Xiamen Hengkun New Material Technology Co., Ltd. Overview
Hengkun is one of the few companies in mainland China that develops and mass-produces lithography and thin-film deposition materials qualified for 12-inch (300 mm) wafer fabrication. Its core products are spin-on carbon (SOC) hard masks, bottom anti-reflective coatings (BARC), and i-Line and KrF photoresists. In precursors its main product is high-purity tetraethyl orthosilicate (TEOS). These materials go into advanced 3D NAND, DRAM and logic chips at 90 nm and below. The company started out importing and distributing foreign materials, mostly from Korean suppliers, and used that business to win fab relationships before replacing the imports with its own formulations. By FY2025, 86.66% of main-business revenue came from products it makes itself. On Frost & Sullivan data it was the largest domestic supplier of both SOC and BARC to China's market in 2023. Its SOC share passed 10% in 2024. ArF immersion photoresist, SiARC, top coats, metal-based and high-k precursors, and spin-on dielectrics make up its next wave of products. The company depends heavily on a few memory customers: its largest customer generated 55.17% of FY2025 sales.
What the company does
Hengkun develops, makes and sells critical materials for front-end integrated-circuit wafer fabrication. It works in two process families:
Lithography materials: These are used in the coating stage of photolithography. They include photoresists (i-Line and KrF in volume, ArF immersion in small batches) and the ancillary films that make patterning possible at fine pitches: SOC carbon hard masks, BARC, silicon-containing anti-reflective coatings (SiARC) and top coats.
Precursor materials: These are used in chemical vapour deposition (CVD) and atomic layer deposition (ALD) to grow thin films. The main product is 9N-grade TEOS for silicon-oxide deposition, followed by silicon-based, metal-based and high-k precursors now in qualification.
Alongside its own products, the company still runs an "introduced" (引进) business. It imports lithography materials, precursors, electronic specialty gases and wet chemicals from foreign makers such as SK Materials Performance (SKMP), Soulbrain, SK trichem, Hansol, KDK, SK specialty and Wonik, and resells them to domestic fabs. Revenue from this business is booked on a net basis, so its reported gross margins are about 98%.
The company's own description (FY2025 annual report and prospectus)
The company calls itself an innovator "dedicated to the R&D and industrial application of key materials in the integrated-circuit field". It says it is one of the few domestic companies able to develop and mass-produce critical materials for 12-inch wafer manufacturing. It says its products are indispensable for lithography and thin-film deposition in advanced NAND, DRAM and sub-90 nm logic. It also says it has displaced foreign products at several leading domestic 12-inch fabs. Products in volume supply are SOC, BARC, i-Line photoresist, KrF photoresist and TEOS. The company describes its strategy as moving from "introduce, digest, absorb, re-innovate" to "self-production first, independently controllable".
Independent characterisation
In practice, Hengkun is a process-material formulator focused on memory. Its five largest customers in the prospectus period were all among the ten largest wafer makers in mainland China by 2023 capacity. Three of them (Customers A, B and C) make memory chips and two (D and E) make logic chips. SOC is the economic core: it has made up more than 75% of self-produced lithography revenue in every reported period. SOC volumes scale with the number of patterning layers in high-stack 3D NAND and advanced DRAM. Because of this, the company's growth follows domestic memory capital spending and localisation policy more than general semiconductor demand.
Revenue model
| Revenue type | Description | Share of FY2025 main-business revenue (%) |
|---|---|---|
| Self-produced products | Own formulations made at Zhangzhou (lithography) and Dalian (precursors) and sold to fabs on volume purchase orders after qualification | 86.66 |
| Introduced products | Foreign products imported and resold; revenue recognised net of cost | 13.34 |
Self-produced products: Description: Own formulations made at Zhangzhou (lithography) and Dalian (precursors) and sold to fabs on volume purchase orders after qualification; Share of FY2025 main-business revenue (%): 86.66
Introduced products: Description: Foreign products imported and resold; revenue recognised net of cost; Share of FY2025 main-business revenue (%): 13.34
All revenue comes from selling products. The company has no subscription, licensing or service revenue. Prices are set per product with each fab and are typically renegotiated every year. The prospectus notes that customers negotiated price cuts on self-produced lithography materials in 2023 and 2024.
Value-chain position and end markets
Hengkun sits between upstream suppliers of resins, photo-acid generators, solvents and high-purity silicon feedstock, much of which is imported, and downstream wafer fabs. In 2026 it began integrating backwards: SOC resin, BARC resin and ArF immersion photoresist resin were all in self-production by the end of June 2026. Its end markets are 3D NAND flash (128 layers and above), DRAM (18 nm and below), logic (7–90 nm, with stated support for 14 nm and below) and specialty-process fabs.
Strategy
Stated strategy (FY2025 annual report, H1 2026 report, investor briefings)
- From "importing to fund self-production" to "self-production first". The introduced business was used to win fab access, understand process requirements and fund R&D. With 86.66% of FY2025 main-business revenue now self-produced, the introduced business is in maintenance mode.
A three-tier product ladder: Lithography materials are the core. Precursors are the second growth curve. Spin-on dielectrics are the new platform.
Vertical integration: The company is moving upstream into high-purity raw materials and resin synthesis (SOC, BARC and ArF resins), to secure supply and improve margins.
From "following localisation" to "co-development": The company aims to develop materials alongside customers' next-generation processes instead of only replacing incumbent foreign products.
Full-chain service: The company offers formulation, pilot and scale-up production, application development and after-sales support. It argues that local supply gives shorter lead times, lower logistics costs and lower prices than imports.
Corporate goal: "Domestically leading, internationally advanced."
Initiatives in the last 24 months
| Initiative | Date | Detail |
|---|---|---|
| End of part of the SKMP introduced-lithography cooperation | 2,025 | Deliberate shift of resources toward self-produced products; trade revenue down 61.59% |
| STAR Market IPO | Nov 2025 | RMB 1.010 billion raised gross, RMB 892 million net |
| IC Precursor Phase II (Dalian) | 2025–2027 | RMB 400 million of IPO proceeds; metal-based and high-k precursors; TEOS expansion |
| Advanced Materials for IC (Hefei) | 2025–2027 | RMB 607 million of IPO proceeds; ArF immersion photoresist and other high-end lithography materials |
| Capital injection and loans to the project subsidiaries | Dec 2025 | Board approved IPO funds going to Dalian Hengkun and Anhui Hengkun |
| Cash management | Dec 2025 | Idle IPO proceeds and own funds put into principal-protected and wealth-management products |
| Xiamen Honggen spin-on dielectric joint venture | Jun 2026 | RMB 100 million of registered capital; company 50% |
| In-house resin production | By Jun 2026 | SOC, BARC and ArF immersion resins produced internally |
| ArF immersion photoresist qualification | H1 2026 | Full customer-process qualification completed; small-batch supply |
End of part of the SKMP introduced-lithography cooperation: Date: 2025; Detail: Deliberate shift of resources toward self-produced products; trade revenue down 61.59%
STAR Market IPO: Date: Nov 2025; Detail: RMB 1.010 billion raised gross, RMB 892 million net
IC Precursor Phase II (Dalian): Date: 2025–2027; Detail: RMB 400 million of IPO proceeds; metal-based and high-k precursors; TEOS expansion
Advanced Materials for IC (Hefei): Date: 2025–2027; Detail: RMB 607 million of IPO proceeds; ArF immersion photoresist and other high-end lithography materials
Capital injection and loans to the project subsidiaries: Date: Dec 2025; Detail: Board approved IPO funds going to Dalian Hengkun and Anhui Hengkun
Cash management: Date: Dec 2025; Detail: Idle IPO proceeds and own funds put into principal-protected and wealth-management products
Xiamen Honggen spin-on dielectric joint venture: Date: Jun 2026; Detail: RMB 100 million of registered capital; company 50%
In-house resin production: Date: By Jun 2026; Detail: SOC, BARC and ArF immersion resins produced internally
ArF immersion photoresist qualification: Date: H1 2026; Detail: Full customer-process qualification completed; small-batch supply
Guidance
Management has not issued numerical guidance. At the 30 September 2026 briefing it said orders for mature localised products would keep being delivered in H2 2026, with reasonable order visibility. It said the company aims for steady revenue growth in 2026 and expects gross margin to improve with scale. It cautioned that ArF revenue would stay small in the near term because the company lacks a dedicated ArF exposure tool for in-house development.
Products & Services
Lithography materials (self-produced)
| Product | Description and function | Key capabilities | Target customers | Commercial status (first sales year) |
|---|---|---|---|---|
| SOC (spin-on carbon) | Carbon-rich spin-on hard mask used in multilayer patterning stacks to transfer patterns into deep etch layers | High carbon content and etch resistance, gap-fill and planarisation for high-aspect-ratio 3D NAND and DRAM; suited to 18 nm-class DRAM and 7–90 nm logic | 3D NAND, DRAM and advanced logic fabs | Volume supply (sold before 2021); RMB 232 million revenue in FY2024; No. 1 domestic supplier in 2023; above 10% of China's market in 2024 |
| BARC (bottom anti-reflective coating) | Organic coating under the photoresist that absorbs reflected exposure light, suppressing standing waves and controlling critical dimensions | Matched to KrF and ArF resists; must be tuned for each resist vendor, including the company's own | Memory and logic fabs | Volume supply since 2021; No. 1 domestic supplier in 2023 |
| i-Line photoresist (negative) | 365 nm resist for thick-film and non-critical layers | Stable mass production; process-management know-how is one of the company's core technologies | Memory, logic and specialty fabs | Volume supply since 2022 |
| KrF photoresist | 248 nm deep-UV resist for mid-critical layers | Mass-produced at Zhangzhou | Memory and logic fabs | Volume supply since 2022 |
| ArF immersion photoresist | 193 nm immersion resist for critical layers at advanced nodes | Full customer qualification completed in H1 2026; resin made in-house | Advanced memory and logic fabs | Small-batch supply; first paid orders in 2024 and H1 2025 revenue above the FY2024 total |
| SiARC (silicon-containing ARC) | Silicon-containing anti-reflective hard-mask layer in tri-layer stacks | Multi-fab testing | Advanced fabs | Small-batch order from one customer |
| Top coat | Protective layer over immersion resists that prevents leaching into immersion water | Multi-fab testing | Advanced fabs | Small-batch order from one customer |
By the end of the prospectus period, the company had more than 100 self-produced products across R&D, qualification and volume supply. Since 2021 it has supplied more than 55,000 gallons of self-produced lithography materials in total. The prospectus names foreign products the company has replaced or is trying to replace, from DuPont, JSR, Shin-Etsu Chemical, Brewer Science, Tokyo Ohka Kogyo (TOK), Fujifilm, Nissan Chemical and Merck.
Precursor materials (self-produced)
| Product | Description | Key capabilities | Status |
|---|---|---|---|
| TEOS (tetraethyl orthosilicate) | Silicon precursor for CVD silicon-dioxide films | 9N purity by continuous distillation; made in Dalian using technology licensed from Soulbrain | Volume supply to several fabs; shipments rose sharply year on year in 2026. Under the Soulbrain technology-transfer agreement it can be sold to all domestic fabs and their overseas subsidiaries except Samsung, SK hynix and their affiliates |
| Silicon-based precursors (other) | CVD and ALD silicon films | In development | Customer qualification |
| Metal-based precursors | ALD and CVD metal and metal-nitride films | Dalian phase II industrialisation | Qualification; some orders received |
| High-k precursors | Gate and capacitor dielectrics for DRAM and logic | Chosen as a growth category | Qualification; some orders received |
Spin-on dielectric (SOD) materials (new platform)
These are spin-on insulating films for gap-fill in DRAM, logic at 14 nm and below, and high-stack 3D NAND. They are being developed through the Xiamen Honggen joint venture established in June 2026, which had no revenue as of the H1 2026 report.
Upstream resins (captive)
By 30 June 2026 the company was making its own SOC resin, BARC resin and ArF immersion photoresist resin. This reduces its dependence on imported resin, which the prospectus identified as its main raw-material exposure.
Introduced products
| Category | Main suppliers (prospectus) | Main destination |
|---|---|---|
| Lithography materials | SKMP (SK Materials Performance) | Customer A1 (FY2024 revenue RMB 142.0 million, 72.63% of introduced revenue) and Customer C; partly ended in 2025 |
| Precursors | Soulbrain, SK trichem, Hansol | Customers C and A1 |
| Electronic specialty gases | KDK, SK specialty, Wonik | Customer C |
| Wet electronic chemicals | Various | Domestic fabs |
The company does not publish list prices. Prices are set by negotiation with each fab, usually under annual frameworks.
Financial Narrative
All figures are in RMB million unless stated. FY2022–FY2024 figures come from the prospectus (audited by Rongcheng CPA), FY2025 from the annual report, and FY2021 from historical financial statements.
Income statement
The first year of the growth row shows 0 only as a base-year placeholder. FY2021 net income excluding non-recurring items is approximated by total net profit (RMB 27 million).
Revenue grew at a 47.0% compound annual rate from FY2021 to FY2025 and at 27.0% from FY2022 to FY2025.
Dividends. The company proposed no cash dividend, bonus shares or capitalisation issue for FY2025. At 31 December 2025, the parent company's undistributed profit was RMB 30.15 million.
Commentary. Hengkun has grown revenue strongly while profit has stood still. Revenue doubled from FY2022 to FY2025, but attributable net income stayed at roughly RMB 90–100 million. The reason is the change in mix. The introduced business earned about 98% net-basis gross margins and produced 66–82% of gross profit in FY2022–FY2024. Its revenue is being replaced by self-produced revenue earning 29–36% gross margins. Each yuan of revenue moved from imports to own production therefore lowers the reported gross margin, even though it builds a more durable business.
FY2025 shows the change most clearly. The SKMP termination cut trade revenue by 61.59%. Reported gross margin fell 9 points to 44.84%. Net income excluding non-recurring items fell 15.47% to RMB 79.71 million. Government subsidies rose 61.45% to RMB 11.24 million and supported headline profit. The new Hefei plant was in trial production, so depreciation and running costs rose. Selling, administrative and R&D expenses together grew 16.2% to RMB 237 million.
Interim and quarterly trend (FY2026 interim reports)
Q1 2026 was flat, with net profit down 9.41%, operating cash flow of minus RMB 41.61 million and inventory rising to RMB 278 million. Momentum then returned. In Q2 and Q3, core profit (excluding non-recurring items) grew strongly: up 50.09% year on year in Q3 alone. Gross margin for the first nine months of 2026 recovered to 53.16%, up 9.56 points, helped by scale effects in self-produced products and by in-house resin. Headline Q3 net profit fell 49.25% because of fair-value losses on trading financial assets and other non-current financial assets. The company also booked RMB 16.43 million of asset and credit impairments for the nine months, against which RMB 9.10 million of inventory provisions were written back.
Balance sheet
The debt-to-asset ratio was 33.92% at end-FY2023, 43.26% at end-FY2024 and 37.16% at end-FY2025. Construction in progress reached RMB 462 million at 30 September 2026, up nearly 30% from the start of the year.
Commentary. Before the IPO, Hengkun paid for about RMB 1.4 billion of capital spending over FY2022–FY2025 with a 2022 private placement (RMB 643 million) and growing bank debt. Net debt peaked at RMB 239 million at end-FY2024. The November 2025 IPO raised RMB 892 million net, and the company ended FY2025 with RMB 746 million of net cash. Short-term borrowing still rose to RMB 669 million, so the company carries both large cash balances and short-dated bank debt, which is common among STAR Market issuers. Inventory grew 53.85% in FY2025 and kept rising into Q1 2026. That reflects the ramp of new products and stocking of imported resin, but it is a working-capital item to watch.
Cash flow
The company has made no share buybacks. FY2025 operating cash flow fell 26.57%.
Commentary. Free cash flow has been negative every year, at minus RMB 116 million to minus RMB 281 million. Capital spending has run at three to four times depreciation as the company built Zhangzhou, Dalian phases I and II, and Hefei. The IPO projects alone plan RMB 1.352 billion of total investment. Once complete, they will add up to RMB 96.75 million a year of depreciation and amortisation, roughly equal to FY2025's entire core net profit. How quickly the new capacity is used will decide whether margins expand or are squeezed in 2027–2028.
Ratios
Commentary. Returns are low for a specialty-materials company: ROE was below 8% in every year and 3.9% in FY2025. The asset base is large relative to revenue, with asset turnover around 0.2x, because the company is building capacity ahead of qualification. Plants at Zhangzhou were also under-used. BARC, KrF, i-Line and TEOS lines all ran below 50% utilisation from 2022 to H1 2025, while SOC utilisation rose from 20.87% in 2022 to 57.42% in 2024. Higher utilisation is the main lever for returns.
Unlock Company Financials
Unlock this company profile to view its financial data.
View Subscription PlansFinancial Detail
Income Statement and Margin Analysis (%)
| Metric | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Revenue (CNY Mn) | 141.2 | 321.8 | 367.7 | 547.9 | 658.9 |
Revenue growth (%) | 0 | 127.9 | 14.3 | 49.0 | 20.3 |
Gross profit (CNY Mn) | 96.8 | 233.6 | 228.9 | 295.0 | 295.4 |
Operating income (CNY Mn) | 7.8 | 110.6 | 82.0 | 94.5 | 69.5 |
EBITDA, operating income plus D&A (CNY Mn) | 31.1 | 145.2 | 122.3 | 151.7 | 145.4 |
Pre-tax income (CNY Mn) | 30.3 | 125.4 | 104.5 | 107.1 | 89.7 |
Net income attributable to shareholders (CNY Mn) | 30.1 | 100.9 | 89.8 | 96.9 | 97.8 |
Net income excluding non-recurring items (CNY Mn) | 27.0 | 91.0 | 81.5 | 94.3 | 79.7 |
EPS, basic (MYR Bn) | 0.11 | 0.30 | 0.23 | 0.25 | 0.25 |
Unlock Company Financials
Unlock this company profile to view its financial data.
View Subscription PlansMargin (%)
| Margin (%) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Gross margin | 68.6 | 72.6 | 62.2 | 53.8 | 44.8 |
Operating margin | 5.5 | 34.4 | 22.3 | 17.2 | 10.5 |
EBITDA margin | 22.0 | 45.1 | 33.3 | 27.7 | 22.1 |
Pre-tax margin | 21.5 | 39.0 | 28.4 | 19.6 | 13.6 |
Net margin | 21.3 | 31.4 | 24.4 | 17.7 | 14.8 |
Income Statement and Margin Analysis (%) (Quarterly)
| Quarter metric (CNY Mn) | Q1 2026 | Q2 2026 | Q3 2026 |
|---|---|---|---|
Revenue | 152.0 | 189.0 | 216.0 |
Revenue growth YoY (%) | 0.1 | 30.7 | 13.0 |
Net income attributable | 25.6 | 58.5 | 16.4 |
Net income excluding non-recurring items | 4.1 | 41.2 | 47.7 |
Income Statement
| Year-to-date comparison (CNY Mn) | 9M 2025 | 9M 2026 |
|---|---|---|
Revenue | 485.1 | 557.0 |
Net income attributable | 73.6 | 100.0 |
Net income excluding non-recurring items | 62.5 | 93.0 |
R&D expense | 71.1 | 89.9 |
Financial Analysis
| Metric | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Total assets | 815.4 | 1,633.0 | 2,091.0 | 2,645.0 | 3,985.0 |
Cash and equivalents | 139.1 | 522.6 | 235.1 | 291.0 | 1,323.0 |
Short-term investments | 0 | 0 | 0 | 107.4 | 327.1 |
Receivables | 33.3 | 104.1 | 155.9 | 210.9 | 215.2 |
Inventory | 34.5 | 46.5 | 121.0 | 158.7 | 242.6 |
Total current assets | 376.1 | 857.5 | 586.4 | 874.9 | 2,208.0 |
Property, plant and equipment | 287.9 | 455.2 | 832.2 | 1,119.0 | 1,332.0 |
Intangible assets (no goodwill recorded) | 67.8 | 91.6 | 88.7 | 100.5 | 97.2 |
Total current liabilities | 190.4 | 279.1 | 472.7 | 763.3 | 1,010.0 |
Short-term debt | 52.6 | 101.4 | 183.0 | 400.9 | 669.4 |
Long-term debt | 32.0 | 0 | 156.4 | 210.5 | 184.6 |
Total debt, including leases | 99.7 | 107.8 | 350.5 | 637.4 | 906.0 |
Net debt (negative = net cash) | -69.5 | -520.2 | 115.4 | 239.0 | -746.0 |
Total equity | 507.6 | 1,271.0 | 1,382.0 | 1,501.0 | 2,504.0 |
Working capital | 185.7 | 578.4 | 113.7 | 111.6 | 1,198.0 |
Financial Analysis — Operating cash flow
| Metric | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Operating cash flow | 29.7 | 149.3 | 88.0 | 191.6 | 140.7 |
Capital expenditure | -145.8 | -271.4 | -368.6 | -409.3 | -383.9 |
Free cash flow | -116.1 | -122.0 | -280.6 | -217.7 | -243.2 |
Dividends and interest paid | -4.5 | -3.1 | -3.2 | -10.7 | -13.0 |
Equity issued | 178.1 | 643.1 | 0 | 0 | 932.5 |
Debt drawn | 52.5 | 218.7 | 361.1 | 732.2 | 1,071.0 |
Debt repaid | -57.5 | -213.5 | -116.1 | -444.3 | -805.4 |
Depreciation and amortisation | 23.3 | 34.5 | 40.3 | 57.2 | 75.9 |
Margin Analysis (%) and Financial Ratios (x)
| Ratio | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
ROE on year-end equity (%) | 5.9 | 7.9 | 6.5 | 6.5 | 3.9 |
ROA on year-end assets (%) | 3.7 | 6.2 | 4.3 | 3.7 | 2.5 |
Current ratio (x) | 1.98 | 3.07 | 1.24 | 1.15 | 2.19 |
Debt to equity (x) | 0.20 | 0.08 | 0.25 | 0.42 | 0.36 |
Net debt to EBITDA (x) | -2.24 | -3.58 | 0.94 | 1.58 | -5.13 |
Asset turnover (x) | 0.17 | 0.20 | 0.18 | 0.21 | 0.17 |
Inventory to revenue (%) | 24.4 | 14.4 | 32.9 | 29.0 | 36.8 |
Receivables to revenue (%) | 23.6 | 32.4 | 42.4 | 38.5 | 32.7 |
Customer Metric Details
| Customer metric (%) | FY2025 |
|---|---|
Top-five customers' share of sales | 93.32 |
Largest customer's share of sales | 55.17 |
Customer C's share of main-business revenue | 6.47 |
Customer C revenue (CNY Mn)
| Customer C revenue (CNY Mn) | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|
Customer C | 31.1 | 43.1 | 33.1 | 41.6 |
Share Price History
| Date | Price (MYR Bn) | Market capitalisation (CNY Bn) |
|---|---|---|
IPO price (Nov 2025) | 14.99 | 6.74 |
18 Nov 2025 (first-day close) | 61.55 | 27.66 |
31 Dec 2025 | 47.76 | 21.46 |
16 Jan 2026 | 66.79 | 30.01 |
20 Mar 2026 | 49.51 | 23.23 |
30 Jun 2026 | 74.80 | 33.61 |
30 Sep 2026 | 43.45 | 19.52 |
28 Oct 2026 | 34.26 | 15.39 |
6 Nov 2026 | 33.26 | 14.94 |
Valuation Multiples
| Multiple | Value (x) |
|---|---|
P/E (trailing twelve months, about MYR Bn 124 million net income) | 120 |
P/E (FY2025) | 153 |
EV/Sales (trailing twelve months, about MYR Bn 731 million revenue) | 19.4 |
EV/EBITDA (FY2025) | 98 |
P/B (FY2025 year-end equity) | 6.0 |
Analyst Conclusions
Management guidance
There is no numerical guidance. Management expects steady revenue growth in 2026 and gradual gross-margin improvement from scale. It has said orders for mature products give visibility into H2 2026. It expects the Hefei plant to show industrialisation progress between late 2026 and H1 2027, with output depending on customer qualification.
Consensus
No published consensus. On current run-rates, FY2026 revenue would be about RMB 750–770 million: nine-month revenue of RMB 557 million plus a fourth quarter similar to Q3's RMB 216 million. That would be growth of about 14–17%. Attributable net income would be about RMB 120–130 million, depending on fair-value movements.
Bull case
-
Core profitability is inflecting. Nine-month gross margin of 53.16% (up 9.56 points) and Q3 core profit up 50.09% suggest the drag from the trade-to-self-production switch is over. Earnings can now grow with self-produced volumes.
-
ArF and precursors are second and third growth engines. ArF is fully qualified, Hefei is coming on stream and precursor revenue is growing about 50% a year. The company could double its addressable market by 2028, when China's lithography and precursor markets are forecast to reach RMB 49.9 billion combined.
-
Localisation is still at an early stage. Even in SOC, domestic supply is only about 10% of 12-inch demand, and in BARC and KrF only 1–2%. Fab expansion of about 1 million wafers a month gives a long runway.
Bear case
-
Concentration risk. One customer accounts for 55% of sales. Any change in that memory maker's capital spending, supplier policy or pricing would hit earnings sharply, and Customer C's acquisition by SK hynix adds further uncertainty.
-
Returns and cash flow. ROE is 3.9%, free cash flow has been negative for five straight years, and up to RMB 96.75 million a year of new depreciation is coming. Margins could be squeezed if Hefei and Dalian phase II ramp slowly, given that most existing lines already run below 50% utilisation.
-
Valuation and competition. At about 120 times trailing earnings, the shares price in successful ArF commercialisation. Better-funded peers such as Tongcheng, Nata and Dinglong are already selling ArF photoresist at scale, and Hengkun lacks an in-house ArF exposure tool.
Key catalysts and monitorables (next 12 months)
| Catalyst | Timing | What to watch |
|---|---|---|
| End of 12-month IPO lock-ups | From about 18 Nov 2026 | Selling by pre-IPO funds |
| FY2026 annual report | Apr 2027 | Gross margin above 50%, core profit growth, top-customer share |
| Hefei ArF industrialisation | Late 2026 to H1 2027 | Volume orders beyond small batches; purchase of an ArF exposure tool |
| Dalian phase II | 2,027 | Revenue from metal-based and high-k precursors; precursor segment break-even |
| Honggen spin-on dielectric joint venture | 2026–2027 | First qualifications and orders |
| Customer C under SK hynix ownership | Ongoing | Volumes of TEOS and other products |
| First dividend decision | Apr 2027 | Capital-allocation policy |
| Fair-value positions | Quarterly | Size and volatility of financial-asset holdings |
End of 12-month IPO lock-ups: Timing: From about 18 Nov 2026; What to watch: Selling by pre-IPO funds
FY2026 annual report: Timing: Apr 2027; What to watch: Gross margin above 50%, core profit growth, top-customer share
Hefei ArF industrialisation: Timing: Late 2026 to H1 2027; What to watch: Volume orders beyond small batches; purchase of an ArF exposure tool
Dalian phase II: Timing: 2027; What to watch: Revenue from metal-based and high-k precursors; precursor segment break-even
Honggen spin-on dielectric joint venture: Timing: 2026–2027; What to watch: First qualifications and orders
Customer C under SK hynix ownership: Timing: Ongoing; What to watch: Volumes of TEOS and other products
First dividend decision: Timing: Apr 2027; What to watch: Capital-allocation policy
Fair-value positions: Timing: Quarterly; What to watch: Size and volatility of financial-asset holdings
Analyst verdict
Hengkun has done what few Chinese materials companies have managed. It turned a distribution business into a genuine formulation and manufacturing franchise in critical 12-inch fab materials. Its SOC and BARC lead among domestic suppliers is real, and SOC share has passed 10% of China's market. Self-produced revenue tripled in two years to RMB 568 million and now makes up almost nine-tenths of main-business revenue.
The cost of the transition is visible in the FY2025 accounts. As high-margin trade revenue fell away, gross margin dropped to 44.8%, core profit fell 15%, and returns on a balance sheet enlarged by the IPO slipped below 4%. The 2026 numbers suggest the trough is past. Nine-month gross margin recovered to 53%, core profit rose almost 50% in Q3, and precursors are growing about 50% a year with the segment close to profitability.
The company's next stage depends on three things. ArF photoresist must move from qualification to volume orders. The new Hefei and Dalian capacity must be filled without diluting margins. And the business must reduce its dependence on one memory customer. Capacity is being funded, and the market and policy backdrop is about as favourable as it gets, with localisation rates of 1–10% and around 19 new 12-inch fabs under construction.
What weighs against the company is scale and valuation. At RMB 659 million of revenue, Hengkun is a fifth the size of Tongcheng, Dinglong or Nata, and each of those is investing heavily in the same ArF and ancillary-material opportunities. It has fewer patents and depends on imported resins and licensed TEOS technology. At about 120 times trailing earnings and 19 times sales, the shares already price in a successful ArF ramp.
Overall, Hengkun is a high-quality but concentrated way to invest in the localisation of Chinese memory-fab materials. The operating trend is improving clearly, while valuation and execution risks remain high. Its credibility in 2027 will rest on volume ArF orders and core profit growing faster than the new depreciation.
Unlock Company Financials
Unlock this company profile to view its financial data.
View Subscription PlansExecutive Leadership
Board of Directors
| Name | Role | Background |
|---|---|---|
Yi Rongkun (易荣坤) | Chairman (since Jan 2014); General Manager (since Feb 2017); founder, controlling shareholder and actual controller | Born June 1971 (age 55). Executive director and GM of Hengkun Industry & Trade (Dec 1999 – Jun 2020); GM of the Hengkun limited company (Dec 2004 – Mar 2012); supervisor (Mar 2012 – Jan 2014) |
Xiao Nan (肖楠) | Non-independent director | Shareholder (3.23% before the IPO) and party to the acting-in-concert agreement with the founder |
Zhuang Chaoying (庄超颖) | Non-independent director | Elected December 2025 |
Wang Tingtong (王廷通) | Employee-representative director; Deputy General Manager | Party to the acting-in-concert agreement |
Huang Xingluan (黄兴孪) | Independent director | Elected December 2025 |
Zou Yousi (邹友思) | Independent director | Elected December 2025 |
Su Xiaorong (苏小榕) | Independent director | Elected December 2025 |
Executive Leadership Team
| Name | Title | Notes |
|---|---|---|
Yi Rongkun | Chairman and General Manager | Reported compensation about RMB 0.69 million |
Wang Tingtong | Director and Deputy General Manager | Represented the company at the H1 2026 results briefing |
Chen Yingzheng (陈颖峥) | Board Secretary | Investor relations and disclosure |
Chen Zhiming (陈志明) | Chief Financial Officer | Signs off the financial statements |
Major Shareholders
| Shareholder | Type | Pre-IPO stake (%) |
|---|---|---|
Yi Rongkun | Founder and actual controller | 19.52 |
Zibo Financial Holding (淄博金控, state-owned) | Local government | 4.36 |
Li Xiangjiang | Individual, acting in concert | 4.07 |
Xiamen Shenjian (厦门神剑) | Founder-controlled vehicle | 3.35 |
Suzhou Houwang (苏州厚望) | Investment fund | 3.34 |
Xiao Nan | Director, acting in concert | 3.23 |
Yang Bo | Individual, acting in concert | 3.16 |
Zhang Lei | Individual, acting in concert | 2.87 |
Anhui Hezhuang (安徽和壮) | Investment fund | 2.86 |
Guo Fangfei | Individual | 2.57 |
Competitive Landscape
Competitors by Segment
| Product line | Global incumbents | Domestic competitors |
|---|---|---|
SOC / spin-on hard masks | Shin-Etsu Chemical, JSR, Merck (EMD Electronics), Brewer Science, Nissan Chemical, Dongjin Semichem, SK Materials Performance | Few domestic suppliers at volume; Hengkun ranked first among them in 2023 |
BARC and anti-reflective coatings | Brewer Science, Nissan Chemical, DuPont, Merck, JSR | Tongcheng New Materials (via Beijing Kehua), some photoresist makers in qualification |
i-Line / KrF photoresist | TOK, JSR, Shin-Etsu, Sumitomo Chemical, Fujifilm, DuPont, Dongjin | Beijing Kehua (Tongcheng), Nata Opto-electronic, Sinyang, Jingrui (Crystal Clear/Ruihong Suzhou), Dinglong, Aisen |
ArF immersion photoresist | JSR, TOK, Shin-Etsu, Sumitomo, Fujifilm | Nata Opto-electronic, Tongcheng (ArF revenue up more than 800% in FY2025), Sinyang, Dinglong |
TEOS and precursors | Merck, Air Liquide, Entegris, Soulbrain, SK trichem, Hansol, UP Chemical | Yoke Technology (UP Chemical), Nata Opto-electronic (precursor sales above RMB 100 million in 2023) |
Peer Comparison FY2025
| Company | Revenue FY2025 (CNY Mn) | Revenue growth FY2025 (%) | Net margin FY2025 (%) |
|---|---|---|---|
Hengkun New Materials | 659 | 20.3 | 14.8 |
Tongcheng New Materials (603650) | 3,430 | 4.9 | 16.4 |
Hubei Dinglong (300054) | 3,660 | 9.7 | 19.7 |
Jiangsu Nata Opto-electronic (300346) | 2,590 | 9.9 | 12.4 |



