9m. Finance costs of 70.7m included FX and derivative effects; interest paid was 20.8m.

The Q4 2025 one-off of USD 9.3m had two parts: 6.0m for renegotiating a long-term SiC raw-wafer purchase agreement, and 3.3m for revaluing SiC substrate inventory [PR Q4-25].

4. Trough (H1 2026).

Automotive revenue fell 19% year on year in Q2 2026. Gross margin dropped to 15.3%, and Q2 2026 EBIT was just 2.1m. R&D rose to 7.6% of revenue in H1 2026, compared with 5.8% in H1 2025.

The cost programme targets USD 6m per quarter of savings by Q4 2026, including a high-single-digit percentage headcount reduction [PR Q4-25].

5. Balance sheet.

Reclassification of about USD 250m of debt to current liabilities pushed the current ratio below 1.0 at end-2025 (0.92). Refinancing therefore became a monitorable. Net debt rose to 312.3m at Q2 2026 despite low capex, because operating cash flow turned slightly negative in Q2 (−1.0m) on working-capital outflows.

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Financial Detail

Revenue by Segment

End-market (USD Mn)FY2021FY2022FY2023FY2024FY2025

Automotive revenue

331.6389.3539.1552.6558.3

Industrial revenue

145.6172.9206.2154.6184.6

Medical revenue

47.955.867.356.371.3

CCC revenue

131.7118.476.957.952.7

Others revenue

1.03.10.70.80.9

Revenue* total

657.8739.5890.2822.3867.6

IFRS 15 over-time impact

0.00.016.6-5.92.7

Reported total revenue

657.8739.5906.8816.4870.3

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Growth and mix (%)

Growth and mix (%)FY2022FY2023FY2024FY2025

Automotive YoY growth %

17.438.52.51.0

Industrial YoY growth %

18.819.3-25.019.4

Medical YoY growth %

16.520.6-16.326.6

CCC YoY growth %

-10.1-35.1-24.7-9.0

Core (Auto+Ind+Med) share of Revenue* %

83.691.392.293.8

End-market share of Revenue* (%)

End-market share of Revenue* (%)FY2021FY2022FY2023FY2024

Automotive share %

50.452.660.667.2

Industrial share %

22.123.423.218.8

Medical share %

7.37.57.66.8

CCC share %

20.016.08.67.0

Revenue by Segment by Technology

Technology (USD Mn)FY2021FY2022FY2023FY2024FY2025

CMOS revenue

558.4609.4722.4680.3733.2

Microsystems/MEMS revenue

65.575.695.391.0100.7

Silicon carbide revenue

33.854.572.651.133.7

Technology YoY growth (%)

Technology YoY growth (%)FY2022FY2023FY2024FY2025

CMOS growth %

9.118.5-5.87.8

Microsystems growth %

15.426.1-4.510.7

SiC growth %

61.233.2-29.6-34.1

Revenue by Segment (Quarterly)

Technology line (USD Mn)Q3 2024Q4 2024Q1 2025Q2 2025Q3 2025Q4 2025Q1 2026Q2 2026

Smart CMOS & SOI

175.0170.8173.4185.1191.8182.9156.9156.7

Microsystems & Photonics

21.620.222.925.327.525.033.728.7

Wide-bandgap (SiC+GaN)

7.45.86.07.99.610.215.110.6

Revenue*

204.0196.8202.3218.3228.9218.1205.8196.0

Reported revenue

206.4188.8204.1215.3228.6222.3195.6199.8

Revenue by Segment (Q3 2024–Q2 2026)

End-market (USD Mn)Q3 2024Q4 2024Q1 2025Q2 2025Q3 2025Q4 2025Q1 2026Q2 2026

Automotive

146.0128.6135.4143.4146.9132.6121.6116.0

Industrial

31.536.139.347.247.650.552.045.2

Medical

12.116.513.815.121.221.219.221.0

CCC

14.215.113.612.213.313.612.713.5

Income Statement and Per-Share Data

Metric (USD Mn)FY2021FY2022FY2023FY2024FY2025

Revenue

657.8739.5906.8816.4870.3

Cost of sales

-507.8-563.5-648.7-633.4-685.9

Gross profit

150.0176.0258.1182.9184.4

R&D expenses

-34.3-40.8-47.2-49.8-49.7

Selling expenses

-8.0-8.2-8.5-9.1-9.2

G&A expenses

-32.8-37.5-47.2-47.4-48.2

Other income/expense (net)

0.4-31.9-0.56.0-3.7

Operating income (EBIT)

77.257.3157.785.576.4

Depreciation & amortisation

76.177.587.9103.4120.4

EBITDA

153.3134.9245.6188.9196.8

Net financial result

-4.3-20.3-2.5-2.3-35.9

Pre-tax income

72.937.1155.283.340.5

Income tax

10.815.46.7-21.8-10.4

Net income

83.652.5161.961.530.1

EPS basic (USD)

0.640.401.240.470.23

EPS diluted (USD)

0.640.401.240.470.23

Dividends per share (USD)

00000

Margin Analysis (%)

Ratio (%)FY2021FY2022FY2023FY2024FY2025

Revenue growth %

37.512.422.6-10.06.6

Gross margin %

22.823.828.522.421.2

EBIT margin %

11.77.817.410.58.8

EBITDA margin %

23.318.227.123.122.6

Adjusted EBITDA margin (ex one-offs) %

23.323.427.123.123.7

Net margin %

12.77.117.97.53.5

Income Statement and Margin Analysis (%)

Metric (USD Mn)H1 2025H1 2026

Revenue

419.4395.4

Gross profit

94.661.2

R&D expenses

-24.5-30.0

EBIT

42.84.4

EBITDA

100.767.8

EBITDA margin %

24.017.1

Net income

11.8-13.9

EPS (USD)

0.09-0.11

Operating cash flow

67.815.9

Capex

155.550.2

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Balance Sheet

Metric (USD Mn)FY2021FY2022FY2023FY2024FY2025

Total assets

986.91,255.11,703.81,906.71,947.0

Property, plant & equipment

340.7460.1734.51,144.61,220.3

Inventories

181.0214.4269.2281.8264.7

Cash & equivalents

290.2369.4405.7215.8194.3

Short-term loans & borrowings

87.1233.5218.344.5292.5

Long-term loans & borrowings

39.963.442.7369.6187.9

Total debt

127.0296.9261.0414.1480.4

Net debt (negative = net cash)

-163.2-72.5-144.7198.3286.1

Total equity

744.3797.0960.51,022.81,053.3

Goodwill & intangibles

4.06.25.66.39.5

Current assets

588.2713.0872.7681.6648.3

Current liabilities

197.0390.6696.6510.0702.2

Working capital

391.3322.4176.1171.5-53.9

Cash Flow

Metric (USD Mn)FY2021FY2022FY2023FY2024FY2025

Operating cash flow

109.5100.0410.0196.1144.1

Capex (PP&E and intangibles)

-67.0-180.6-337.8-509.5-204.1

Free cash flow (OCF minus capex)

42.5-80.672.2-313.4-60.0

Dividends paid

00000

Share buybacks

00000

Proceeds from borrowings

82.6184.3205.8209.7104.5

Repayment of borrowings

-28.2-11.4-241.8-124.2-75.3

Sale-and-leaseback receipts

07.7060.630.1

Government grants received

0.50.9009.9

Capex as % of revenue

10.224.437.362.423.5

Returns & Leverage Ratios (%) and Financial Ratios (x)

RatioFY2021FY2022FY2023FY2024FY2025

ROE % (year-end equity)

11.26.616.96.02.9

ROA % (year-end assets)

8.54.29.53.21.5

ROIC % (EBIT x 0.75 / (equity + net debt))

10.05.914.55.34.3

Current ratio (x)

2.991.831.251.340.92

Debt / equity (x)

0.170.370.270.400.46

Net debt / EBITDA (x)

-1.06-0.54-0.591.051.45

Interest coverage (EBIT / interest paid, x)

49.23.213.65.03.7

Asset turnover (revenue / total assets, x)

0.670.590.530.430.45

Days inventory outstanding

130139151162141

Days sales outstanding

4136504337

Days payables outstanding

3035513929

Cash conversion cycle (days)

141140150166149

Region (USD Mn, derived from % x FY2025 revenue 870.3)

Region (USD Mn, derived from % x FY2025 revenue 870.3)FY2025

Belgium

379.5

Germany

94.9

United Kingdom

54.8

France

18.3

Other Europe

39.2

China

108.8

Japan

49.6

Singapore

12.2

Other Asia

30.5

United States

77.5

Other

5.2

Region share (%)

FY2025

Belgium share %

43.6

Germany share %

10.9

United Kingdom share %

6.3

France share %

2.1

Other Europe share %

4.5

China share %

12.5

Japan share %

5.7

Singapore share %

1.4

Other Asia share %

3.5

United States share %

8.9

Other share %

0.6

Share Price History

DatePrice / eventSource

Apr 2017

IPO price 8.00

BNPP Fortis note

Jul 2025

6.95 (+10% on guidance raise)

Boursier

31 Oct – 4 Nov 2025

About −23% over three sessions after Q3 bookings

Zonebourse/BFM

2 Jan 2026

About 5.6 (technical buy level cited)

BFM Bourse

24 Apr 2026

6.74; 52-week range 4.00–7.44; market cap EUR 884m

Google Finance

27 May 2026

Intraday +76%; market cap about EUR 2.06bn

ABC Bourse/Reuters

3 Jul 2026

7.91

Idéal Investisseur

20–24 Jul 2026

6.95–6.96; market cap EUR 908m

Idéal Investisseur

29 Sep 2026

About 6.82 (+6.6%) after a 5.71 low

Boursorama/TEC

Valuation Snapshot

MetricValue

Market capitalisation (USD Mn)

1,030

Net debt, 30 Jun 2026 (USD Mn)

312

Enterprise value (USD Mn)

1,342

LTM revenue to Q2 2026 (USD Mn)

846

LTM EBITDA (USD Mn)

164

LTM net income (USD Mn)

4

EV / Sales (x)

1.6

EV / EBITDA (x)

8.2

P / Book (x)

1.0

P / E LTM

Not meaningful (about 230x)

Analyst Ratings & Targets

BrokerDateRatingTarget (EUR)

Bernstein

23 Jun 2026; reiterated 7 Sep 2026

Outperform / Buy

12.80

Kepler Cheuvreux

6 Jul 2026

Buy (upgraded from Hold)

10.50

KBC Securities

24 Jun 2026

Hold

8.80

Deutsche Bank

10 Jul 2026

Hold

6.00 (raised from 4.60)

Berenberg

4 Aug 2026

Hold

Not captured

Oddo BHF

5 May 2026

Not captured

Not captured

Degroof Petercam

Covering

Not captured

Not captured

Median target

Jul 2026

—

8.80 (range 6.00–12.80)

Analyst Conclusions

Management guidance

ItemGuidance
Q3 2026 Revenue*USD 195–205m
Q3 2026 EBITDA margin17–20%
AssumptionsUSD/EUR 1.14; excluding IFRS 15
H2 2026Stronger than H1; gradual automotive recovery; no formal Q4 guidance
Cost programmeAbout USD 6m per quarter of savings by Q4 2026
FY2026 capexAbout USD 100m
Long termHigh-single-digit average growth across cycles; EBITDA margin above 30%; capex 10–15% of revenue

Consensus growth. Deutsche Bank cut its 2026 sales growth forecast to 2% in November 2025. On H1 2026 actuals of USD 395m, FY2026 revenue is tracking roughly flat to slightly down versus FY2025's 870m (analyst inference).

Bull case

  1. Cyclical operating leverage. The fully installed USD 1bn+ capacity base could restore EBITDA margins toward the 27% achieved at USD 907m revenue in FY2023. Q2 2026 automotive book-to-bill was the highest in two years.

  2. New, under-appreciated growth vectors. Data centres (about USD 300m potential), photonics (2028 volume), GaN and microfluidics diversify the mix away from automotive. Microsystems & Photonics reached a record 33.7m in Q1 2026.

  3. Asset-backed valuation. About 1.0x book and about 8x trough EBITDA, with subsidised growth capex (EUR 127.4m). Free cash flow should turn positive as capex drops to about USD 100m.

Bear case

  1. Structural margin erosion. Gross margin fell to 15.3% while depreciation is at a record (USD 120m in FY2025). Chinese mature-node supply may cap pricing, so "above 30%" may prove aspirational.

  2. Balance-sheet strain. Net debt of USD 312m (about 1.9x LTM EBITDA), negative Q2 operating cash flow, and a current ratio below 1 increase refinancing and dilution risk if recovery stalls.

  3. Revenue air pockets. The end of the 0.6µm last-time-buy in early 2027, SiC price deflation and automotive EV softness could offset new wins. Targets have already been reset twice (2024 and 2026).

Catalysts and monitorables (next 12 months)

Catalyst / monitorableTimingWhat to watch
Q3 2026 results29 Oct 2026Delivery within the 195–205m and 17–20% guidance; Q4 commentary; bookings above USD 180m
FY2026 results and first 2027 guidanceFeb 2027Whether guidance returns; margin trajectory after cost savings
Automotive book-to-billQuarterlySustained above 1.0
0.6µm technology end-of-lifeEarly 2027Size of the industrial revenue gap
Malaysia ramp to 40k wafer starts per monthEnd-2026Utilisation and gross margin
Data-centre design-win conversion2026–27Revenue disclosure by application
SiC/GaN2026–27Wide-bandgap revenue trend (Q2 2026: 10.6m)
Refinancing of current debt2026–27Maturity extension; covenant headroom
Fab4Micro construction2026–28Budget and schedule
GovernanceOngoingCOO appointment; any ownership changes among Elex, Sensinnovat and Sarawak

Analyst verdict

X-FAB enters late 2026 at the bottom of a painful but largely self-explained cycle. Between 2022 and 2025 it roughly tripled its fixed asset base (PP&E from USD 460m to 1.22bn), financed partly by customer LTAs. Its core automotive market then entered a prolonged inventory correction just as the new capacity came online. The result is predictable: EBITDA margin has fallen from 27.1% in FY2023 to 16.8% in Q2 2026, ROE has collapsed to low single digits, and the balance sheet has swung from USD 145m net cash to USD 312m net debt.

What distinguishes X-FAB from a generic mature-node foundry is the quality of its option set:

  • A differentiated 180nm SOI/BCD franchise relevant to data-centre power.

  • A profitable and growing medical and microsystems business.

  • A credible, subsidised photonics and microsystems hub in Erfurt.

  • One of the few open SiC/GaN foundry offerings in the West.

The new CEO, a former operations head and Melexis executive, inherits a capacity base that requires little further investment.

The investment debate therefore centres on utilisation and pricing, not on strategy. If automotive bookings continue to recover and the cost programme delivers about USD 24m in annualised savings, a return to 22–25% EBITDA margins in 2027 looks plausible on roughly 5–10% revenue growth. At about 8x trough EBITDA and about 1x book, that scenario is not priced in. Conversely, several factors could keep returns below the cost of capital for longer than the market tolerates:

  • A slower automotive recovery.

  • The 0.6µm last-time-buy cliff.

  • Continued SiC deflation.

  • Chinese mature-node pricing pressure.

Investors would also face refinancing risk and the governance discount of a tightly held register.

Net assessment: a high-beta, asset-rich recovery play with genuine structural optionality. The Q3 and Q4 2026 bookings trajectory and the return of formal full-year guidance in February 2027 are the decisive tests.


Disclaimer: Compiled from public sources as of 20 October 2026.

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Executive Leadership

Executive Leadership Team

NameTitleTenurePrior roles / educationAge

Damien Macq

CEO and Executive Director (via Fajel Consultants BV)

COO from Apr 2023; CEO since 6 Feb 2026; director since 30 Apr 2026

VP & GM of the Sense & Light business unit at Melexis. Earlier executive roles at ST-Ericsson, ON Semiconductor/AMIS, GlobespanVirata and Alcatel. MSEE and PhD, UCLouvain; Stanford Executive Program (2006); IEEE Senior Member and former chair of IEEE Benelux [Board; PR CEO]

Born 1966 (about 60)

Alba Morganti

Chief Financial Officer

CFO since at least 2022 (on Q4 2022 call)

Not detailed in sources retrieved

—

Jörg Doblaski

Chief Technology Officer

Listed as CTO in investor materials

Not detailed

—

Group COO (successor to Macq)

——

Appointment not identified in sources retrieved

—

Lee Boon Chun

CEO, X-FAB Sarawak

———

Sébastien Daveau

CEO, X-FAB France

———

Dr. Gabriel Kittler

CEO, X-FAB Erfurt

—

Leads Fab4Micro

—

Rico Tillner

CEO, X-FAB Texas

———

Michael Woittennek

CEO, X-FAB Dresden

———

Uta Steinbrecher

Investor Relations

———

“—” = not publicly disclosed.

Board of Directors

DirectorRoleIndependenceAffiliation / background

Tan Sri Datuk Amar Dr. Hamid bin Bugo

Chairman

Non-independent (Sarawak-linked)

Former State Secretary of Sarawak; chairs the National Library Council of Malaysia and Petroleum Sarawak Berhad; MA in Economics & Political Science (Canterbury, NZ)

Damien Macq (Fajel Consultants BV)

Executive director & CEO

Executive

Four-year term to the AGM approving FY2029 accounts

Rudi De Winter

Non-executive director

Non-independent (Sensinnovat)

Co-founder; CEO 2011/2014–2026; Melexis CEO 1996–2011; Electronic Engineering, Ghent. Co-opted 3 Feb 2026, appointed for four years

Dato Sri Dr. Wan Lizozman Haji Wan Omar

Non-executive director

Non-independent (Sarawak)

State Financial Secretary of Sarawak; Columbia SIPA; PhD UNIMAS

Roland Duchâtelet

Non-executive director

Non-independent (Elex)

Co-founder of the parent company; former Belgian senator (2007–10); KU Leuven engineering/economics/MBA

Hans-Jürgen Straub

Independent non-executive director

Classified independent by the company

X-FAB CEO 1999–2014; formerly at Kombinat Mikroelektronik Erfurt

Christine Juliam (Aurore NV)

Independent non-executive director

Independent

Pharma executive (MSD, Abbott, Nycomed/Takeda, Orifarm); MD (Ghent), MBA (Northwestern). Re-appointed 2026 for four years

Christel Verschaeren

Independent non-executive director

Independent

29 years at IBM, including VP CIO Services EMEA; Master's in Economics (Antwerp)

Estelle Iacona

Independent non-executive director

Independent

Physics professor at CentraleSupélec; former President of Paris-Saclay University; French Ministry of Higher Education and Research

Major Shareholders

HolderShares% of voting rightsNotes

Elex NV (Roland Duchâtelet / Duchâtelet Future Private Foundation)

32,672,77824.98

Acts in concert with Roland Duchâtelet (125,724 shares; 25.08% combined) [FSMA]

Sensinnovat BV (Rudi De Winter / Françoise Chombar, via Chione Partnership)

31,666,781 (FSMA, Nov 2023); 31,936,781 (company site)

24.21–24.4

Combined with family about 24.27% (Nov 2023) [FSMA]; company IR page shows 24.4%

Sarawak Technology Holdings Sdn Bhd (State Financial Secretary, Sarawak)

14,948,65511.43

[FSMA]

Treasury shares (X-FAB Semiconductor Foundries GmbH)

about 149,748

0.11

2018 notification

Free float

about 51.2m

about 39

Analyst calculation

Competitive Landscape

Competitors by Segment

SegmentCompetitorsNotes

Specialty analog/mixed-signal and HV CMOS foundry

Tower Semiconductor (Israel/US/Japan/Italy); GlobalFoundries (US/Germany/Singapore); Vanguard International Semiconductor (Taiwan/Singapore); Hua Hong Semiconductor (China); United Microelectronics (Taiwan); DB HiTek (Korea); SkyWater Technology (US); SilTerra (Malaysia); Nexchip and other Chinese 8-inch foundries

Overlap in 180nm/130nm BCD, HV and SOI

SOI / BCD-on-SOI

Tower; GlobalFoundries; TSMC (specialty)

X-FAB's 180nm deep-trench SOI is a niche strength

MEMS foundry

Silex Microsystems (Sweden); Teledyne MEMS (Canada); TSMC; STMicroelectronics (captive); Bosch (captive)

X-FAB has a CMOS-plus-MEMS integration advantage

Silicon photonics foundry

Tower (strong SiPho leader); GlobalFoundries; TSMC; AIM Photonics; imec (pilot line)

X-FAB is a late entrant; volume from 2028

SiC / GaN foundry

Clas-SiC (UK); TSMC and Vanguard in GaN; IDMs Infineon, STMicroelectronics, onsemi and Wolfspeed (vertically integrated)

X-FAB is one of few open SiC foundries in the West

Peer Comparison FY2025

MetricX-FABTower SemiconductorGlobalFoundries

Revenue FY2025 (USD Mn)

870.31,566.16,791.0

Revenue growth FY2025 %

6.69.00.6

Gross margin FY2025 %

21.223.224.9

Operating margin FY2025 %

8.812.411.7

Net income FY2025 (USD Mn)

30.1218.8

not computed here

R&D % of revenue FY2025

5.7——

Capex FY2025 (USD Mn)

204.1437.0—

Company Snapshot

$558M

Revenue

4,200

Employees

$1,030M

Market Cap

1992

Founded

Germany

Headquarters

SWOT Analysis

Strengths

  • Core-market focus. Automotive, industrial and medical reached 94% of Revenue* in FY2025, up from 80% in FY2021 [PR Q4-22; PR Q4-25].
  • Medical growth engine. Record FY2025 medical revenue of USD 71.3m (+26%), and +39% YoY in Q2 2026 [PR Q4-25; PR Q2-26].
  • Microsystems scale. More than USD 100m revenue in FY2025 (+11%), and a record USD 33.7m in Q1 2026 [PR Q4-25; PR Q1-26].
  • Modernised asset base. PP&E grew from USD 340.7m (FY2021) to 1,220.3m (FY2025). The expansion is complete and 2026 capex falls to about 100m [PR Q4-25].
  • Natural FX hedge. At constant FX, Q2 2026 margin would have been only 0.1pp higher [PR Q2-26].
  • Public-funding support. EUR 127.4m Chips Act grant for Fab4Micro [PR Chips].
  • SiC volume momentum. Q1 2026 SiC wafer shipments of 14,300, up 195% YoY.

Weaknesses

  • Automotive concentration. 64.3% of FY2025 Revenue*; the H1 2026 automotive decline drove EBIT down 90% YoY in Q2 [PR Q2-26].
  • Margin compression. Gross margin fell from 28.5% (FY2023) to 15.3% (Q2 2026).
  • Weak returns. FY2025 ROE of 2.9% and ROIC of about 4% (analyst calculations).
  • Leverage and liquidity. Net debt of USD 312.3m (about 1.9x LTM EBITDA) and a current ratio of 0.92 at end-2025, with 255.5m of current borrowings at Q2 2026.
  • Thin free cash flow. Cumulative FCF for FY2021–FY2025 is −339m; Q2 2026 operating cash flow was −1.0m.
  • Guidance credibility. The 2026 target of USD 1.05bn and 30% (set Dec 2024) has been effectively abandoned; there was no FY2026 guidance.
  • Deferred tax impairment. USD 11.0m Malaysian DTA derecognition signals lower expected local profitability [PR Q2-26].

Opportunities

  • Data centres. About USD 300m long-term annual revenue potential [PR Q2-26].
  • Photonics. Volume from 2028, with traction in co-packaged optics and quantum.
  • GaN. 1,200V and vertical GaN projects could create a second wide-bandgap leg [PR Q1-26].
  • Asian capacity reallocation. Asian 8-inch fabs shifting to AI could leave customers looking for capacity [PR Q2-26].
  • Automotive restocking. Book-to-bill at its highest in two years in Q2 2026 [PR Q2-26].
  • Malaysia ramp. 40k wafer starts per month and shorter cycle times support share gains.
  • Operating leverage on recovery. FY2023 showed 27% EBITDA margin at USD 907m revenue.

Threats

  • Chinese mature-node overcapacity and price competition. Industry-level risk; Deutsche Bank also flagged the 300mm absence.
  • Further SiC price deflation and substrate commitments (Q4 2025 USD 9.3m hit).
  • Revenue cliff after 0.6µm LTB ends in early 2027 [PR Q4-25].
  • EV adoption slower than expected. Management acknowledged the 2025 slowdown [PR Q4-25].
  • Trade and tariff escalation. The company cited tariff and trade-war caution among automotive customers [PR Q4-25].
  • Cyber attack recurrence. The July 2020 attack halted production group-wide.
  • Share price volatility from retail flows. Up to +76% intraday on 27 May 2026, which complicates capital-markets access.

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Key Developments

DateEventSignificance
24 Apr 2025Q1 2025 results: revenue 204.1m, up 8% QoQ; EBITDA margin about 24%; guidance reaffirmed. KBC keeps an EUR 6.3 target and Accumulate ratingEarly signs of recovery (Bolero/KBC)
Jul 2025Q2 2025 results: revenue 215.3m (+5% YoY); EBITDA 51.6m (24.0%); bookings +19% QoQ to about 207m; FY2025 revenue guidance raised to 840–870m; shares +10% to EUR 6.95Guidance raise (Boursier)
Mid-2025Three-year capacity expansion programme completedEnd of the capex super-cycle
9 Sep 2025Investor Day in Brussels: three pillars and long-term targetsNew strategic framework [PR ID-25]
Sep 2025Malaysia new cleanroom begins productionCapacity
30 Oct 2025Q3 2025 results: revenue 228.6m (+11% YoY, above 215–225m guidance); record medical revenue of 21.2m (+74%); EBITDA 53.9m (23.6%)Strong quarter but weak bookings [PR Q3-25]
30 Oct 2025CEO succession: Macq to replace De Winter on 6 Feb 2026Leadership change [PR CEO]
31 Oct – 4 Nov 2025Shares fall about 23% in three sessions. Deutsche Bank downgrades to Hold (target EUR 7.5 to 6.0), citing Q3 orders −25% YoY and a lack of 300mm production; cuts its 2026 sales growth forecast to 2% from 8%Sentiment reset (Zonebourse/BFM)
Q4 2025Progress on securing EU Chips Act support for ErfurtSubsidy
5 Feb 2026FY2025 results: revenue 870.3m (+7%); EBITDA 196.8m; Q4 one-off of 9.3m; no FY2026 guidance; cost programme announced; 2026 capex about 100mEarnings reset [PR Q4-25]
6 Feb 2026KBC Securities cuts its price target citing limited visibilityAnalyst action (Bolero)
6 Feb 2026Damien Macq takes office as CEOLeadership
31 Mar 2026Annual Report 2025 published (net income USD 30.13m)Filing
30 Apr 2026Q1 2026 results: revenue 195.6m (−4% YoY); record Microsystems & Photonics revenue of 33.7m (+42%); wide-bandgap 15.1m (+152%); EBITDA 34.2m (17.5%); 1,200V GaN prototype; net debt 291.4mTrough with mix improvement [PR Q1-26]
30 Apr 2026AGM/EGM: Macq and De Winter appointed directors; Juliam re-appointed; AGM date changedGovernance [AGM 2026]
5 May 2026Analyst action
27 May 2026Shares surge up to 76% intraday on retail flows after a viral post on X; market cap briefly about EUR 2.06bn; second most-traded stock on TradegateExtreme volatility (ABC Bourse/Reuters)
23 Jun 2026Bernstein: Outperform, EUR 12.80 targetAnalyst action (Idéal Investisseur)
23 Jun 2026EUR 127.4m Chips Act grant notification for Fab4MicroGrowth capex largely subsidised [PR Chips]
24 Jun 2026KBC Securities: Hold, EUR 8.80 targetAnalyst action
6 Jul 2026Kepler Cheuvreux upgrades to Buy (EUR 10.50)Analyst action
10 Jul 2026Deutsche Bank raises target to EUR 6.00 from 4.60 (Hold)Analyst action (TipRanks)
30 Jul 2026Q2 2026 results: revenue 199.8m (−7% YoY, +2% QoQ); automotive book-to-bill highest in two years; data-centre potential about 300m; EBITDA 33.6m (16.8%); USD 11.0m Malaysian DTA write-off; Q3 guidance 195–205m and 17–20%Bottoming signals [PR Q2-26]
4 Aug 2026Berenberg maintains HoldAnalyst action
1 Sep 2026Half-Year Report 2026 publishedFiling
7 Sep 2026Bernstein reiterates Buy/OutperformAnalyst action
28 Sep – 2 Oct 2026Exhibits SiC solutions at ICSCRM 2026, YokohamaSiC marketing
29 Sep 2026Shares +6.6% to about EUR 6.8 after a technical rebound from a low of EUR 5.71Price action (Boursorama)
Early Oct 2026Fab4Micro groundbreaking in ErfurtProject execution (Evertiq, 6 Oct 2026)
29 Oct 2026 (scheduled)Q3 2026 resultsNext catalyst

Product Offering

  • X-FAB Silicon Foundries SE
    • MEMS Sensors

Financial Performance

Explore key financial metrics, segmented revenue, balance sheet health, and performance trends.

Revenue

6 charts
Income Statement: Revenue & Gross Profit: Revenue rose from USD 657.8 Mn in FY2021 to USD 870.3 Mn in FY2025.
X-FAB Silicon Foundries SE — Income Statement: Revenue & Gross Profit
Series (USD Mn)FY2021FY2022FY2023FY2024FY2025
Revenue657.8739.5906.8816.4870.3
Cost of sales-507.8-563.5-648.7-633.4-685.9
Gross profit150176258.1182.9184.4

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