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Amkor Technology Inc.

Company Profile Analysis

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Amkor Technology Inc. - Semiconductor showcase

Year Founded & Workforce

1968

29,300 Employees

Industry

Semiconductor

Services

Packaging
A

Amkor Technology Inc. Employee Contacts

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Amkor Technology Inc. Overview

Company Headquarters: Arizona, US

Founded: 1968

Workforce: ~29,300

Company Working: Amkor Technology is one of the leading providers of outsourced semiconductor packaging and test services. The company also provides turn-key test services and packaging including wafer probe, wafer bump, wafer back-grind, packaging, package design, and drop shipment services. Integrated device manufacturers (IDMs) to reduce their capital expenditure on research tend to outsource parts of its manufacturing responsibilities to companies such as Amkor, which are in the business of IC packaging and testing.

The company offers its products through four segments, namely packaging, technology, services, and applications. Under the packaging segment, the company offers products under the subcategories such as laminate, lead frame, power discrete, and wafer level. Amkor has strategically positioned its offices, globally to reach a wider client base. It has offices in the countries including the US, France, Germany, China, Korea, Japan, and Singapore. The company has about 20 factories in the countries of Japan, Korea, the Philippines, China, Malaysia, and Portugal.

Strategy

Amkor follows product innovation as a primary strategy and has invested substantially in its R&D department, assigning about 600 employees for the department. In order to achieve significant efficiency, the company aims to improve the utilization rate of its existing assets. Amkor, as a part of its key strategy, aims to improve the utilization of its existing assets by offering improved package technology to its existing customer base. While, the existing assets will be offered to the potential customers. Another strategy followed by the company is the investments to tap into the opportunities and enhance the product portfolio. For instance, Amkor strategically acquired Nanium S.A. in 2015 that is a primary manufacturer of fan-out wafer-level packaging.

Company Snapshot

$28,840M

Revenue

29,300

Employees

1968

Founded

Arizona, US

Headquarters

SWOT Analysis

Strengths

  • Wide portfolio of packaging and test services
  • Strong research and technology capabilities and operational efficiency
  • Strong financial performance allows the company to strengthen its market position
  • Wide range of products
  • Continuous capital investment

Weaknesses

  • Dependence on limited customers
  • Dependence on the semi-conductor industry
  • Fluctuations in cash flow

Opportunities

  • Growth in semiconductor market
  • Positive outlook for smartphones market
  • Rising demand in the automotive sector
  • Growing demand from phone manufacturers

Threats

  • Risk associated with cyclical semiconductor industry
  • Lack of contractually committed customer demand leading to difficulty in forecasting demand
  • Intense competition could have an adverse effect on the company’s business
  • Dependence on internationally based factories
  • Changes on tax regulations

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Key Developments

DateApproachDevelopment
May-2017Merger/AcquisitionAmkor Technology Inc. acquired NANIUM S.A., to strengthen Amkor’s leading position in wafer-level packaging.
December 2018New Product DevelopmentAmkor Technology announced the extension of its MEMS and sensor package technology to meet the growing demand from the global optical market. The products can be used for applications including LIDAR, ambient light sensing, and fingerprint sensing.
July 2018PartnershipsAmkor Technology, in collaboration with Mentor, launched Amkor’s “SmartPackage” package assembly design Kit (PADK). The product will be used to support Mentor’s High-Density Advanced Packaging (HDAP) tools and design process.
May 2017Mergers & AcquisitionsAmkor Technology completed the acquisition of Nanium S.A, based in Portugal, which is a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. The acquisition has strengthened Amkor’s position in the market.
June 2016New Product DevelopmentAmkor Technology announced the launch of a new product line of MEMS and sensor packaging line from its facility in Shanghai.
January 2016Mergers & AcquisitionsAmkor Technology announced the complete acquisition of J-Devices, based in Japan, which has helped Amkor expand its product portfolio and global presence.

Product Offering

  • Amkor Technology Inc.
    • Packaging

Financial Performance

Explore key financial metrics, segmented revenue, balance sheet health, and performance trends.

By Business Segment: SBU breakup-0 rose from USD 28.8 Mn in 2015 to USD 41.9 Mn in 2017.
Amkor Technology Inc. — By Business Segment
Series (USD Mn)201520162017
SBU breakup-028.838.941.9

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