Zhejiang Huazheng New Materials Co., Ltd. Overview
Huazheng New Materials is a mid-sized Chinese maker of copper-clad laminates (CCL). Its 2.8% share of the 2024 global rigid-CCL market ranked 11th worldwide (Prismark, cited in the FY2025 annual report). Around that core it has built a portfolio of semiconductor-packaging dielectrics: BT-resin packaging laminates, already in volume supply, and the CBF build-up insulation film. CBF is a domestic alternative to Ajinomoto's ABF and is being qualified at China's main IC-substrate makers. The company also makes thermal-conductive metal-base laminates, functional composites, thermoplastic honeycomb panels for logistics, and aluminium-plastic battery pouch film. After two loss-making years (FY2023–FY2024), the AI-server-driven upturn in high-speed CCL has transformed its economics. Revenue for the first nine months of 2026 reached RMB 5.61 billion (+75.5%) and attributable net profit RMB 800 million (+1,178%). Third-quarter gross margin reached 36.1%. In strategic terms the company is moving from commodity FR-4 toward high-speed CCL for AI servers and switches, and toward packaging dielectrics where supply is concentrated in Japan. This makes it one of the few listed Chinese candidates for import substitution in advanced-packaging build-up dielectrics.
Company self-description (FY2025 annual report)
The company describes its business as the design, research, development, production and sale of copper-clad laminates (including prepreg/bonding sheets), composite materials (functional composites and transportation/logistics composites) and film materials. Its products hold China CQC and US UL certification and comply with EU REACH and RoHS. They serve 5G communications, servers, data centres, semiconductor packaging, new-energy vehicles, smart home appliances, medical equipment, rail transit and green logistics. Under China's national industry classification (GB/T 4754-2017) the company falls in "C3985 Electronic Special Materials Manufacturing"; under the CSRC classification it falls in "C39 Computer, Communication and Other Electronic Equipment Manufacturing".
Independent characterisation
Economically, Huazheng is a resin-formulation and lamination business. It buys copper foil, electronic glass fabric and resins, impregnates the reinforcement with formulated resin systems, and hot-presses the stack into laminates and prepregs. PCB fabricators and IC-substrate makers then turn these into circuit boards and package substrates. The value chain runs as follows:
Upstream: copper foil, glass fibre yarn and fabric (including low-Dk and low-CTE glass), epoxy, PPO/PPE, hydrocarbon and BT resins, fillers (spherical silica). Raw materials make up most of the cost of goods.
Huazheng's position: formulated laminates (CCL), prepregs, BT packaging laminates, build-up dielectric film (CBF) and resin-coated copper (CBF-RCC).
Downstream: PCB fabricators (rigid multilayer, HDI, high-frequency RF boards), IC-substrate makers (BT and FC-BGA), then OEMs and hyperscale data-centre, telecom, automotive and consumer-electronics end users.
Revenue model. Revenue is almost entirely product sales on purchase orders. Pricing is cost-plus and follows the market: CCL prices track copper, glass fabric and resin. The business has no subscription, licensing or service revenue of any size. "Other business" revenue (RMB 153 million in FY2025, 43.9% gross margin) includes aluminium-plastic film, materials sales and rental income from its own property.
Customer types. Revenue comes from PCB fabricators (most CCL revenue), IC-substrate makers (BT and CBF), and OEM and brand customers who specify materials. In AI servers, switches, optical modules, base stations and automotive electronics, the end customer certifies the material and the PCB maker buys it, so "terminal certification" is the gating step the company refers to repeatedly. Composites go to consumer-electronics structural-part makers, CT-scanner makers, and truck-body, bus, RV and logistics-box assemblers. In September 2023 the company said its cooperation with Huawei covered FR-4, high-frequency, high-speed, thermal and semiconductor packaging materials for base stations, wireless, datacom, automotive, servers, PV energy and semiconductors.
End-markets. AI servers and data-centre switching (the fastest-growing), 5G/6G base stations and antennas, automotive electronics (ADAS and domain controllers, smart cockpit, power systems, lighting, cameras), smartphones, tablets and notebooks (HDI), memory and Mini/Micro-LED packaging (BT), and green logistics (thermoplastic honeycomb).
Product mix. CCL and thermal-conductive materials together exceed 85% of revenue (2026 placement prospectus). In H1 2026, CCL revenue was RMB 2.516 billion, reported as 86.89% of the company's revenue.
Strategy
Stated strategic themes (FY2025 annual report and 2026 placement documents)
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Focus on high-end CCL and packaging materials. The company plans to concentrate resources on high-frequency, high-speed, high-thermal-conductivity, HDI and BT packaging materials and to raise their share of revenue.
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Serve AI computing infrastructure. It aims to build a full high-speed series from Very Low Loss to Extreme Low Loss, aimed at AI servers, switches and optical modules, and to move its customer base toward higher-value clients in AI computing, communications, automotive electronics and smart terminals.
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Domestic substitution in packaging dielectrics. The company is industrialising CBF build-up film against the near-monopoly of Ajinomoto's ABF, and offering BT laminates on a fully domestic raw-material route.
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Operational excellence. It uses Integrated Product Development (IPD) for R&D, SRM for procurement, smart factories at Qingshanhu and Zhuhai (MES, APS, QMS, ERP, SAP optimisation), cross-functional "3R" sales teams, and a programme of quality, cost and talent restructuring.
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Policy alignment. It cites the 15th Five-Year Plan recommendations (October 2025), the MIIT/SAMR Electronics Manufacturing Stabilisation Action Plan 2025–2026, and the 2024 Industrial Structure Adjustment Catalogue, which lists high-performance CCL as encouraged.
Initiatives in the last 24 months
| Initiative | Date | Detail |
|---|---|---|
| 12 million sheets/year high-grade CCL project | Announced Mar 2026 | Zhuhai Huazheng; total investment RMB 1,004.01 million; H2 and H3 grades only (Megtron 4–8 equivalent); funded by the placement |
| Private placement of up to RMB 1.2 billion | Mar 2026; SSE accepted 4 Aug 2026 | Up to 47,037,155 shares (30% cap) to no more than 35 investors; RMB 1.0 billion for the CCL project and RMB 0.2 billion for working capital |
| Convertible bond forced conversion | Jan–Feb 2026 | Removed about RMB 0.57 billion of debt; equity base widened |
| Headquarters relocation | Jan and Dec 2025 | Total compensation of RMB 335.2 million; monetises old Yuhang industrial land under urban renewal |
| CBF commercialisation | Ongoing | Computing-chip series under substrate-maker validation; CBF-RCC small-batch VCM orders |
| Extreme Low Loss qualification | 2025–2026 | International chip-customer testing |
| Governance modernisation | Nov 2025 | Supervisory board abolished; board expanded; rules revised |
| Digital manufacturing | 2,025 | MES, APS and QMS roll-out at Qingshanhu and Zhuhai |
12 million sheets/year high-grade CCL project: Date: Announced Mar 2026; Detail: Zhuhai Huazheng; total investment RMB 1,004.01 million; H2 and H3 grades only (Megtron 4–8 equivalent); funded by the placement
Private placement of up to RMB 1.2 billion: Date: Mar 2026; SSE accepted 4 Aug 2026; Detail: Up to 47,037,155 shares (30% cap) to no more than 35 investors; RMB 1.0 billion for the CCL project and RMB 0.2 billion for working capital
Convertible bond forced conversion: Date: Jan–Feb 2026; Detail: Removed about RMB 0.57 billion of debt; equity base widened
Headquarters relocation: Date: Jan and Dec 2025; Detail: Total compensation of RMB 335.2 million; monetises old Yuhang industrial land under urban renewal
CBF commercialisation: Date: Ongoing; Detail: Computing-chip series under substrate-maker validation; CBF-RCC small-batch VCM orders
Extreme Low Loss qualification: Date: 2025–2026; Detail: International chip-customer testing
Governance modernisation: Date: Nov 2025; Detail: Supervisory board abolished; board expanded; rules revised
Digital manufacturing: Date: 2025; Detail: MES, APS and QMS roll-out at Qingshanhu and Zhuhai
Medium-term targets
Management has not published numerical medium-term financial targets or guidance. The placement documents use a pricing illustration (issue price RMB 58.11 assuming the 28 February 2026 pricing base) only to calculate dilution. They are not guidance. The economic rationale stated is a capacity shortfall: high-grade CCL demand exceeds supply, and existing capacity limits order intake.
Products & Services
A. Copper-Clad Laminate Division
| Product family | Description and key properties | Target applications | Commercial status (latest disclosure) |
|---|---|---|---|
| High-speed CCL, halogenated Ultra Low Loss | Low-Dk/Df resin system with low-loss glass | AI servers, switches, optical modules | Volume sales |
| High-speed CCL, halogen-free Ultra Low Loss | Halogen-free ultra-low-loss formulation | Servers, data centres | Volume sales; accepted by server customers and recognised by an international chip end customer |
| High-speed CCL, Ultra Low Loss (Low CTE) | Ultra-low loss with low coefficient of thermal expansion for large-die computing boards | Large-chip AI compute ("智算") boards | Passed certification at a leading domestic end customer; volume sales into AI data centres reported by September 2026 |
| High-speed CCL, Extreme Low Loss | Highest-tier loss class (roughly Megtron 8 equivalent) | Next-generation 224G-class switching and AI servers | Under end-customer validation, including international chip customers |
| Very Low Loss to Low Loss grades | Mid-tier high-speed laminates | Enterprise servers, storage, routers | Commercial |
| High-frequency CCL | Low-loss, high-thermal-conductivity and low-CTE RF laminates | 5G base-station antennas, power amplifiers, automotive millimetre-wave radar | Steady expansion; new low-loss, high-thermal and low-CTE grades in accelerated development |
| HDI CCL | Thin, high-Tg laminates and prepregs suited to laser drilling | Smartphones, tablets, notebooks, storage modules, automotive electronics | Commercial; positioned on value for money |
| Standard FR-4 / high-Tg FR-4 | Epoxy-glass laminate and prepreg | Consumer electronics, industrial, home appliances | Commercial; volume base of the business |
| Automotive-grade CCL | IATF 16949-certified laminates | Smart cockpit, ADAS and domain controllers, power systems, lighting, cameras | Stable volume supply to several key customers |
| Thermal-conductive metal-base laminates | Aluminium- and copper-base laminates with high-thermal-conductivity dielectric | Automotive electronics, computing-server power, LED | Volume supply; market share rising (FY2025: 1.4354 million m² sold) |
Internal grading. For its 2026 placement the company split its CCL products into three tiers, H1, H2 and H3, from lowest to highest technical grade. H2 and H3 correspond to Panasonic Megtron M4–M8 loss classes, and the new Zhuhai line will make only H2 and H3 products.
B. Semiconductor Packaging Materials
| Product | Description | Applications | Status |
|---|---|---|---|
| BT packaging laminate | Bismaleimide-triazine resin laminates and prepregs for organic package substrates; the company promotes a fully domestic raw-material route | Mini/Micro LED, memory (Flash and DRAM), VCM, PMIC; validation in MEMS and RF modules | Stable batch orders; offered as a lower-cost substitute for Japanese BT |
| CBF build-up insulation film (积层绝缘膜) | Film-type thermosetting interlayer dielectric for FC-BGA substrates: modified epoxy with spherical silica filler, developed with the Shenzhen Institute of Advanced Electronic Materials and designed to avoid Ajinomoto's patents | CPU/GPU computing-chip FC-BGA substrates; chip redistribution layers | A series of products for computing chips; under validation at China's major IC-substrate makers |
| CBF-RCC (resin-coated copper) | Build-up resin on copper foil | Smartphone VCM voice-coil motors, mainboards, PMIC | Small-batch orders for VCM; validation for mainboard and PMIC |
Dedicated CBF R&D and production lines at the Qingshanhu industrial park can make batch deliveries. CBF does not yet contribute materially to earnings: as of April 2026 the company said CBF orders "do not yet affect operating results".
C. Composites Division
| Product | Description | Applications | Status |
|---|---|---|---|
| Functional composites | Thin, high-modulus fibre-reinforced structural composites, including the SMART COVER lineage | Back covers and structural parts for flagship phones, tablets and laptops; CT gantry parts; CT slip rings | Commercial (FY2025: 1,436 t sold); CT gantry in small-batch delivery; CT slip ring in internal testing |
| Thermoplastic honeycomb panels | Polypropylene-based honeycomb sandwich panels | Refrigerated and dry truck bodies, logistics boxes, buses, RVs, battery packs, warehouse shelving, lightweight pallets | Commercial (FY2025: 2.6936 million m² sold, +27.5%); offered as a complete solution from material to CKD assembly |
D. Film Materials
| Product | Description | Applications | Status |
|---|---|---|---|
| Aluminium-plastic film, W1 / W3 / W5 series | Multilayer pouch film for soft-pack lithium-ion cells | Small power and high-end consumer electronics; expanding into power and energy storage; validation for solid-state and semi-solid batteries | Volume production since the 2023 expansion of 36 million m² per year |
Pricing for all categories is negotiated per order and follows raw-material costs. No list prices are published.
Financial Narrative
Margins (%)
FY2021–FY2025 revenue CAGR was 4.8%. FY2016–FY2025 CAGR was 15.1% (FY2016 revenue RMB 1,250 million).
EBITDA and operating income. Chinese GAAP statements do not report an "operating income" or EBITDA line. Approximations from the reported figures: FY2025 EBIT (pre-tax profit plus finance expense) of about RMB 377 million, and EBITDA of about RMB 584 million after adding RMB 207 million of depreciation, amortisation and impairment. Both include about RMB 211 million of non-recurring gains. On the same basis FY2024 EBIT was about RMB -34 million and EBITDA about RMB 233 million.
Quality of FY2025 earnings
FY2025 attributable profit of RMB 276.7 million included about RMB 211 million of non-recurring items. The main ones were about RMB 171 million of government grants (up more than RMB 90 million year on year) and about RMB 134 million of asset-disposal gains. Both relate chiefly to the government-led relocation of part of the Huayi Road headquarters site (agreements worth RMB 300.59 million and RMB 34.62 million), which added about RMB 190 million after tax. Q4 2025 shows the effect clearly: attributable profit was RMB 214.1 million but only RMB 16.1 million after non-recurring items. Core profitability recovered only modestly in FY2025, to RMB 65.7 million of recurring profit.
The 2026 inflection
Year-to-date 2026 (nine months): revenue RMB 5,609.8 million (+75.54%), attributable net profit RMB 799.96 million (+1,177.71%), recurring net profit RMB 793.36 million (+1,499.31%). Q3 2026 revenue was up 140.8% year on year and 53.6% on the previous quarter. Q3 recurring profit of RMB 626.8 million was up 4,003% year on year. Gross margin of 36.06% in Q3 2026 compares with 18.72% in Q2 2026 and a 13.1% FY2025 average. It is the highest gross margin in the company's listed history and well above the 22.0% FY2016 pre-downturn level. Unlike FY2025, 2026 profits are almost entirely recurring: non-recurring items were under 1% of nine-month profit.
H1 2026 detail: revenue RMB 2,959.9 million (+41.28%), pre-tax profit RMB 190.5 million (+310.03%), attributable net profit RMB 172.9 million (+305.28%), recurring net profit RMB 166.5 million (+385.11%), basic EPS RMB 1.14, weighted ROE 7.86% (+4.97 percentage points).
Balance sheet
The total-asset series runs RMB 5,098 million (FY2021), 5,640 million (FY2022), 5,792 million (FY2023), 6,113 million (FY2024) and 6,335 million (FY2025). At end-2025, fixed assets had an original cost of RMB 3,479.3 million, accumulated depreciation of RMB 861.0 million and impairment of RMB 28.2 million, giving a net book value of RMB 2,590.1 million and an overall condition ratio of 74.4%. The company holds no material goodwill. The only financial investment is a RMB 12 million stake in Nanjing Kuanneng.
Leverage. Liabilities/assets were 75.5% at end-2024 and 72.4% at end-2025, among the highest in China's listed CCL group. Short-term borrowings net of cash were RMB 661 million at end-2024 and RMB 506 million at end-2025. At end-2025 the RMB 1,179 million of non-current liabilities mostly comprised the liability component of the convertible bond and long-term bank loans. The bond was then almost entirely converted into equity by 13 February 2026, removing about RMB 0.57 billion of debt. Together with 2026 retained earnings, this lifted attributable equity 42.3% to RMB 2,463 million by June 2026. Liabilities/assets at 30 June 2026 were about 64%, derived from total assets of RMB 7,126 million and total equity of about RMB 2.48 billion.
Cash flow
Operating cash flow was RMB 377.0 million in H1 2026 (+137.7%) and about RMB 0.56 billion for the first nine months of 2026, up about 268% year on year. In FY2025 the company used relocation proceeds and operating cash to repay about RMB 362 million of debt. Dividends: the board proposed a FY2025 cash dividend of RMB 1.30 per 10 shares (RMB 0.13 per share), about RMB 20 million on the enlarged share base and a payout of roughly 7% of reported profit. The company has no buyback programme.
Ratios
FY2025 ROIC was about 9%, approximated as EBIT after a 15% tax rate divided by average equity plus net short-term borrowings and non-current liabilities, and it was flattered by one-off gains. Net debt/EBITDA (short-term borrowings net of cash, over approximate EBITDA) was about 0.9x for FY2025.
Trend commentary
2021 peak: A commodity price spike in CCL and the Qingshanhu II ramp lifted revenue 58.5% and net profit to RMB 238 million.
2022–2024 trough: Demand fell, new capacity at Zhuhai (June 2022) arrived into oversupply, and copper foil stayed expensive. CCL ASP fell from RMB 131 to RMB 85 per sheet even as volume rose 72%, from 20.51 million to 35.30 million sheets. Depreciation from the 2020–2022 capex cycle pressed on margins. The result was two losses, and the Zhuhai bond-funded project fell short of its promised RMB 69.28 million annual profit (actual: RMB -17.49 million in 2023, RMB 20.26 million in 2024 and RMB 54.81 million in 2025).
2025 transition: Volume rose to a record 38.87 million sheets, ASP stabilised at RMB 87, and the high-end mix rose. One-off relocation gains made the headline profit.
2026 breakout: Price increases in AI-driven high-speed laminates, cost pass-through on copper foil, glass cloth and resin, and full utilisation (lead times stretched from under 10 days to about a month) pushed operating leverage through a largely depreciated asset base. Q3 2026 gross margin of 36% suggests unusually wide spreads, not just a recovery to the historical norm.
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Product Lines
| Product line (CNY Mn) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Copper-clad laminates | 2,693 | 2,492 | 2,630 | 3,005 | 3,375 |
Thermal-conductive materials | 221 | 190 | 228 | 257 | 294 |
Functional composite materials | 171 | 193 | 126 | 166 | 170 |
Transport and logistics composites | 333 | 340 | 264 | 297 | 377 |
Other business | 201 | 71 | 114 | 140 | 153 |
Total revenue | 3,620 | 3,286 | 3,362 | 3,865 | 4,369 |
Product line gross margin (%)
| Product line gross margin (%) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Copper-clad laminates | 15.6 | 10.1 | 6.0 | 6.8 | 9.1 |
Thermal-conductive materials | 16.0 | 15.4 | 17.7 | 18.2 | 27.3 |
Functional composite materials | 25.2 | 29.9 | 27.5 | 26.7 | 28.7 |
Transport and logistics composites | 15.5 | 15.2 | 14.0 | 16.9 | 18.3 |
Other business | 23.5 | 49.9 | 24.7 | 33.3 | 43.9 |
Group | 16.5 | 13.0 | 8.9 | 10.2 | 13.1 |
Product Lines (FY2023 gross profit–FY2025 gross profit)
| Product line | FY2023 gross profit | FY2024 gross profit | FY2025 gross profit | FY2025 % of revenue | FY2025 YoY revenue growth (%) |
|---|---|---|---|---|---|
Copper-clad laminates | 158 | 204 | 307 | 77.2 | 12.3 |
Thermal-conductive materials | 40 | 47 | 80 | 6.7 | 14.4 |
Functional composite materials | 35 | 44 | 49 | 3.9 | 2.4 |
Transport and logistics composites | 37 | 50 | 69 | 8.6 | 26.9 |
Other business | 28 | 47 | 67 | 3.5 | 9.3 |
Income Statement and Margin Analysis (%)
| Metric (CNY Mn) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Revenue | 3,620 | 3,286 | 3,362 | 3,865 | 4,369 |
Revenue growth (%) | 58.5 | -9.2 | 2.3 | 15.0 | 13.1 |
Gross profit | 598 | 427 | 299 | 393 | 571 |
Net profit attributable to shareholders | 238 | 36 | -121 | -97 | 277 |
Basic EPS (MYR Bn) | 1.68 | 0.25 | -0.85 | -0.69 | 1.95 |
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View Subscription PlansIncome Statement and Per-Share Data
| Metric (CNY Mn) | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Pre-tax profit (total profit) | -157.1 | -104.1 | 311.8 |
Net profit attributable to shareholders | -120.5 | -97.4 | 276.7 |
Net profit attributable, excluding non-recurring items | -130.2 | -118.6 | 65.7 |
Diluted EPS (MYR Bn) | -0.85 | -0.69 | 1.90 |
R&D expense | not separately itemised in the summary | 201 | 219 |
Finance expense | not separately itemised in the summary | 70 | 65 |
Margin (%)
| Margin (%) | FY2021 | FY2022 | FY2023 | FY2024 | FY2025 |
|---|---|---|---|---|---|
Gross margin | 16.5 | 13.0 | 8.9 | 10.2 | 13.1 |
Net margin (attributable) | 6.6 | 1.1 | -3.6 | -2.5 | 6.3 |
Q1 2025 by Quarter
| Quarter (CNY Mn) | Q1 2025 | Q2 2025 | Q3 2025 | Q4 2025 | Q1 2026 | Q2 2026 | Q3 2026 |
|---|---|---|---|---|---|---|---|
Revenue | 1,030.0 | 1,065.1 | 1,100.6 | 1,173.5 | 1,234.0 | 1,725.9 | 2,649.9 |
Net profit attributable | 18.4 | 24.3 | 19.9 | 214.1 | 31.0 | 142.0 | 627.0 |
Net profit attributable, excluding non-recurring items | 14.4 | 19.9 | 15.3 | 16.1 | — | — | 626.8 |
“—” = not publicly disclosed.
Balance Sheet
| Balance sheet item (CNY Mn) | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Total assets | 5,792 | 6,113 | 6,335 |
Current assets | 2,712 | 2,919 | 3,297 |
Cash and equivalents | not separately itemised | 468 | 456 |
Notes and accounts receivable | not separately itemised | 1,946 | 2,283 |
Inventory | not separately itemised | 455 | 511 |
Fixed assets | not separately itemised | 2,807 | 2,731 |
Intangibles and other non-current | not separately itemised | 377 | 296 |
Short-term borrowings | not separately itemised | 1,129 | 962 |
Notes and accounts payable | not separately itemised | 1,981 | 2,351 |
Current liabilities | not separately itemised | 3,251 | 3,405 |
Non-current liabilities (incl. convertible bond and long-term loans) | not separately itemised | 1,364 | 1,179 |
Total liabilities | not separately itemised | 4,615 | 4,584 |
Equity attributable to shareholders | 1,551 | 1,455 | 1,731 |
Total equity incl. minorities | not separately itemised | 1,497 | 1,751 |
Balance sheet item (CNY Mn) | 30 Jun 2026 | — | — |
Total assets | 7,126 | — | — |
Equity attributable to shareholders | 2,463 | — | — |
Cash flow item (CNY Mn)
| Cash flow item (CNY Mn) | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Operating cash flow | 243.9 | 168.9 | 354.1 |
Capital expenditure | not separately itemised | 247 | not separately itemised (net investing inflow of 3 after relocation proceeds) |
Free cash flow (OCF minus capex) | not separately itemised | -78 | not separately itemised |
Net change in debt | not separately itemised | 94 | -362 |
Returns & Leverage Ratios (%) and Financial Ratios (x)
| Ratio | FY2023 | FY2024 | FY2025 |
|---|---|---|---|
Weighted average ROE (%) | -7.46 | -6.48 | 17.37 |
ROA, attributable profit / average assets (%) | -2.1 | -1.6 | 4.4 |
Current ratio (x) | not separately itemised | 0.90 | 0.97 |
Liabilities to assets (%) | not separately itemised | 75.5 | 72.4 |
Asset turnover (x) | 0.59 | 0.65 | 0.70 |
Receivable days, year-end | not separately itemised | 184 | 191 |
Inventory days, year-end | not separately itemised | 48 | 49 |
Payable days, year-end | not separately itemised | 208 | 226 |
Cash conversion cycle (days) | not separately itemised | 24 | 14 |
EBIT / finance expense (x) | not separately itemised | -0.5 | 5.8 |
Revenue by Region
| Region (CNY Mn) | FY2025 revenue | FY2025 cost of sales | FY2025 gross profit | FY2025 gross margin (%) | Share of revenue (%) |
|---|---|---|---|---|---|
Mainland China | 3,672 | 3,183 | 488 | 13.30 | 84.0 |
Overseas | 697 | 615 | 83 | 11.86 | 16.0 |
Share Price & Returns
| Reference point | Price (MYR Bn) | Note |
|---|---|---|
2 Apr 2026 | 59.87 | One-year range then RMB 18.68–88.15 |
23 Mar 2026 | 57.90 | Day before the placement plan |
21 Jul 2026 | 148.00 | Market cap RMB 23.2 billion |
20 Oct 2026 | 192.42 | Market cap RMB 30.17 billion |
30 Sep 2026 (Q3-end, implied) | about 212.6 | From Fang Wenyan's holding value |
52-week high | 269.87 | Reached in October 2026 |
4 Nov 2026 | 145.22 | Limit-up; market cap RMB 22.77 billion |
25 Nov 2025 | 42.98 | Limit-up; market cap RMB 6.09 billion |
52-week low | 37.53 | Late 2025 |
Valuation Snapshot
| Metric | Value |
|---|---|
Market cap | RMB 19.4–22.8 billion |
TTM net profit (Q4 2025 plus 9M2026) | RMB 1,014 million |
P/E, TTM | about 19–22x |
P/E on annualised Q3 2026 profit | about 8–9x |
TTM revenue | RMB 6,783 million |
EV/Sales, TTM | about 3x |
P/B (equity about MYR Bn 3.1 billion at Q3 2026) | about 6–7x |
Analyst Ratings & Targets
| Broker | Date | Rating | 2026E net profit (CNY Mn) | 2027E net profit (CNY Mn) | 2028E net profit (CNY Mn) |
|---|---|---|---|---|---|
Zheshang Securities | 23 Mar 2026 (maintained 17 Sep 2026) | Buy | 573 | 802 | 1,054 |
Shenwan Hongyuan | 3 Apr 2026 | Buy (initiation) | 473 | 771 | 968 |
Consensus (2 institutions, Aug 2026) | 5 Aug 2026 | — | 523 | 787 | 1,011 |
Analyst Conclusions
Management guidance
Management issues no formal annual guidance. Its qualitative outlook (FY2025 annual report, H1 and Q3 2026 reports and investor Q&A) says high-grade CCL demand is strong and supply-constrained, prices and volumes are rising together, and lead times have stretched to about one month. New H2/H3 capacity depends on the RMB 1.2 billion placement.
Consensus growth expectations
Before Q3, the sell side expected 2026 revenue of RMB 6.4–7.3 billion and net profit of RMB 0.47–0.57 billion, followed by 23–30% revenue growth and 40–63% profit growth in 2027. Actual nine-month results (revenue RMB 5.61 billion, profit RMB 0.80 billion) mean full-year 2026 will likely exceed RMB 7.5 billion of revenue and RMB 1.2 billion of profit if Q4 holds near Q3 levels.
Bull case
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Margins are structurally higher. Q3 2026 gross margin of 36% on fully depreciated FR-4 lines plus a rising high-speed mix shows that cost pass-through plus scarcity can sustain margins well above the 13–22% historical range while industry capacity stays tight until 2027–2028.
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CBF becomes a second engine. With Ajinomoto at about 95% of a USD 0.5–1.1 billion market and reported supply curbs to China, even a small domestic share of FC-BGA build-up film would be worth more than the whole of today's composites business, at far higher margins.
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High-end capacity at the right time. The 12 million-sheet H2/H3 line adds about 31% to volume at Megtron 4–8 class, and conversion of the bond has already deleveraged the balance sheet. Equity funding limits financial risk.
Bear case
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Cyclical peak. The 2021 peak was followed by two loss years. Four or more domestic peers are adding high-grade capacity, and the industry expects price increases to converge within three to five years.
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Execution record. The last growth project missed promised returns for three straight years, and CBF has stayed in validation for four years without material revenue.
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Valuation and sentiment risk. The stock fell about 50% from its October 2026 high within weeks. Executives sold near the peak and a speculative individual holder sits just below 5%, so the share price reflects momentum flows as much as fundamentals.
Key catalysts and monitorables (next 12 months)
| Catalyst / monitorable | Expected timing | What to watch |
|---|---|---|
| SSE approval and CSRC registration of the RMB 1.2 billion placement | Q4 2026 – H1 2027 | Pricing, dilution and investor mix |
| FY2026 annual report and dividend | March–April 2027 | Full-year profit; payout increase; segment margins |
| Q4 2026 and Q1 2027 gross margin | Jan–Apr 2027 | Whether margins of 30% or more hold as copper and glass-cloth costs move |
| CBF qualification at domestic FC-BGA substrate makers | 2,027 | First batch orders for computing chips |
| Extreme Low Loss approval with an international chip customer | 2,027 | Entry into global AI platforms |
| Zhuhai H2/H3 line construction start | 2,027 | Capex timing and ramp schedule |
| Industry pricing (Kingboard, Shengyi notices) | Monthly | Signs of price peak or decline |
| Insider and major-holder activity | Ongoing | Fang Wenyan crossing 5%; Huali Group stake |
- SSE approval and CSRC registration of the RMB 1.2 billion placement — Expected timing: Q4 2026 – H1 2027; What to watch: Pricing, dilution and investor mix
FY2026 annual report and dividend: Expected timing: March–April 2027; What to watch: Full-year profit; payout increase; segment margins
Q4 2026 and Q1 2027 gross margin: Expected timing: Jan–Apr 2027; What to watch: Whether margins of 30% or more hold as copper and glass-cloth costs move
CBF qualification at domestic FC-BGA substrate makers: Expected timing: 2027; What to watch: First batch orders for computing chips
- Extreme Low Loss approval with an international chip customer — Expected timing: 2027; What to watch: Entry into global AI platforms
Zhuhai H2/H3 line construction start: Expected timing: 2027; What to watch: Capex timing and ramp schedule
Industry pricing (Kingboard, Shengyi notices): Expected timing: Monthly; What to watch: Signs of price peak or decline
Insider and major-holder activity: Expected timing: Ongoing; What to watch: Fang Wenyan crossing 5%; Huali Group stake
Analyst verdict
Huazheng New Materials has gone from loss-making also-ran to one of the clearest earnings-leverage stories in China's AI hardware supply chain. The numbers are hard to dispute. Nine-month 2026 revenue rose 75.5% to RMB 5.61 billion, and net profit rose more than twelve-fold to RMB 800 million, almost entirely recurring. Third-quarter gross margin of 36.1% is the highest in the company's listed history. The turnaround was not created by financial engineering: the one-off relocation gains that flattered FY2025 have disappeared from the 2026 numbers. Price, mix and utilisation on an asset base built in 2020–2022 drive the gain, as AI-server demand and raw-material scarcity turned a commoditised laminate market into a seller's market.
The harder question is durability. Huazheng is still a sub-scale player with about 2.8% of the global market and a very small high-speed share. Its history of returns on growth capital is weak, and it is about to add capacity at the same time as several domestic peers. If Q3 2026 margins revert even halfway toward the 13–16% long-run norm, earnings would fall sharply from the current run-rate. The CBF build-up film is the real strategic option. It addresses a near-monopoly market that matters to national supply-chain security, but four years into development it is still in qualification. Until batch FC-BGA orders arrive it should be valued as an option, not as earnings.
At roughly 19–22x trailing and 8–9x annualised Q3 earnings, the market is already discounting a cyclical peak. The stock's recent 50% drawdown from its high shows how sensitive it is to signs that the cycle is turning. The investment case therefore rests on three verifiable events: placement approval and a timely Zhuhai ramp, gross margins holding above about 25% through mid-2027, and a first FC-BGA-scale CBF order. The first two would support today's valuation; the third would justify a structural re-rating. Absent these, Huazheng is best viewed as a high-beta, well-run cyclical at an earnings peak rather than a compounder.
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View Subscription PlansExecutive Leadership
Board of Directors
| Name | Role | Committees and background |
|---|---|---|
Liu Tao (刘涛) | Chairman and director representing the company in executing company affairs | Chair of the Strategy Committee. Born 1966; bachelor's degree; senior engineer. Formerly assistant GM and marketing manager at International Laminate Co., then deputy GM and GM of Zhejiang Huazheng Electronics Group. Long-serving chairman since before the IPO |
Guo Jiangcheng (郭江程) | Director and General Manager | Also a director of controlling shareholder Huali Group |
Wang Siyang (汪思洋) | Non-independent director | Strategy Committee member; Huali Group nominee |
Yang Qingjun (杨庆军) | Non-independent director | — |
Xu Liang (许良) | Non-independent director | — |
Dong Hui (董辉) | Non-independent director | — |
Wang Fengyang (王凤扬) | Independent director | — |
Wang Xu (王旭) | Independent director | Strategy Committee member |
Wang Li (王莉) | Independent director | — |
Executive Leadership Team
| Name | Title |
|---|---|
Guo Jiangcheng | General Manager |
Yu Gao (俞高) | Deputy GM and Chief Financial Officer |
Wang Chao (王超) | Deputy GM; rotating GM of the CCL Division |
Liu Hongsheng (刘洪生) | Deputy GM; rotating GM of the Composites Division |
Zhou Yang (周洋) | Deputy GM; rotating GM of the Film Division; chairman of Shenzhen Zhongke Huazheng |
Zhu Yuwen (祝郁文) | Board Secretary |
Li Linlin (黎林林) | Head of the accounting department |
Directors' Shareholdings
| Insider | Shares sold | % of total share capital | Price range (MYR Bn) |
|---|---|---|---|
Liu Tao (Chairman) | 228,400 | 0.1457 | 75.27 – 206.06 |
Guo Jiangcheng (Director, GM) | 282,000 | 0.1799 | 70.65 – 231.91 |
Yu Gao (Deputy GM, CFO) | 7,200 | 0.0046 | 101.00 – 117.28 |
Wang Chao (Deputy GM) | 10,000 | 0.0064 | 80.00 – 81.00 |
Major Shareholders
| Rank | Shareholder | Shares held | % of total |
|---|---|---|---|
| 1 | Huali Group Co., Ltd. | 56,902,768 | 40.07 |
| 2 | CCB – Cinda Australia New Energy Industry Equity Fund | 2,110,500 | 1.49 |
| 3 | Hong Kong Monetary Authority – own funds | 1,468,400 | 1.03 |
| 4 | Hong Kong Securities Clearing Co. (Northbound Stock Connect) | 1,265,200 | 0.89 |
| 5 | CCB – E Fund Innovation-Driven Flexible Allocation Hybrid Fund | 1,248,900 | 0.88 |
| 6 | Guo Jiangcheng | 1,177,481 | 0.83 |
| 7 | Liu Tao | 914,046 | 0.64 |
| 8 | ICBC – Cinda Australia Zhiyuan 3-Year Holding Hybrid Fund | 906,800 | 0.64 |
| 9 | SPDB – Cinda Australia Leading Selection Hybrid Fund | 861,100 | 0.61 |
| 10 | SPDB – Maxwealth Digital Economy Selection Hybrid Fund | 815,400 | 0.57 |
Competitive Landscape
Key Competitors
| Competitor | Listing | Positioning versus Huazheng |
|---|---|---|
Kingboard Laminates (建滔积层板) | HKEX 1888 | Global #1 by volume; vertically integrated into glass, copper foil and resin; dominant in FR-4 |
Shengyi Technology (生益科技) | SSE 600183 | China's technology and scale leader; FY2025 net profit RMB 3,334 million (+91.76%); SIF packaging film in batch orders |
Nan Ya Plastics (CCL division) | TWSE 1303 | Large Taiwanese integrated producer |
Elite Material (EMC, 台光电子) | TWSE 2383 | Global leader in high-speed AI-server laminates; also a potential ABF-type film entrant |
ITEQ (联茂电子) | TWSE 6213 | High-speed and high-Tg laminates for servers and networking |
Taiwan Union Technology (TUC, 台耀科技) | TPEx 6274 | High-speed and HDI laminates |
Panasonic Industry (Megtron) | TSE 6752 | Benchmark for ultra-low-loss laminates; Huazheng's H2/H3 grades map to M4–M8 |
Doosan Electro-Materials | KRX (Doosan Corp.) | High-speed laminates for AI accelerators |
Nanya New Material (南亚新材) | SSE STAR 688519 | Domestic high-speed peer; FY2025 net profit RMB 240 million; also pursuing a placement |
Jin'an Guoji (金安国纪) | SZSE 002636 | FR-4 volume producer; RMB 1.3 billion placement for 40 million m² |
Hongchang Electronic (宏昌电子) | SSE 603002 | Epoxy and CCL; RMB 1.8 billion placement; GBF build-up film R&D |
Chaohua Technology (超华科技) | SZSE 002288 | Copper foil and CCL |
Ajinomoto Fine-Techno | ABF | About 95–98% global build-up film share; sets the industry standard |
Sekisui Chemical | Build-up film | Distant #2 |
Taiyo Ink | Build-up dielectric | Niche |
Mitsubishi Gas Chemical (MGC) | BT laminates | Together with Resonac and Nippon Mining, over 90% of BT resin supply |
Resonac | BT and package laminates | Raised prices 30% from March 2026 |
Shengyi Technology | SIF series packaging film | Batch orders from advanced-packaging customers |
Hongchang Electronic | GBF build-up film | R&D |
Lotus Holdings (莲花控股) | ABF via 46% of Newfiss (纽菲斯) | Entrant |
Guangdong Hinno-Tech, Xi'an Tianhe Defense, Wuhan Sanxuan, Shenzhen EPS | Build-up film | Domestic entrants |
Peer Comparison FY2025
| Company | Market cap, 2 Apr 2026 (CNY Bn) | FY2025 net profit (CNY Mn) | 2026E net profit (CNY Mn) | 2027E net profit (CNY Mn) | FY2025 P/E (x) | 2026E P/E (x) |
|---|---|---|---|---|---|---|
Shengyi Technology | 125.4 | 3,334 | 5,357 | 7,392 | 38 | 23 |
Nanya New Material | 28.0 | 240 | 513 | 821 | 116 | 55 |
Huazheng New Materials | 9.4 | 277 | 473 | 771 | 34 | 20 |



