3D Semiconductor Packaging Market

Company Headquarters: Arizona, US Founded: 1968 Workforce: ~29,300 Company Working: Amkor Technology is one of the leading providers of outsourced semiconductor packaging and test services. The company also provides turn-key test services and packaging including wafer probe, wafer bump, wafer back-grind, packaging, package design, and drop shipment services. Integrated device manufacturers (IDMs) to reduce their capital expenditure on research tend to outsource parts of its manufacturing responsibilities to companies such as Amkor, which are in the business of IC packaging and testing. The company offers its products through four segments, namely packaging, technology, services, and applications. Under the packaging segment, the company offers products under the subcategories such as laminate, lead frame, power discrete, and wafer level. Amkor has strategically positioned its offices, globally to reach a wider client base. It has offices in the countries including the US, France, Germany, China, Korea, Japan, and Singapore. The company has about 20 factories in the countries of Japan, Korea, the Philippines, China, Malaysia, and Portugal.

Company Headquarter: Austria Founded: 1981 Workforce: ~11,168 Company Working: ams AG is an Austria-based company that designs, manufactures, and develops sensors, sensor interfaces, power management, analog semiconductors, and wireless solutions. The company provides products that include power management integrated circuits, sensors, sensor interfaces, and wireless integrated circuits for customers in the consumer, industrial, medical, mobile communications, and automotive markets. The company operates through three segments, namely, consumer, non-consumer, and foundry. Moreover, the company provides wireless connectivity products, time-to-digital converters for high-precision time interval measurement, sensor interfaces, and analog and mixed signal applications. The company was formerly known as austriamicrosystems AG and changed its name to ams AG in May 2012.

Company Headquarter: Taiwan Founded: 1984 Workforce: ~68,000 Company Working: Advanced Semiconductor Engineering Inc. is a Taiwan-based company, that manufactures, designs, and sells semiconductor products. The company offers semiconductor testing, packaging, and electronic manufacturing services. The company operates through four segments, namely, testing, EMS, packaging, and estate. The company is also engaged in assembling, manufacturing, designing, and selling electronic components and telecommunications equipment and computer motherboards. Additionally, the company is also involved in the substrate production, as well as sale and leasing of real estate properties. The company is a subsidiary of ASE Technology Holding Co. Ltd.

Company Headquarter: Taiwan Founded: 1987 Workforce: ~48,600 Company Working: Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) engages in the manufacture and sale of integrated circuits and wafer semiconductor devices. The company offers a range of wafer fabrication processes including manufacturing of complementary metal oxide semiconductor (CMOS) logic, mixed-signal, radio frequency, embedded memory, BiCMOS mixed-signal, and other semiconductors. Apart from this, the company also provides design, mask making, bumping, probing, assembly, and testing services. TSMC offers a range of CMOS image sensors, characterized by technology features including low dark current, high sensitivity, small pixel size, and high dynamic range achieved through integration with mixed mode processes. Its chips are used in personal computers and peripheral products, information applications, wired and wireless communications system products, and automotive and industrial equipment including consumer electronics such as digital video compact disc player, digital television, game consoles, and digital cameras. Geographically, the company caters to the Americas, Europe, Asia, the Middle East and Africa, and other regions.

Company Headquarters: Geneva, Switzerland Founded: 1987 Workforce: ~ 45,500 Company Working: STMicroelectronics is one of the key semiconductor solution providers and integrated device manufacturers, globally. It offers products,, tools, and software & services to its end-use customers. These products & services can be used in the spectrum of electronics and semiconductor solutions. It conducts its business through three business segments, namely automotive and discrete group (ADG), analog, MEMS and sensors group (AMS), and microcontrollers and digital ICs group (MDG). The company offers its package and material products under the ADG segment. The company also offers a variety of software solutions and evaluation tools to its clients in order to evaluate the package and material product features and to monitor the power equipment’s critical electrical parameters. It is strongly involved in research & development activities to enhance its position in the market. For instance, it has approximately 7,400 employees involved in research & development and product design in order to have an edge in terms of technology. Furthermore, STMicroelectronics continuously updates its substantial patent rights; as the company has approximately 17,000 patents, 9,500 patent families till date, and 500 new patents filed in year 2017. It has a wide product portfolio ranging from amplifiers and comparators, audio ICs to wireless connectivity. It offers wide bandgap transistors and SiC diodes in power transistors and SiC devices segments, respectively. It has approximately 80 sales & marketing offices in 35 countries and 11 manufacturing sites, globally.

Company Headquarters: Taiwan Founded: 1984 Workforce: ~24,000 Company Overview: Siliconware Precision Industries Co. Ltd (SPIL) is engaged in the provision of semiconductor packaging, assembly, testing, and bumping services. Its assembly services include IC packaging processes for chipsets. SPIL also provides in-house design and consultation services. The company's test services are used to validate the assembly process by utilizing testing solutions for a range of digital and mixed signal devices. The bumping services include direct bumping, re-passivation, redistribution, wafer level CSP, and gold bumping services. Apart from this, the company offers packaging and testing solution including substrate packages and lead-frame packages with either wire bond or flip chip interconnections. The company also uses technologies such as wafer thinning, wire bonding, stacked-die bonding, wafer bumping, fine-pitch, and flip-chip assembly for developing packages including quad- plastic ball grid array (PBGA), thin and fine-pitch ball grid array (TFBGA), stacked-die chip scale package (CSP), flat no-leads (QFN), wafer level chip scale package (WLCSP), memory card, and flip chip ball grid array (FCBGA). The application of these packages could be observed in personal computers, consumer products, hand-held products, and wire communications. The company’s product portfolio comprises ball grid array, chip scale, stacked die, memory cards, and quad and dual leaded packages. The company's subsidiaries include SPIL (B.V.I.) Holding Limited, Siliconware US Inc., SPIL (Cayman) Holding Limited, and Siliconware Technology (Suzhou) Limited. Geographically, the company offers its solutions to the US, China, Taiwan, Europe, and other regions.